CN103887272B - Electronic module and its manufacture method - Google Patents
Electronic module and its manufacture method Download PDFInfo
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- CN103887272B CN103887272B CN201210566365.1A CN201210566365A CN103887272B CN 103887272 B CN103887272 B CN 103887272B CN 201210566365 A CN201210566365 A CN 201210566365A CN 103887272 B CN103887272 B CN 103887272B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention proposes a kind of electronic module and its manufacture method, and electronic module includes circuit board, electronic component, the first chip type conducting substrate, the first molding layer and the first conductive layer.The connection pad that circuit board has upper surface and is located at upper surface.Electronic component is installed on an upper, and is electrically connected with circuit board.First chip type conducting substrate is installed on connection pad, and is electrically connected with circuit board.First molding layer is located on upper surface, and coated electric components, the first chip type conducting substrate, connection pad and upper surface.First conductive layer is located on the first molding layer.First conductive layer has at least one first hole, and this opening can expose the top that the first chip type turns on substrate.Chip type conducting substrate is installed on circuit boards by the present invention as element, replaces the through-hole structure used in general circuit, can omit the fill process of relatively time-consuming connection hole drilling and metal material after molding.
Description
Technical field
The present invention relates to a kind of electronic module and its process, and comprise chip type conducting substrate particularly to one kind
Electronic module and its manufacture method.
Background technology
In the manufacture process of assist side or packaging technology, generally after molding, with laser or other techniques, by molding
The circuit that material removes to circuit board weld pad or to be connected, to form via, is further filled with metal material as circuit board weld pad
With the connection of the circuit in molding, or make can electrically conduct between the circuit of more than two-layer.The manufacturer of via at present
Method adopts machine drilling mostly（Mechanicaldrilling）Or laser drill（Laser drilling）.Afterwards, right
The inner side of via carries out the electroplates in hole（Plating through hole,PTH）, e.g. chemical plating（Chemical
plating）And plating（Electroplating）, so that can electrically conduct between circuit more than two-layer.
Pursue compact with product, the density of circuit board also and then increases, and dimensions are also less and less.So
And, during carrying out the electroplates in hole, more undersized via, more it is susceptible to turn on the situation of hole plug, may make
Bore portion must be turned on do not electroplate or occur situations such as plated thickness is uneven, in turn result in the internal existing defects of via.
Content of the invention
It is an advantage of the invention to provide a kind of electronic module, it has chip type conducting board structure.
It is a further object of the invention to provide a kind of manufacture method of electronic module, it is used for manufacturing above-mentioned electronics
Module.
For achieving the above object, the present invention proposes a kind of electronic module and its manufacture method, is characterized mainly in that with crystalline substance
Piece type turns on the connection of the circuit as molding surface for the substrate and circuit board line.
When circuit board surface carries out assembling parts, simultaneously by chip type conducting substrate mounting on the connection pad to be connected, connect
After molding, turn on surface in chip type, with laser or other techniques, remove part molding and led with exposing chip type
The metal gasket of logical substrate is so as to directly can connect with the follow-up circuit making in molding.
The present invention provide a kind of electronic module, this electronic module include circuit board, electronic component, chip type conducting substrate,
Molding layer and conductive layer.The connection pad that circuit board has upper surface and is located at upper surface.Electronic component is installed on an upper
And electric connection circuit board, and chip type conducting substrate is installed on connection pad and is electrically connected with circuit board.Molding layer cladding electricity
Subcomponent, chip type conducting substrate, connection pad and upper surface.Conductive layer cover molding layer and conductive layer have at least one hole with
Expose the top that chip type turns on substrate.
In an embodiment of the present invention, this electronic module also includes：
At least one solder, among this first hole, and is electrically connected with this first chip type conducting substrate；
At least one second chip type conducting substrate, is electrically connected with this solder；
One second molding layer, on this first conductive layer, and covers this second chip type conducting substrate and partly should
First conductive layer, and this second molding layer has at least one second hole to expose this second chip type conducting substrate；
One second conductive layer, covers on this second molding layer and this second chip type conducting substrate, and is electrically connected with
This second chip type turns on substrate, and this second conductive layer turns on substrate, this solder and this second crystalline substance by this first chip type
Piece type conducting electrical property of substrate connects this circuit board, this solder, this first chip type conducting substrate and the conducting of this second chip type
Electrical property of substrate insulate this first conductive layer.
In an embodiment of the present invention, to include one exhausted for this first chip type conducting substrate or this second chip type conducting substrate
Edge material layer and a metal column, this insulant surrounds this metal column.
In an embodiment of the present invention, this first chip type conducting substrate includes a hollow insulated column and a conductive material
Layer, this conductive material layer covers the inside side walls of this hollow insulated column.
In an embodiment of the present invention, this second chip type conducting substrate includes a hollow insulated column and a conductive material
Layer, this conductive material layer covers the inside side walls of this hollow insulated column.
In an embodiment of the present invention, this second conductive layer is an antenna diagram pattern layer, and this first conductive layer is a shielding
Metal level.
In an embodiment of the present invention, this electronic module also includes at least one side metal level, and this side metal level is located at
The side outer surface of this first molding layer, and it is electrically connected with this first conductive layer or this circuit board ground pad or this circuit board
Ground plane.
The present invention provides a kind of manufacture method of electronic module.First, provide circuit board, it has upper surface and is located at
The connection pad of upper surface.Afterwards, electronic component is set on an upper, and electronic component is electrically connected with circuit board.Come again, setting the
One chip type conducting substrate is on connection pad, and this first chip type conducting electrical property of substrate connects circuit board.Afterwards, form molding layer
On an upper, and this molding layer coated electric components, chip type conducting substrate, connection pad and plane.Come again, form conductive layer
On molding layer, and get out the first hole on the electrically conductive, to expose the top that the first chip type turns on substrate.
In an embodiment of the present invention, the manufacture method of this electronic module also includes：
Form at least one solder among this first hole；
Setting at least one second chip type conducting substrate connection is in this solder；
Heat this solder so that this second chip type conducting substrate is fixed on this solder, and electrically connect by this solder
Connect this first chip type conducting substrate；
Form one second molding layer on this first conductive layer, and this second molding layer coats this second chip type conducting base
Plate；
At least one second hole is got out on this second molding layer, and this second hole exposes the conducting of this second chip type
The top of substrate；And
Form one second conductive layer on this second molding layer and this second chip type conducting substrate, and electric connection should
Second chip type conducting substrate, this solder is electrically connected with this first chip type conducting substrate and this second chip type conducting base
Plate, and this second conductive layer turns on substrate, this solder and this first chip type conducting electrical property of substrate by this second chip type
Connect this circuit board, this first conductive layer be electrically insulated this first chip type conducting substrate, this second chip type conducting substrate with
This solder.
In an embodiment of the present invention, the manufacture method of this electronic module also includes：
Form at least one solder among this first hole；
Setting at least one second chip type conducting substrate connection is in this solder；
Heat this solder so that this second chip type conducting substrate is fixed on this solder, and electrically connect by this solder
Connect this first chip type conducting substrate；
Form one second molding layer on this first conductive layer, and this second molding layer coats this second chip type conducting base
Plate；
At least one second hole is got out on this second molding layer, and this second hole exposes the conducting of this second chip type
The top of substrate；And
Form one second conductive layer on this second molding layer and this second chip type conducting substrate, and electric connection should
Second chip type conducting substrate, this solder is electrically connected with this first chip type conducting substrate and this second chip type conducting base
Plate, and this second conductive layer turns on substrate, this solder and this first chip type conducting electrical property of substrate by this second chip type
Connect this circuit board, this first conductive layer be electrically insulated this first chip type conducting substrate, this second chip type conducting substrate with
This solder.
In sum, the invention provides a kind of electronic module and its manufacture method, this electronic module is in element assembling
During technique, chip type conducting substrate is installed on circuit boards as element, replace the via knot used in general circuit
Structure, can omit the fill process of relatively time-consuming connection hole drilling and metal material after molding.Because chip type conducting substrate is one
Complete conductive structure, therefore can reduce the chance of via internal flaw formation so that the turn-on effect of circuit board is lifted.
For enabling feature and the technology contents being further understood that the present invention, refer to below in connection with the present invention specifically
Bright and accompanying drawing, but these explanations and accompanying drawing are only used for the present invention is described, rather than any limit is made to the interest field of the present invention
System.
Brief description
Fig. 1 is the generalized section of the electronic module of one embodiment of the invention.
Figure 1A to Fig. 1 F is the manufacture method schematic diagram of the electronic module in Fig. 1.
Fig. 1 G is the generalized section of the electronic modular unit of one embodiment of the invention.
Fig. 2A is the generalized section of the electronic module of another embodiment of the present invention.
Fig. 2 B is the generalized section of the electronic modular unit of another embodiment of the present invention.
Wherein, description of reference numerals is as follows：
1st, 2 electronic module
1 ', 2 ' electronic modular unit
110 circuit boards
112 upper surfaces
114 connection pads
120 electronic components
130 first chip type conducting substrates
132 first metal columns
134 first insulation material layers
140 first molding layers
150 first conductive layers
152 first holes
154th, 154 ' side metal level
210 solders
220 second chip type conducting substrates
222 second metal columns
224 second insulation material layers
230 second molding layers
232 second holes
240 second conductive layers
300 laser beams
Specific embodiment
Fig. 1 is the generalized section of the electronic module 1 of one embodiment of the invention.Refer to Fig. 1, electronic module 1 includes electricity
Road plate 110, at least one electronic component 120, at least one the first chip type conducting substrate 130, first molding floor 140, first
Conductive layer 150, at least one solder 210, at least one second chip type conducting substrate 220, the second molding layer 230 and second are led
Electric layer 240.Circuit board 110 has upper surface 112 and at least one connection pad 114.First chip type conducting substrate 130 is installed in and connects
On pad 114, electronic component 120 and the first chip type conducting substrate 130 are electrically connected with circuit board 110.Circuit board 110
Printed circuit board (PCB) in this way（Printed circuit board,PCB）, double-sided wiring board（Double side wiring
board）, multilayer circuit board（Multilayer wiring board）.When circuit board 110 is multilayer circuit board, electronic component
120 are arranged on the outer-layer circuit layer of circuit board 110, and are electrically connected with this outer-layer circuit layer, and in circuit board 110 at least
Through hole is can use between two-layer line layer（Through hole）Or blind hole（Blind hole）To be electrically connected with.The present invention is not
For the method for electrical communication between the number of plies of the line layer that limiting circuit plate 110 has and line layer.In addition, electronics is first
Part 120 can be active member, e.g. bare crystalline（Die）Or the chip after encapsulation（Packagedchip）, and electronic component 120
Can also be passive device, e.g. resistor, inducer or capacitor.
First chip type conducting substrate 130 can further include the first metal column 132 and the first insulation material layer 134, and first
Insulation material layer 134 can coat the first metal column 132.First chip type conducting substrate 130 can also be hollow insulated column and
There is conductive material and cover the inside side walls in hollow insulated column.In addition, the first chip type conducting substrate 130 can also be metal
Post but be not surrounded by insulator materials.
First molding layer 140 coated electric components 120, the first chip type conducting substrate 130, connection pad 114 and upper surface
112.First chip type turn on substrate 130 height can ratio in multiple electronic components 120, the height of highest electronic component 120
Come high.And the height of the first molding layer 140 slightly above the first chip type turns on the height of substrate 130.
First conductive layer 150 covers above the first molding layer 140, and the first conductive layer 150 have at least one
One hole 152.Specifically, the quantity of the first hole 152 can correspond to the quantity that the first chip type turns on substrate 130.Namely
Say, multiple first holes 152 can expose the top that each first chip type turns on substrate 130.Additionally, the first hole 152
Size can turn on the size of the first metal column 132 in substrate 130 more than the first chip type, so that the first chip type conducting substrate
130 and first conductive layer 150 be electrically insulated.In addition, the first conductive layer 150 can be as the shielding construction of electromagnetic interference, to keep away
Exempting from outside electromagnetic interference affects the running of electronic module 1 internal electronic element 120, reduces electromagnetic interference to the electronics unit in running
The influence degree of part 120.
Solder 210 is located among the first hole 152, and is electrically connected with the first chip type conducting substrate 130.Solder 210
Quantity can correspond to the quantity of the first hole 152 and the first chip type turns on the quantity of substrate 130, i.e. each first chip type
The top of conducting substrate 130 can have a solder 210.Additionally, the volume of solder 210 can be less than the volume of the first hole 152,
So that solder 210 and the first conductive layer 150 are electrically insulated.Second chip type turns on the top that substrate 220 is located at solder 210, and
And it is electrically connected with solder 210.Generally speaking, the first chip type conducting substrate 130 can be by solder 210 and the conducting of the second chip type
Substrate 220 is electrically connected with so that the first chip type conducting substrate 130, solder 210 and the second chip type turn on substrate 220 shape
Become a whole conductor, and be electrically insulated with the first conductive layer 150.
The structure of the second chip type conducting substrate 220 and the first chip type conducting substrate 130 are roughly the same, the second chip type
Conducting substrate 220 includes the second metal column 222 and the second insulation material layer 224, and the second insulation material layer 224 can coat second
The surface of metal column 222.Additionally, the quantity of electronic component 120 is two in FIG, first, second chip type conducting substrate
130th, the quantity of 220, connection pad 114 and solder 210 is all three, however, the present embodiment do not limit electronic component 120, first,
Second chip type turns on the quantity of substrate 130,220, connection pad 114 and solder 210.
First chip type turns on substrate 130, the second chip type turns on substrate 220 itself and is complete conductive structure, can
With the via being substituted in traditional circuit-board.So, via need not be got out, also via need not be electroplated, therefore
Conducting in the hole conductive materials filling can be reduced uneven, and affect the situation of conductive effect.
Second molding layer 230 is located at the top of the first conductive layer 150, covers the first conductive layer 150 and the second chip type
Conducting substrate 220, and the height of the second molding layer 230 can be slightly above the height that the second chip type turns on substrate 220.Additionally, by
In solder 210 volume be less than the first hole 152 volume, so the second molding layer 230 can by the first hole 152 remaining
Volume is connected with the first molding layer 140, and the first molding layer 140 and the second molding layer 230 connect the overall molding of formation one
The first chip type conducting substrate 130, solder 210 and the second chip type conducting substrate 220 is surrounded during body.
In addition, the material of the first molding layer 140, the second molding layer 230 is all insulant, and the first molding layer 140 with
And second the material of molding layer 230 can be same or like material, for example both are epoxy resin (Epoxy Resin).Cause
This, the first molding layer 140 and the second molding layer 230 can make the first chip type conducting substrate 130, solder 210 and second
Chip type conducting substrate 220 is electrically insulated the first conductive layer 150.
In addition, the second molding layer 230 further includes at least one second hole 232.The quantity of the second hole 232 can correspond to second
Chip type turns on the quantity of substrate 220, and that is, multiple second holes 232 can expose each second chip type conducting substrate 220
Top.Second conductive layer 240 covers the second molding layer 230 and the second chip type conducting substrate 220, and is electrically connected with second
Chip type turns on the second metal column 222 of substrate 220.Second conductive layer 240 can turn on substrate 130, weldering by the first chip type
Material 210 and the second chip type conducting substrate 220 are electrically connected with circuit board 110.
Second conductive layer 240 can be antenna diagram pattern layer, using the antenna as electronic module 1, and in order to transmitting/receiving wireless signal.
Turn on substrate 130 because the second conductive layer 240 can turn on substrate 220, solder 210 and the first chip type by the second chip type
It is electrically connected with circuit board 110, the wireless signal that the therefore second conductive layer 240 is received can reach circuit board 110, and passes through
Circuit on circuit board 110 is transferred to electronic component 120.Now, the second molding layer 230 can as the first conductive layer 150 with
And second insulating barrier between conductive layer 240, to avoid producing electromagnetic interference between electromagnetic armouring structure and antenna pattern.
However, the molding layer between the first conductive layer 150 and the second conductive layer 240 can produce the effect of electric capacity, can
Can lead to parasitic capacitance, and then affect the efficiency of electronic module 1.Therefore, the second molding layer 230 and the conducting of the second chip type
Material selected by the height of substrate 220 and the second molding layer 230 can regard the design of antenna stack and the application of electronic module 1
Field being designed, to reduce the impact of parasitic capacitance.
The above is the structure of electronic module 1, next will introduce the manufacture method of electronic module 1.Figure 1A to Fig. 1 G
Manufacture method schematic diagram for the electronic module 1 in Fig. 1.Refer to Figure 1A, first, provide circuit board 110.Circuit board 110 has
There are upper surface 112 and connection pad 114, and connection pad 114 is exposed to upper surface 112.Come again, surface adhering technical can be passed through
Electronic component 120 and the first chip type conducting substrate 130 are arranged at connection pad 114 by (Surface Mount Technology)
On, to be electrically connected with circuit board..And the height that the first chip type turns on substrate 130 can exceed highest electronics unit on circuit board 110
The height of part 120.
In other embodiments, electronic component 120 can use flip（Flip chip）Or routing engages
（Wirebonding）Mode be fixed on upper surface 112.In addition, the first chip type conducting substrate 130 can be with the first insulation
Layer 134, around cladding the first metal column 132.But, the first chip type conducting substrate 130 can also be the interior of hollow insulated column
Side side wall has metal material cover layer.Additionally, the first chip type conducting substrate 130 can also be to cut existing printed circuit board (PCB)
(PCB) making.
Next, referring to Figure 1B, form the first molding layer 140 on circuit board 110, the first molding layer 140 can cover
Electronic component 120, the first chip type conducting substrate 130, connection pad 114 and upper surface 112.Afterwards, form the first conductive layer 150
On the first molding layer 140.First conductive layer 150 can be used as the shielding construction of the anti-electromagnetic interference of electronic module 1.Refer to figure
1C, then come, turn on the position of substrate 130 in corresponding first chip type, to the first conductive layer 150 and the first molding layer 140
Holed using laser or other drilling technique, to form the first hole 152, and exposed the first chip type conducting substrate
130 top.
Then, refer to Fig. 1 D, in each first hole 152, form solder 210, and existed using e.g. SMT technology
Second chip type conducting substrate 220 is arranged on each solder 210.Afterwards, heating solder 210 is so that the second chip type turns on base
Plate 220 is fixed on solder 210, and is electrically connected with the first chip type conducting substrate 130 by solder 210.
Second chip type turns on structure and manufacture and the first chip type conducting substrate 130 substantially phase of substrate 220
With here does not repeat.In addition, different from known techniques, must be led in the electroplates in hole mode in upper and lower two molding layers
The practice of logical two-layer Above Transmission Lines, the first chip type conducting substrate 130 in the present invention and the second chip type conducting substrate 220
For complete conductive structure, so being not required to adopt the electroplates in hole, there will not be the uneven situation of the internal plating of via and occurring.
Refer to Fig. 1 E, afterwards, form the second molding layer 230 on the first conductive layer 150.Second molding layer 230 can wrap
Cover the second chip type conducting substrate 220, and fill the first hole 152 so that the first chip type turns on substrate 130, solder 210
And second chip type conducting substrate 220 and the first conductive layer 150 be electrically insulated.Afterwards, in corresponding second chip type conducting base
On the position of plate 220, the second molding layer 230 is holed, to form the second hole 232, and expose the second chip type and lead
The top of logical substrate 220.
Please referring next to Fig. 1 F, form the second conductive layer 240 on the second molding layer 230, and the second conductive layer 240 is electrical
Turn on the second chip type conducting substrate 220, and substrate 220, solder 210 and the first chip type are turned on by the second chip type and lead
Logical substrate 130 is electrically connected with circuit board 110.Afterwards, the second conductive layer 240 can be patterned to form antenna diagram pattern layer.At it
In its embodiment, antenna diagram pattern layer, e.g. pattern masking can be formed while forming the second conductive layer 240 in the lump
(mask) collocation metal spraying.
Fig. 1 G is the generalized section of the electronic modular unit 1 ' of one embodiment of the invention.Please refer to Fig. 1 F and figure
1G, electronic module 1 can cut into small-sized electronic modular unit 1 ' again according to actual demand.As shown in fig. 1f, electronic module 1
Can be to be cut using the mode of laser beam 300, to form multiple electronic modular unit 1 '（As shown in Figure 1 G）.
Refer to Fig. 1 G, side metal level 154 can be formed in the side of electronic modular unit 1 ' again according to actual demand afterwards
Side outer surface.This side metal level 154 can and the first conductive layer 150 be electrically connected with, and can extend to the second molding layer 230,
First molding layer 140 and the side of circuit board 110.In addition, side metal level 154 can be with the ground mat of circuit board 110（In figure
Do not show）Or ground plane（In figure is not shown）It is connected, to form metal masking structure.In addition, side metal level 154 can and the
Two conductive layers 240 are electrically insulated.
The method forming side metal level 154 includes being formed shielding layer above the second conductive layer 240（In figure is not shown）,
E.g. ink layer, covers the second conductive layer 240 and the second molding layer 230, to protect the second conductive layer 240 and the second mould
Sealing 230.Come again, it is possible to use sputter（Sputtering）, printing（Printing）Or spraying（Spraying）Exist etc. mode
The side of electronic modular unit 1 ' forms side metal level 154.Because ink layer can protect the second conductive layer 240 and the second mould
Sealing 230, the metal of spraying will not touch the second conductive layer 240 and the second molding layer 230, the therefore second conductive layer 240
Can be electrically insulated with side metal level 154.After side metal level 154 is formed, then ink layer is removed.
The technological core of the present invention is to be replaced in prior art and filled using borehole again using chip type conducting substrate
The via method of metal.
Fig. 2A is the generalized section of another embodiment of the present invention electronic module 2.Refer to Fig. 2A, electronic module 2 only wraps
Containing circuit board 110, at least one electronic component 120, at least one first chip type conducting substrate 130, the first molding layer 140 with
And first conductive layer 150.And the structure of electronic module 2 is substantially identical with electronic module 1 understructure, here does not repeat.
Fig. 2 B is the generalized section of the electronic modular unit 2 ' of another embodiment of the present invention.Electronic modular unit 2 ' is
Electronic module 2 cuts into small-sized electronic modular unit 2 ' again according to actual demand.And can be in electronic modular unit 2 '
Side forms side metal level 154 ', and this side metal level 154 ' electrically can connect with the first conductive layer 150 and circuit board 110
Connect, to form an ELECTROMAGNETIC OBSCURANT structure.Additionally, the structure of electronic modular unit 2 ' is substantially identical with electronic module 2 understructure,
Here does not repeat.
In sum, the invention provides a kind of electronic module and its manufacture method, chip type is led by this electronic module
Logical substrate is installed on circuit boards as element, and in order to connect antenna diagram pattern layer and circuit board.This kind of chip type conducting
Substrate is complete conductive structure, therefore can replace the through-hole structure used in general circuit, therefore the present invention need not bore
Go out via, also via need not be electroplated, the chance that therefore can reduce the formation of via internal flaw is so that circuit
The turn-on effect lifting of plate.
The foregoing is only embodiments of the invention, it is not limited to scope of the presently claimed invention.Any
Field those of ordinary skill in the equivalence replacement without departing from the change in spirit and scope of the invention, made and retouching, still for
In scope of the presently claimed invention.
Claims (10)
1. a kind of electronic module is it is characterised in that this electronic module includes：
One circuit board, has a upper surface and at least one connection pad being exposed to this upper surface；
At least one electronic component, is installed in this upper surface and is electrically connected with this circuit board；
At least one first chip type conducting substrate, is installed on this connection pad, and is electrically connected with this circuit board；
One first molding layer, coats this electronic component, this first chip type conducting substrate, this connection pad and this upper surface, wherein
The height of this first molding layer is higher than the height that this first chip type turns on substrate；And
One first conductive layer, covers this first molding layer, and has at least one first hole, and this first hole expose this
One chip type turns on the top of substrate.
2. electronic module as claimed in claim 1 is it is characterised in that this electronic module also includes：
At least one solder, among this first hole, and is electrically connected with this first chip type conducting substrate；
At least one second chip type conducting substrate, is electrically connected with this solder；
One second molding layer, on this first conductive layer, and cover this second chip type conducting substrate and part this first
Conductive layer, and this second molding layer has at least one second hole to expose this second chip type conducting substrate；
One second conductive layer, covers on this second molding layer and this second chip type conducting substrate, and be electrically connected with this
Two chip type conducting substrates, this second conductive layer turns on substrate, this solder and this second chip type by this first chip type
Conducting electrical property of substrate connects this circuit board, this solder, this first chip type conducting substrate and this second chip type conducting substrate
Be electrically insulated this first conductive layer.
3. electronic module as claimed in claim 2 is it is characterised in that this first chip type turns on substrate or this second chip type
Conducting substrate includes an insulation material layer and a metal column, and this insulant surrounds this metal column.
4. electronic module as claimed in claim 1 is it is characterised in that this first chip type conducting substrate includes a hollow insulation
Post and a conductive material layer, this conductive material layer covers the inside side walls of this hollow insulated column.
5. electronic module as claimed in claim 2 is it is characterised in that this second chip type conducting substrate includes a hollow insulation
Post and a conductive material layer, this conductive material layer covers the inside side walls of this hollow insulated column.
6. electronic module as claimed in claim 2 is it is characterised in that this second conductive layer is an antenna diagram pattern layer, and this
One conductive layer is a shielding metal level.
7. electronic module as claimed in claim 1 is it is characterised in that this electronic module also includes at least one side metal level,
Described side metal level is located at the side outer surface of this first molding layer, and is electrically connected with this first conductive layer or this circuit board
Ground mat or the ground plane of this circuit board.
8. a kind of manufacture method of electronic module is it is characterised in that the manufacture method of this electronic module includes：
One circuit board is provided, there is a upper surface and at least one connection pad；
Setting at least one electronic component is in this upper surface, and this electronic component is electrically connected with this circuit board；
Setting at least one first chip type conducting substrate is on this connection pad, and this first chip type conducting electrical property of substrate connects this electricity
Road plate；
Form one first molding layer in this upper surface, this first molding layer coats this electronic component, this first chip type conducting base
Plate, this connection pad and part this on plane, wherein the height of this first molding layer be higher than this first chip type turn on substrate height
Degree；
Form one first conductive layer on this first molding layer；And
At least one first hole is got out on this first conductive layer, and this first hole exposes this first chip type conducting substrate
Top.
9. the manufacture method of electronic module as claimed in claim 8 is it is characterised in that the manufacture method of this electronic module is also wrapped
Include：
Form at least one solder among this first hole；
Setting at least one second chip type conducting substrate connection is in this solder；
Heat this solder so that this second chip type conducting substrate is fixed on this solder, and should by the electric connection of this solder
First chip type conducting substrate；
Form one second molding layer on this first conductive layer, and this second molding layer coats this second chip type conducting substrate；
At least one second hole is got out on this second molding layer, and this second hole exposes this second chip type conducting substrate
Top；And
Formed one second conductive layer in this second molding layer and this second chip type conducting substrate on, and be electrically connected with this second
Chip type turns on substrate, and this solder is electrically connected with this first chip type conducting substrate and this second chip type conducting substrate, and
This second conductive layer turns on substrate, this solder and the conducting electrical property of substrate connection of this first chip type by this second chip type should
Circuit board, this first conductive layer is electrically insulated, and this first chip type turns on substrate, this second chip type turns on substrate and this solder.
10. electronic module as claimed in claim 9 manufacture method it is characterised in that the manufacture method of this electronic module also
Including after forming this second conductive layer, pattern this second conductive layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210566365.1A CN103887272B (en) | 2012-12-24 | 2012-12-24 | Electronic module and its manufacture method |
| CN201710032612.2A CN107068647B (en) | 2012-12-24 | 2012-12-24 | Electronic module and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210566365.1A CN103887272B (en) | 2012-12-24 | 2012-12-24 | Electronic module and its manufacture method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710032612.2A Division CN107068647B (en) | 2012-12-24 | 2012-12-24 | Electronic module and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103887272A CN103887272A (en) | 2014-06-25 |
| CN103887272B true CN103887272B (en) | 2017-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210566365.1A Active CN103887272B (en) | 2012-12-24 | 2012-12-24 | Electronic module and its manufacture method |
| CN201710032612.2A Active CN107068647B (en) | 2012-12-24 | 2012-12-24 | Electronic module and method for manufacturing the same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201710032612.2A Active CN107068647B (en) | 2012-12-24 | 2012-12-24 | Electronic module and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107765920B (en) * | 2017-10-26 | 2020-01-14 | 惠科股份有限公司 | Signal transmission device and display device |
| CN118056275A (en) * | 2022-09-15 | 2024-05-17 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board connection structure and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324416A (en) * | 2010-09-16 | 2012-01-18 | 日月光半导体制造股份有限公司 | Integrate the semiconductor package part of screened film and antenna |
| CN102412197A (en) * | 2010-09-22 | 2012-04-11 | 新科金朋有限公司 | Semiconductor device and method of forming conductive tsv with insulating annular ring |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7198987B1 (en) * | 2004-03-04 | 2007-04-03 | Skyworks Solutions, Inc. | Overmolded semiconductor package with an integrated EMI and RFI shield |
| US7838337B2 (en) * | 2008-12-01 | 2010-11-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming an interposer package with through silicon vias |
| CN101937905B (en) * | 2010-08-23 | 2012-09-05 | 日月光半导体制造股份有限公司 | Semiconductor encapsulating part and manufacture method thereof |
-
2012
- 2012-12-24 CN CN201210566365.1A patent/CN103887272B/en active Active
- 2012-12-24 CN CN201710032612.2A patent/CN107068647B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324416A (en) * | 2010-09-16 | 2012-01-18 | 日月光半导体制造股份有限公司 | Integrate the semiconductor package part of screened film and antenna |
| CN102412197A (en) * | 2010-09-22 | 2012-04-11 | 新科金朋有限公司 | Semiconductor device and method of forming conductive tsv with insulating annular ring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107068647B (en) | 2021-02-09 |
| CN103887272A (en) | 2014-06-25 |
| CN107068647A (en) | 2017-08-18 |
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