CN104902676A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN104902676A CN104902676A CN201410081499.3A CN201410081499A CN104902676A CN 104902676 A CN104902676 A CN 104902676A CN 201410081499 A CN201410081499 A CN 201410081499A CN 104902676 A CN104902676 A CN 104902676A
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- layer
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- line layer
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Abstract
The invention discloses a printed circuit board and a manufacturing method thereof. The printed circuit board comprises a support plate, wherein the support plate has a front surface and a back surface; a first bonding layer which is arranged on the front surface of the support plate; and a front surface circuit layer which is embedded in the first bonding layer. The front surface circuit layer comprises at least an external contact portion for connecting with an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first bonding layer encircling the external contact portion. The invention also discloses the manufacturing method of the printed circuit board.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly relate to and there is outside contact part in order to connect the printed circuit board (PCB) of an electronic component.
Background technology
Printed circuit board (PCB) is one of main body of electronic product now.Printed circuit board (PCB) has a supporter multiple electronic component of carrying and circuit that multiple electronic component is interconnected on it usually.Early stage printed circuit board (PCB), adopts the engineering method of screen printing to make line pattern, is therefore called as printed circuit board (PCB).Current most printed circuit board (PCB) has changed employing photoetching engineering method all, makes line pattern to etch or to electroplate.Along with the continuous microminiaturization of electronic product, electronic product requires also more and more higher to the fineness of printed circuit board (PCB).Therefore, the printed circuit board arrangement more innovated and manufacture method is needed to meet the requirement of electronic product.
Summary of the invention
The present inventor carefully finds the printed circuit board (PCB) manufactured by prior art, and the contact surface flatness of itself and electronic component is inadequate, easily causes the electronic component of device on it to rock, and then affects the usefulness of electronic product.For solving above-mentioned and other problem, the invention provides following Printed circuit board and manufacturing methods.
According to an embodiment, the invention provides a kind of manufacture method of printed circuit board (PCB), comprise:
One support plate is provided;
Form a first line layer on this support plate, wherein this first line layer relief is on the surface of this support plate, and this first line layer has at least one outside contact part in order to connect an electronic component;
There is provided a substrate and one first adhesive film, this first adhesive film is placed in this substrate and has between this support plate of this first line layer, and this first line aspect is to this first adhesive film;
In conjunction with this substrate, this first adhesive film and this support plate with this first line layer, wherein this first line layer is embedded in this first adhesive film.
According to another embodiment, the invention provides the manufacture method of printed circuit board (PCB) as above, wherein this support plate comprises:
One base plate; And
Cover this base plate to electroplate the flatness layer formed, wherein this flatness layer is that the surface forming this support plate is seated top to make this first line layer.
According to another embodiment, the invention provides the manufacture method of printed circuit board (PCB) as above, wherein this substrate comprises:
One first conductive layer, one second line layer, a dielectric layer between this first conductor layer and this second line layer and a cover layer cover this second line layer, wherein this cover layer is to be combined with this support plate towards this first adhesive film.
According to another embodiment, the invention provides the manufacture method of printed circuit board (PCB) as above, wherein in conjunction with this substrate, this first adhesive film and have this first line layer this support plate step after also comprise:
Make this first conductive layer transfer a tertiary circuit layer to, this tertiary circuit layer relief is on the surface of this dielectric layer.
According to another embodiment, the invention provides the manufacture method of printed circuit board (PCB) as above, also comprise:
Form one the 4th line layer in the top of this tertiary circuit layer, wherein one second adhesive film is between this tertiary circuit layer and the 4th line layer, and the 4th line layer relief is in the surface of this second adhesive film.
According to another embodiment, the invention provides the manufacture method of printed circuit board (PCB) as above, wherein this substrate defines an exposed area, and this first adhesive film comprises one first cavity to should exposed area, and this first line layer is to the place of exposed area should not having line pattern.
According to another embodiment, the invention provides the manufacture method of printed circuit board (PCB) as above, wherein this substrate defines an exposed area, this second adhesive film comprises one second cavity to should exposed area, and the 4th line layer is to the place of exposed area should not having line pattern to expose this exposed area of this substrate.
According to another embodiment, the invention provides a kind of manufacture method of printed circuit board (PCB), comprise:
One temporary substrate is provided, there is a first surface and relative to this first surface one second;
Be coated with a circle glue-line respectively on this first surface and this second;
Two support plates are provided
Attach this support plate respectively on this first surface of this temporary substrate and this second by this glue-line, this glue-line does not cover this temporary substrate all sidedly, therefore has a space between this temporary substrate and this support plate;
This first surface of this temporary substrate and this second perform each step as described in the various embodiments above respectively; And
Carry out cutting to remove this temporary substrate along this glue-line.
According to another embodiment, the invention provides a kind of printed circuit board (PCB), comprise:
One supporting bracket, this supporting bracket has a front and a back side;
One first bonding coat is positioned on this front of this supporting bracket; And
One front line layer is embedded in this first bonding coat, and this front line layer comprises at least one outside contact part in order to connect an electronic component, surface and the surperficial copline around this first bonding coat of this outside contact part of this outside contact part.
According to another embodiment, the invention provides a kind of printed circuit board (PCB) as above, also comprise:
One second bonding coat is positioned on this back side of this supporting bracket; And
One back side line layer is positioned on this second bonding coat, and this back side line layer relief is on the surface of this second bonding coat.
According to another embodiment, the invention provides a kind of printed circuit board (PCB) as above, wherein this supporting bracket comprises:
Interior lines layer on one, this back side line layer contiguous;
Interior lines layer once, this front line layer contiguous; And
One dielectric layer to be located on this between interior lines layer and this lower interior lines layer, is not only communicated with the via of this lower interior lines layer and this front line layer in this supporting bracket.
According to another embodiment, the invention provides a kind of printed circuit board (PCB) as above, wherein this supporting bracket defines an exposed area, this first adhesive film comprises one first cavity to should exposed area, this front line layer, to the place of exposed area should not having line pattern, exposes this exposed area of this substrate thus.
According to another embodiment, the invention provides a kind of printed circuit board (PCB) as above, wherein this supporting bracket defines an exposed area, this second adhesive film comprises one second cavity to should exposed area, this back side line layer, to the place of exposed area should not having line pattern, exposes this exposed area of this substrate thus.
The present invention still comprises other aspects and is disclosed in detail in following execution mode to solve other problems and to merge above-mentioned each side.
Accompanying drawing explanation
Fig. 1 to Fig. 7 is the manufacturing process cutaway view according to first embodiment of the present invention exemplary illustration printed circuit board (PCB).
Fig. 8 A and Fig. 9 to Figure 10 is the manufacturing process cutaway view according to second embodiment of the present invention exemplary illustration printed circuit board (PCB).
Fig. 8 B is the top view corresponding to Fig. 8 A cutaway view.
Figure 11 to 16 is the manufacturing process top views according to third embodiment of the present invention exemplary illustration printed circuit board (PCB).
Symbol description
700 printed circuit board (PCB)s
100 support plates
L1, L1 ' first line layer, front line layer
101 base plates
102 flatness layers
I, I ' J, J ' dotted line
103 outside contact parts
200 substrates
201 first conductive layers
L2, L2 ' second line layer, lower layer within the circuit
203 dielectric layers
204 cover layers
300,300 ' first adhesive film, the first bonding coat
301,301 ' first cavity
T1, T2, T3, T4 via
L3, L3 ' tertiary circuit layer, upper layer within the circuit
501 protective layers
601 second conductive layers
L4, L4 ' the 4th line layer, back side line layer
602 second adhesive films, the second bonding coat
603 second cavities
710,710 ' supporting bracket
A front
The B back side
103a, 300a surface
X first surface
Y second
800 temporary substrates
801,802 glue-lines
803,804 spaces
160 printed circuit board (PCB) product units
161 welding resisting layers
Embodiment
To demonstrate preferred embodiment of the present invention below with reference to appended accompanying drawing.In appended accompanying drawing, similar components adopts identical component symbol.Should note presenting the present invention for clear, each element in appended accompanying drawing not according to the scale of material object, and for avoiding fuzzy content of the present invention, below illustrating and also omitting existing spare part, associated materials and correlation processing technique thereof.
Fig. 1 to Fig. 7 is the manufacturing process according to one of the present invention the first embodiment exemplary illustration printed circuit board (PCB) 700.With reference to figure 1, provide a support plate 100 in order to form first line layer L1 thereon.Support plate 100 in addition to their support function, separately has the function providing flat surfaces.And support plate 100 is only temporary transient use, will be removed in subsequent manufacturing processes therefore remain in final printed circuit panel products.In this embodiment, support plate 100 comprises base plate 101 and a flatness layer 102.Base plate 101 can be copper or other suitable materials are made; Flatness layer 102 is made for electrotinning or other suitable materials, and wherein flatness layer 102 is the surfaces forming this support plate 100.Support plate 100 defines an exposed area, as shown in the region of dotted line I-I ' in Fig. 1.Then, first line layer L1 is formed on support plate 100.First line layer L1 relief is on the surface (i.e. the surface of support plate 100) of flatness layer 102.First line layer L1 is formed by prior art, such as with the photoresist of patterning for mask; Circuit is formed on the surface of flatness layer 102 via plating; And then photoresist is removed.First line layer L1 in exposed area without any line pattern.First line layer L1 has at least one outside contact part 103 in order to connect an electronic component (not shown).
With reference to figure 2, provide a substrate 200 in addition.When support plate 100 is removed in subsequent manufacturing processes, substrate 200 can be used to support first line layer L1.Substrate 200 can comprise or not comprise circuit.In this embodiment, substrate 200 also defines the exposed area corresponding with support plate 100, as shown in the region of dotted line I-I ' in Fig. 2.In this embodiment, substrate 200 comprise one first conductive layer 201,1 second line layer L2, a dielectric layer 203 between the first conductor layer 201 and the second line layer L2 and a cover layer 204 cover the second line layer L2.Second line layer L2 has line pattern in exposed area.First conductive layer 201 and the second line layer L2 can be copper or other suitable materials are made.Dielectric layer 203 and cover layer 204 can be any suitable insulating material, such as flexible insulating material pi adds made by the materials such as epoxy resin.
With reference to figure 3, first provide one first adhesive film 300 to be seated in substrate 200 and have between the support plate 100 of first line layer L1.First line layer L1 is towards the first adhesive film 300.The cover layer 204 of substrate 200 is towards the first adhesive film 300.In this embodiment, the first adhesive film 300 comprises exposed area corresponding to one first cavity 301.Then, by hot pressing, substrate 200, first adhesive film 300 and the support plate 100 with first line layer L1 are combined.After completing, first line layer L1 is embedded in the first adhesive film 300, as shown in Figure 4.First adhesive film 300 can be fiber cloth used in general circuit plate manufacture craft and makes containing the adhesive film (Prepreg) of resin pickup or other suitable materials.
After completing above-mentioned integrating step, one or more layers line layer can be formed on substrate 200.Also boring copper facing manufacture craft can be performed to make the line conduction between each layer.In this embodiment, as shown in Figure 5, first Laser drill and blind hole copper facing is performed, to form via T1 and T2 as illustrated in the drawing.Then, a tertiary circuit layer L3 is formed on dielectric layer 203.Tertiary circuit layer L3 is changed by the patterned etching of the first conductive layer 201 to be formed, and therefore tertiary circuit layer L3 relief is on the surface of dielectric layer 203.In exposed area, tertiary circuit layer L3 optionally containing circuit or not containing circuit, can explain with the situation with circuit in this embodiment.Via T1 direct conducting first line layer L1 and tertiary circuit layer L3, though namely via T1 has and runs through the second line layer L2 and there is no the second line layer L2 that electrically conducts.Via T2 conducting second line layer L2 and tertiary circuit layer L3.Because boring copper facing manufacture craft is carried out at the first conductive layer 201 (i.e. tertiary circuit layer L3), the via of a conducting first line layer L1 and the second line layer L2 therefore can not be formed.After completing tertiary circuit layer L3, then can be coated with a protective layer 501 and cover tertiary circuit layer L3.The material of protective layer 501 can be identical with cover layer 204 or use other suitable materials.
With reference to figure 6 and Fig. 7, display formation one second conductive layer 601 is above tertiary circuit layer L3; Carry out boring copper facing manufacture craft; Remove support plate 100 to expose first line layer L1; And convert the second conductive layer 601 to one the 4th line layer L4.Available existing printed-board technology carries out above-mentioned each step.In detail, as shown in Figure 6, a copper sheet (as the second conductive layer 601) and one second adhesive film 602 is provided to be placed between copper sheet and tertiary circuit layer L3.Second adhesive film 602 comprises 603 corresponding exposed area, one second cavity.The material of the second adhesive film 602 can be identical with aforesaid first adhesive film 300.Then, the structure, the second adhesive film 602 and the copper sheet (i.e. the second conductive layer 601) that are formed by Fig. 5 by hot pressing are combined.Then boring copper facing manufacture craft is carried out to form via T3 and T4.With reference to figure 7, after boring copper facing manufacture craft, then carry out being etched with divesting support plate 100.Also utilize etch cut carry out patterning second conductive layer 601 and then transferred to the 4th line layer L4 simultaneously.In this embodiment, the 4th line layer L4 relief is on the surface of the second adhesive film 602.The place of the corresponding exposed area of the 4th line layer L4 does not have line pattern.
Fig. 7 shows the printed circuit board (PCB) 700 manufactured by method according to first embodiment of the invention demonstration.As shown in the figure, printed circuit board (PCB) 700 has supporting bracket 710.Supporting bracket 710 defines an a front B and back side A.Supporting bracket 710 comprises interior lines layer L3 (i.e. tertiary circuit layer L3) on; Interior lines layer (i.e. the second line layer L2) once; And one dielectric layer 203 be located between interior lines layer L3 and lower interior lines layer L2.Printed circuit board (PCB) 700 also comprises one first bonding coat 300 (i.e. the first adhesive film) and is positioned on the front B of supporting bracket 710; One front line layer L1 (i.e. first line layer) is embedded in the first bonding coat 300; One second bonding coat 602 (i.e. the second adhesive film) is positioned on the back side A of supporting bracket 710; And one back side line layer L4 (i.e. the 4th line layer) be positioned on the second bonding coat 602.Back side line layer L4 relief is on the surface of the second bonding coat 602.Front line layer L1 comprises at least one outside contact part 103 in order to connect an electronic component (not shown).It should be noted that the surperficial 103a of outside contact part 103 has coplanar in fact feature with the surperficial 300a around the first bonding coat 300 of outside contact part 103.Therefore, when the surface performing electronic component and outside contact part 103 is glutinous fill time, the above-mentioned feature of copline in fact surperficially has enough flatnesses, so can solve electronic component to produce the problem of rocking thereon by making glutinous dress.In addition, it should be noted that the copline flat surfaces formed compared to front line layer L1 and the first bonding coat 300, the surface that back side line layer L4 and the second bonding coat 602 are formed is considerably uneven.Rough reason is not the drop only having back side line layer L4 relief to cause on the surface of the second bonding coat 602, and in fact back side line layer L4 itself is also because the impact of stacked in multi-layers and boring copper facing program forms the surface that height rises and falls in manufacture process.Obviously do not represent the fluctuating on line layer L4 surface, the back side in figure, and be familiar with this operator and should know when implementation and comprehend.
Same reference diagram 7, also has via T1 (being communicated with front line layer L1, lower interior lines layer L2 and upper interior lines layer L3), T2 (being communicated with lower interior lines layer L2 and upper interior lines layer L3), T3 (being communicated with interior lines layer L3 and back side line layer L4) and T4 (being communicated with interior lines layer L3 and back side line layer L4) in supporting bracket 710.The via of upper front line layer L1, lower interior lines layer L2 is not only communicated with in supporting bracket 710.Supporting bracket 710 defines an exposed area, as the region in figure between dotted line I and I '.First bonding coat 300 comprises 301 corresponding exposed area, one first cavity.The place of the corresponding exposed area of front line layer L1 does not have line pattern, exposes the exposed area of this supporting bracket 710 thus.Second bonding coat 602 comprises 603 corresponding exposed area, one second cavity.The place of the corresponding exposed area of back side line layer L4 does not have line pattern.
Fig. 8 A, Fig. 8 B and Fig. 9 to Figure 10 are the another kind of manufacturing process according to one of the present invention the second embodiment exemplary illustration printed circuit board (PCB) 700.With reference to 8A and Fig. 8 B, first the manufacture method of the second embodiment comprises the temporary substrate 800 providing and have a first surface X and one second Y relative to first surface X.Temporary substrate 800 can be made by any suitable material, such as a conventional two-sided Copper Foil basal plate.Then, a circle glue-line 801 and 802 is coated with respectively in first surface X and second Y.Fig. 8 B is the top view corresponding to Fig. 8 A cutaway view.The pattern that Fig. 8 B shows glue-line 801 is a circle rectangle.Except rectangle, the pattern of glue-line 801 also can be circle or other suitable patterns.The material of glue-line can be fiber cloth used in general circuit plate manufacture craft and makes containing the adhesive film (Prepreg) of resin pickup or other suitable materials.
With reference to figure 9, respectively support plate 100 as described in the first embodiment is attached on first surface X and second Y of temporary substrate 800 by glue-line 801 and 802.Note, because glue-line 801 does not cover temporary substrate 800 all sidedly, therefore having space 803 and 804 between temporary substrate 800 and support plate 801.Then, with reference to Figure 10, first surface X and second Y of temporary substrate 800 performs each step in as the first embodiment as described in Fig. 1 to Fig. 6 respectively, to be formed, there is the structure that two groups of printed circuit board (PCB)s as shown in Figure 6 lay respectively at the two sides of temporary substrate 800.Then, along as the dotted line J of Figure 10, the inward flange of the glue-line 801,802 shown in J ' the inner ring edge of the glue-line 801 of figure 8B (or with reference to) cuts.After cutting, glue-line 801,802 depart from.Because having space 803 and 804 therefore can delamination between temporary substrate 800 and upper and lower support plate 100.Therefore, two groups of printed circuit board (PCB)s as shown in Figure 6 can be obtained in same manufacture craft by above-mentioned method.Can then these printed circuit board (PCB)s be continued to carry out follow-up each step as described in the first embodiment, two groups of printed circuit board (PCB)s 700 can be obtained.
Figure 11 be according to the display of the present invention 1 the 3rd embodiment have support plate 100 ' and the upper schematic diagram of first line layer L1 '.Fig. 1 reference in the lump of the first embodiment of Figure 11 can being arranged in pairs or groups.
Figure 12 is the upper schematic diagram according to third embodiment of the invention display with the substrate 200 ' of the second line layer L2 '.Fig. 2 reference in the lump of the first embodiment of Figure 12 can being arranged in pairs or groups.
Figure 13 is the upper schematic diagram according to third embodiment of the invention display with first adhesive film 300 ' in one first cavity 301 '.Fig. 3 reference in the lump of the first embodiment of Figure 13 can being arranged in pairs or groups.
Figure 14 is the upper schematic diagram according to third embodiment of the invention display with the supporting bracket 710 ' of front line layer L1 '.Fig. 7 reference in the lump of the first embodiment of Figure 14 can being arranged in pairs or groups.
Figure 15 is the upper schematic diagram according to third embodiment of the invention display with the supporting bracket 710 ' of back side line layer L4 '.Fig. 7 reference in the lump of the first embodiment of Figure 15 can being arranged in pairs or groups.
Figure 16 is the schematic diagram according to third embodiment of the invention display printed circuit board (PCB) product unit 160 structure.Figure 16 those shown is the product unit 160 for the printed circuit board (PCB) shown in Figure 14 and Figure 15 is formed after the coating of welding resisting layer 161 and unit nicking again.As shown in the figure, the external form of product unit 160 comprises the exposed area of supporting bracket 710 ' and is embedded in the outside contact part 103 ' of the front line layer L1 ' in the first bonding coat 300 '.Outside contact part 103 ' is in order to connect an electronic component (not shown).Surface and the surperficial copline around the first bonding coat 300 ' of outside contact part 103 ' of outside contact part 103 '.
The foregoing is only preferred embodiment of the present invention, and be not used to limit claim of the present invention; Under all other does not depart from disclosed spirit, the equivalence that completes changes or modifies, and all should be included in described claim.
Claims (13)
1. a manufacture method for printed circuit board (PCB), comprises:
One support plate is provided;
Form a first line layer on this support plate, wherein this first line layer relief is on the surface of this support plate, and this first line layer has at least one outside contact part in order to connect an electronic component;
There is provided a substrate and one first adhesive film, this first adhesive film is seated in this substrate and has between this support plate of this first line layer, and this first line aspect is to this first adhesive film;
In conjunction with this substrate, this first adhesive film and this support plate with this first line layer, wherein this first line layer is embedded in this first adhesive film.
2. the manufacture method of printed circuit board (PCB) as claimed in claim 1, wherein this support plate comprises:
Base plate; And
Cover this base plate to electroplate the flatness layer formed, wherein this flatness layer is that the surface forming this support plate is seated top to make this first line layer.
3. the manufacture method of printed circuit board (PCB) as claimed in claim 1, wherein this substrate comprises:
First conductive layer, the second line layer, dielectric layer between this first conductor layer and this second line layer and cover layer cover this second line layer, wherein this cover layer face to this first adhesive film to be combined with this support plate.
4. the manufacture method of printed circuit board (PCB) as claimed in claim 3, wherein in conjunction with this substrate, this first adhesive film and have this first line layer this support plate step after also comprise:
Make this first conductive layer transfer a tertiary circuit layer to, this tertiary circuit layer relief is on the surface of this dielectric layer.
5. the manufacture method of printed circuit board (PCB) as claimed in claim 4, also comprises:
Form one the 4th line layer in the top of this tertiary circuit layer, wherein one second adhesive film is between this tertiary circuit layer and the 4th line layer, and the 4th line layer relief is on the surface of this second adhesive film.
6. the manufacture method of printed circuit board (PCB) as claimed in claim 1, wherein this substrate defines an exposed area, and this first adhesive film comprises one first cavity to should exposed area, and this first line layer is to the place of exposed area should not having line pattern.
7. the manufacture method of printed circuit board (PCB) as claimed in claim 5, wherein this substrate defines an exposed area, and this second adhesive film comprises one second cavity to should exposed area, and the 4th line layer is to the place of exposed area should not having line pattern.
8. a manufacture method for printed circuit board (PCB), comprises:
One temporary substrate is provided, there is a first surface and relative to this first surface one second;
Be coated with a circle glue-line respectively on this first surface and this second;
Two support plates are provided;
Attach this support plate respectively on this first surface of this temporary substrate and this second by this glue-line, this glue-line does not cover this temporary substrate all sidedly, therefore has a space between this temporary substrate and this support plate;
On this first surface of this temporary substrate and this second, enforcement of rights requires each step according to any one of 1 to 4 and 6 respectively; And
Carry out cutting to remove this temporary substrate along this glue-line.
9. a printed circuit board (PCB), comprises:
Supporting bracket, this supporting bracket has a front and a back side;
First bonding coat, is positioned on this front of this supporting bracket; And
Front line layer, is embedded in this first bonding coat, and this front line layer comprises at least one outside contact part in order to connect an electronic component, surface and the surperficial copline around this first bonding coat of this outside contact part of this outside contact part.
10. printed circuit board (PCB) as claimed in claim 9, also comprises:
Second bonding coat, is positioned on this back side of this supporting bracket; And
Back side line layer, is positioned on this second bonding coat, and this back side line layer relief is on the surface of this second bonding coat.
11. printed circuit board (PCB)s as claimed in claim 9, wherein this supporting bracket comprises:
Upper interior lines layer, this back side line layer contiguous;
Lower interior lines layer, this front line layer contiguous; And
Dielectric layer to be folded on this between interior lines layer and this lower interior lines layer, is not only communicated with the via of this lower interior lines layer and this front line layer in this supporting bracket.
12. printed circuit board (PCB)s as claimed in claim 9, wherein this supporting bracket defines an exposed area, and this first bonding coat comprises one first cavity to should exposed area, and this front line layer is to the place of exposed area should not having line pattern.
13. printed circuit board (PCB)s as claimed in claim 10, wherein this supporting bracket defines an exposed area, and this second bonding coat comprises one second cavity to should exposed area, and this back side line layer is to the place of exposed area should not having line pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410081499.3A CN104902676A (en) | 2014-03-06 | 2014-03-06 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410081499.3A CN104902676A (en) | 2014-03-06 | 2014-03-06 | Printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104902676A true CN104902676A (en) | 2015-09-09 |
Family
ID=54034981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410081499.3A Pending CN104902676A (en) | 2014-03-06 | 2014-03-06 | Printed circuit board and manufacturing method thereof |
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| CN (1) | CN104902676A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112055482A (en) * | 2019-06-06 | 2020-12-08 | 欣兴电子股份有限公司 | Circuit carrier plate and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281725A (en) * | 2010-06-10 | 2011-12-14 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN202160338U (en) * | 2011-01-10 | 2012-03-07 | 欣兴电子股份有限公司 | Circuit board |
| US8186045B2 (en) * | 2000-02-25 | 2012-05-29 | Ibiden Co., Ltd. | Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| CN102548252A (en) * | 2010-12-28 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN103582320A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
-
2014
- 2014-03-06 CN CN201410081499.3A patent/CN104902676A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8186045B2 (en) * | 2000-02-25 | 2012-05-29 | Ibiden Co., Ltd. | Multilayer printed circuit board and multilayer printed circuit board manufacturing method |
| CN102281725A (en) * | 2010-06-10 | 2011-12-14 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN102548252A (en) * | 2010-12-28 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN202160338U (en) * | 2011-01-10 | 2012-03-07 | 欣兴电子股份有限公司 | Circuit board |
| CN103582320A (en) * | 2012-07-19 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112055482A (en) * | 2019-06-06 | 2020-12-08 | 欣兴电子股份有限公司 | Circuit carrier plate and manufacturing method thereof |
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Application publication date: 20150909 |