JP6694311B2 - Printed wiring board - Google Patents

Description

  The present invention relates to a printed wiring board.

  As an example of a technique for mounting electronic components on a printed wiring board, reflow soldering is generally widely known. In reflow soldering, the paste-like solder provided between the pads provided on the surface of the printed wiring board and the terminals of the electronic component is heated in the reflow oven to melt and then cooled. By solidifying the solder, the terminals of the electronic component are soldered to the pads of the printed wiring board.

  The positions, sizes, shapes, etc. of the terminals of the electronic components soldered to the pads of the printed wiring board are basically the same as long as they are the same electronic components. However, even for the same electronic component, the positions, sizes, shapes, etc. of the terminals may be slightly different due to, for example, different manufacturers. Further, even if the same electronic component is manufactured by the same manufacturer, the position, size, shape, etc. of the terminal may be changed due to design changes or specification changes. In such a case, the position, size, and shape of the pad of the printed wiring board may not match the position, size, and shape of the terminal of the electronic component.

  When the position, size, and shape of the pads on the printed wiring board do not match the position, size, shape, etc. of the terminals of the electronic component, solder between the pads of the printed wiring board and the terminals of the electronic component in the reflow furnace. When is melted, the electronic component may move on the melted solder and the mounting position may be displaced. If the mounting position of the electronic component is deviated, there is a possibility that the electronic component may come into contact with another electronic component adjacent thereto, a contact failure of the terminal, a circuit short circuit or the like may occur. In this case, for example, it is possible to prevent displacement of the mounting position by fixing the electronic component to the printed wiring board with resin or the like in the process before putting the printed wiring board in the reflow furnace. However, it is not preferable to add a step of fixing the electronic component to the printed wiring board with resin or the like, because the manufacturing cost will increase due to the increase in the number of steps. For this reason, for example, when the manufacturer of electronic components is changed, or when the design or specifications of electronic components are changed, the printed wiring board design may need to be changed each time. Therefore, there is a possibility that the manufacturing cost will increase.

  Also, for example, if the printed wiring boards used for electronic devices with different specifications are shared and it is possible to select and mount the same type of electronic component with different electrical characteristics according to the specifications of the electronic device, the manufacturing cost can be reduced. Will be possible. However, even if electronic components of the same type have different electrical characteristics, the positions, sizes, shapes, etc. of the terminals may also differ. For example, if multiple printed wiring boards must be designed for each electronic component with different terminal position, size, shape, etc., cost reduction due to commonization of printed wiring boards will be hindered. ..

  As an example of a conventional technique aiming at solving such a problem, two pads that are opposed to each other are provided, and the two pads have a short side on the opposite side and a long side on the opposite side. A printed wiring board that is trapezoidal and in which the distance between the two pads and the dimensions of the short side and the long side are determined based on the maximum and minimum external dimensions of the chip component to be mounted is known (for example, patents). Reference 1).

JP, 09-199841, A

  However, in the above-mentioned conventional technology, chip parts standardized by JIS (Japanese Industrial Standards) and EIA (Electronic Industries Alliance), that is, the position, size, shape, etc. of terminals have electrical characteristics. It is intended for chip components that are proportionally different in a similar manner according to the difference. In other words, the above-mentioned conventional technology is a technology that can be used only for substantially standardized chip parts, and for example, it is hardly applicable to electronic parts whose positions, sizes, shapes, etc. of terminals are not standardized. There is a problem called.

  The present invention has been made in view of such circumstances, and an object thereof is to realize a common printed wiring board on which electronic components whose terminal positions, sizes, shapes, etc. are not standardized are mounted. is there.

<First Aspect of the Present Invention>
According to a first aspect of the present invention, a substrate including a component mounting area on which a first electronic component or a second electronic component is selectively mounted, and the first electronic component or the second electronic component provided in the component mounting area. A first conductor to which a first terminal of an electronic component is connected; and a resist layer formed on a surface of the substrate, wherein the first conductor is covered by the resist layer. The first pad portion of the first conductor includes a first pad portion and a second pad portion formed of, and the first pad portion of the first conductor has the first electronic component of the first electronic component when the first electronic component is mounted in the component mounting region. The second pad portion of the first conductor has a shape that defines the position of the first terminal, and the second pad portion of the first conductor is formed on the first terminal of the second electronic component when the second electronic component is mounted in the component mounting area. The printed wiring board has a shape that defines a position.

  The first pad portion and the second pad portion of the first conductor are formed by covering a part of the first conductor with a resist layer. Therefore, the first pad portion and the second pad portion of the first conductor are both part of the first conductor and are electrically connected to each other. The positions, sizes, and shapes of the first pad portion and the second pad portion of the first conductor can be freely set by adjusting the range in which the resist layer is formed.

  The first pad portion of the first conductor defines the position of the first terminal of the first electronic component when the first electronic component is mounted in the component mounting area. On the other hand, the second pad portion of the first conductor defines the position of the first terminal of the second electronic component when the second electronic component is mounted in the component mounting area. That is, the first conductor to which the first terminal of the first electronic component or the second electronic component is connected includes the first pad portion corresponding to the position, size, shape, etc. of the first terminal of the first electronic component, and the first conductor. Second pad portions corresponding to the positions, sizes, shapes, etc. of the first terminals of the two electronic components are formed.

  As a result, when the first electronic component is mounted in the component mounting area, the position of the first terminal of the first electronic component can be defined at a predetermined position by the first pad portion of the first conductor. The first electronic component can be mounted at a predetermined position in the area. On the other hand, when the second electronic component is mounted in the component mounting area, the position of the first terminal of the second electronic component can be defined at a predetermined position by the second pad portion of the first conductor, so that the component mounting can be performed. The second electronic component can be mounted at a predetermined position in the area. Therefore, it is possible to selectively mount the first electronic component or the second electronic component having different positions, sizes, shapes, etc. of the first terminals in the component mounting area.

  As a result, according to the first aspect of the present invention, it is possible to obtain the effect that the printed wiring board on which the electronic component whose terminal position, size, shape and the like are not standardized is mounted can be made common.

<Second aspect of the present invention>
According to a second aspect of the present invention, in the above-described first aspect of the present invention, the first pad portion of the first conductor has the first electronic component mounted on the component mounting area. 1 The electronic component has a shape having a first X-direction position defining portion that defines the position of one end of the first terminal of the electronic component in the X direction, and the second pad portion of the first conductor is located in the component mounting area. When the second electronic component is mounted, the second electronic component has a shape having a second X-direction position defining portion that defines the position of one end of the first terminal of the second electronic component in the X direction. , A printed wiring board.
According to the second aspect of the present invention, when the first electronic component is mounted in the component mounting area, one of the first terminals of the first electronic component in the X direction is moved by the first X-direction position defining portion. The position of the side end can be defined as a predetermined position. On the other hand, when the second electronic component is mounted in the component mounting area, the second X-direction position defining portion sets the position of one end of the first terminal of the second electronic component in the X direction to the predetermined position. Can be defined.

<Third aspect of the present invention>
According to a third aspect of the present invention, in the above-described second aspect of the present invention, the first pad portion of the first conductor has the first electronic component mounted on the component mounting area. One electronic component has a shape having first Y-direction position defining portions that define positions of both ends of the first terminal of the electronic component in the Y direction intersecting the X direction, and the second pad portion of the first conductor is the component. When the second electronic component is mounted in the mounting area, it has a shape having second Y-direction position defining portions that define the positions of both ends of the first terminal of the second electronic component in the Y direction. , A printed wiring board.
According to the third aspect of the present invention, when the first electronic component is mounted in the component mounting area, the first Y-direction position defining portion further causes the first terminal of the first electronic component to move in the Y-direction. The positions of both ends can be defined as predetermined positions. On the other hand, when the second electronic component is mounted in the component mounting area, the positions of both ends of the first terminal of the second electronic component in the Y direction are further defined at predetermined positions by the second Y-direction position defining portion. be able to.

<Fourth aspect of the present invention>
A fourth aspect of the present invention is the device according to any one of the first to third aspects of the present invention described above, which is provided at a position apart from the first conductor in the component mounting region to one side in the X direction. And a second conductor connected to the second terminal of the first electronic component or the second electronic component, the second conductor being formed by covering a part of the second conductor with the resist layer. A first pad portion and a second pad portion, and the first pad portion of the second conductor has a second pad of the first electronic component when the first electronic component is mounted in the component mounting region. The second pad portion of the second conductor has a shape that defines the position of the terminal, and when the second electronic component is mounted in the component mounting area, the second pad portion defines the position of the second terminal of the second electronic component. A printed wiring board having a prescribed shape.

  The first pad portion and the second pad portion of the second conductor are formed by covering a part of the second conductor with a resist layer. Therefore, the first pad portion and the second pad portion of the second conductor are both a part of the second conductor and are electrically connected to each other. The positions, sizes, and shapes of the first pad portion and the second pad portion of the second conductor can be freely set by adjusting the range in which the resist layer is formed.

  The first pad portion of the second conductor defines the position of the second terminal of the first electronic component when the first electronic component is mounted in the component mounting area. On the other hand, the second pad portion of the second conductor defines the position of the second terminal of the second electronic component when the second electronic component is mounted in the component mounting area. That is, the second conductor to which the second terminal of the first electronic component or the second electronic component is connected includes the first pad portion corresponding to the position, size, shape, etc. of the second terminal of the first electronic component, and the second conductor. Second pad portions corresponding to the positions, sizes, shapes, etc. of the second terminals of the two electronic components are formed.

  As a result, when the first electronic component is mounted in the component mounting area, the first pad portion of the first conductor can define the position of the first terminal of the first electronic component at a predetermined position, and Since the position of the second terminal of the first electronic component can be defined at a predetermined position by the first pad portion of the conductor, the first electronic component can be mounted at a predetermined position in the component mounting area. On the other hand, when the second electronic component is mounted in the component mounting area, the second pad portion of the first conductor can define the position of the first terminal of the second electronic component at a predetermined position, and Since the position of the second terminal of the second electronic component can be defined at a predetermined position by the second pad portion of the conductor, the second electronic component can be mounted at a predetermined position in the component mounting area. Therefore, the first electronic component or the second electronic component having different positions, sizes, shapes, etc. of the first terminal and the second terminal can be selectively mounted in the component mounting area.

<Fifth aspect of the present invention>
A fifth aspect of the present invention is the above-described fourth aspect of the present invention, wherein the first pad portion of the second conductor is the first pad when the first electronic component is mounted in the component mounting area. 1 has a shape having a third X-direction position defining portion that defines the position of the other end of the second terminal of the electronic component in the X direction, and the second pad portion of the second conductor has the component mounting area. When the second electronic component is mounted on, a shape having a fourth X-direction position defining portion that defines the position of the other end of the second terminal of the second electronic component in the X direction is formed. It is a printed wiring board.
According to the fourth aspect of the present invention, when the first electronic component is mounted in the component mounting area, the other of the second terminals of the first electronic component in the X direction is moved by the third X-direction position defining portion. The position of the side end can be defined as a predetermined position. On the other hand, when the second electronic component is mounted in the component mounting area, the position of the other end of the second terminal of the second electronic component in the X direction is set to the predetermined position by the fourth X-direction position defining portion. Can be defined.

<Sixth aspect of the present invention>
According to a sixth aspect of the present invention, in the above-described fifth aspect of the present invention, the first pad portion of the second conductor has the first electronic component mounted on the component mounting region, 1 electronic component has a shape having a third Y-direction position defining portion that defines positions of both ends of the second terminal in the Y direction, and the second pad portion of the second conductor has the first pad in the component mounting area. A printed wiring board having a fourth Y-direction position defining portion that defines the positions of both ends of the second terminal of the second electronic component in the Y direction when the two electronic components are mounted. is there.
According to the sixth aspect of the present invention, when the first electronic component is mounted in the component mounting area, the third Y-direction position defining portion further causes the second terminal of the first electronic component to move in the Y direction. The positions of both ends can be defined as predetermined positions. On the other hand, when the second electronic component is mounted in the component mounting area, the positions of both ends of the second terminal of the second electronic component in the Y direction are further regulated to predetermined positions by the fourth Y direction position regulating section. be able to.

  According to the present invention, it is possible to realize a common printed wiring board on which electronic components whose terminal positions, sizes, shapes, etc. are not standardized are mounted.

The side view which showed the state which mounted the 1st electronic component on the printed wiring board of 1st Example. FIG. 3 is a plan view showing a state in which the first electronic component is mounted on the printed wiring board of the first embodiment. The side view which showed the state which mounted the 2nd electronic component on the printed wiring board of 1st Example. The top view which showed the state which mounted the 2nd electronic component on the printed wiring board of 1st Example. The top view which expanded and illustrated the 1st conductor in the state which mounted the 1st electronic component. The top view which expanded and illustrated the 1st conductor in the state which mounted the 2nd electronic component. The top view which expanded and illustrated the 2nd conductor in the state which mounted the 1st electronic component. The top view which expanded and illustrated the 2nd conductor in the state which mounted the 2nd electronic component. The top view which expanded and illustrated the 1st conductor of the printed wiring board of 2nd Example. The top view which expanded and illustrated the 2nd conductor of the printed wiring board of 2nd Example.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Needless to say, the present invention is not particularly limited to the embodiments described below, and various modifications can be made within the scope of the invention described in the claims.

<First embodiment>
A first embodiment of the printed wiring board 10 according to the present invention will be described with reference to FIGS.

  FIG. 1 is a side view showing a state in which the first electronic component 40 is mounted on the printed wiring board 10 of the first embodiment. FIG. 2 is a plan view illustrating a state in which the first electronic component 40 is mounted on the printed wiring board 10 according to the first embodiment. FIG. 3 is a side view illustrating a state in which the second electronic component 50 is mounted on the printed wiring board 10 according to the first embodiment. FIG. 4 is a plan view showing a state in which the second electronic component 50 is mounted on the printed wiring board 10 of the first embodiment.

  The printed wiring board 10 according to the present invention includes a substrate 11, a resist layer 12, a first conductor 20, and a second conductor 30.

  The substrate 11 is a single-sided or double-sided substrate, a multilayer substrate, or the like, and is a rigid substrate such as a glass epoxy substrate. The substrate 11 includes a wiring pattern, a land, a pad, a via (not shown) formed on the surface layer or the inner layer, and forms a predetermined electronic circuit by mounting electronic components. The board 11 includes a component mounting area 13 in which the first electronic component 40 or the second electronic component 50 is selectively mounted. The resist layer 12 is, for example, a solder resist or the like, and is applied and formed on the surface of the substrate 11 so as to cover the surface of the substrate 11.

  Here, the first electronic component 40 and the second electronic component 50 are, for example, surface-mounted components having the same external dimensions, and are electronic components of the same type having different electrical characteristics. More specifically, the first electronic component 40 and the second electronic component 50 are, for example, inductor (coil) components having different electrical characteristics. The first terminal 41 and the second terminal 42 of the first electronic component 40 have the same size and shape. Similarly, the first terminal 51 and the second terminal 52 of the second electronic component 50 have the same size and shape. On the other hand, the positions, sizes, and shapes of the first terminals 41 and the second terminals 42 of the first electronic component 40 are different from the positions, sizes, and shapes of the first terminals 51 and the second terminals 52 of the second electronic component 50. ing.

  The first conductor 20 is provided in the component mounting area 13 and is connected to the wiring pattern of the board 11. When the first electronic component 40 is mounted in the component mounting area 13, the first conductor 20 is connected to the first terminal 41 of the first electronic component 40 by soldering, and the first electronic component 40 is mounted in the component mounting area 13 to the second electronic component 40. When the 50 is mounted, the first terminal 51 of the second electronic component 50 is connected by soldering.

  The first conductor 20 includes three pads 21 to 23 formed by covering a part of the first conductor 20 with the resist layer 12. The three pads 21 to 23 of the first conductor 20 are all part of the first conductor 20 and are electrically connected to each other. The positions, sizes, and shapes of the three pads 21 to 23 of the first conductor 20 can be freely set by adjusting the range in which the resist layer 12 is formed.

  When the first electronic component 40 is mounted in the component mounting area 13, when the solder between the first terminal 41 of the first electronic component 40 and the pad 21 is melted in the reflow furnace, the first electronic component 40 is mounted. The position of the first terminal 41 is restricted within the range of the outer shape of the pad 21 by the surface tension of the molten solder. The pad 21 as the “first pad portion of the first conductor” has a shape that defines the position of the first terminal 41 of the first electronic component 40 when the first electronic component 40 is mounted in the component mounting area 13. Yes (Fig. 2).

  On the other hand, when the second electronic component 50 is mounted in the component mounting area 13, when the solder between the first terminal 51 of the second electronic component 50 and the pads 21 to 23 is melted in the reflow furnace, The position of the first terminal 51 of the two electronic component 50 is restricted within the range of the outer shape of the pad 22 and the pad 23 by the surface tension of the molten solder. The pad 22 and the pad 23 as the “second pad portion of the first conductor” define the position of the first terminal 51 of the second electronic component 50 when the second electronic component 50 is mounted in the component mounting area 13. It has a shape (Fig. 4).

  That is, on the first conductor 20, the pad 21, which corresponds to the position, size, shape, etc. of the first terminal 41 of the first electronic component 40, and the position, size, and shape of the first terminal 51 of the second electronic component 50. Pads 22 and 23 corresponding to the same are formed respectively. The position, size, and shape of the pad 21 is defined as a predetermined position of the first terminal 41 of the first electronic component 40 according to the position, size, shape, etc. of the first terminal 41 of the first electronic component 40. And the amount of solder on the pad 21 is determined to be an appropriate amount. The positions, sizes, and shapes of the pads 22 and 23 are the positions of the first terminals 51 of the second electronic component 50 according to the positions, sizes, and shapes of the first terminals 51 of the second electronic component 50. Is determined to be a predetermined position, and further, the solder amounts of the pads 22 and 23 are determined to be proper solder amounts.

  The second conductor 30 is provided in the component mounting area 13, and more specifically, is provided at a position away from the first conductor 20 on one side in the X direction (direction side indicated by reference numeral X1). There is. The second conductor 30 is connected to the wiring pattern of the substrate 11. When the first electronic component 40 is mounted in the component mounting area 13, the second conductor 30 is connected to the second terminal 42 of the first electronic component 40 by soldering, and the second electronic component 40 is mounted in the component mounting area 13. When the 50 is mounted, the second terminal 52 of the second electronic component 50 is connected by soldering.

  The second conductor 30 includes three pads 31 to 33 formed by covering a part of the second conductor 30 with the resist layer 12. The three pads 31 to 33 of the second conductor 30 are all part of the second conductor 30 and are electrically connected to each other. The positions, sizes, and shapes of the three pads 31 to 33 of the second conductor 30 can be freely set by adjusting the range in which the resist layer 12 is formed.

  When the first electronic component 40 is mounted in the component mounting area 13, when the solder between the second terminal 42 of the first electronic component 40 and the pad 31 is melted in the reflow furnace, the first electronic component 40 is mounted. The position of the second terminal 42 is regulated within the range of the outer shape of the pad 31 by the surface tension of the molten solder. The pad 31 as the “first pad portion of the second conductor” has a shape that defines the position of the second terminal 42 of the first electronic component 40 when the first electronic component 40 is mounted in the component mounting area 13. Yes (Fig. 2).

  On the other hand, when the second electronic component 50 is mounted in the component mounting area 13, when the solder between the second terminal 52 of the second electronic component 50 and the pads 31 to 33 is melted in the reflow furnace, The position of the second terminal 52 of the two-electronic component 50 is regulated within the range of the outer shape of the pad 32 and the pad 33 by the surface tension of the molten solder. The pad 32 and the pad 33 as the “second pad portion of the second conductor” define the position of the second terminal 52 of the second electronic component 50 when the second electronic component 50 is mounted in the component mounting area 13. It has a shape (Fig. 4).

  That is, in the second conductor 30, the pad 31, which corresponds to the position, size, shape, etc. of the second terminal 42 of the first electronic component 40, and the position, size, shape of the second terminal 52 of the second electronic component 50. Pads 32 and 33 corresponding to the same are formed, respectively. The position, the size, and the shape of the pad 31 are defined such that the position of the second terminal 42 of the first electronic component 40 is a predetermined position according to the position, the size, the shape, etc. of the second terminal 42 of the first electronic component 40. The solder amount of the pad 31 is further determined to be an appropriate amount. The positions, sizes, and shapes of the pads 32 and 33 are the positions of the second terminals 52 of the second electronic component 50 according to the positions, sizes, and shapes of the second terminals 52 of the second electronic component 50. Is determined to be a predetermined position, and further, the solder amounts of the pads 32 and 33 are determined to be proper solder amounts.

  When the first electronic component 40 is mounted in the component mounting area 13, the printed wiring board 10 according to the present invention having such a configuration uses the pads 21 of the first conductor 20 to form the first terminal of the first electronic component 40. The position of 41 can be defined at a predetermined position, and the position of the second terminal 42 of the first electronic component 40 can be defined at a predetermined position by the pad 31 of the second conductor 30. Thereby, when the first electronic component 40 is mounted in the component mounting area 13, the first electronic component 40 can be mounted at a predetermined position in the component mounting area 13.

  On the other hand, when the second electronic component 50 is mounted in the component mounting area 13, the position of the first terminal 51 of the second electronic component 50 is defined as a predetermined position by the pad 22 and the pad 23 of the first conductor 20. In addition, the position of the second terminal 52 of the second electronic component 50 can be defined at a predetermined position by the pad 32 and the pad 33 of the second conductor 30. As a result, when the second electronic component 50 is mounted in the component mounting area 13, the second electronic component 50 can be mounted at a predetermined position in the component mounting area 13.

  In this way, the printed wiring board 10 according to the present invention can selectively mount the first electronic component 40 or the second electronic component 50 in the component mounting area 13. Therefore, according to the present invention, it is possible to realize the commonization of the printed wiring board 10 on which the electronic parts whose positions, sizes, shapes, etc. of the terminals are not standardized are mounted.

  FIG. 5 is an enlarged plan view of the first conductor 20 in a state where the first electronic component 40 is mounted in the component mounting area 13. FIG. 6 is an enlarged plan view of the first conductor 20 in a state where the second electronic component 50 is mounted in the component mounting area 13.

  The first terminal 41 of the first electronic component 40 has a rectangular shape with a horizontal width L1 and a vertical width L2. On the other hand, the first terminal 51 of the second electronic component 50 has a rectangular shape with a horizontal width L3 and a vertical width L4. For example, in the embodiment, the lateral width L1 of the first terminal 41 is shorter than the lateral width L3 of the first terminal 51. The vertical width L2 of the first terminal 41 is longer than the vertical width L4 of the first terminal 51. Further, the first terminal 41 of the first electronic component 40 is located at a position displaced from the first terminal 51 of the second electronic component 50 to the other side in the X direction (direction side indicated by reference numeral X2).

The pad 21 of the first conductor 20 has a substantially trapezoidal shape including an upper base 211, a first oblique side 212, and a second oblique side 213. When the first electronic component 40 is mounted in the component mounting area 13, the upper base 211 of the pad 21 as the “first X-direction position defining portion” has the X direction of the first terminal 41 of the first electronic component 40. The position of the end 411 (the end in the direction indicated by the reference symbol X1) on one side is defined (FIG. 5). The first hypotenuse 212 and the second hypotenuse 213 of the pad 21 as the “first Y-direction position defining portion” are the first electronic component 40 of the first electronic component 40 when the first electronic component 40 is mounted in the component mounting area 13. The positions of both ends 412 and 413 in the Y direction intersecting the X direction of the one terminal 41 are defined (FIG. 5).
Note that, for example, when the lateral width L1 of the first terminal 41 of the first electronic component 40 is slightly long within the manufacturing tolerance range, one side of the first terminal 41 of the first electronic component 40 in the X direction is The position of the end 411 (the end in the direction indicated by the symbol X1) can be defined by the first oblique side 212 and the second oblique side 213 of the pad 21.

The pad 22 of the first conductor 20 includes an end portion 221 and a hypotenuse 222, and has a shape that is substantially parallel to the first hypotenuse 212 of the pad 21. The pad 23 of the first conductor 20 includes an end portion 231 and a hypotenuse 232, and has a shape that is substantially parallel to the second hypotenuse 213 of the pad 21. The end portion 221 of the pad 22 and the end portion 231 of the pad 23 as the “second X-direction position defining portion” are provided in the second electronic component 50 when the second electronic component 50 is mounted in the component mounting area 13. The position of one end 511 of the first terminal 51 in the X direction (the end in the direction indicated by reference numeral X1) is defined (FIG. 6). The oblique side 222 of the pad 22 and the oblique side 232 of the pad 23 as the “second Y-direction position defining portion” are the first side of the second electronic component 50 when the second electronic component 50 is mounted in the component mounting area 13. The positions of both ends 512 and 513 of the terminal 51 in the Y direction are defined (FIG. 6).
Note that, for example, when the lateral width L3 of the first terminal 51 of the second electronic component 50 is slightly long within the manufacturing tolerance range, one side of the first terminal 51 of the second electronic component 50 in the X direction is provided. The position of the end 511 (the end in the direction indicated by the reference numeral X1) can be defined by the hypotenuse 222 of the pad 22 and the hypotenuse 232 of the pad 23.

  FIG. 7 is an enlarged plan view of the second conductor 30 in a state where the first electronic component 40 is mounted in the component mounting area 13. FIG. 8 is an enlarged plan view of the second conductor 30 in a state where the second electronic component 50 is mounted in the component mounting area 13.

  The second terminal 42 of the first electronic component 40, like the first terminal 41, has a rectangular shape with a horizontal width L1 and a vertical width L2. On the other hand, the second terminal 52 of the second electronic component 50, like the first terminal 51, has a rectangular shape with a horizontal width L3 and a vertical width L4. For example, in this embodiment, the lateral width L1 of the second terminal 42 is shorter than the lateral width L3 of the second terminal 52. The vertical width L2 of the second terminal 42 is longer than the vertical width L4 of the second terminal 52. Further, the second terminal 42 of the first electronic component 40 is located at a position displaced from the second terminal 52 of the second electronic component 50 to one side in the X direction (direction side indicated by reference numeral X1).

The pad 31 of the second conductor 30 has a substantially trapezoidal shape including an upper base side 311, a first oblique side 312, and a second oblique side 313. When the first electronic component 40 is mounted in the component mounting area 13, the upper bottom side 311 of the pad 31 as the “third X-direction position defining portion” is the X direction of the second terminal 42 of the first electronic component 40. The position of the other end 421 (the end in the direction indicated by the reference symbol X2) of is defined (FIG. 7). The first hypotenuse 312 and the second hypotenuse 313 of the pad 31 as the “third Y-direction position defining portion” are the first electronic component 40 of the first electronic component 40 when the first electronic component 40 is mounted in the component mounting area 13. The positions of both ends 422 and 423 in the Y direction of the two terminals 42 are defined (FIG. 7).
Note that, for example, when the lateral width L1 of the second terminal 42 of the first electronic component 40 is slightly long within the manufacturing tolerance, the second terminal 42 of the first electronic component 40 on the other side in the X direction is The position of the end 421 (the end in the direction indicated by the symbol X2) can be defined by the first oblique side 312 and the second oblique side 313 of the pad 31.

The pad 32 of the second conductor 30 includes an end portion 321 and an oblique side 322, and has a shape that is substantially parallel to the first oblique side 312 of the pad 31. The pad 33 of the second conductor 30 includes an end portion 331 and a hypotenuse 332, and has a shape that is substantially parallel to the second hypotenuse 313 of the pad 31. The end portion 321 of the pad 32 and the end portion 331 of the pad 33 as the “fourth X-direction position defining portion” are provided in the second electronic component 50 when the second electronic component 50 is mounted in the component mounting area 13. The position of the other end 521 of the second terminal 52 in the X direction (the end in the direction indicated by reference numeral X2) is defined (FIG. 8). The oblique side 322 of the pad 32 and the oblique side 332 of the pad 33 as the “fourth Y-direction position defining portion” are the second side of the second electronic component 50 when the second electronic component 50 is mounted in the component mounting area 13. The positions of both ends 522, 523 of the terminal 52 in the Y direction are defined (FIG. 8).
Note that, for example, when the lateral width L3 of the second terminal 52 of the second electronic component 50 is slightly longer within the manufacturing tolerance range, the second terminal 52 of the second electronic component 50 on the other side in the X direction is The position of the end 521 (the end in the direction indicated by the symbol X2) can be defined by the hypotenuse 322 of the pad 32 and the hypotenuse 332 of the pad 33.

<Second embodiment>
A second embodiment of the printed wiring board 10 according to the present invention will be described with reference to FIGS. 9 and 10.
FIG. 9 is an enlarged plan view of the first conductor 20 of the printed wiring board 10 according to the second embodiment. FIG. 10 is an enlarged plan view of the second conductor 30 of the printed wiring board 10 according to the second embodiment.

  The printed wiring board 10 according to the second embodiment is different from the first embodiment in that the first conductor 20 further includes the pads 24 in addition to the pads 21 to 23. The printed wiring board 10 of the second embodiment is different from the first embodiment in that the second conductor 30 further includes the pad 34 in addition to the pads 31 to 33. Since the other configuration is the same as that of the first embodiment, the same components are designated by the same reference numerals and detailed description thereof will be omitted.

  As shown in the figure, the pad 24 of the first conductor 20 is provided so as to connect the pads 21 to 23 on the other side of the pads 21 to 23 of the first conductor 20 in the X direction (direction side indicated by reference numeral X2). (Fig. 9). Further, the pad 34 of the second conductor 30 is provided so as to connect the pads 31 to 33 on one side in the X direction of the pads 31 to 33 of the second conductor 30 (direction side indicated by reference numeral X1) as shown in the figure. (Fig. 10). Therefore, the first conductor 20 of the second embodiment has a larger amount of solder when soldering the first terminal 41 of the first electronic component 40 or the first terminal 51 of the second electronic component 50 than in the first embodiment. .. Similarly, the second conductor 30 of the second embodiment has a larger amount of solder when soldering the second terminal 42 of the first electronic component 40 or the second terminal 52 of the second electronic component 50 than in the first embodiment. Become. As described above, the pad configurations of the first conductor 20 and the second conductor 30 have the first terminal 41 and the second terminal 42 of the first electronic component 40, and the second electronic component 50 of the second electronic component 50 in consideration of an appropriate amount of solder. It is preferable that the first terminal 51 and the second terminal 52 are appropriately set in appropriate positions, sizes, and shapes depending on the positions, sizes, shapes, and the like of the first terminals 51 and the second terminals 52.

10 printed wiring board 11 substrate 12 resist layer 13 component mounting area 20 first conductors 21-24 first conductor pads 30 second conductors 31-34 second conductor pads 40 first electronic components 41, 51 first terminals 42, 52 second terminal 50 second electronic component

Claims (6)

A substrate including a component mounting area on which the first electronic component or the second electronic component is selectively mounted;
A first conductor provided in the component mounting area, to which a first terminal of the first electronic component or the second electronic component is connected;
A resist layer formed on the surface of the substrate,
The first conductor includes a first pad portion and a second pad portion formed by covering a part of the first conductor with the resist layer,
The first pad portion of the first conductor has a shape that defines the position of the first terminal of the first electronic component when the first electronic component is mounted in the component mounting area,
The second pad portions of the first conductor, wherein, when said second electronic component to the component mounting area is mounted, to name a shape that defines the position of the first terminal of the second electronic component,
The second pad portion of the first conductor has a first portion and a second portion, and the first portion and the second portion sandwich the first pad portion of the first conductor and sandwich the first pad portion of the first conductor. A printed wiring board, each of which is located on both sides of the first pad portion of the conductor . The printed wiring board according to claim 1, wherein the first pad portion of the first conductor has an X of a first terminal of the first electronic component when the first electronic component is mounted in the component mounting area. Forming a shape having a first X-direction position defining portion that defines the position of one end in the direction,
The second pad portion of the first conductor defines the position of one end of the first terminal of the second electronic component in the X direction when the second electronic component is mounted in the component mounting area. A printed wiring board having a shape having a second X-direction position defining portion. The printed wiring board according to claim 2, wherein the first pad portion of the first conductor has the first terminal of the first electronic component when the first electronic component is mounted in the component mounting area. A shape having a first Y-direction position defining portion that defines the positions of both ends in the Y direction intersecting the X direction,
The second pad portion of the first conductor defines a position of both ends of the first terminal of the second electronic component in the Y direction when the second electronic component is mounted in the component mounting area. A printed wiring board having a shape having a Y direction position defining portion. The printed wiring board according to claim 3 , wherein the printed circuit board is provided at a position spaced apart from the first conductor in the component mounting region to one side in the X direction, and is provided in a position of the first electronic component or the second electronic component. Further comprising a second conductor to which the two terminals are connected,
The second conductor includes a first pad portion and a second pad portion formed by covering a part of the second conductor with the resist layer,
The first pad portion of the second conductor has a shape that defines the position of the second terminal of the first electronic component when the first electronic component is mounted in the component mounting area,
The second pad portion of the second conductor has a shape that defines the position of the second terminal of the second electronic component when the second electronic component is mounted in the component mounting area. substrate. The printed wiring board according to claim 4, wherein the first pad portion of the second conductor has the second terminal of the first electronic component when the first electronic component is mounted in the component mounting region. A shape having a third X-direction position defining portion that defines the position of the other end in the X direction,
The second pad portion of the second conductor defines the position of the other end of the second terminal of the second electronic component in the X direction when the second electronic component is mounted in the component mounting area. A printed wiring board having a shape having a fourth X-direction position defining portion. The printed wiring board according to claim 5, wherein the first pad portion of the second conductor has the second terminal of the first electronic component when the first electronic component is mounted in the component mounting region. A shape having a third Y-direction position defining portion that defines the positions of both ends in the Y direction,
The second pad portion of the second conductor defines a position of both ends of the second terminal of the second electronic component in the Y direction when the second electronic component is mounted in the component mounting area. A printed wiring board having a shape having a Y direction position defining portion.

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