CN210225876U - Multi-group impedance PCB - Google Patents
Multi-group impedance PCB Download PDFInfo
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- CN210225876U CN210225876U CN201920844419.3U CN201920844419U CN210225876U CN 210225876 U CN210225876 U CN 210225876U CN 201920844419 U CN201920844419 U CN 201920844419U CN 210225876 U CN210225876 U CN 210225876U
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- copper foil
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Abstract
The utility model discloses a multiunit impedance PCB board, this multiunit impedance PCB board have simple structure, with low costs, can possess multiunit impedance's characteristics. The utility model discloses a bottom plate be equipped with a plurality of groups copper foil wire on the bottom plate, each group the thickness homogeneous phase of copper foil wire, a plurality of groups the line width of copper foil wire is mutually different, each group all be provided with the tin coating on the copper foil wire. The utility model discloses be applied to the technical field of PCB board.
Description
Technical Field
The utility model relates to a PCB board, in particular to multiunit impedance PCB board.
Background
The PCB is a supplier of electrical connection of electronic components, the development of the PCB has been over 100 years, the design of the PCB is mainly a layout design, and the adoption of the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. At present, only one group of impedance is generally arranged in the same PCB, so that the requirements of customers with multiple groups of impedance are difficult to meet.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome prior art not enough, provide a multiunit impedance PCB board, this multiunit impedance PCB board has simple structure, with low costs, can possess the characteristics of multiunit impedance.
The utility model adopts the technical proposal that: the utility model discloses a bottom plate be equipped with a plurality of groups copper foil wire on the bottom plate, each group the thickness homogeneous phase of copper foil wire, a plurality of groups the line width of copper foil wire is mutually different, each group all be provided with the tin coating on the copper foil wire.
Further, the thickness of the tin plating layer on each set of the copper foil leads is the same or different.
Further, an anti-oxidation layer is arranged on the tin coating.
The utility model has the advantages that: because the utility model discloses a design of the different linewidths of multiunit, the utility model discloses a bottom plate be equipped with a plurality of groups copper foil wire on the bottom plate, each group the thickness homogeneous phase of copper foil wire, a plurality of groups the linewidth of copper foil wire is different, each group all be provided with the tin coating on the copper foil wire, thereby make the utility model has the characteristics of simple structure, with low costs, can possess the multiunit impedance, can satisfy different customers' demand well.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
As shown in 1, in this embodiment, the utility model discloses a bottom plate be equipped with a plurality of groups copper foil conductor 2, each group on the bottom plate 1 the thickness homogeneous phase of copper foil conductor 2, a plurality of groups the line width of copper foil conductor 2 is different each other, each group all be provided with tin coating 3 on the copper foil conductor 2.
In the present embodiment, the thickness of the tin-plated layer 3 on each set of the copper foil wires 2 is the same or different.
In this embodiment, the tin plating layer 3 is provided with an oxidation preventing layer 4. In the electronics industry as a whole, the PCB is the most problematic in the tinning process and is a key process for influencing impedance. For the electronics industry, according to the interior investigation, the most fatal weaknesses of the chemical tin coating are that the chemical tin coating is easy to discolor (i.e. easy to oxidize or deliquesce), poor solderability causes poor soldering, high impedance causes poor conductivity or unstable performance of the whole board, and easy growth of tin whiskers causes short circuit of the PCB circuit to burn out or catch fire. Therefore, the tin coating 3 can be protected by the oxidation preventing layer 4, and the stability of the impedance of the PCB is kept.
The utility model discloses be applied to the technical field of PCB board.
While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.
Claims (3)
1. Multiunit impedance PCB board, including bottom plate (1), its characterized in that: the bottom plate (1) is provided with a plurality of groups of copper foil conducting wires (2), the thickness of each group of copper foil conducting wires (2) is the same, the line widths of the copper foil conducting wires (2) are different, and each group of copper foil conducting wires (2) is provided with a tin-plated layer (3).
2. The multi-impedance PCB of claim 1, wherein: the thickness of the tin coating (3) on each group of copper foil conducting wires (2) is the same or different.
3. The multi-impedance PCB of claim 1 or 2, wherein: and an anti-oxidation layer (4) is arranged on the tin coating (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920844419.3U CN210225876U (en) | 2019-06-05 | 2019-06-05 | Multi-group impedance PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920844419.3U CN210225876U (en) | 2019-06-05 | 2019-06-05 | Multi-group impedance PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210225876U true CN210225876U (en) | 2020-03-31 |
Family
ID=69930110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920844419.3U Active CN210225876U (en) | 2019-06-05 | 2019-06-05 | Multi-group impedance PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210225876U (en) |
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2019
- 2019-06-05 CN CN201920844419.3U patent/CN210225876U/en active Active
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