CN101951726A - Resistor built-in printing circuit board and manufacturing process thereof - Google Patents
Resistor built-in printing circuit board and manufacturing process thereof Download PDFInfo
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- CN101951726A CN101951726A CN2010102860432A CN201010286043A CN101951726A CN 101951726 A CN101951726 A CN 101951726A CN 2010102860432 A CN2010102860432 A CN 2010102860432A CN 201010286043 A CN201010286043 A CN 201010286043A CN 101951726 A CN101951726 A CN 101951726A
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- layer
- insulated substrate
- printed wiring
- metallic circuit
- circuit board
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Abstract
The invention discloses a resistor built-in printing circuit board and a manufacturing process thereof. A sprayed resistive layer which replaces a resistor on the surface of the circuit board is formed by the processes of shearing, circuit spraying, drilling, copper deposition perforation, electroplating and green oil spraying in turn; and the structure of a finished product comprises an insulation substrate, a metal circuit layer and an interlayer through hole, wherein the surface of the part, exposed from the metal circuit layer, of the insulation substrate is covered with an insulation printing ink layer; at least one pair of electrodes are formed in the metal circuit layer; the insulation substrate between each pair of electrodes is covered with the resistive layer; and each resistive layer extends to cover one of the two ends, which is close to the resistive layer, of the electrode. The product is wide in use; and a built-in resistor shortens the path of a signal to each element, reduces stray inductance, the crosstalk of the signal, the size of the circuit board, the weight of the product and welding spots on the circuit board, so that the product has the characteristics of precision, smallness, light weight and reliable signal and is suitable for requirement trends of the electronic products.
Description
Technical field
The present invention relates to the printed wiring board field, especially a kind of printed wiring board of embedded resistors and manufacture craft thereof.
Background technology
Electronic product trends towards microminiaturization, multifunctional direction development, and the electronic product in resistance field not only will satisfy this requirement, and the more important thing is the composite signal laser propagation effect that will satisfy components and parts, good function.
The resistance board product mostly is the separate type elements combination, has more components and parts to mount in the product, and lead involves, and volume is big, and the composite signal conversion effect of components and parts is poor.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of printed wiring board and manufacture craft thereof of embedded resistors, can realize embedded resistors, volume is little, integrated level is high.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of printed wiring board of embedded resistors, the hole wall that comprise insulated substrate, is formed at the metallic circuit layer on insulated substrate surface and corresponding conducting metallic circuit layer covers the interlayer conduction hole of metal level, the position that the metallic circuit layer is exposed on the insulated substrate surface is coated with the dielectric ink layer, be formed with at least one pair of electrode in this metallic circuit layer, each is to being coated with resistive layer on the insulated substrate between the electrode, and each resistive layer extend cover its two ends electrode near on the end of this resistive layer.
As a further improvement on the present invention, described resistive layer is the carbon oil rete, and its resistance is 1K～100K ohm.
A kind of manufacture craft of printed wiring board of embedded resistors in turn includes the following steps:
A, cut out: base material is cut out to appropriate size the total specification of this appropriate size after for the size amalgamation of producing the required insulated substrate of several embedded resistors printed wiring boards;
B, spraying circuit: each insulated substrate on the base material is carried out identical circuit spraying make, form the metallic circuit layer by spraying out conducting wire, pad and electrode on the insulated substrate surface, the metallic circuit layer that is sprayed is the copper layer;
C, boring: process location hole and interlayer conduction hole at each insulated substrate;
D, heavy copper perforation: on the hole wall in each interlayer conduction hole, deposit one deck colloid palladium by ion deposition, make on the palladium layer of hole wall through the migration of chemical electronics again to deposit the last layer chemical copper, thereby make two sides copper layer conducting;
E, plating: the copper layer on the insulated substrate is thickened the needed standard of client by electrolytic copper plating;
F, spray green oil: cook the green oil insulating barrier on the insulated substrate outside still being exposed to after above-mentioned steps, the exhausted layer of this green oil forms the dielectric ink layer of printed wiring board.
Having made during ordinary production generally also needs after the above steps carry out the gong plate by customer requirement again, and gong becomes the size of customer requirement, packs, transports, operation such as storage.
The invention has the beneficial effects as follows: the resistor that replaces PCB surface with the resistive layer of spraying, of many uses, for mounting resistor, embedded resistors the is brief path of signal to components and parts reduced stray inductance and reduced crosstalking of signal, and can reduce the size of wiring board again, alleviate product weight, simultaneously reduce solder joint on the wiring board again, made product have precision, small, frivolous, signal reliable characteristics, adapted to the demand trend of electronic product.
Description of drawings
Fig. 1 is an embedded resistors structural representation of the present invention;
Fig. 2 is that the A-A of Fig. 1 is to cross-sectional view.
Embodiment
Embodiment: a kind of printed wiring board of embedded resistors, the hole wall that comprise insulated substrate 1, is formed at the metallic circuit layer on insulated substrate 1 surface and corresponding conducting metallic circuit layer covers the interlayer conduction hole 2 of metal level, the position that the metallic circuit layer is exposed on the insulated substrate surface is coated with the dielectric ink layer, be formed with at least one pair of electrode 3 in this metallic circuit layer, each is to being coated with resistive layer 4 on the insulated substrate between the electrode 3, and each resistive layer 4 extend cover its two ends electrode 3 near on the ends of this resistive layer.
Described resistive layer 4 is the carbon oil rete, and its resistance is 1K～100K ohm.
A kind of manufacture craft of printed wiring board of embedded resistors in turn includes the following steps:
A, cut out: base material is cut out to appropriate size the total specification of this appropriate size after for the size amalgamation of producing the required insulated substrate 1 of several embedded resistors printed wiring boards;
B, spraying circuit: each insulated substrate 1 on the base material is carried out identical circuit spraying make, form the metallic circuit layer by spraying out conducting wire, pad and electrode 3 on insulated substrate 1 surface, the metallic circuit layer that is sprayed is the copper layer;
C, boring: process location hole and interlayer conduction hole 2 at each insulated substrate 1;
D, heavy copper perforation: on the hole wall in each interlayer conduction hole 2, deposit one deck colloid palladium by ion deposition, make on the palladium layer of hole wall through the migration of chemical electronics again to deposit the last layer chemical copper, thereby make two sides copper layer conducting;
E, plating: the copper layer on the insulated substrate is thickened the needed standard of client by electrolytic copper plating;
F, spray green oil: cook the green oil insulating barrier on the insulated substrate outside still being exposed to after above-mentioned steps, the exhausted layer of this green oil forms the dielectric ink layer of printed wiring board.
Having made during ordinary production generally also needs after the above steps carry out the gong plate by customer requirement again, and gong becomes the size of customer requirement, packs, transports, operation such as storage.
Claims (3)
1. the printed wiring board of an embedded resistors, the hole wall that comprise insulated substrate (1), is formed at the metallic circuit layer on insulated substrate (1) surface and corresponding conducting metallic circuit layer covers the interlayer conduction hole (2) of metal level, the position that the metallic circuit layer is exposed on the insulated substrate surface is coated with the dielectric ink layer, it is characterized in that: be formed with at least one pair of electrode (3) in this metallic circuit layer, each is to being coated with resistive layer (4) on the insulated substrate between the electrode (3), and each resistive layer (4) extend cover its two ends electrode (3) near on the end of this resistive layer.
2. the printed wiring board of embedded resistors according to claim 1, it is characterized in that: described resistive layer (4) is the carbon oil rete, and its resistance is 1K～100K ohm.
3. the manufacture craft of the printed wiring board of an embedded resistors as claimed in claim 1 is characterized in that: in turn include the following steps:
A, cut out: base material is cut out to appropriate size the total specification of this appropriate size after for the size amalgamation of producing the required insulated substrates of several embedded resistors printed wiring boards (1);
B, spraying circuit: each insulated substrate (1) on the base material is carried out identical circuit spraying make, form the metallic circuit layer by spraying out conducting wire, pad and electrode (3) on insulated substrate (1) surface, the metallic circuit layer that is sprayed is the copper layer;
C, boring: process location hole and interlayer conduction hole (2) at each insulated substrate (1);
D, heavy copper perforation: on the hole wall in each interlayer conduction hole (2), deposit one deck colloid palladium by ion deposition, make on the palladium layer of hole wall through the migration of chemical electronics again to deposit the last layer chemical copper;
E, plating: the copper layer on the insulated substrate is thickened by electrolytic copper plating;
F, spray green oil: cook the green oil insulating barrier on the insulated substrate outside still being exposed to after above-mentioned steps, the exhausted layer of this green oil forms the dielectric ink layer of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102860432A CN101951726A (en) | 2010-09-17 | 2010-09-17 | Resistor built-in printing circuit board and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102860432A CN101951726A (en) | 2010-09-17 | 2010-09-17 | Resistor built-in printing circuit board and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101951726A true CN101951726A (en) | 2011-01-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102860432A Pending CN101951726A (en) | 2010-09-17 | 2010-09-17 | Resistor built-in printing circuit board and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101951726A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112567483A (en) * | 2018-09-19 | 2021-03-26 | 贺利氏先进传感器技术有限公司 | Resistor device for surface mounting on a printed circuit board and printed circuit board provided with at least one resistor device |
| WO2023005691A1 (en) * | 2021-07-30 | 2023-02-02 | 长春捷翼汽车零部件有限公司 | Wiring harness production method, nozzle, and wiring harness |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379498A (en) * | 2001-03-30 | 2002-11-13 | 三洋电机株式会社 | Composite battery having internal breaker |
| CN1505461A (en) * | 2002-12-03 | 2004-06-16 | 叶清祥 | A method for manufacturing plated-through-hole non-formaldehyde electrolytic thick copper |
| CN101247699A (en) * | 2007-02-16 | 2008-08-20 | 财团法人工业技术研究院 | Circuit boards with embedded resistors |
| CN201797653U (en) * | 2010-09-17 | 2011-04-13 | 昆山华扬电子有限公司 | Printed wiring board of buried resistor |
-
2010
- 2010-09-17 CN CN2010102860432A patent/CN101951726A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1379498A (en) * | 2001-03-30 | 2002-11-13 | 三洋电机株式会社 | Composite battery having internal breaker |
| CN1505461A (en) * | 2002-12-03 | 2004-06-16 | 叶清祥 | A method for manufacturing plated-through-hole non-formaldehyde electrolytic thick copper |
| CN101247699A (en) * | 2007-02-16 | 2008-08-20 | 财团法人工业技术研究院 | Circuit boards with embedded resistors |
| CN201797653U (en) * | 2010-09-17 | 2011-04-13 | 昆山华扬电子有限公司 | Printed wiring board of buried resistor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112567483A (en) * | 2018-09-19 | 2021-03-26 | 贺利氏先进传感器技术有限公司 | Resistor device for surface mounting on a printed circuit board and printed circuit board provided with at least one resistor device |
| US11547000B2 (en) | 2018-09-19 | 2023-01-03 | Heraeus Nexensos Gmbh | Resistor component for surface mounting on a printed circuit board and printed circuit board with at least one resistor component arranged thereon |
| WO2023005691A1 (en) * | 2021-07-30 | 2023-02-02 | 长春捷翼汽车零部件有限公司 | Wiring harness production method, nozzle, and wiring harness |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110119 |