CN202160338U - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN202160338U CN202160338U CN2011201982911U CN201120198291U CN202160338U CN 202160338 U CN202160338 U CN 202160338U CN 2011201982911 U CN2011201982911 U CN 2011201982911U CN 201120198291 U CN201120198291 U CN 201120198291U CN 202160338 U CN202160338 U CN 202160338U
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- 239000004020 conductor Substances 0.000 claims abstract description 144
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000010410 layer Substances 0.000 claims description 217
- 239000002184 metal Substances 0.000 claims description 120
- 229910052751 metal Inorganic materials 0.000 claims description 120
- 230000004888 barrier function Effects 0.000 claims description 69
- 230000001936 parietal effect Effects 0.000 claims description 65
- 239000011247 coating layer Substances 0.000 claims description 52
- 239000012774 insulation material Substances 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 8
- 239000011469 building brick Substances 0.000 claims 2
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- 238000007772 electroless plating Methods 0.000 description 2
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- 239000005030 aluminium foil Substances 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
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Images
Abstract
The utility model relates to a circuit board, including a first base plate, a second base plate and a bond line of connecting between first base plate and second base plate. The first substrate includes a first insulating layer, at least one first conductive layer, and a first mesh structure disposed in the first insulating layer. The first insulating layer has a first upper surface, a first lower surface opposite to the first upper surface, and at least one first through hole. The first through hole partially exposes the first mesh structure, and the first conductive layer is disposed on the first lower surface. The second substrate includes a second insulating layer, two circuit layers and at least one conductive wall layer. The second insulating layer is arranged between the circuit layers and is provided with a notch communicated with the first through hole. The conductor wall layer covers the side walls of the notch. The utility model provides a circuit board can block external environment's foreign matter and enter into to the notch in from the through-hole to protect electronic component to avoid receiving the damage of foreign matter, be suitable for very much the practicality.
Description
Technical field
The utility model relates to a kind of wiring board, and particularly relates to a kind of wiring board with network structure (netstructure).
Background technology
(Microelectromechanical System, MEMS) technology has developed and an a kind of micro-electro-mechanical microphone device and a pressure-sensing device existing MEMS.No matter be present micro-electro-mechanical microphone device and pressure-sensing device, the both comprises a wiring board and a chip of micro-electro-mechanical system (MEMS chip).Wiring board has the through hole that a chamber (chamber) and is communicated with chamber and external environment, and chip of micro-electro-mechanical system installing (mounted) is in chamber.
In the micro-electro-mechanical microphone device, the sound that through hole can transmit the environment that comes from the outside so that chip of micro-electro-mechanical system receives sound, thereby converts tones into electric energy to chamber.In pressure-sensing device, through hole can make chip of micro-electro-mechanical system can sense the air pressure change in the environment.Yet, no matter be micro-electro-mechanical microphone device and pressure-sensing device, the foreign matter of external environment (foreign object), for example the dust or the spittle (spit) all might enter in the chamber from through hole, cause chip of micro-electro-mechanical system to be damaged.
Summary of the invention
The utility model provides a kind of wiring board, and it has the network structure that can stop that foreign matter gets into.
The utility model proposes a kind of wiring board, and it comprises one first substrate, one second substrate and an adhesive layer.First substrate comprises that one first insulating barrier, at least one first conductor layer and are distributed in first network structure in first insulating barrier, and wherein first insulating barrier has first lower surface and at least one first through hole that is exposed to first upper surface and first lower surface of one first upper surface, relative first upper surface.First through hole is local to expose first network structure, and first conductor layer is configured on first lower surface.Second substrate comprises one second insulating barrier, two line layers and at least one conductor parietal layer.Second insulating barrier has second lower surface and at least one notch that is exposed to second lower surface of one second upper surface, relative second upper surface, wherein these line layers be configured in respectively on second upper surface with second lower surface on.Notch is communicated with first through hole, and local exposure first substrate, and the conductor parietal layer covers a sidewall of notch.Adhesive layer is connected between first substrate and second substrate, and the position is between second upper surface and first lower surface.
In the utility model one embodiment, the quantity of above-mentioned first conductor layer is two, and these first conductor layers be configured in respectively on first upper surface with first lower surface on.
In the utility model one embodiment, above-mentioned first conductor layer is one to cover the metal level or a local metal pattern layer that covers this first lower surface of this first lower surface comprehensively.
In the utility model one embodiment, above-mentioned first conductor layer comprises at least one becket that centers on first through hole.
In the utility model one embodiment, above-mentioned wiring board more comprises at least one conductor pin that runs through first substrate and second substrate, and wherein conductor pin connects wherein a line layer and first conductor layer.
In the utility model one embodiment, above-mentioned second substrate more comprises at least one conductor pin that is configured in second insulating barrier, and conductor pin is connected between these line layers.
In the utility model one embodiment, above-mentioned conductor pin is a solid metal column, and comprise one have a perforation metal cylinder and fill up the filler of perforation.
In the utility model one embodiment, above-mentioned first substrate more comprises at least one metal parietal layer, and the metal parietal layer covers a hole wall of first through hole.
In the utility model one embodiment, above-mentioned first substrate more comprises at least one local covering first cancellated metal coating layer, and metal coating layer position is in first through hole.
In the utility model one embodiment, above-mentioned metal coating layer electrically connects first conductor layer.
In the utility model one embodiment, above-mentioned first insulating barrier comprises two insulation material layers, and first network structure is interposed between these insulation material layers.
In the utility model one embodiment, above-mentioned wiring board more comprises a support plate and a plurality of solder bump.Support plate comprises line layer on, once line layer and is configured in the 3rd insulating barrier between line layer and the line layer.These solder bumps connect upward line layer and wherein a line layer, so that the second substrate position is between first substrate and support plate.
In the utility model one embodiment, above-mentioned support plate comprises that more one is distributed in second network structure in the 3rd insulating barrier, and the 3rd insulating barrier has second through hole of at least one connection notch.Local second network structure that exposes of second through hole.
In the utility model one embodiment, above-mentioned support plate more comprises at least one metal parietal layer, and the metal parietal layer covers a hole wall of second through hole.
In the utility model one embodiment, above-mentioned support plate more comprises at least one local covering second cancellated metal coating layer, and metal coating layer position is in second through hole.
In the utility model one embodiment, above-mentioned metal coating layer electrically connects goes up line layer and line layer.
In the utility model one embodiment, above-mentioned the 3rd insulating barrier comprises two insulation material layers, and second network structure is interposed between these insulation material layers.
In the utility model one embodiment, above-mentioned wiring board more comprises at least one electronic component that is installed on the support plate, and wherein line layer and electrically connect to be gone up in the electronic component position in notch.
In the utility model one embodiment, the above-mentioned conductor parietal layer contact adhesive layer and first substrate.
Based on above-mentioned; The network structure that the utility model wiring board is had (for example first network structure) can stop that the foreign matter (for example being the dust or the spittle) of external environment enters in the notch from through hole (for example first through hole), thereby the protection electronic component avoids receiving the damage of foreign matter.
For letting the above-mentioned feature and advantage of the utility model can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended graphicly, elaborates as follows.
Description of drawings
Fig. 1 is the generalized section of the wiring board of the utility model one embodiment.
Fig. 2 A is the generalized section of the wiring board of another embodiment of utility model.
Fig. 2 B is the sketch map of watching along direction Y among Fig. 2 A.
Fig. 3 is the generalized section of the wiring board of another embodiment of the utility model.
[main element symbol description]
100,200,300 wiring boards, 110,210,310 first substrates
111,311 first insulating barrier 111b, 311b first lower surface
111t, 311t first upper surface 112,212 first conductor layers
113,313 first network structures, 114,144,314,344 metal parietal layers
115,145,315,345 metal coating layers, 120,220 second substrates
121 second insulating barrier 121b, second lower surface
121t second upper surface 122 line layers
124 conductor parietal layers, 126,226,270,370 conductor pins
130 adhesive layers, 140,340 support plates
141,341 the 3rd insulating barrier 142t go up line layer
142b line layer 143,343 second network structure
150 solder bumps, 160,260 electronic components
212a becket 226a, 272 metal cylinder
226b, 274 filler 311a, 341a insulation material layer
H1, H2 perforation L1 mesh
L2 line footpath R1 radius
S11 notch T11, T31 first through hole
T12, the T32 second through hole W11, W14, W31, W34 hole wall
The W12 sidewall
Embodiment
For further setting forth technological means and the effect that the utility model is taked, below in conjunction with accompanying drawing and preferred embodiment, to embodiment, structure, characteristic and the effect thereof of the wiring board that proposes according to the utility model, specify as after.
Fig. 1 is the generalized section of the wiring board of the utility model one embodiment.See also Fig. 1, the wiring board 100 of present embodiment comprises one first substrate 110, one second substrate 120 and an adhesive layer 130.Adhesive layer 130 is connected between first substrate 110 and second substrate 120, and for example is the glue material of resinous composition.So adhesive layer 130 can be the film (prepreg) that solidifies (cured), and can be the film of pressing (laminating) semi-solid preparation or be coated with liquid glue material and form.
These first conductor layers 112 can be all metal level.Wherein one deck first conductor layer 112 covers the first upper surface 111t comprehensively, and another layer first conductor layer 112 covers the first lower surface 111b comprehensively.In addition, these first conductor layers 112 can be that for example first conductor layer 112 can be copper electroplating layer, Copper Foil or aluminium foil via plating (electroplating) formed metallic film or tinsel (metal foil).
What must explain is; Though first substrate 110 shown in Figure 1 comprises two first conductor layers 112; And the quantity of the first through hole T11 is two; But in other embodiments, first substrate 110 can only comprise first conductor layer 112 of one deck position on the first lower surface 111b, and the quantity of the first through hole T11 can be one or more.Therefore, first conductor layer 112 that Fig. 1 illustrated and the quantity of the first through hole T11 only supply to illustrate, and non-limiting the utility model.
In the present embodiment, first substrate 110 can be that (Copper CladLaminate CCL) is made, and wherein first network structure 113 can be a glass layer, and first insulating barrier 111 can be a resin bed by a copper clad laminate.In addition, these local first through hole T11 that expose first network structure 113 utilize laser ablation (laser ablation) to form.
In detail; The method that forms these first through holes T11 can be to first insulating barrier, 111 irradiation one laser beams (laser beam); Though first the insulating barrier 111 and energy of this laser beam is enough to ablate can not destroy first network structure 113 on the whole.So, these first through holes T11 is able to form.In addition, above-mentioned laser beam for example is to be provided by yag laser (Yttrium AluminumGarnet laser, YAG laser) device or optical-fiber laser (fiber laser) device.
In the present embodiment, these metal coating layers 115 can be that (Plating Throuhg H0le PTH) forms via the electroplates in hole with metal parietal layer 114.That is to say that the method that forms metal coating layer 115 and metal parietal layer 114 can be that first insulating barrier 111 and first network structure 113 are carried out electroless-plating (electroless plating) in regular turn and electroplate.In addition, these metal coating layers 115 all can electrically connect these first conductor layers 112 with metal parietal layer 114.
Though first substrate 110 among Fig. 1 comprises metal coating layer 115 and metal parietal layer 114, metal coating layer 115 and metal parietal layer 114 are merely selection element and the inessential element in the present embodiment.Therefore, first substrate 110 not necessarily will comprise metal coating layer 115 and metal parietal layer 114.That is to say that in other embodiments, first substrate 110 can not comprise any metal coating layer 115 and metal parietal layer 114.So metal coating layer 115 shown in Figure 1 only supplies to illustrate with metal parietal layer 114, and non-limiting the utility model.
Must the explanation be, look closely product demand or design, in other embodiments, conductor parietal layer 124 can be selection element and inessential element.That is to say that second substrate 120 can not comprise any conductor parietal layer 124.Therefore, the conductor parietal layer 124 that Fig. 1 illustrated only supplies to illustrate, and non-limiting the utility model.
These line layers 122 can be electrically connected to each other.In detail; Second substrate 120 can more comprise the many conductor pins 126 that are configured in second insulating barrier 121; And these conductor pins 126 are connected between these line layers 122; Wherein conductor pin 126 can be solid metal column, and can be via the electroplates in hole or fill conductor filled material and form, and wherein conductor filled material for example is conductor ink, conductor paste or the resin material that contains conductive particle.
Though second substrate 120 shown in Figure 1 comprises many conductor pins 126, in other embodiments, second substrate 120 can only comprise a conductor pin 126, and wherein conductor pin 126 promptly shown in Figure 1 can omit.
In addition, wiring board 100 can more comprise a support plate 140, a plurality of solder bump 150 and at least one electronic component 160.These solder bumps 150 connect the support plate 140 and second substrate 120, so that support plate 140 can electrically connect second substrate 120 via solder bump 150.Electronic component 160 is installed on the support plate 140, and the position is in notch S11, and electronic component 160 can be a chip of micro-electro-mechanical system, and it for example is electroacoustic transducer (electro-acoustic transducer for example is microphone or loud speaker) or air pressure sensor.
For example, electronic component 160 can be to be installed on the support plate 140 with the routing kenel, so electronic component 160 can electrically connect with support plate 140.Because the support plate 140 and second substrate 120 electrically connect, so electronic component 160 can electrically connect second substrate 120 with solder bump 150 via support plate 140.In addition; Electronic component 160 shown in Figure 1 is to be installed on the support plate 140 with the routing kenel; But in other embodiments, electronic component 160 can be to be installed on the support plate 140 with the attitude of falling the core pattern, and the utility model does not limit the installing kenel between electronic component 160 and the support plate 140.
In addition, the formation method of the second through hole T12 and the first through hole T11 can be identical, and promptly second through hole T12 laser ablation also capable of using forms, and laser beam for example is to be provided by yag laser device or fiber laser device.In addition, second both quantity of through hole T12 shown in Figure 1 are all one, but in other embodiments, the 3rd insulating barrier 141 can have a plurality of second through hole T12, so the quantity of the second through hole T12 that Fig. 1 illustrated only supplies to illustrate and non-limiting the utility model.
Both formation methods of metal coating layer 145 and metal parietal layer 144 can be same as both formation methods of metal coating layer 115 and metal parietal layer 114, and promptly metal coating layer 145 can be to form via the electroplates in hole with metal parietal layer 144.In addition, metal coating layer 145 can electrically connect line layer 142t and line layer 142b with metal parietal layer 144.
In sum; Because these first through holes T11 all is communicated with notch S11 with the second through hole T12; Therefore when electronic component 160 be chip of micro-electro-mechanical system such as electroacoustic transducer or air pressure sensor, the interior electronic component 160 of notch S11 can or be sounded from the sound of the first through hole T11 or second through hole T12 reception external environment; Or electronic component 160 can be from the first through hole T11 or the second through hole T12 sensing air pressure.
Secondly; Wiring board 100 has first network structure 113 and second network structure 143; And first network structure 113 can stop that the foreign matter (for example being the dust or the spittle) of external environment enters in the notch S11 from the first through hole T11; Second network structure 143 can stop that the foreign matter of external environment enters in the notch S11 from the second through hole T12, and therefore first network structure 113 and second network structure 143 can be protected electronic component 160, prevent that it is damaged because of foreign matter.
Moreover; Because metal coating layer 115 all can electrically connect first conductor layer 112 with metal parietal layer 114; And metal coating layer 145 can electrically connect line layer 142t and line layer 142b with metal parietal layer 144; So first conductor layer, 112 ability transfer overvoltage to metal coating layers 115 and metal parietal layers 114, and go up line layer 142t and line layer 142b ability transfer overvoltage to metal coating layer 145 and metal parietal layer 144, so that metal coating layer 115,145 can produce electrostatic field; Thereby the absorption foreign matter prevents that effectively foreign body intrusion is to notch S11.
In addition; From Fig. 1; The conductor parietal layer 124 that covers sidewall W12 surrounds electronic component 160 with the position at first conductor layer 112 of the first lower surface 111b; To such an extent as to the conductor parietal layer 124 and first conductor layer 112 can be as the electromagnetic shieldings (electromagneticshielding) of protection electronic components 160, (Electromagnetic Interference is EMI) to the injury and the influence of electronic component 160 thereby reduce electromagnetic interference.
What deserves to be mentioned is that the notch S11 that Fig. 1 illustrated has only one, but look closely the quantity of the electronic component 160 that is installed on the support plate 140, the quantity of notch S11 can be a plurality of.For example, the quantity of electronic component 160 can be equal to the quantity of notch S11, so when the quantity of electronic component 160 when being a plurality of, the quantity of notch S11 also can be a plurality of.Therefore, notch S11 shown in Figure 1 and electronic component 160 both quantity only supply to illustrate, and non-limiting the utility model.
Fig. 2 A is the generalized section of the wiring board of another embodiment of the utility model.See also Fig. 2 A, the wiring board 200 of present embodiment wiring board 100 with previous embodiment on function is identical, and structure is similar with wiring board 100, and followingly will mainly introduce wiring board 100,200 both differences structurally.
Be different from wiring board 100, these first conductor layers 212 are all metal pattern layer, and it for example is a line layer.Wherein one deck first conductor layer 212 parts cover the first upper surface 111t, and another layer first conductor layer 212 local first lower surface 111b that cover.In addition, these first conductor layers 212 are via little shadow (photolithograph) and etching (etching) and form.In addition, in other embodiments, these first conductor layers 212 also can be the metal levels of the comprehensive covering first upper surface 111t and the first lower surface 111b, and promptly arbitrary first conductor layer 212 can be replaced with aforementioned first conductor layer 112.
What must explain is; Though first substrate 210 shown in Fig. 2 A comprises two first conductor layers 212; And the quantity of the first through hole T11 is two; But in other embodiments, first substrate 210 can include only first conductor layer 212 of one deck position on the first lower surface 111b, and the quantity of the first through hole T11 can be one or more.Therefore, first conductor layer 212 that Fig. 2 A is illustrated and the quantity of the first through hole T11 only supply to illustrate, and non-limiting the utility model.
In addition, first substrate 210 can more comprise a plurality of metal parietal layers 114 and a plurality of metal coating layer 115.These metal coating layers 115 difference positions are in these first through holes T11, and local first network structure 113 that covers.These metal parietal layers 114 are distinguished the position in these first through holes T11, and cover these hole walls W11.In addition, these metal coating layers 115 all can electrically connect these first conductor layers 212 with metal parietal layer 114.
Though first substrate 210 among Fig. 2 A comprises metal coating layer 115 and metal parietal layer 114, metal coating layer 115 and metal parietal layer 114 are merely selection element and the inessential element in the present embodiment.Therefore, first substrate 210 not necessarily will comprise metal coating layer 115 and metal parietal layer 114.That is to say that in other embodiments, first substrate 210 can not comprise any metal coating layer 115 and metal parietal layer 114.So the metal coating layer 115 shown in Fig. 2 A only supplies to illustrate with metal parietal layer 114, and non-limiting the utility model.
In addition, see also Fig. 2 A and Fig. 2 B, wherein Fig. 2 B is the sketch map of watching along direction Y among Fig. 2 A.In the present embodiment, each first conductor layer 212 comprises at least one becket 212a that centers on the first through hole T11, wherein local first network structure 113 that exposes of these beckets 212a.Form in the process of the first through hole T11 carrying out laser ablation, these beckets 212a can be used as the shade (mask) of laser beam, impels laser beam first insulating barrier 111 in becket 212a originally of only ablating.
In addition; Specification about network structure 113; In the present embodiment, the mesh L1 of network structure 113 can be more than or equal to 3 microns (μ m), and can be less than or equal to the radius R 1 of the first through hole T11; And the line of first network structure 113 footpath L2 can be more than or equal to 3 microns, and can be less than or equal to radius R 1.But, the specification of first network structure 113 does not limit the utility model more than.
Please consult Fig. 2 A once more; Second substrate 120 similar in appearance to previous embodiment; Second substrate 220 also comprises one second insulating barrier 121, two line layers 122, at least one conductor parietal layer 124 and at least one conductor pin 226 that is configured in second insulating barrier 121; And second insulating barrier 121 also has notch S11, and wherein 124 of conductor parietal layers and cover sidewall W12 in notch S11.
Conductor pin 226 is connected between these line layers 122; And also can form via the electroplates in hole; But the conductor pin 126 that is different from previous embodiment; Conductor pin 226 but comprise one have a perforation H1 metal cylinder 226a and fill up the filler 226b of perforation H1, wherein filler 226b for example is conductor ink, conductor paste or the conductor filled materials such as resin material that contain conductive particle, or insulator such as dielectric ink is filled material.In addition, the conductor pin 226 shown in Fig. 2 A also can be replaced with the conductor pin 126 among Fig. 1, and promptly conductor pin 226 also can be solid metal column.
What must explain is that though second substrate 220 shown in Fig. 2 A only comprises a conductor pin 226, in other embodiments, second substrate, 220 included conductor pins 226 can be many.Therefore, the quantity of the conductor pin 226 shown in Fig. 2 A is merely and illustrates, and non-limiting the utility model.
In addition, wiring board 200 can more comprise at least one conductor pin 270 that runs through first substrate 210 and second substrate 220.Conductor pin 270 connects a wherein line layer 122 and at least one first conductor layer 212.For example, the conductor pin shown in Fig. 2 A 270 connects all line layers 122 and all first conductor layers 212.Therefore, first substrate 210 can electrically connect second substrate 220 via conductor pin 270.
The manufacture method of conductor pin 270 can be identical with conductor pin 226, and the structure of conductor pin 270 is similar with conductor pin 226.In detail, conductor pin 270 comprises a metal cylinder 272 and a filler 274, and wherein conductor pin 270 has the filler 274 that a perforation H2 and fills up perforation H2, and wherein filler 274 can be filler 226b.In addition; In other embodiments; Conductor pin 270 also can be replaced with the conductor pin 126 among Fig. 1; Be that conductor pin 270 also can be solid metal column, and can or fill conductor filled material and form that wherein conductor filled material for example is conductor ink, conductor paste or the resin material that contains conductive particle via the electroplates in hole.
Fig. 3 is the generalized section of the wiring board of another embodiment of the utility model.Therefore see also Fig. 3, the wiring board 300 of present embodiment wiring board 100,200 with previous embodiment on function is identical, and structure is similar with wiring board 200, will mainly introduce wiring board 200,300 both differences structurally below.
Wiring board 300 comprises that one first substrate 310, one second substrate 220 and are connected the adhesive layer 130 between first substrate 310 and second substrate 220.First substrate 310 comprises that one first insulating barrier 311, two first conductor layers 212 and are distributed in first network structure 313 in first insulating barrier 311, and wherein first network structure 313 is wire netting, ceramic network or thermosetting plastic net.
First insulating barrier 311 has one first upper surface 311t, the first lower surface 311b and at least one first through hole T31 with respect to the first upper surface 311t; First insulating barrier 311 wherein shown in Figure 3 has a plurality of first through hole T 31, and these first through holes T 31 is communicated with the notch S11 of second substrate 220.In addition, the formation method of these first through holes T 31 can be identical with the formation method of the aforementioned first through hole T11.
What must explain is; Though first substrate 310 shown in Figure 3 comprises two first conductor layers 212; And the quantity of the first through hole T31 is two; First substrate 310 can include only first conductor layer 212 of one deck position on the first lower surface 311b, and the quantity of the first through hole T31 can be one or more but in other embodiments.Therefore, first conductor layer 212 that Fig. 3 illustrated and the quantity of the first through hole T31 only supply to illustrate, and non-limiting the utility model.
In addition, first substrate 310 can more comprise a plurality of metal parietal layers 314 and a plurality of metal coating layers 315, and wherein metal parietal layer 314 all can be identical with metal coating layer 115 with metal parietal layer 114 with manufacturing approach, material and the function of metal coating layer 315.These metal coating layers 315 difference positions are in these first through holes T31, and local first network structure 313 that covers.These metal parietal layers 314 are distinguished the position in these first through holes T31, and cover these hole walls W31.In addition, these metal coating layers 315 all can electrically connect these first conductor layers 212 with metal parietal layer 314.
Wiring board 300 can more comprise at least one conductor pin 370 that runs through first substrate 310 and second substrate 220.Be different from conductor pin 270, conductor pin 370 is a solid metal column.Conductor pin 370 connects a wherein line layer 122 and at least one first conductor layer 212.For example, conductor pin 370 shown in Figure 3 connects all line layers 122 and all first conductor layers 212.Therefore, first substrate 310 can electrically connect second substrate 220 via conductor pin 370.In addition, conductor pin 370 can be via the electroplates in hole or fill conductor filled material and form; Perhaps, also can be as as the conductor pin 270, promptly conductor pin 370 can comprise that a metal cylinder and is filled in the filler in this metal cylinder, wherein this conductor filled material for example is conductor ink, conductor paste or the resin material that contains conductive particle.
In addition, when first network structure 313 was metal material, conductor pin 370 can not contact with first network structure 313; Be that the conductor pin 370 and first network structure 313 are electrically insulated; As shown in Figure 3, avoiding interference the transmission of electric current in wiring board 300, thereby make the running of wiring board 300 normal.But, when first network structure 313 was ceramic network or thermosetting plastic net, conductor pin 370 can contact with first network structure 313.
In addition, wiring board 300 can more comprise a support plate 340, a plurality of solder bump 150 and at least one electronic component 260.Some of them solder bump 150 connects the support plate 340 and second substrate 220, so that support plate 340 can electrically connect second substrate 220 via solder bump 150.Other solder bumps 150 are connected between electronic component 260 and the support plate 340.Electronic component 260 is to be installed on the support plate 340 with the attitude of falling the core pattern, and can electrically connect via solder bump 150 and support plate 340.But, in other embodiments, electronic component 260 can be to be installed on the support plate 340 with the routing kenel, so the utility model does not limit the installing kenel between electronic component 260 and the support plate 340.
Support plate 340 is similar with support plate 140, comprises on one the 3rd insulating barrier 341, line layer 142t and line layer 142b once.The 3rd insulating barrier 341 is configured between line layer 142t and the line layer 142b, and solder bump 150 connects and goes up line layer 142t and one deck line layer 122 wherein, so that 220 of second substrates are between first substrate 310 and support plate 340.In addition, electronic component 260 electrically connects and goes up line layer 142t.
Support plate 340 comprises that more one is distributed in second network structure 343 in the 3rd insulating barrier 341; And the 3rd insulating barrier 341 has the second through hole T32 of at least one connection notch S11; Wherein the second through hole T32 runs through the 3rd insulating barrier 341 and forms, and local second network structure 343 that exposes.The formation method of the second through hole T32 and the first through hole T11 can be identical, and promptly second through hole T32 laser ablation capable of using forms, and laser beam for example is to be provided by yag laser device or fiber laser device.
Be different from aforementioned support plate 140; Second network structure 343 is wire netting, ceramic network or thermosetting plastic net; And the 3rd insulating barrier 341 has sandwich construction, and wherein the 3rd insulating barrier 341 comprises two insulation material layer 341a, and second network structure 343 is interposed between these insulation material layers 341a.In addition, these insulation material layers 341a can be insulation material layer 311a.
Second network structure 343 can be distributed in the overlapping region between these insulation material layers 341a fully, and first network structure 313 can be distributed in the overlapping region between these insulation material layers 311a fully, and is as shown in Figure 3.But; In other embodiments; Second network structure 343 can the overlapping region of local distribution between these insulation material layers 341a; And first network structure 313 can the overlapping region of local distribution between these insulation material layers 311a; For example second network structure 343 can be avoided position and the overlapping region of local distribution between these insulation material layers 341a of the second through hole T32, and first network structure 313 can be avoided position and the overlapping region of local distribution between these insulation material layers 311a of the first through hole T31.
In addition, support plate 340 can more comprise at least one metal parietal layer 344 and at least one metal coating layer 345.345 of metal coating layers are in the second through hole T32, and local second network structure 343 that covers, and wherein the second through hole T32 has a hole wall W34, and 344 of metal parietal layers are in the second through hole T32, and cover hole wall W34.In addition; Both formation methods of metal coating layer 345 and metal parietal layer 344 can be same as both formation methods of metal coating layer 115 and metal parietal layer 114, and metal coating layer 345 can electrically connect line layer 142t and line layer 142b with metal parietal layer 344.
The above; It only is the preferred embodiment of the utility model; Be not that the utility model is done any pro forma restriction; Though the utility model discloses as above with preferred embodiment, yet be not that any professional and technical personnel of being familiar with is not in breaking away from the utility model technical scheme scope in order to qualification the utility model; When the technology contents of above-mentioned announcement capable of using is made a little change or is modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from the utility model technical scheme, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of the utility model technical scheme according to the technical spirit of the utility model.
Claims (19)
1. wiring board is characterized in that comprising:
One first substrate; Comprise that one first insulating barrier, at least one first conductor layer and are distributed in first network structure in this first insulating barrier; Wherein this first insulating barrier has first lower surface and at least one first through hole that is exposed to this first upper surface and this first lower surface of one first upper surface, relative this first upper surface; This first through hole is local to expose this first network structure, and this first conductor layer is configured on this first lower surface;
One second substrate; Comprise one second insulating barrier, two line layers and at least one conductor parietal layer; This second insulating barrier has second lower surface and at least one notch that is exposed to this second lower surface of one second upper surface, relative this second upper surface, wherein above-mentioned line layer be configured in respectively on this second upper surface with this second lower surface on, this notch is communicated with this first through hole; And local this first substrate that exposes, and this conductor parietal layer covers a sidewall of this notch; And
One adhesive layer is connected between this first substrate and this second substrate, and the position is between this second upper surface and this first lower surface.
2. wiring board as claimed in claim 1 is characterized in that wherein the quantity of this first conductor layer is two, and above-mentioned first conductor layer be configured in respectively on this first upper surface with this first lower surface on.
3. according to claim 1 or claim 2 wiring board is characterized in that wherein this first conductor layer is one to cover the metal level or a local metal pattern layer that covers this first lower surface of this first lower surface comprehensively.
4. wiring board as claimed in claim 3 is characterized in that wherein this first conductor layer comprises at least one becket around this first through hole.
5. wiring board as claimed in claim 3 is characterized in that more comprising at least one conductor pin that runs through this first substrate and this second substrate, and wherein this conductor pin connects wherein a line layer and this first conductor layer.
6. wiring board as claimed in claim 1 it is characterized in that wherein this second substrate more comprises at least one conductor pin that is configured in this second insulating barrier, and this conductor pin is connected between the above-mentioned line layer.
7. like claim 5 or 6 described wiring boards, it is characterized in that wherein this conductor pin is a solid metal column, and comprise one have a perforation metal cylinder and fill up the filler of this perforation.
8. according to claim 1 or claim 2 wiring board is characterized in that wherein this first substrate more comprises at least one metal parietal layer, and this metal parietal layer covers a hole wall of this first through hole.
9. according to claim 1 or claim 2 wiring board it is characterized in that wherein that this first substrate more comprises at least onely locally to cover this first cancellated metal coating layer, and this metal coating layer position is in this first through hole.
10. wiring board as claimed in claim 9 is characterized in that wherein this metal coating layer electrically connects this first conductor layer.
11. wiring board as claimed in claim 1 it is characterized in that wherein this first insulating barrier comprises two insulation material layers, and this first network structure is interposed between the above-mentioned insulation material layer.
12. wiring board as claimed in claim 1 is characterized in that more comprising:
One support plate comprises line layer on, line layer and is configured in the 3rd insulating barrier between the line layer and this line layer on this once; And
A plurality of solder bumps connect upward line layer and wherein a line layer, so that this second substrate position is between this first substrate and this support plate.
13. wiring board as claimed in claim 12; It is characterized in that wherein this support plate comprises that more one is distributed in second network structure in the 3rd insulating barrier; And the 3rd insulating barrier has second through hole of at least one this notch of connection, local this second network structure that exposes of this second through hole.
14. wiring board as claimed in claim 13 is characterized in that wherein this support plate more comprises at least one metal parietal layer, this metal parietal layer covers a hole wall of this second through hole.
15. wiring board as claimed in claim 13 it is characterized in that wherein this support plate more comprises at least one local this second cancellated metal coating layer of covering, and this metal coating layer position is in this second through hole.
16. wiring board as claimed in claim 15 is characterized in that wherein this metal coating layer electrically connects upward line layer and this line layer.
17. wiring board as claimed in claim 13 it is characterized in that wherein the 3rd insulating barrier comprises two insulation material layers, and this second network structure is interposed between the above-mentioned insulation material layer.
18. wiring board as claimed in claim 13 is characterized in that more comprising at least one electronic building brick that is installed on this support plate, wherein this electronic building brick position and electrically connects and should go up line layer in this notch.
19. wiring board as claimed in claim 1 is characterized in that wherein this conductor parietal layer this adhesive layer of contact and this first substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100100831A TWI413459B (en) | 2011-01-10 | 2011-01-10 | Circuit board and manufacturing method thereof and sensor |
| TW100100831 | 2011-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202160338U true CN202160338U (en) | 2012-03-07 |
Family
ID=45767958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201982911U Expired - Fee Related CN202160338U (en) | 2011-01-10 | 2011-06-09 | Circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202160338U (en) |
| TW (1) | TWI413459B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902676A (en) * | 2014-03-06 | 2015-09-09 | 常熟东南相互电子有限公司 | Printed circuit board and manufacturing method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI405508B (en) * | 2011-09-28 | 2013-08-11 | Unimicron Technology Corp | Circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI266403B (en) * | 2003-12-31 | 2006-11-11 | Phoenix Prec Technology Corp | Method for fabricating semiconductor package substrate with opening penetrating therethrough |
| WO2005078458A1 (en) * | 2004-02-05 | 2005-08-25 | Analog Devices, Inc. | Capped sensor |
| TWI371238B (en) * | 2009-04-29 | 2012-08-21 | Nan Ya Printed Circuit Board | Circuit board and method of manufacturing the same |
-
2011
- 2011-01-10 TW TW100100831A patent/TWI413459B/en not_active IP Right Cessation
- 2011-06-09 CN CN2011201982911U patent/CN202160338U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902676A (en) * | 2014-03-06 | 2015-09-09 | 常熟东南相互电子有限公司 | Printed circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI413459B (en) | 2013-10-21 |
| TW201230896A (en) | 2012-07-16 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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