JPWO2017175263A1 - Substrate manufacturing method - Google Patents

Abstract

The substrate (1) includes a multilayer wiring board (3) in which a plurality of conductive layers (2) made of a conductive material are formed, a through hole (6) formed through the multilayer wiring board (3), Through-hole (6) The metal piece (10) arranged inside the through-hole (6) over the entire length, and the overall length in the longitudinal direction of the through-hole (6) bulging outward from the outer edge of the through-hole (6) A bulging portion formed by being surrounded by the surface of the bulging portion (8) formed by cutting over the bulging portion (8) and the metal piece (10) exposed in the bulging portion (8). (9) and a plating film (13) covering the inner wall of the bulging hole (9).

Description

  The present invention relates to a substrate such as a printed wiring board, a substrate in which a metal piece is fitted and excellent in large current characteristics and heat dissipation characteristics, and a method for manufacturing the substrate.

  Semiconductor devices in electric circuits tend to generate more heat due to higher density and higher current. In particular, a semiconductor using Si causes malfunction and failure when the ambient temperature is 100 ° C. or higher. Examples of such heat generating components such as semiconductor elements include switching elements such as IGBTs (Insulated Gate Bipolar Transistors) and IPMs (Intelligent Power Modules).

  In order to effectively cool the heat generating component, a heat dissipation path is formed so as to release heat generated from the heat generating component toward the opposite side of the substrate. Specifically, cooling is performed by conducting heat generated from the heat-generating component to a heat sink or the like on the back side of the substrate (the side opposite to the component mounting surface (mounting surface)).

  As the heat dissipation path, for example, a metal piece made of a metal (Cu, Al, etc.) having high thermal conductivity is used. This metal piece is fixed in a through hole formed in the substrate. The metal piece is fixed to the through hole by adhesion by press-fitting or plastic deformation, joining by an adhesive or solder, etc. (see, for example, Patent Document 1). When the metal piece comes into contact with the heat generating component, heat generated from the heat generating component is radiated to the outside through the metal piece (for example, columnar copper).

Japanese Patent Laid-Open No. 2-134895

  However, there is a demand for using a metal piece not only for heat dissipation but also for electrical connection. Conventionally, the metal piece fixed to the through hole is merely in physical contact with the through hole, and thus electrical conduction is unstable. That is, the conductivity cannot be secured stably and reliably. For this reason, conventionally, through-hole plating formed by separately providing a through-hole for electrical conduction in a substrate and applying copper plating to the inner wall of the through-hole is used. However, such through-hole plating requires a space for the substrate, which is not preferable from the viewpoint of increasing the density of component mounting.

  The present invention has been made in consideration of the above-described prior art, and an object thereof is to provide a substrate and a method for manufacturing the substrate that have heat dissipation characteristics and can achieve sufficient electrical conduction.

  In order to achieve the above object, in the present invention, a laminated wiring board in which a plurality of conductive layers made of a conductive material are formed, a through hole formed through the laminated wiring board, and the entire length of the through hole are covered. A metal piece disposed inside the through-hole, a bulge formed by bulging outward from the outer edge of the through-hole and notched over the entire length in the longitudinal direction of the through-hole, and the bulge And a bulging hole formed by being surrounded by the surface of the metal piece exposed in the bulging portion, and a plating film covering the inner wall of the bulging hole.

  Preferably, through-hole plating which is a metal film is interposed between the through hole and the metal piece, and between the bulging portion and the plating film.

  Preferably, it further has pores as spaces surrounded by the plating film, and the pores are filled with a filler.

  Further, in the present invention, a laminated wiring board forming step of forming the laminated wiring board by stacking an insulating layer made of an insulating resin material and the conductive layer in which the conductive material is formed as a pattern and pressing in a laminating direction; A punching step for forming the through hole and the bulging portion penetrating the laminated wiring board, and pressing the metal piece in a state where the metal piece is inserted into the through hole and arranged in the through hole. And a pressing step for temporarily holding the metal piece in the through hole, and a plating film forming step for plating the inside of the bulging hole to form the plating film. A method for manufacturing a substrate is provided.

  Preferably, after the drilling step, a through-hole plating forming step of forming a through-hole plating that is electrically connected to the conductive layer on the inner wall of the through-hole and the bulging portion is performed.

  Preferably, after the plating film forming step, a filling step of filling a filler inside pores as a space surrounded by the plating film is provided.

  According to the present invention, the metal piece disposed in the through hole is electrically connected to the conductive layer at a portion in contact with the inner wall of the through hole, and is electrically connected to the conductive layer even through the plating film. Will be connected. In this way, the metal piece is connected to the conductive layer through the metal plating film, whereby chemically stable electrical conduction can be obtained. That is, it is possible to obtain a substrate that has heat dissipation characteristics due to metal pieces and can achieve sufficient electrical conduction. Moreover, since conductivity can be ensured through such a plating film, it is not necessary to separately form through-hole plating for electrical conduction on the laminated wiring board. For this reason, the space for forming such a through hole becomes unnecessary, and it can contribute to the high density of the component mounting in the board | substrate currently calculated | required in recent years. In addition, since the bulging portion for forming the plating film can directly use means for forming a through hole (such as a drill, a punch press, or a laser), it can be efficiently manufactured.

  In addition, by forming through-hole plating, which is a metal film, between the through-hole and the metal piece, and between the bulge and the plating film, the metal piece can be smoothly inserted into the through-hole. Can do. Furthermore, the connection with the conductive layer can be realized in advance by through-hole plating, and the connectivity between the metal piece and the conductive layer can be improved.

  Further, by embedding the filler in the pores, it is possible to prevent the solder from flowing inside the plating film and leaking to the opposite surface of the substrate during component mounting. Further, both surfaces of the multilayer wiring board may be covered with a lid plating layer formed by plating the entire surface. This is effective in improving solder wettability.

  Further, according to the present invention, since the bulging portion is formed in the punching step, when the metal piece is pressed in the subsequent pressing step, the metal piece is a through hole other than the portion where the bulging portion is formed. Can be brought into contact with the inner wall. For this reason, the state by which the metal piece was temporarily hold | maintained in the through hole can be formed. Therefore, it becomes easy to perform the plating process to the bulging part and the filling work of the filler to the pores in the subsequent process. In addition, even when the through-hole plating process is performed, the metal piece comes into contact with the through-hole plating only after performing the pressing process, so when inserting the metal piece into the through-hole, Do not touch. For this reason, it can prevent that through-hole plating is damaged.

It is a schematic sectional drawing of the board | substrate which concerns on this invention. It is a schematic sectional drawing of the metal piece periphery seen from the penetration direction of the through-hole vicinity of FIG. It is a flowchart of the manufacturing method of the board | substrate which concerns on this invention. It is explanatory drawing of a laminated wiring board formation process. It is explanatory drawing when a through hole is formed in the drilling process. It is explanatory drawing when a bulging part is formed in the drilling process. It is a schematic sectional drawing when the vicinity of the through hole of FIG. 6 is seen from the penetration direction. It is explanatory drawing when a metal piece is penetrated to the through hole at the press process. It is explanatory drawing when a metal piece is pressed in a press process. FIG. 10 is a schematic cross-sectional view of the periphery of a metal piece viewed from the penetration direction in the vicinity of the through hole in FIG. 9. It is explanatory drawing when a plating process is performed to the bulging hole at the plating film formation process. It is a schematic sectional drawing of the metal piece periphery seen from the penetration direction of the through-hole vicinity of FIG. It is explanatory drawing at the time of embedding a filler in a pore at the filling process. It is a schematic sectional drawing of the board | substrate formed by performing a through-hole plating process. It is a schematic sectional drawing of the metal piece periphery seen from the penetration direction of the through-hole vicinity of FIG. It is explanatory drawing when the small hole containing a bulging part is formed prior to through-hole formation in a drilling process.

  As shown in FIGS. 1 and 2, a substrate 1 according to the present invention has a multilayer wiring board 3 called a multilayer board (including a double-sided board) in which a plurality of conductive layers 2 are formed as a main structure. ing. In the example of FIG. 1, a so-called four-layer plate in which four conductive layers 2 are formed is shown. The conductive layer 2 is formed in each layer as a conductor pattern. An insulating layer 4 is disposed between the conductive layers 2. The insulating layer 4 is made of an insulating material such as a prepreg. More specifically, the insulating layer 4 is made of, for example, a prepreg in which a sheet-like glass cloth 5 that is a cloth woven with glass fiber yarns is placed in an epoxy resin.

  A through hole 6 is formed in the laminated wiring board 3. The through hole 6 penetrates the laminated wiring board 3. The through hole 6 has a substantially cylindrical shape. In a plan view of the laminated wiring board 3 as viewed from above (through direction of the through hole 6), the through hole 6 has a circular shape. Here, the bulging portion 8 is formed by cutting away from the outer edge of the through hole 6. The bulging portion 8 is formed to bulge from the outer periphery of the through hole 6 in plan view. Further, the bulging portion 8 is formed over the entire length of the through hole 6 in the longitudinal direction. The number of the bulging portions 8 is not particularly limited. For example, by providing a plurality of bulging portions 8 at positions facing the through holes 6 as shown in FIG. 2, the electrical connection between the metal piece 10 and the conductive layer 2 described later can be stabilized. Can be.

  A metal piece 10 is disposed in the through hole 6. Specifically, the metal piece 10 is held in engagement with the through-hole 6 by being pushed outwardly in the through-hole 6 and pressed against the inner wall of the through-hole 6. By arranging the metal piece 10, a bulging hole 9 is formed which is a space surrounded by the bulging portion 8 and the surface of the metal piece 10 exposed in the bulging portion 8. The inner wall of the bulging hole 9 is covered with a metal plating film 13. Since the plating film 13 is electrically connected to the conductive layer 2 communicating with the inner wall of the bulging portion 8, copper is preferable as the plating material from the viewpoint of conductivity. That is, the plating film 13 is made of, for example, copper deposited by plating. Here, the space surrounded by the plating film 13 is formed as pores 11, and the pores 11 are filled with a filler 14.

  The metal piece 10 described above comes into contact with the plating film 13 at the location facing the bulging portion 8 and on both sides of the laminated wiring board 3. Since this metal piece 10 plays the role of heat dissipation and conduction of the substrate 1 as a part, a metal having excellent heat dissipation and conduction characteristics is used. For example, it is preferably made of any metal of copper, silver, or aluminum having high electrical conduction characteristics and heat dissipation characteristics. The lid plating layer 12 may be disposed on both surfaces of the laminated wiring board 3. The lid plating layer 12 covers both surfaces of the laminated wiring board 3. Since this lid plating layer 12 is formed by a plating process, metal is deposited on the surface of the laminated wiring board 3.

  By adopting the substrate 1 having the above structure, the metal piece 10 disposed in the through hole 6 is electrically connected to the conductive layer 2 at a portion in contact with the inner wall of the through hole 6, and a plating film Even through 13, the conductive layer 2 is electrically connected. Thus, the metal piece 10 is connected to the conductive layer 2 through the metal plating film 13, whereby chemically stable electrical conduction can be obtained. That is, it is possible to obtain the substrate 1 that has heat dissipation characteristics due to the metal piece 10 and can achieve sufficient electrical conduction. Further, since conductivity can be ensured through such a plating film 13, it is not necessary to separately form through-hole plating for electrical conduction on the laminated wiring board 3. For this reason, the space for forming such a through hole becomes unnecessary, and it can contribute to the high density of the component mounting in the board | substrate currently calculated | required in recent years. Moreover, since the bulging part 8 for forming the plating film 13 can use the means for forming the through hole 6 (a drill, a punch press, a laser, or the like) as it is, it can be efficiently manufactured.

  Also, by embedding the filler 14 in the pores 11, it is possible to prevent the solder from flowing inside the plating film 13 and leaking to the opposite surface of the substrate 1 during component mounting. Further, if both surfaces of the laminated wiring board 3 are covered with the lid plating layer 12 formed by plating the entire surface, it is effective in improving the solder wettability. Further, if the lid plating layer 12 is provided, the integration of the metal piece 10 and the laminated wiring board 3 is strengthened, and the metal piece 10 is reliably prevented from coming out of the through hole 6, and the integrity as the substrate 1 is improved. It can be secured.

  The board | substrate 1 mentioned above can be manufactured with the manufacturing method of the board | substrate demonstrated below. This manufacturing method is represented in the flowchart shown in FIG. In this method, a laminated wiring board forming step is first performed (step S1). In this step, a laminated wiring board 3 as shown in FIG. 4 is obtained by stacking a plurality of insulating layers 4 and conductive layers 2 and pressing them in the laminating direction. The insulating layer 4 is made of, for example, an insulating resin material, and the conductive layer 2 is formed of a conductive material as a pattern. In order to form a laminated wiring board having four conductive layers 2, for example, a so-called single-sided board (a copper-clad laminate in which a copper foil is formed only on one side) in which the conductive layer 2 is formed only on one side of the insulating layer 4 is used. Two sheets are sandwiched between so-called double-sided plates (copper-clad laminates with copper foils formed on both sides) in which the conductive layer 2 is formed on both sides of the insulating layer 4 and laminated.

  Next, a drilling process is performed (step S2). In this step, first, a through hole 6 as shown in FIG. 5 penetrating the laminated wiring board 3 is formed. The through hole 6 is formed by drilling the laminated wiring board 3 with a drill, punch press, laser, or the like. The through hole 6 has a substantially cylindrical shape. In the plan view of the laminated wiring board 3 as viewed from above, the through hole 6 has a circular shape. After the through hole 6 is formed, a bulging portion 8 is further formed on the outer edge of the through hole 6 as shown in FIGS. The bulging portion 8 is also formed by a drill, a punch press, a laser, or the like, like the through hole 6. Prior to the formation of the through hole 6, a small hole including the bulging portion 8 may be processed and formed, and then the through hole 6 may be formed (see FIG. 16). In this case, the small hole is formed first with the circumference of the through hole 6 being the center. If the small hole including the bulging portion 8 is formed first in this way, the processing becomes easier than forming the through hole 6 first.

  Next, a pressing process is performed (step S3). In this step, first, the metal piece 10 is inserted through the through hole 6 as shown in FIG. At this time, the diameter of the metal piece 10 is smaller than the diameter of the through hole 6. Then, in a state where the metal piece 10 is disposed in the through hole 6, the metal piece 10 is pressed from the vertical direction (on both sides of the through hole through direction). Thereby, as shown in FIG. 9, the diameter of the metal piece 10 is expanded outward. Further, as shown in FIG. 10, by expanding the diameter of the metal piece 10, the outer peripheral surface of the metal piece 10 has a portion that contacts the through hole 6 and a portion that is exposed in the bulging portion 8. In this state, the metal piece 10 is temporarily held in the through hole 6. At this time, a space surrounded by the inner wall of the bulging portion 8 and the surface of the metal piece 10 exposed in the bulging portion 8 is formed as the bulging hole 9. Holding the metal piece 10 makes it easier to perform the plating process on the bulging portion 8 and the filling work of the filler 14 into the pores 11 in a later process (described later). The pressing may be performed by placing a plate for pressing on one surface of the metal piece 10 and pressing the pressing member only from the other side.

  Next, a plating film forming process is performed (step S4). In this step, the plating film 13 is formed by plating the bulging hole 9. By this step, the plating film 13 is formed in the bulging hole 9 as shown in FIGS. The plating film 13 is formed along the inner wall of the bulging hole 9. That is, the plating film 13 is deposited on the inner wall of the bulging portion 8 and the surface of the metal piece 10 exposed in the bulging portion 8. In addition, the space (pore 11) still remains inside the plating film 13. By forming the plating film 13, the plating film 13 and the conductive layer 2 communicating with the bulging portion 8 are electrically connected. For this reason, copper is preferable as the plating material. Coupled with this, the metal piece 10 is electrically connected to the conductive layer 2 through the plating film 13. Thus, the metal piece 10 is connected to the conductive layer 2 through the metal plating film 13, whereby chemically stable electrical conduction can be obtained. Of course, the metal piece 10 is also ensured electrical continuity due to contact with the conductive layer 2 communicating with the through hole 6. That is, it is possible to obtain the substrate 1 that has heat dissipation characteristics due to the metal piece 10 and can achieve sufficient electrical conduction. Further, the plating film 13 is deposited on both surfaces of the metal piece 10 and both surfaces of the laminated wiring board 3. Thereby, the integration of the metal piece 10 and the laminated wiring board 3 is strengthened, and the metal piece 10 is reliably prevented from coming out of the through hole 6, and the integrity as the substrate 1 can be secured.

  Stable electrical conduction between the metal piece 10 and the conductive layer 2 can be sufficiently obtained in the plating film forming step, but the following steps may be further performed. That is, you may perform a filling process next (step S5). In this step, the pores 11 are filled with the filler 14. The filler 14 is filled so as to fill the entire inner space of the pores 11. As the filler 14, in addition to an insulating epoxy resin, a conductive ink can also be used. When the filling process is finished, the state shown in FIG. 13 is obtained. 13 is the same as FIG. 2 when viewed from the penetration direction in the vicinity of the through hole. Thus, by embedding the filler 14 in the pores 11, it is possible to prevent the solder from flowing inside the plating film 13 and leaking to the opposite surface of the substrate 1 during component mounting.

  Furthermore, you may perform a lid plating layer formation process next (step S6). In this step, the lid plating layer 12 is formed on both surfaces of the laminated wiring board 3. The lid plating layer 12 is formed to form the substrate 1 as shown in FIG. The lid plating layer 12 is formed by performing plating on both surfaces of the laminated wiring board 3. Thus, if the lid plating layer 12 is provided, the surface of the filler 14 is plated, so that the solder wettability is improved. On the other hand, the integration of the metal piece 10 and the laminated wiring board 3 is further strengthened, and the metal piece 10 is reliably prevented from coming out of the through hole 6, and the integrity as the substrate 1 can be secured.

  According to the manufacturing method of the substrate 1 according to the present invention as described above, since the bulging portion 8 is formed in the punching step, the metal piece 10 swells when the metal piece 10 is pressed in the subsequent pressing step. It can be made to contact | abut to the inner wall of the through hole 6 other than the location in which the protrusion part 8 is formed. For this reason, the state where the metal piece 10 is temporarily held in the through hole 6 can be formed. Therefore, it is easy to perform the plating process on the bulging portion 8 and the filling work of the filler 14 into the pores 11 in the subsequent process.

  On the other hand, you may perform the through-hole metal-plating formation process which forms the through-hole metal plating electrically connected to the conductive layer 2 in the inner wall of the through-hole 6 and the bulging part 8 after a drilling process. By performing this through-hole plating step, a metal film is formed between the through-hole 6 and the metal piece 10 and between the bulging portion 8 and the plating film 13 when the final substrate 1 is manufactured. A certain through-hole plating 7 is formed (see FIGS. 14 and 15). Since this plating process is performed on the entire surface of the multilayer wiring board 3, the through-hole plating 7 deposited by the plating process is applied to both surfaces of the multilayer wiring board 3 and the inner wall surfaces of the through-hole 6 and the bulging portion 8. Formed. This through-hole plating 7 is electrically connected to the conductive layer 2 singly connected to the through-hole 6 and the bulging portion 8, and allows electrical conduction of a large current by contacting the metal piece 10 in a later process. It is possible to secure such a route. Further, even when the through-hole plating process is performed, the metal piece 10 comes into contact with the through-hole plating 7 only after performing the pressing process. Therefore, when the metal piece 10 is inserted into the through-hole 6, There is no contact with the through-hole plating 7. For this reason, the through-hole plating 7 can be prevented from being damaged. Even if the metal piece 10 has substantially the same diameter as the through hole 6, the insertion operation of the metal piece 10 can be performed smoothly due to the presence of the through hole plating 7. That is, by forming the through-hole plating 7 in advance prior to the insertion of the metal piece 10, the conduction reliability between the circuits can be ensured, and the metal piece 10 can be inserted smoothly. By forming the through-hole plating 7, the electrochemical connection between the metal piece 10 and the through-hole plating 7 can be realized by the plating film 13. The plating film 13 can also be expected to have a connection effect on the surface layer close to the lid plating layer 12.

1: substrate, 2: conductive layer, 3: laminated wiring board, 4: insulating layer, 5: glass cloth, 6: through hole, 7: through hole plating, 8: bulging portion, 9: bulging hole, 10: Metal piece, 11: pore, 12: lid plating layer, 13: plating film, 14: filler

The present invention is a substrate such as a printed wiring board, a method of manufacturing a fitted metal pieces large current characteristics and excellent heat dissipation characteristics board.

The present invention has been made in consideration of the above prior art, and an object thereof is to provide both sufficient electrical method for producing a board in which the Ru can be achieved conduction with heat dissipation characteristics.

Claims (6)

A laminated wiring board in which a plurality of conductive layers made of a conductive material are formed;
A through hole formed through the laminated wiring board;
A metal piece disposed inside the through hole over the entire length of the through hole;
A bulging portion formed by bulging outward from the outer edge of the through hole and notching the entire length in the longitudinal direction of the through hole;
A bulging hole formed by being surrounded by the bulging portion and the surface of the metal piece exposed in the bulging portion;
And a plating film covering an inner wall of the bulging hole.   2. The substrate according to claim 1, wherein through-hole plating as a metal film is interposed between the through-hole and the metal piece, and between the bulging portion and the plating film. . It further has a pore as a space surrounded by the plating film,
The substrate according to claim 1 or 2, wherein the pores are filled with a filler. A laminated wiring board forming step of forming the laminated wiring board by stacking an insulating layer made of an insulating resin material and the conductive layer in which the conductive material is formed as a pattern and pressing in a laminating direction;
A hole forming step for forming the through hole and the bulging portion penetrating the laminated wiring board;
With the metal piece inserted into the through hole and disposed in the through hole, the metal piece is pressed to expand the diameter of the metal piece and temporarily hold the metal piece in the through hole. Process,
The method for manufacturing a substrate according to claim 1, further comprising: a plating film forming step of forming the plating film by plating the inside of the bulge hole.   5. The through-hole plating forming step of forming a through-hole plating that is electrically connected to the conductive layer on the through-hole and an inner wall of the bulging portion after the drilling step. Substrate manufacturing method.   The substrate manufacturing method according to claim 4, further comprising a filling step of filling a filler inside pores as spaces surrounded by the plating film after the plating film forming step. Method.

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