CN103209547A - Process for manufacturing boss printed board by means of addition process - Google Patents
Process for manufacturing boss printed board by means of addition process Download PDFInfo
- Publication number
- CN103209547A CN103209547A CN2012100134505A CN201210013450A CN103209547A CN 103209547 A CN103209547 A CN 103209547A CN 2012100134505 A CN2012100134505 A CN 2012100134505A CN 201210013450 A CN201210013450 A CN 201210013450A CN 103209547 A CN103209547 A CN 103209547A
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- CN
- China
- Prior art keywords
- boss
- addition process
- metal
- printed board
- manufacture craft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a process for manufacturing a boss printed board by means of an addition process. First, a base material is selected as an insulating base board; then, the insulating base board is sequentially subjected to cutting, drilling, hole passing, hole plugging and copper deposition returning/electroplating to form a copper coated board, namely one copper layer is respectively plated on the upper side face and the lower side face of the insulating base board; pattern transfer and etching/film stripping of the copper coated board are performed to obtain a printed circuit board (PCB) including a first step, and a metal boss is added on the first step of the PCB including the first step by means of the addition process. The process is simple and easy to manage and control. In addition, the boss printed board can be manufactured by using common thick copper, and the cost is greatly saved.
Description
Technical field
The present invention relates to a kind of field of acoustics that relates to, be mainly earphone or microphone on the mobile phone, relate in particular to a kind of addition process boss printed board manufacture craft.
Background technology
Electronic product trends towards microminiaturization, multifunctional direction development, and this just requires the PCB product also will constantly develop to microminiaturized, multifunction direction.
At present, etch partially technology for general employing of boss printed board, namely etch the boss that needs at thick copper, belong to subtractive process, its not only difficult control of complex process, and have a large amount of copper to be wasted.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of addition process boss printed board manufacture craft, this technology is simple, management and control easily not only, and can adopt the normal thick copper to do, and saves cost greatly.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of addition process boss printed board manufacture craft, at first choose base material as insulated substrate; Then described insulated substrate is carried out cutting, boring, perforation, consent successively, returns heavy copper/plating formation copper-clad plate, namely on the two sides up and down of described insulated substrate, plate the layer of copper layer respectively; Again described copper-clad plate is carried out that figure shifts and etching/move back the pcb board that film obtains containing first step, set up the metal boss in the described first step employing addition process that contains the pcb board of first step.
As a further improvement on the present invention, described addition process is set up the mode of metal boss for putting one of tin, spot welding and plating.
As a further improvement on the present invention, described some tin formula addition process set up the metal boss and be may further comprise the steps: at first do not need to set up metal boss place on the first step of the described pcb board that contains first step and add block ring, waiting that setting up metal boss place adopts the mode of paste solder printing or wicking to produce the metal boss, removes block ring at last again and gets final product then.
As a further improvement on the present invention, described spot welded type addition process is set up the metal boss and be may further comprise the steps: produce the metal works that requires shape, size and thickness at first as required, the mode that adopts spot welding then can form described metal boss with the assigned address that this metal works is welded on the first step on the described pcb board that contains first step.
As a further improvement on the present invention, described plating formula addition process is set up the metal boss and be may further comprise the steps: at first do not need to set up metal boss place on the first step of the described pcb board that contains first step and produce figure with the anti-plate material, waiting that by the mode of electrotinning or electro-coppering setting up metal boss place adds thickness coating then, form described metal boss, strip described plated material at last and get final product.
As a further improvement on the present invention, described first boss is Copper Foil.
As a further improvement on the present invention, the thickness of described metal boss is: 0.01-0.50mm.
As a further improvement on the present invention, the thickness deviation of described metal boss is ± 0.015mm.
The present invention also provides a kind of addition process boss printed board of adopting above-mentioned addition process boss printed board manufacture craft to obtain.
The invention has the beneficial effects as follows: this addition process boss printed circuit board technology is by technology such as micropore, high density buried via hole, welding resistance choked flow, literal choked flow, accurate control shape, high-accuracy tin, the control of some tin height, spot welding, the thick copper plating of figure, making the figure that has differing heights to reach on the same surface of PCB according to different demands, is the particularity product of a kind of SMD of collection port and functional PCB.It has the following advantages: 1. utilize the projection section of addition process boss fabrication techniques, can be directly be assembled on the electronic product as the nested parts of SMD, need not to install other Assembly part again; 2. than traditional contact pin method assembling, this manufacture method is simpler, convenient, the making of especially convenient back processing procedure, and from can mechanization producing in batches, improved the make efficiency of product greatly; 3. this product has better shield effectiveness, and performance is more reliable; 4. dwindle the volume of product, embodied small, accurate characteristics; 5. this product is cheaper than etching partially the boss product price, and technology is simpler, is convenient to control.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is structure for covering copper plate schematic diagram of the present invention;
Fig. 3 is the pcb board structural representation that contains first step of the present invention;
Fig. 4,5 sets up metal boss process schematic diagram for of the present invention some tin formula addition process;
Fig. 6 sets up metal boss process schematic diagram for spot welded type addition process of the present invention;
Fig. 7,8 sets up metal boss process schematic diagram for plating formula addition process of the present invention.
By reference to the accompanying drawings, make the following instructions:
1---insulated substrate 2---copper layer
3---first step 4---metal boss
5---block ring 6---metal works
7---the anti-plate material
Embodiment
A kind of addition process boss printed board manufacture craft is at first chosen base material as insulated substrate 1; Then described insulated substrate is carried out cutting, boring, perforation, consent successively, returns heavy copper/plating formation copper-clad plate, namely on the two sides up and down of described insulated substrate, plate layer of copper layer 2 (as shown in Figure 2) respectively; Again described copper-clad plate is carried out that figure shifts and etching/move back the pcb board (as shown in Figure 3) that film obtains containing first step 3, set up metal boss 4 in the described first step employing addition process that contains the pcb board of first step.
Preferably, above-mentioned addition process is set up the mode of metal boss for putting one of tin, spot welding and plating.
Preferably, above-mentioned some tin formula addition process set up the metal boss and be may further comprise the steps: at first do not need to set up metal boss place on the first step of the described pcb board that contains first step and add block ring 5 (as shown in Figure 4), waiting that setting up metal boss place adopts the mode of paste solder printing or wicking to produce metal boss (as shown in Figure 5), removes block ring at last again and gets final product then.
Preferably, above-mentioned spot welded type addition process is set up the metal boss and be may further comprise the steps: produce the metal works 6 that requires shape, size and thickness at first as required, the mode that adopts spot welding then can form described metal boss (as shown in Figure 6) with the assigned address that this metal works is welded on the first step on the described pcb board that contains first step.
Preferably, above-mentioned plating formula addition process is set up the metal boss and be may further comprise the steps: at first do not need to set up metal boss place on the first step of the described pcb board that contains first step and produce figure (as shown in Figure 7) with anti-plate material 7, waiting that by the mode of electrotinning or electro-coppering setting up metal boss place adds thickness coating then, form described metal boss (as shown in Figure 8), strip described plated material at last and get final product.
Preferably, above-mentioned first boss is Copper Foil.
Preferably, the thickness of above-mentioned metal boss is: 0.01-0.50mm.
Preferably, the thickness deviation of above-mentioned metal boss is ± 0.015mm.
A kind of addition process boss printed board of adopting above-mentioned addition process boss printed board manufacture craft to obtain.
Claims (9)
1. an addition process boss printed board manufacture craft is at first chosen base material as insulated substrate (1); Then described insulated substrate is carried out cutting, boring, perforation, consent successively, returns heavy copper/plating formation copper-clad plate, namely on the two sides up and down of described insulated substrate, plate layer of copper layer (2) respectively; Again described copper-clad plate is carried out that figure shifts and etching/move back the pcb board that film obtains containing first step (3), it is characterized in that: set up metal boss (4) in the described first step employing addition process that contains the pcb board of first step.
2. addition process boss printed board manufacture craft according to claim 1 is characterized in that: the mode that described addition process is set up the metal boss is point one of tin, spot welding and plating.
3. addition process boss printed board manufacture craft according to claim 2, it is characterized in that: described some tin formula addition process set up the metal boss and be may further comprise the steps: at first do not need to set up metal boss place on the first step of the described pcb board that contains first step and add block ring (5), waiting that setting up metal boss place adopts the mode of paste solder printing or wicking to produce the metal boss, removes block ring at last again and gets final product then.
4. addition process boss printed board manufacture craft according to claim 2, it is characterized in that: described spot welded type addition process is set up the metal boss and be may further comprise the steps: produce the metal works (6) that requires shape, size and thickness at first as required, the mode that adopts spot welding then can form described metal boss with the assigned address that this metal works is welded on the first step on the described pcb board that contains first step.
5. addition process boss printed board manufacture craft according to claim 2, it is characterized in that: described plating formula addition process is set up the metal boss and be may further comprise the steps: at first do not need to set up metal boss place on the first step of the described pcb board that contains first step and produce figure with anti-plate material (7), waiting that by the mode of electrotinning or electro-coppering setting up metal boss place adds thickness coating then, form described metal boss, strip described plated material at last and get final product.
6. according to each described addition process boss printed board manufacture craft in the claim 1 to 5, it is characterized in that: described first boss is Copper Foil.
7. according to each described addition process boss printed board manufacture craft in the claim 1 to 5, it is characterized in that: the thickness of described metal boss is: 0.01-0.50mm.
8. addition process boss printed board manufacture craft according to claim 7 is characterized in that: the thickness deviation of described metal boss is ± 0.015mm.
9. addition process boss printed board of adopting addition process boss printed board manufacture craft as claimed in claim 1 to obtain.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210013450.5A CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559439.2A CN105282984B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559276.8A CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210013450.5A CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559276.8A Division CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559439.2A Division CN105282984B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103209547A true CN103209547A (en) | 2013-07-17 |
| CN103209547B CN103209547B (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559439.2A Active CN105282984B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201210013450.5A Active CN103209547B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
| CN201510559276.8A Active CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559439.2A Active CN105282984B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510559276.8A Active CN105188271B (en) | 2012-01-17 | 2012-01-17 | Addition process boss printed board manufacture craft |
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| Country | Link |
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| CN (3) | CN105282984B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688716A (en) * | 2018-12-20 | 2019-04-26 | 广州陶积电电子科技有限公司 | A kind of wiring board and its manufacture craft with Lamp cup |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835564A (en) * | 2017-10-19 | 2018-03-23 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465216A (en) * | 2001-05-31 | 2003-12-31 | 三井金属鉱业株式会社 | Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| US20040198044A1 (en) * | 2003-04-04 | 2004-10-07 | Sheng-Chuan Huang | Stacking photoresist image transferring method for fabricating a packaging substrate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100274764B1 (en) * | 1991-11-29 | 2001-01-15 | 이사오 우치가사키 | Manufacturing method of the wiring board |
| JP2001111201A (en) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | Method of manufacturing wiring board and wiring board using the same |
| JP2002026475A (en) * | 2000-07-07 | 2002-01-25 | Mitsui Mining & Smelting Co Ltd | Copper foil circuit with carrier foil, method of manufacturing printed wiring board, using the same, and printed wiring board |
| US7140103B2 (en) * | 2001-06-29 | 2006-11-28 | Mitsubishi Gas Chemical Company, Inc. | Process for the production of high-density printed wiring board |
| JP3941463B2 (en) * | 2001-11-06 | 2007-07-04 | 凸版印刷株式会社 | Manufacturing method of multilayer printed wiring board |
| KR100797698B1 (en) * | 2005-09-27 | 2008-01-23 | 삼성전기주식회사 | Manufacturing method of high density printed circuit board |
-
2012
- 2012-01-17 CN CN201510559439.2A patent/CN105282984B/en active Active
- 2012-01-17 CN CN201210013450.5A patent/CN103209547B/en active Active
- 2012-01-17 CN CN201510559276.8A patent/CN105188271B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1465216A (en) * | 2001-05-31 | 2003-12-31 | 三井金属鉱业株式会社 | Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet |
| US20040198044A1 (en) * | 2003-04-04 | 2004-10-07 | Sheng-Chuan Huang | Stacking photoresist image transferring method for fabricating a packaging substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688716A (en) * | 2018-12-20 | 2019-04-26 | 广州陶积电电子科技有限公司 | A kind of wiring board and its manufacture craft with Lamp cup |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105282984B (en) | 2018-08-31 |
| CN103209547B (en) | 2015-11-25 |
| CN105188271B (en) | 2017-12-05 |
| CN105188271A (en) | 2015-12-23 |
| CN105282984A (en) | 2016-01-27 |
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Address after: 215341 No. 322, Hongyang Road, Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: JIANGSU PUNUOWEI ELECTRONIC Co.,Ltd. Address before: 215341 Private Development Zone (Nanwan Village), Qiandeng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN HWAYUNG ELECTRONICS Co.,Ltd. |
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