CN102647853A - High-accuracy through-hole resistance printed board and manufacture method thereof - Google Patents

Abstract

The invention discloses a high-accuracy through-hole resistance printed board and a manufacture method thereof. The printed board is characterized in that at least two line layers are arranged, an insulation layer is arranged between each two line layers for separation, a plurality of resistors are embedded in the printed board, the resistors are arranged between the two adjacent line layers, through holes are drilled in the insulation layer between each two adjacent line layers, carbon oil is filled in the through holes, and the resistors are formed by a way that the carbon oil communicates the two adjacent line layers. Resistors on the surface of a circuit board are replaced by a means that carbon oil is filled in through holes to communicate two adjacent line layers to form resistance, the resistance range can be controlled between 1-100k ohm, so the use is extensive; a manufactured resistance finished product has the outstanding advantages that a path from a signal to an element is shortened, parasitic inductance is reduced, signal crosstalk is reduced, separate components are replaced, the size of a printed board can be effectively reduced, the product weight is reduced, welding spots are reduced; and distinctive characteristics of products, such as precision, small size, light weight, less thickness and reliability of signals, can be realized, and the printed board and the manufacture method thereof adapt to the trend of demands on electronic products.

Description

High accuracy resistance printed board and preparation method thereof

Technical field

The present invention relates to the printed wiring board field, especially a kind of high accuracy resistance printed board and preparation method thereof.

Background technology

Electronic product trend and microminiaturized, multifunctional direction development, and the electronic product in resistance field not only will satisfy this requirement, and the more important thing is the composite signal laser propagation effect that will satisfy components and parts, good function; Mostly the resistance board product is the separate type elements combination, has more components and parts to mount in the product, lead involves, volume is big, the composite signal conversion effect of components and parts is poor.

Summary of the invention

In order to overcome above-mentioned defective, the invention provides a kind of high accuracy resistance printed board and preparation method thereof, volume is little, integrated level is high, can realize embedded resistors.

The present invention for the technical scheme that solves its technical problem and adopt is:

The printed board of a kind of high accuracy resistance; Be provided with two-layer at least line layer, intercepting between each line layer has insulating barrier, is embedded with some resistance in this printed board; It is characterized in that: said resistance is formed between adjacent two line layers; Be formed with through hole on the insulating barrier between these adjacent two line layers, be filled with carbon oil in the through hole, said resistance is communicated with adjacent two line layers by carbon oil and forms.

As further improvement of the present invention, said each resistance comprises that the through hole of filling carbon oil in conducting line, two tie points and two forms; This conducting line is by the line layer etching forming in said adjacent two line layers, and these two tie points are by another line layer etching forming; The two ends of said conducting line cover two through hole, the corresponding respectively two through hole that covers of said two tie points, and the carbon oil in this two through hole is communicated with tie point and conducting line.

The manufacture method of a kind of high accuracy resistance printed board, carry out as follows:

A. cut out material: base material is cut out to appropriate size, and this appropriate size is the total specification after the required size amalgamation of several high accuracy resistance printed boards of production;

B. boring: process through hole at each base material;

C. carbon ink perforation: the mode through the gambling hole is stifled to the through hole that need be made into resistance in carbon oil, earlier after after 100 ℃ of bakings in 30 minutes, 150 ℃ of bakings in 30 minutes and 180 ℃ of bakings in 30 minutes carbon oil curing in the through hole is dried;

D. belt-sanding:, remove the unnecessary carbon printing ink in limit, hole through sand milling;

E. heavy copper is electroplated: through deposition one deck colloid palladium on the insulation hole wall of ion deposition the carbon ink perforation after and the base material, the migration of the chemical electronics of process makes and deposits the last layer chemical copper on the colloid palladium more earlier; Through electrolytic copper plating the copper layer on the insulated substrate is thickened the needed standard that reaches again;

F. circuit is made: through the exposure etching method that develops the copper layer is made into required circuit, is formed with conducting line and tie point in the said circuit;

G. resistance weldering: on the base material that is exposed to the circuit outside, cook the green oil insulating barrier;

H. change gold: be to utilize electrochemical principle, on the copper face of printed board, plate the needed certain thickness Gold plated Layer of one deck client;

I. gong plate: the base material gong becomes required size.

The invention has the beneficial effects as follows: through the filling carbon oil is to be communicated with the mode alternate route plate sheet resistance device that adjacent two line layers form resistance in the through hole, resistance range can be controlled between 1K～100Kohm, and is of many uses; The projecting point of processing after the resistance finished product is, brief signal to the path of first device, reduce stray inductance, reduce crosstalking of signal, and replace size that the separate type components and parts can effectively reduce printed board, alleviate product weight, minimizing solder joint; Can demonstrate fully the precision of product, small, frivolous, the reliable distinguishing feature of signal, adapt to the demand trend of electronic product.

Description of drawings

Fig. 1 is sketch map of printed board of the present invention;

Fig. 2 is a printed board another side sketch map of the present invention;

Fig. 3 is the cross-sectional view of resistance according to the invention.

Embodiment

Embodiment: a kind of high accuracy resistance printed board; Be provided with two-layer at least line layer 1, intercepting between each line layer 1 has insulating barrier 2, is embedded with some resistance in this printed board; Said resistance is formed between adjacent two line layers 1; Be formed with through hole on the insulating barrier 2 between these adjacent two line layers 1, be filled with carbon oil 3 in the through hole, said resistance is communicated with adjacent two line layers by carbon oil 3 and forms.

Said each resistance comprises that the through hole of filling carbon oil 3 in conducting line 11, two tie points 12 and two forms; This conducting line 11 is by a line layer 1 etching forming in said adjacent two line layers, and these two tie points 12 are by another line layer 1 etching forming; The two ends of said conducting line 11 cover two through hole, the corresponding respectively two through hole that covers of said two tie points 12, and the carbon oil 3 in this two through hole is communicated with tie point 12 and conducting line 11.

The manufacture method of a kind of high accuracy resistance printed board, carry out as follows:

A. cut out material: base material is cut out to appropriate size, and this appropriate size is the total specification after the required size amalgamation of several high accuracy resistance printed boards of production;

B. boring: process through hole at each base material;

C. carbon ink perforation: the mode through the gambling hole is stifled to the through hole that need be made into resistance in carbon oil 3, earlier after after 100 ℃ of bakings in 30 minutes, 150 ℃ of bakings in 30 minutes and 180 ℃ of bakings in 30 minutes 3 curing of carbon oil in the through hole are dried;

D. belt-sanding:, remove the unnecessary carbon printing ink in limit, hole through sand milling;

E. heavy copper is electroplated: through deposition one deck colloid palladium on the insulation hole wall of ion deposition the carbon ink perforation after and the base material, the migration of the chemical electronics of process makes and deposits the last layer chemical copper on the colloid palladium more earlier; Through electrolytic copper plating the copper layer on the insulated substrate is thickened the needed standard that reaches again;

F. circuit is made: through the exposure etching method that develops the copper layer is made into required circuit, is formed with conducting line 11 and tie point 12 in the said circuit;

G. resistance weldering: on the base material that is exposed to the circuit outside, cook the green oil insulating barrier;

H. change gold: be to utilize electrochemical principle, on the copper face of printed board, plate the needed certain thickness Gold plated Layer of one deck client;

I. gong plate: the base material gong becomes required size.

Claims (3)

1. high accuracy resistance printed board; Be provided with two-layer at least line layer (1), intercepting between each line layer (1) has insulating barrier (2), is embedded with some resistance in this printed board; It is characterized in that: said resistance is formed between adjacent two line layers (1); Be formed with through hole on the insulating barrier (2) between these adjacent two line layers (1), be filled with carbon oil (3) in the through hole, said resistance is communicated with adjacent two line layers by carbon oil (3) and forms.

2. high accuracy resistance according to claim 1 printed board is characterized in that: said each resistance comprises that the through hole of filling carbon oil (3) in conducting line (11), two tie points (12) and two forms; This conducting line (11) is by a line layer (1) etching forming in said adjacent two line layers, and these two tie points (12) are by another line layer (1) etching forming; The two ends of said conducting line (11) cover two through hole, the corresponding respectively two through hole that covers of said two tie points (12), and the carbon oil (3) in this two through hole is communicated with tie point (12) and conducting line (11).

3. the manufacture method of high accuracy resistance printed board is characterized in that: carry out as follows:

A. cut out material: base material is cut out to appropriate size, and this appropriate size is the total specification after the required size amalgamation of several high accuracy resistance printed boards of production;

B. boring: process through hole at each base material;

C. carbon ink perforation: the mode through the gambling hole is stifled to the through hole that need be made into resistance in carbon oil (3), earlier after after 100 ℃ of bakings in 30 minutes, 150 ℃ of bakings in 30 minutes and 180 ℃ of bakings in 30 minutes carbon oil in the through hole (3) curing is dried;

D. belt-sanding:, remove the unnecessary carbon printing ink in limit, hole through sand milling;

E. heavy copper is electroplated: through deposition one deck colloid palladium on the insulation hole wall of ion deposition the carbon ink perforation after and the base material, the migration of the chemical electronics of process makes and deposits the last layer chemical copper on the colloid palladium more earlier; Through electrolytic copper plating the copper layer on the insulated substrate is thickened the needed standard that reaches again;

F. circuit is made: through the exposure etching method that develops the copper layer is made into required circuit, is formed with conducting line (11) and tie point (12) in the said circuit;

G. resistance weldering: on the base material that is exposed to the circuit outside, cook the green oil insulating barrier;

H. change gold: be to utilize electrochemical principle, on the copper face of printed board, plate the needed certain thickness Gold plated Layer of one deck client;

I. gong plate: the base material gong becomes required size.

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