CN108353499B - Substrate and method for manufacturing substrate - Google Patents
Substrate and method for manufacturing substrate Download PDFInfo
- Publication number
- CN108353499B CN108353499B CN201680063337.4A CN201680063337A CN108353499B CN 108353499 B CN108353499 B CN 108353499B CN 201680063337 A CN201680063337 A CN 201680063337A CN 108353499 B CN108353499 B CN 108353499B
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- Prior art keywords
- hole
- plating
- substrate
- metal piece
- wiring board
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- 239000000758 substrate Substances 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 109
- 239000002184 metal Substances 0.000 claims abstract description 109
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 109
- 238000003825 pressing Methods 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 16
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 239000011148 porous material Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 80
- 230000017525 heat dissipation Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A substrate (1) is provided with: a laminated wiring board (3) in which a plurality of conductive layers (2) made of a conductive material are formed; a through hole (6) formed through the laminated wiring board (3); a metal sheet (10) which is disposed inside the through hole (6) in the range of the entire length of the through hole (6); a bulging portion (8) bulging outward from the outer edge of the through-hole (6) and formed in a cut-away manner over the entire length of the through-hole (6); a bulging hole (9) formed by being surrounded by the bulging portion (8) and the surface of the metal sheet (10) exposed in the bulging portion (8); and a coating film (13) which covers the inner wall of the drum hole (9).
Description
Technical Field
The present invention relates to a substrate such as a printed wiring board, which is embedded with a metal piece and has excellent large current characteristics and heat dissipation characteristics, and a method for manufacturing the substrate.
Background
The semiconductor elements in the circuits tend to increase in heat generation due to higher density and higher current. In particular, semiconductors using Si cause malfunctions and failures when the ambient temperature is 100 ℃. As heat generating components such as such semiconductor devices, there are switching devices such as igbts (insulated Gate Bipolar transistor) and ipms (intelligent Power module).
In order to effectively cool the heat generating component, a heat dissipation path is formed so that heat generated from the heat generating component is dissipated toward the opposite side of the substrate. Specifically, the heat generated from the heat generating component is conducted to the heat sink or the like on the back surface side of the substrate (the side opposite to the component mounting surface (mounting surface)).
As the heat radiation path, for example, a metal sheet made of metal (Cu, Al, or the like) having high thermal conductivity is used. The metal sheet is fixed in a through hole formed in the substrate. The metal sheet is fixed to the through hole by adhesion by press-fitting or plastic deformation, or by bonding by an adhesive or solder (see, for example, patent document 1). The metal sheet is in contact with the heat generating component, so that heat generated from the heat generating component is dissipated to the outside through the metal sheet (for example, columnar copper).
Prior art documents
Patent document
Patent document 1: japanese patent laid-open No. 2-134895
Disclosure of Invention
Problems to be solved by the invention
However, it is desirable to use the metal sheet not only for heat dissipation but also for electrical connection. Conventionally, the metal piece fixed to the through hole is merely in physical contact with the through hole, and therefore, the electrical conduction is unstable. That is, the conductivity cannot be stably and reliably secured. Therefore, conventionally, a through-hole plating layer formed by plating copper on the inner wall of a through-hole is used in addition to a through-hole for electrical conduction provided on a substrate. However, the through-hole plating requires a space for applying the through-hole plating on the substrate, and is not preferable from the viewpoint of high density of component mounting.
The present invention has been made in view of the above-described conventional techniques, and an object thereof is to provide a substrate having heat dissipation characteristics and capable of achieving sufficient electrical conduction, and a method for manufacturing the substrate.
Means for solving the problems
In order to achieve the above object, the present invention provides a substrate comprising: a laminated wiring board in which a plurality of conductive layers made of a conductive material are formed; a through hole formed through the laminated wiring board; a metal sheet disposed inside the through hole over the entire length of the through hole; a bulging portion bulging outward from an outer edge of the through hole and formed to be cut out in an entire length direction of the through hole; a bulging hole formed by being surrounded by the bulging portion and the surface of the metal piece exposed to the inside of the bulging portion; and a plated film covering the inner wall of the bulging hole.
Preferably, a through-hole plating layer as a metal film is interposed between the through-hole and the metal piece, and between the bulging portion and the plating film.
Preferably, the substrate further has a pore which is a space surrounded by the plating film, and the pore is filled with a filler.
In addition, the present invention provides a method for manufacturing a substrate, including: a laminated wiring board forming step of forming the laminated wiring board by stacking an insulating layer made of an insulating resin material and the conductive layer having the conductive material formed in a pattern and pressing the insulating layer and the conductive layer in a stacking direction; a hole forming step of forming the through hole and the bulging portion penetrating the laminated wiring board; a pressing step of pressing the metal piece in a state where the metal piece is disposed in the through hole by passing through the through hole, thereby expanding the diameter of the metal piece and temporarily holding the metal piece in the through hole; and a plating film forming step of forming the plating film by performing a plating treatment in the bulging holes.
Preferably, a through-hole plating layer forming step is performed after the hole forming step, and in the through-hole plating layer forming step, a through-hole plating layer electrically connected to the conductive layer is formed on the inner walls of the through-hole and the protruding portion.
Preferably, the method of manufacturing a substrate includes a filling step of filling a filler into a fine hole, which is a space surrounded by the plating film, after the plating film forming step.
Effects of the invention
According to the present invention, the metal sheet disposed in the through hole is electrically connected to the conductive layer at a portion in contact with the inner wall of the through hole, and is also electrically connected to the conductive layer via the plating film. By connecting the metal sheet to the conductive layer via the metal plating film in this manner, chemically stable electrical conduction can be achieved. That is, a substrate having heat dissipation characteristics by the metal sheet and capable of achieving sufficient electrical conduction can be obtained. In addition, since the plating film can ensure conductivity, it is not necessary to separately form a through-hole plating layer for electrical conduction on the laminated wiring board. Therefore, such a space for forming the through hole is not required, and it is possible to contribute to the densification of component mounting on the substrate which has been pursued in recent years. In addition, since the bulge portion for forming the plating film can be formed directly by a mechanism for forming a through hole (a drill, a punch, a laser, or the like), efficient manufacturing can be performed.
Further, by forming the through-hole plating layer as a metal film between the through-hole and the metal piece and between the bulging portion and the plating film, the insertion operation of inserting the metal piece into the through-hole can be smoothly performed. Further, the connection with the conductive layer can be achieved in advance by the through-hole plating layer, and the connectivity between the metal piece and the conductive layer can be improved.
Further, by filling the fine hole with the filler, it is possible to prevent the solder from flowing inside the plating film and leaking to the surface on the opposite side of the substrate when mounting the component. Both surfaces of the laminated wiring board may be covered with a cap plating layer formed by plating the entire surface thereof. Thus, it is effective for improving the solder wettability.
Further, according to the present invention, since the bulging portion is formed in the hole forming step, the metal piece can be brought into contact with the inner wall of the through hole other than the portion where the bulging portion is formed when the metal piece is pressed in the subsequent pressing step. Therefore, a state in which the metal piece is temporarily held in the through hole can be formed. Therefore, the plating treatment for plating the bulge portion and the filling operation for filling the filler into the fine hole can be easily performed in the subsequent steps. In addition, even when the through-hole plating step is performed, the metal piece is brought into contact with the through-hole plating layer by performing the pressing step, and therefore the metal piece does not come into contact with the through-hole plating layer when the metal piece is inserted into the through-hole. Therefore, the through-hole plating layer can be prevented from being damaged.
Drawings
Fig. 1 is a schematic cross-sectional view of a substrate of the present invention.
Fig. 2 is a schematic cross-sectional view of the periphery of the metal piece as viewed in the penetrating direction near the through hole in fig. 1.
Fig. 3 is a flowchart of a method of manufacturing a substrate of the present invention.
Fig. 4 is an explanatory view of a laminated wiring board forming process.
Fig. 5 is an explanatory view of the formation of a through hole in the hole forming step.
Fig. 6 is an explanatory view of the case where the bulge portion is formed in the hole forming step.
Fig. 7 is a schematic cross-sectional view of the vicinity of the through hole in fig. 6 as viewed from the penetrating direction.
Fig. 8 is an explanatory view of the case where the metal piece is inserted through the through hole in the pressing step.
Fig. 9 is an explanatory view of the case where the metal sheet is pressed in the pressing step.
Fig. 10 is a schematic cross-sectional view of the periphery of the metal piece viewed from the penetrating direction in the vicinity of the through hole in fig. 9.
Fig. 11 is an explanatory view of the case where the projection hole is subjected to the plating treatment in the plating film forming step.
Fig. 12 is a schematic cross-sectional view of the periphery of the metal piece viewed from the penetrating direction in the vicinity of the through hole in fig. 11.
Fig. 13 is an explanatory view of filling of a filler into the fine pores in the filling step.
Fig. 14 is a schematic cross-sectional view of a substrate formed by performing a through-hole plating step.
Fig. 15 is a schematic cross-sectional view of the periphery of the metal piece viewed from the penetrating direction in the vicinity of the through hole in fig. 14.
Fig. 16 is an explanatory view of the case where a small hole including a bulge portion is formed before the formation of a through hole in the hole forming step.
Detailed Description
As shown in fig. 1 and 2, a substrate 1 of the present invention is mainly configured to include a multilayer wiring board 3 called a multilayer board (including a double-sided board) in which a plurality of conductive layers 2 are formed. In the example of fig. 1, a so-called four-layer board is shown, in which four conductive layers 2 are formed. The conductive layer 2 is formed as a conductive pattern in each layer. An insulating layer 4 is provided between the conductive layers 2. The insulating layer 4 is formed of an insulating material such as prepreg. More specifically, a prepreg in which a sheet-like glass cloth 5 is disposed in an epoxy resin is used as the insulating layer 4, and the sheet-like glass cloth 5 is a cloth woven from glass fiber yarns.
A through hole 6 is formed in the laminated wiring board 3. The through hole 6 penetrates the laminated wiring board 3. The through-hole 6 has a substantially cylindrical hole shape. The through hole 6 is formed in a circular shape when the laminated wiring board 3 is viewed from above (the penetrating direction of the through hole 6). Here, a bulging portion 8 bulging outward from the outer edge of the through hole 6 is formed by cutting. The bulging portion 8 is formed to bulge from the outer periphery of the through hole 6 in a plan view. The bulge 8 is formed over the entire length of the through hole 6 in the longitudinal direction. The number of the protruding portions 8 is not particularly limited, and a plurality of protruding portions are provided at positions facing the through holes 6 as shown in fig. 2, for example, whereby the metal piece 10 to be described later can be electrically connected to the conductive layer 2 stably.
A metal piece 10 is disposed in the through hole 6. Specifically, the metal piece 10 is pressed outward in the through hole 6 to have a large diameter and pressed against the inner wall of the through hole 6, thereby engaging with and being held by the through hole 6. By disposing the metal piece 10, the bulging hole 9, which is a space surrounded by the bulging portion 8 and the surface of the metal piece 10 exposed to the inside of the bulging portion 8, is formed. The inner wall of the projection hole 9 is covered with a metal plating film 13. Since the plating film 13 is electrically connected to the conductive layer 2 communicating with the inner wall of the bulging portion 8, copper is preferable as a plating material from the viewpoint of conductivity. That is, the plating film 13 is formed of, for example, copper precipitated by plating treatment. Here, the space surrounded by the plating film 13 is formed as a fine hole 11, and the inside of the fine hole 11 is filled with a filler 14.
The metal sheet 10 is in contact with the plating film 13 at a portion facing the protruding portion 8 and both surfaces of the laminated wiring board 3. Since the metal sheet 10 partially plays a role in heat dissipation and conduction of the substrate 1, a metal having excellent heat dissipation and conduction characteristics is used. For example, the metal sheet 10 is preferably made of a metal of any one of copper, silver, or aluminum having high electrical conduction characteristics and heat dissipation characteristics. The cover plating layers 12 may be provided on both surfaces of the laminated wiring board 3. The cover plating layer 12 covers both sides of the laminated wiring board 3. Since the cap plating layer 12 is formed by plating, metal is deposited on the surface of the laminated wiring board 3.
With the substrate 1 configured as described above, the metal piece 10 disposed in the through hole 6 is electrically connected to the conductive layer 2 at a portion in contact with the inner wall of the through hole 6, and is also electrically connected to the conductive layer 2 via the plating film 13. In this way, the metal piece 10 is connected to the conductive layer 2 via the metal plating film 13, and chemically stable electrical conduction can be achieved. That is, the substrate 1 having heat dissipation characteristics by the metal sheet 10 and capable of achieving sufficient electrical conduction can be obtained. Since the plated film 13 can secure conductivity, it is not necessary to separately form a through-hole plating layer for electrical conduction on the laminated wiring board 3. Therefore, such a space for forming the through hole is not required, and it is possible to contribute to the densification of component mounting on the substrate which has been pursued in recent years. Further, since the bulge portion 8 for forming the plating film 13 can be formed by a mechanism (drill, punch, laser, or the like) for forming the through hole 6 as it is, efficient manufacturing can be performed.
Further, by filling the fine holes 11 with the filler 14, it is possible to prevent the solder from flowing inside the plating film 13 and leaking to the surface on the opposite side of the substrate 1 at the time of component mounting. Further, it is effective for improving solder wettability if both surfaces of the laminated wiring board 3 are covered with the lid plating layer 12 formed by plating the entire surface of both surfaces of the laminated wiring board 3. In addition, when the cap plating layer 12 is provided, the integration of the metal piece 10 and the laminated wiring board 3 is reinforced, and the metal piece 10 can be reliably prevented from coming off the through hole 6, thereby ensuring the integrity as the substrate 1.
The substrate 1 can be manufactured by a method for manufacturing a substrate described below. This manufacturing method is represented by a flowchart shown in fig. 4. In this method, a laminated wiring board forming step is first performed (step S1). In this step, a plurality of insulating layers 4 and conductive layers 2 are stacked and pressed in the stacking direction to obtain a multilayer wiring board 3 as shown in fig. 4. The insulating layer 4 is made of, for example, an insulating resin material, and the conductive layer 2 is formed with a conductive material in a pattern. In order to form a multilayer wiring board in which the conductive layer 2 is four layers, for example, a so-called double-sided board (a copper-clad laminate in which copper foils are formed on both sides) in which the conductive layers 2 are formed on both sides of the insulating layer 4 is sandwiched between two so-called single-sided boards (a copper-clad laminate in which copper foils are formed on only one side) in which the conductive layer 2 is formed on only one side of the insulating layer 4, and the two boards are laminated.
Next, a hole forming process is performed (step S2). In this step, first, a through hole 6 as shown in fig. 5 is formed to penetrate the laminated wiring board 3. The through hole 6 is formed by drilling the laminated wiring board 3 with a drill, a punch, a laser, or the like. The hole shape of the through-hole 6 is a substantially cylindrical shape. The through hole 6 draws a circular shape in a plan view of the laminated wiring board 3 viewed from above. After the through-hole 6 is formed, as shown in fig. 6 and 7, a bulge 8 is further formed on the outer edge of the through-hole 6. The bulge 8 is also formed by a drill, a punch, a laser, or the like, as in the through hole 6. Before the formation of the through-hole 6, a small hole including the bulge portion 8 may be formed by machining, and then the through-hole 6 may be formed (see fig. 16). In this case, the small hole is formed first with the center on the circumference of the through-hole 6. If the small hole including the bulge portion 8 is formed first, the processing is easier than the forming of the through hole 6.
Next, a pressing process is performed (step S3). In this step, first, as shown in fig. 8, the metal piece 10 is inserted through the through hole 6. At this time, the diameter of the metal piece 10 is smaller than that of the through hole 6. Then, in a state where the metal piece 10 is disposed in the through hole 6, the metal piece 10 is pressed from the up-down direction (both sides in the penetrating direction of the through hole). Thereby, the metal piece 10 expands outward in diameter as shown in fig. 9. As shown in fig. 10, the outer peripheral surface of the metal sheet 10 has a portion in contact with the through hole 6 and a portion exposed to the inside of the bulging portion 8 by expanding the metal sheet 10 in diameter. In this state, the metal sheet 10 is temporarily held in the through-hole 6. At this time, a space surrounded by the inner wall of the bulging portion 8 and the surface of the metal piece 10 exposed into the bulging portion 8 is formed as a bulging hole 9. The metal piece 10 is temporarily held, so that the plating treatment for plating the bulge portion 8 and the filling operation (described later) for filling the filler 14 into the fine pores 11 can be easily performed in the subsequent steps. In the pressing, a plate for pressing may be disposed on one surface of the metal sheet 10, and the pressing may be performed only from the other side using a pressing member.
Next, a plating film forming step is performed (step S4). In this step, the inside of the projection hole 9 is subjected to plating treatment to form a plated film 13. Through this step, as shown in fig. 11 and 12, the plating film 13 is formed in the projection hole 9. The plated film 13 is formed along the inner wall of the drum hole 9. That is, the plating film 13 is formed by deposition on the inner wall of the bulging portion 8 and the surface of the metal piece 10 at the portion exposed in the bulging portion 8. The space (the fine hole 11) remains inside the plating film 13. By forming the plated film 13, the plated film 13 is electrically connected to the conductive layer 2 communicating with the bulging portion 8. Therefore, copper is preferable as the plating material. In conjunction with this, the metal sheet 10 is electrically connected to the conductive layer 2 via the plated film 13. By connecting the metal piece 10 to the conductive layer 2 through the metal plating film 13 in this way, chemically stable electrical conduction can be achieved. Of course, the electrical conduction of the metal sheet 10 in contact with the conductive layer 2 communicating with the through-hole 6 is also ensured. That is, the substrate 1 having heat dissipation characteristics by the metal sheet 10 and capable of achieving sufficient electrical conduction can be obtained. The plating films 13 are deposited on both surfaces of the metal sheet 10 and both surfaces of the laminated wiring board 3. This reinforces the integration of the metal piece 10 and the laminated wiring board 3, and can reliably prevent the metal piece 10 from coming off the through hole 6, thereby ensuring the integrity of the substrate 1.
Stable electrical conduction between the metal piece 10 and the conductive layer 2 can be sufficiently achieved in the plating film formation step described above, but the following steps may also be performed. That is, the filling step (step S5) may be performed next. In this step, the fine pores 11 are filled with the filler 14. The filler 14 fills the entire inner space of the pores 11. As the filler 14, not only an insulating epoxy resin but also a conductive ink can be used. When the filling process is completed, the state shown in fig. 13 is obtained. The cross-sectional view of fig. 13 viewed from the penetrating direction in the vicinity of the through hole is the same as that of fig. 2. By filling the fine pores 11 with the filler 14 in this way, it is possible to prevent the solder from flowing inside the plating film 13 and leaking to the surface on the opposite side of the substrate 1 when mounting the component.
Further, the cap plating layer forming step (step S6) may be performed subsequently. In this step, the cap plating layers 12 are formed on both surfaces of the laminated wiring board 3. The cap plating layer 12 is formed to form the substrate 1 as shown in fig. 1. The cap plating layer 12 is formed by applying plating treatment to both surfaces of the laminated wiring board 3. When the cap plating layer 12 is provided in this way, the surface of the filler 14 is plated, and thus the solder wettability is improved. On the other hand, the integration of the metal piece 10 and the laminated wiring board 3 is further strengthened, and the metal piece 10 can be reliably prevented from coming off the through hole 6, and the integration as the substrate 1 can be ensured.
According to the method of manufacturing the substrate 1 of the present invention as described above, since the bulging portion 8 is formed in the hole forming step, when the metal piece 10 is pressed in the subsequent pressing step, the metal piece 10 can be brought into contact with the inner wall of the through hole 6 except for the portion where the bulging portion 8 is formed. Therefore, a state in which the metal piece 10 is temporarily held in the through hole 6 can be formed. Therefore, the plating process for plating the bulge portion 8 and the filling operation for filling the filler 14 into the fine pores 11 can be easily performed in the subsequent steps.
On the other hand, after the hole forming step, a through-hole plating layer forming step of forming a through-hole plating layer electrically connected to the conductive layer 2 on the inner walls of the through-hole 6 and the bulging portion 8 may be performed. By performing this through-hole plating step, the through-hole plating layer 7 (see fig. 14 and 15) as a metal film is formed between the through-hole 6 and the metal piece 10 and between the expanded portion 8 and the plating film 13 when the final substrate 1 is manufactured. Since the plating treatment is applied to the entire surface of the laminated wiring board 3, the through-hole plating layers 7 deposited by the plating treatment are formed on both surfaces of the laminated wiring board 3 and the inner wall surfaces of the through-hole 6 and the bulging portion 8. The through-hole plating layer 7 is electrically connected to the conductive layer 2 which communicates with the through-hole 6 and the bulging portion 8, and is brought into contact with the metal piece 10 in a subsequent step, whereby a path which allows electrical conduction of a large current can be secured. Even when the through-hole plating step is performed, the metal piece 10 is in contact with the through-hole plating layer 7 by performing the pressing step, and therefore the metal piece 10 is not in contact with the through-hole plating layer 7 when the metal piece 10 is inserted into the through-hole 6. Therefore, the through-hole plating layer 7 can be prevented from being damaged. Even if the metal piece 10 has substantially the same diameter as the through-hole 6, the insertion operation of the metal piece 10 can be smoothly performed by the through-hole plating layer 7. That is, by forming the through-hole plating layer 7 in advance before the insertion of the metal piece 10, the reliability of conduction between circuits can be ensured, and the metal piece 10 can be inserted smoothly. By forming the through-hole plating layer 7, the metal sheet 10 and the through-hole plating layer 7 can be electrochemically connected by the plating film 13. The plating film 13 can be expected to have a bonding effect on the surface layer close to the cap plating layer 12.
Description of the reference numerals
1: substrate, 2: conductive layer, 3: laminated wiring board, 4: insulating layer, 5: glass cloth, 6: through hole, 7: through-hole plating, 8: bulge, 9: drum outlet, 10: metal sheet, 11: pore, 12: cap plating, 13: coating, 14: and (4) filling materials.
Claims (6)
1. A substrate, characterized in that,
the substrate is provided with:
a laminated wiring board in which a plurality of conductive layers made of a conductive material are formed;
a through hole formed through the laminated wiring board;
a metal sheet which is arranged inside the through hole in the range of the whole length of the through hole and is pressed and held on the inner wall of the through hole;
a bulging portion bulging outward from an outer edge of the through hole and formed to be cut out in an entire length direction of the through hole;
a bulging hole formed by being surrounded by the bulging portion and the surface of the metal piece exposed to the inside of the bulging portion; and
a metal plating film covering the inner wall of the bulging hole,
the metal sheet is electrically connected to the conductive layer at a portion in contact with the inner wall of the through hole, and is electrically connected to the conductive layer at the bulging hole via the plating film.
2. The substrate of claim 1,
through-hole plating layers as metal films are interposed between the through-holes and the metal sheet, and between the bulging portions and the plating films.
3. The substrate according to claim 1 or 2,
the substrate further has a fine hole which is a space surrounded by the plating film,
the pores are filled with a filler material.
4. A method of manufacturing a substrate, for manufacturing the substrate according to claim 1,
the method for manufacturing a substrate includes:
a laminated wiring board forming step of forming the laminated wiring board by stacking an insulating layer made of an insulating resin material and the conductive layer having the conductive material formed in a pattern and pressing the insulating layer and the conductive layer in a stacking direction;
a hole forming step of forming the through hole and the bulging portion penetrating the laminated wiring board;
a pressing step of pressing the metal piece in a state where the metal piece is disposed in the through hole through the through hole, thereby expanding the diameter of the metal piece, temporarily holding the metal piece in the through hole in a manner of pressure-contacting the metal piece to an inner wall of the through hole, and electrically connecting the metal piece to the conductive layer at a portion in contact with the inner wall of the through hole; and
and a plating film forming step of forming the metal plating film by performing a plating process in the projection hole so that the metal piece is electrically connected to the conductive layer through the plating film in the projection hole.
5. The method for manufacturing a substrate according to claim 4,
and a through-hole plating layer forming step of forming a through-hole plating layer electrically connected to the conductive layer on the inner walls of the through-hole and the bulging portion, after the hole forming step.
6. The method for manufacturing a substrate according to claim 4 or 5,
the method for manufacturing a substrate includes a filling step of filling a filler into a fine hole, which is a space surrounded by the plating film, after the plating film forming step.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/060990 WO2017175263A1 (en) | 2016-04-04 | 2016-04-04 | Substrate and method for producing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108353499A CN108353499A (en) | 2018-07-31 |
| CN108353499B true CN108353499B (en) | 2020-10-09 |
Family
ID=57572355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680063337.4A Expired - Fee Related CN108353499B (en) | 2016-04-04 | 2016-04-04 | Substrate and method for manufacturing substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6047688B1 (en) |
| CN (1) | CN108353499B (en) |
| TW (1) | TW201803419A (en) |
| WO (1) | WO2017175263A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009153A (en) * | 2017-06-20 | 2019-01-17 | 大陽工業株式会社 | Wiring board, electronic device, and method of manufacturing electronic device |
| US11445596B2 (en) | 2018-12-27 | 2022-09-13 | Unimicron Technology Corp. | Circuit board having heat-dissipation block and method of manufacturing the same |
| TWI694756B (en) * | 2018-12-27 | 2020-05-21 | 欣興電子股份有限公司 | A circuit board with heat-dissipation block and method of manufacturing thereof |
| JP7255403B2 (en) * | 2019-07-19 | 2023-04-11 | 株式会社オートネットワーク技術研究所 | Substrate with metal member |
| CN110730575A (en) * | 2019-10-18 | 2020-01-24 | 苏州浪潮智能科技有限公司 | Method for manufacturing solid through hole |
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| JP2004200448A (en) * | 2002-12-19 | 2004-07-15 | Nissan Motor Co Ltd | Method for mounting electronic part on substrate |
| JP2007214277A (en) * | 2006-02-08 | 2007-08-23 | Meidensha Corp | Printed circuit board |
| CN101257770A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN102647853A (en) * | 2011-02-18 | 2012-08-22 | 昆山华扬电子有限公司 | High-accuracy through-hole resistance printed board and manufacture method thereof |
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6454265U (en) * | 1987-09-25 | 1989-04-04 | ||
| JPH01120780A (en) * | 1987-11-04 | 1989-05-12 | Hitachi Chem Co Ltd | Press fit pin |
-
2016
- 2016-04-04 CN CN201680063337.4A patent/CN108353499B/en not_active Expired - Fee Related
- 2016-04-04 JP JP2016532010A patent/JP6047688B1/en active Active
- 2016-04-04 WO PCT/JP2016/060990 patent/WO2017175263A1/en active Application Filing
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2017
- 2017-03-17 TW TW106109011A patent/TW201803419A/en unknown
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200448A (en) * | 2002-12-19 | 2004-07-15 | Nissan Motor Co Ltd | Method for mounting electronic part on substrate |
| JP2007214277A (en) * | 2006-02-08 | 2007-08-23 | Meidensha Corp | Printed circuit board |
| CN101257770A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN102647853A (en) * | 2011-02-18 | 2012-08-22 | 昆山华扬电子有限公司 | High-accuracy through-hole resistance printed board and manufacture method thereof |
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108353499A (en) | 2018-07-31 |
| TW201803419A (en) | 2018-01-16 |
| JP6047688B1 (en) | 2016-12-21 |
| JPWO2017175263A1 (en) | 2018-04-12 |
| WO2017175263A1 (en) | 2017-10-12 |
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