CN108353499A - The manufacturing method of substrate and substrate - Google Patents
The manufacturing method of substrate and substrate Download PDFInfo
- Publication number
- CN108353499A CN108353499A CN201680063337.4A CN201680063337A CN108353499A CN 108353499 A CN108353499 A CN 108353499A CN 201680063337 A CN201680063337 A CN 201680063337A CN 108353499 A CN108353499 A CN 108353499A
- Authority
- CN
- China
- Prior art keywords
- hole
- sheet metal
- substrate
- bellying
- plated film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 100
- 239000002184 metal Substances 0.000 claims abstract description 100
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims description 61
- 238000000576 coating method Methods 0.000 claims description 49
- 239000011248 coating agent Substances 0.000 claims description 46
- 230000015572 biosynthetic process Effects 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 20
- 239000011148 porous material Substances 0.000 claims description 20
- 238000012856 packing Methods 0.000 claims description 16
- 238000003825 pressing Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 47
- 230000017525 heat dissipation Effects 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000004744 fabric Substances 0.000 description 5
- 238000000280 densification Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 206010000060 Abdominal distension Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 208000024330 bloating Diseases 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Substrate (1) has：Wiring plate (3) is laminated, is formed with multiple conductive layers (2) being constructed from a material that be electrically conducting；Through-hole (6) is formed through stacking wiring plate (3)；Sheet metal (10) is disposed in the inside of through-hole (6) in the range of through-hole (6) overall length；Bellying (8) is bulged from the outer rim of through-hole (6), and is cut off and formed on the whole length direction of through-hole (6)；It bloats hole (9), is formed by being surrounded by the surface of bellying (8) and the sheet metal (10) being exposed in bellying (8)；Plated film (13), the inner wall of covering bulging hole (9).
Description
Technical field
The present invention relates to the manufacturing method of substrate and substrate, the substrate is the substrates such as printed circuit board, and has been embedded into
Sheet metal, large current characteristic and heat dissipation characteristics are excellent.
Background technology
Semiconductor element in circuit there are calorific values because of densification, high current increased tendency.Especially, make
The reason of becoming malfunction, failure when the temperature of surrounding becomes 100 DEG C or more with the semiconductor of Si.It is partly led as such
The heat generating components such as volume elements part, for example there is IGBT (Insulated Gate Bipolar Transistor), IPM
Switch elements such as (Intelligent Power Module).
For effectively cooling heat generating components, so that from the heat that heat generating components generates towards the side of the opposite side loss of substrate
Formula forms heat dissipation path.Specifically, by the way that the heat generated from heat generating components (is taken to the back side in substrate with component
The opposite side of section (mounting surface)) the conduction such as radiating piece cooled down.
As heat dissipation path, such as use the sheet metal being made of the high metal of pyroconductivity (Cu, Al etc.).The sheet metal
It is fixed in the through-hole formed on substrate.Fixation from sheet metal to through-hole by using indentation, plastic deformation realize contiguity,
Engagement etc. for being realized using bonding agent, solder is carried out (referring for example to patent document 1).It is connect by sheet metal and heat generating components
It touches, the heat to be generated from heat generating components is via the sheet metal (such as columnar copper) to external cooling.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2-134895 bulletins
Invention content
The subject that the invention solves
Nonetheless, it is intended that not only sheet metal will be also used to be electrically connected for radiating.In the past, it is fixed on the state of through-hole
Sheet metal is only to be physically contacted with through-hole, therefore conduct unstable.That is, can not steadily and reliably ensure electric conductivity.Therefore,
The general through-hole of conductance is separately set on substrate in the past, and the through-hole implemented copper facing using the inner wall to the through-hole and formed plates
Layer.However, for implementing such through-hole coating, the space for implementing the through-hole coating is needed on substrate, from component
From the perspective of the densification of installation not preferably.
The present invention allows for the invention of the above-mentioned prior art, and its purpose is to provide with heat dissipation characteristics and can be real
The manufacturing method of the substrate and substrate that now adequately conduct.
Solution for solving the problem
In order to reach the purpose, in the present invention, a kind of substrate is provided, which is characterized in that the substrate has：Stacking
Wiring plate is formed with multiple conductive layers being constructed from a material that be electrically conducting；Through-hole is formed through the stacking wiring plate；Metal
Piece is disposed in the inside of the through-hole in the range of through-hole overall length；Bellying, from the outer rim outward bulge of the through-hole
Go out, and cuts off and formed on the whole length direction of the through-hole；Hole is bloated, by the bellying and is exposed to the bulging
The surface of the sheet metal in portion surrounds and is formed；And plated film, cover the inner wall in the bulging hole.
Preferably, it is accompanied between the through-hole and the sheet metal and between the bellying and the plated film
Through-hole coating as metal film.
Preferably, it is the space surrounded by the plated film that the substrate, which also has pore, the pore, and the pore is interior by filling out
Fill material filling.
In addition, in the present invention, providing a kind of manufacturing method of substrate, which is characterized in that the manufacturing method of the substrate
Have：Wiring plate formation process is laminated, in the stacking wiring plate formation process, by insulating layer and conductive layer overlapping and edge
Stacking direction pressurization and form the stacking wiring plate, the insulating layer is made of dielectric resin material, the conductive layer with
The form of pattern is formed with the conductive material；Trepanning process is formed in the trepanning process through the stacking wiring plate
The through-hole and the bellying；The sheet metal is being arranged across the through-hole in the pressing process for pressing process
In the state of in the through-hole, the sheet metal is pressed, thus makes the sheet metal expanding, the sheet metal is faced
When be maintained in the through-hole；And plated film formation process, in the plated film formation process, to carrying out plating in the bulging hole
It handles and forms the plated film.
Preferably, through-hole coating formation process is carried out after the trepanning process, in the through-hole coating formation process
In, the through-hole coating being electrically connected with the conductive layer is formed in the inner wall of the through-hole and the bellying.
Preferably, the manufacturing method of the substrate has filling work procedure, after the plated film formation process, fills out at this
It fills in process, packing material is inserted to the inside of the pore as the space surrounded by the plated film.
Invention effect
According to the present invention, the sheet metal being disposed in through-hole is electrically connected in the part contacted with through-hole wall with conductive layer,
And it is also electrically connected with conductive layer via plated film.It is connect with conductive layer by sheet metal like this is via metal plated film,
That stablizes in terms of so as to realize chemistry conducts.That is, can obtain that there are heat dissipation characteristics based on sheet metal and can
Realize the substrate adequately conducted.In addition, plated film that can be in this way ensures electric conductivity, there is no need to be connected up in stacking
The general through-hole coating of conductance is separately formed on plate.The space that therefore, there is no need to such through-hole formation can aid in close
The densification of component installation on the substrate that year pursues.In addition, through-hole can directly be utilized by being used to form the bellying of plated film
The mechanism (drill bit, punching machine or laser etc.) of formation and formed, therefore can efficiently be manufactured.
In addition, the through-hole coating as metal film is formed between through-hole and sheet metal and between bellying and plated film,
The insert action that thus, it is possible to swimmingly carry out being inserted into sheet metal into through-hole.Moreover, can be real in advance by through-hole coating
Now with the connection of conductive layer, the connectivity of sheet metal and conductive layer can be improved.
In addition, by inserting packing material to pore, can prevent when component is installed solder flowed on the inside of plated film and
It is leaked to the face of the opposite side of substrate.In addition, the two sides of stacking wiring plate can also be by the shape to the progress plating processing of its whole face
At lid coating covering.Improvement accordingly, for solder wettability is effective.
In addition, according to the present invention, bellying is formed in trepanning process, therefore in pressing process later, pressed
When sheet metal, sheet metal can be abutted with the inner wall of the through-hole other than the position for being formed with bellying.Therefore, it is possible to form metal
Piece is temporarily kept in the state in through-hole.Therefore, in subsequent handling be easy carry out to the plating of bellying plating processing with
And the filling operation of packing material is inserted to pore.Even if in addition, in the case where carrying out through-hole coating process, sheet metal also leads to
It crosses carry out pressing process just to contact with through-hole coating, therefore sheet metal does not connect with through-hole coating when being inserted into sheet metal into through-hole
It touches.Therefore, it is possible to prevent through-hole coating to be damaged.
Description of the drawings
Fig. 1 is the diagrammatic cross-sectional view of the substrate of the present invention.
Fig. 2 is the diagrammatic cross-sectional view on the sheet metal periphery observed from the perforation direction near the through-hole of Fig. 1.
Fig. 3 is the flow chart of the manufacturing method of the substrate of the present invention.
Fig. 4 is the definition graph that wiring plate formation process is laminated.
Fig. 5 is definition graph when forming through-hole in trepanning process.
Fig. 6 is definition graph when forming bellying in trepanning process.
Diagrammatic cross-sectional view when Fig. 7 is near the through-hole of perforation direction observation chart 6.
Fig. 8 is definition graph when sheet metal being made to pass through through-hole in pressing process.
Fig. 9 is definition graph when pressing sheet metal in pressing process.
Figure 10 is the diagrammatic cross-sectional view on the sheet metal periphery observed from the perforation direction near the through-hole of Fig. 9.
Figure 11 is definition graph when implementing plating processing to bulging hole in plated film formation process.
Figure 12 is the diagrammatic cross-sectional view on the sheet metal periphery observed from the perforation direction near the through-hole of Figure 11.
Figure 13 is definition graph when inserting packing material to pore in filling work procedure.
Figure 14 is the diagrammatic cross-sectional view for the substrate for carrying out through-hole coating process and being formed.
Figure 15 is the diagrammatic cross-sectional view on the sheet metal periphery observed from the perforation direction near the through-hole of Figure 14.
Figure 16 is definition graph when forming the aperture comprising bellying before through-hole formation in trepanning process.
Specific implementation mode
As shown in Figures 1 and 2,1 main composition of substrate of the invention be be formed with multiple conductive layers 2 be referred to as it is more
The stacking wiring plate 3 of laminate (also including dual platen).In the example in fig 1, it shows and is formed with the so-called of four layers of conductive layer 2
Four laminates.Conductive layer 2 is formed in each layer as conductive pattern.Insulating layer 4 is equipped between conductive layer 2.Insulating layer 4 is for example
It is formed by insulating materials such as prepregs.More specifically, insulating layer 4 is for example using the glass for being equipped with sheet in epoxy resin
The glass cloth 5 of the prepreg of glass cloth 5, the sheet is the cloth woven by the yarn of glass fibre.
It is formed with through-hole 6 on stacking wiring plate 3.The through-hole 6 is through stacking wiring plate 3.The hole shape of the through-hole 6 is big
Cause cylindrical shape.In the case where the vertical view of wiring plate 3 is laminated from upper direction (the perforation direction of through-hole 6), through-hole 6 draws circle.
Here, being formed with the bellying 8 bulged from the outer rim of through-hole 6 by excision.The bellying 8 be formed as under vertical view from
It heaves the periphery of through-hole 6.In addition, bellying 8 is formed in the range of the length direction overall length of through-hole 6.The quantity of bellying 8 is not
Be particularly limited to, for example, be provided with as shown in Figure 2 in the position opposed with through-hole 6 it is multiple, it is aftermentioned thus, it is possible to steadily carry out
Sheet metal 10 is electrically connected with conductive layer 2.
Sheet metal 10 is equipped in through-hole 6.Specifically, sheet metal 10 in the through-hole 6 by outside side pressure wide diameter and
The inner wall of through-hole 6 is pressed on, thus engage with through-hole 6 and is kept.By being equipped with sheet metal 10, to be formed by bellying
8 and the space that surrounds of the surface of sheet metal 10 that is exposed in bellying 8 bloat hole 9.The inner wall in the bulging hole 9 is by made of metal
Plated film 13 cover.The plated film 13 and the conductive layer 2 being connected to the inner wall of bellying 8 are electrically connected, therefore as plating material, from
Preferred copper from the perspective of electric conductivity.I.e. plated film 13 is formed for example by the copper that plating is handled and is precipitated.Here, by plated film 13
The space of encirclement is formed as pore 11, is filled by packing material 14 in the pore 11.
Above-mentioned sheet metal 10 is contacted in two surface sides at position and stacking wiring plate 3 in face of bellying 8 with plated film 13.It should
10 part of sheet metal undertakes the effect of heat dissipation and the conducting of substrate 1, therefore uses the excellent metal of those heat dissipations and on state characteristic.
For example, sheet metal 10 is preferably by with the made of metal of either one in the high copper, silver or aluminium that conduct characteristic and heat dissipation characteristics
It makes.It should be noted that lid coating 12 can also be equipped on the two sides of stacking wiring plate 3.12 coating laying up line of lid coating
The two sides of plate 3.The lid coating 12 is handled by plating and is formed, therefore metal is precipitated on the surface of stacking wiring plate 3.
By using the substrate 1 of above structure, the sheet metal 10 to be disposed in through-hole 6 connects in the inner wall with through-hole 6
Tactile part is electrically connected with conductive layer 2, and is also electrically connected with conductive layer 2 via plated film 13.In this way, sheet metal 10 is via metal
The plated film 13 of system and connect with conductive layer 2, so as to realize that stablizes in terms of chemistry conducts.That is, can obtain with base
In sheet metal 10 heat dissipation characteristics and can realize the substrate 1 adequately conducted.In addition, plated film 13 that can be in this way
Ensure electric conductivity, there is no need to separately form the general through-hole coating of conductance on stacking wiring plate 3.It therefore, there is no need to this
The space of the through-hole formation of sample can aid in the densification of the component installation on the substrate pursued in recent years.In addition, being used for
The mechanism (drill bit, punching machine or laser etc.) of 6 formation of through-hole can directly be utilized and be formed by forming the bellying 8 of plated film 13, because
This can efficiently be manufactured.
In addition, by inserting packing material 14 to pore 11, it can prevent when component is installed solder in plated film 13
It flows and is leaked to the face of the opposite side of substrate 1 in side.If in addition, carrying out plating using the whole face on the two sides to wiring plate 3 is laminated
Processing and 12 coating of lid coating that is formed fold the two sides of wiring plate 3, then are effective for the improvement of solder wettability.And
And if setting lid coating 12, sheet metal 10 is reinforced with stacking the integrated of wiring plate 3, is reliably prevented from sheet metal
10 fall off from through-hole 6, it is ensured that the integraty as substrate 1.
Above-mentioned substrate 1 can be manufactured by the manufacturing method of substrate described below.The manufacturing method is as shown in Figure 4
Flow chart indicate.In the method, stacking wiring plate formation process (step S1) is carried out first.In this process, it will insulate
Layer 4 and conductive layer 2 are overlapped multiple and pressurize obtain stacking wiring plate 3 as shown in Figure 4 along stacking direction respectively.Insulation
Layer 4 is for example made of dielectric resin material, and conductive layer 2 is formed with conductive material in a pattern.It is to form conductive layer 2
Four layers of stacking wiring plate, such as be only formed with by two the so-called single sided board of conductive layer 2 in the single side of insulating layer 4 and (only exist
Single side is formed with the copper-clad laminated board of copper foil) sandwich the two sides of insulating layer 4 be formed with conductive layer 2 so-called two panels (
Two sides is formed with the copper-clad laminated board of copper foil), and be laminated.
Then, trepanning process (step S2) is carried out.In this process, it is initially formed shown in Fig. 5 through stacking wiring plate 3
Such through-hole 6.The through-hole 6 carries out trepanning processing and shape by using drill bit, punching machine or laser etc. to stacking wiring plate 3
At.The hole shape of through-hole 6 is generally cylindrical shaped.In the case where the vertical view of wiring plate 3 is laminated from upper direction, through-hole 6 draws circle
Shape.After forming through-hole 6, as shown in FIG. 6 and 7 like that, further bellying 8 is formed in the outer rim of through-hole 6.The bellying
8 is also same as through-hole 6, is formed by drill bit, punching machine or laser etc..It should be noted that can also through-hole 6 formation it
Preceding processing forms the aperture for including bellying 8, forms through-hole 6 (referring to Fig.1 6) later.In this case, aperture is in center
Mode on the circumference of through-hole 6 is initially formed.If being initially formed the aperture for including bellying 8 like this, compared with being initially formed through-hole 6
Processing becomes easy.
Then, pressing process (step S3) is carried out.In this process, as shown in Figure 8 pass through sheet metal 10 first
Through-hole 6.At this point, the diameter of sheet metal 10 is smaller than the diameter of through-hole 6.Then, it is disposed in the state in through-hole 6 in sheet metal 10
Under, press sheet metal 10 from upper and lower directions (the perforation direction both sides of through-hole).Sheet metal 10 as shown in Figure 9 is outside as a result,
Side is expanding.In addition, as shown in Figure 10 by keeping sheet metal 10 expanding, to the peripheral surface appearance of sheet metal 10 and through-hole
6 parts abutted and the part being exposed in bellying 8.In this state, sheet metal 10 is temporarily kept in through-hole 6.At this point,
The space surrounded by the inner wall of bellying 8 and the surface for the sheet metal 10 being exposed in bellying 8 is formed as bloating hole 9.Pass through
Sheet metal 10 is temporarily held, to be easy to carry out in subsequent handling to the processing of the plating of 8 plating of bellying and to pore
The filling operation (aftermentioned) of 11 filling packing materials 14.It should be noted that for pressing, it can also be in the one side of sheet metal 10
The plate for pressing is arranged and is only pressed from the other side using pressing element.
Then, plated film formation process (step S4) is carried out.In this process, the shape to progress plating processing in bulging hole 9
At plated film 13.By the process, as shown in FIG. 11 and 12 like that, it is formed with plated film 13 in bulging hole 9.Plated film 13 is along drum
9 inner wall of portalling is formed.That is, sheet metal 10 of the plated film 13 by inner wall and the part being exposed in bellying 8 in bellying 8
Surface be precipitated and formed.It should be noted that being even in the state for remaining space (pore 11) in the inside of plated film 13.
By forming plated film 13, the conductive layer 2 being connected to plated film 13 and with bellying 8 is electrically connected.Therefore, excellent as plating material
Select copper.Synergistically with this phase, sheet metal 10 is electrically connected via plated film 13 with conductive layer 2.By sheet metal 10 like this via
Metal plated film 13 and connect with conductive layer 2, can realize that stablizes in terms of chemistry conducts.Certainly, the sum of sheet metal 10
The conductive layer 2 being connected to through-hole 6 is in contact and conducting for realizing also is ensured.It is based on sheet metal that is, can obtain having
10 heat dissipation characteristics and it can realize the substrate 1 adequately conducted.In addition, plated film 13 is also in the two sides of sheet metal 10 and layer
The two sides of folded wiring plate 3 is precipitated.Sheet metal 10 is reinforced with stacking the integrated of wiring plate 3 as a result, is reliably prevented from gold
Belong to piece 10 to fall off from through-hole 6, it can be ensured that the integraty as substrate 1.
Sheet metal 10 and the stabilization of conductive layer 2 conduct can by fully being realized in above-mentioned plated film formation process,
But it can also also carry out process below.That is, process (step S5) can also be then filled.In this process, to pore
11 filling packing materials 14.Packing material 14 is filled in such a way that the whole to the inner space of pore 11 is filled.As
The packing material 14 can also use the ink of electric conductivity other than the epoxy resin for using insulating properties.When end filling work procedure
When, become state as Figure 13.It should be noted that from the sectional view and Fig. 2 of perforation direction observation chart 13 near through-hole
Equally.In this way, by inserting packing material 14 to pore 11, so as to prevent when component is installed solder in plated film 13
It flows and is leaked to the face of the opposite side of substrate 1 in side.
Furthermore, it is also possible to then carry out lid coating formation process (step S6).In this process, in stacking wiring plate 3
Two sides forms lid coating 12.It forms the lid coating 12 and becomes substrate 1 as shown in Figure 1.Lid coating 12 passes through to cloth is laminated
Implement plating processing and formed in the two sides of line plate 3.In this way, if setting lid coating 12, plating is carried on the surface of packing material 14
Layer, therefore solder wettability improves.On the other hand, sheet metal 10 is further reinforced with stacking the integrated of wiring plate 3, energy
It is enough reliably prevented sheet metal 10 to fall off from through-hole 6, it can be ensured that the integraty as substrate 1.
According to the manufacturing method of the substrate 1 of the present invention as described above, the formation bellying 8 in trepanning process, therefore
When pressing sheet metal 10 in pressing process later, sheet metal 10 can be with the through-hole 6 being formed with other than the position of bellying 8
Inner wall abuts.Therefore, it is possible to form the state that sheet metal 10 is temporarily kept in through-hole 6.Therefore, be easy in subsequent handling into
Row inserts the filling operation of packing material 14 to the processing of the plating of 8 plating of bellying and to pore 11.
On the other hand, can also be after trepanning process, formed and conduction in the inner wall of through-hole 6 and bellying 8
The through-hole coating formation process of the through-hole coating of 2 electrical connection of layer.By carrying out the through-hole coating process, to manufacture finally
The through-hole coating as metal film is formed when substrate 1, between through-hole 6 and sheet metal 10 and between bellying 8 and plated film 13
7 (4 and Figure 15 referring to Fig.1).It should be noted that due to implementing plating processing to the whole surface that wiring plate 3 is laminated,
The through-hole coating 7 being precipitated by plating is handled is formed in the internal face on the two sides and through-hole 6 and bellying 8 of stacking wiring plate 3.
The through-hole coating 7 individually and with through-hole 6, bellying 8 be connected to conductive layer 2 be electrically connected, and in subsequent handling with metal
Piece 10 abuts, and thus, it is possible to ensure to allow the path as the conducting of high current.Even if in addition, carrying out through-hole coating work
In the case of sequence, sheet metal 10 is contacted also by pressing process ability is carried out with through-hole coating 7, therefore gold is being inserted into through-hole 6
Sheet metal 10 is not contacted with through-hole coating 7 when belonging to piece 10.Therefore, it is possible to prevent through-hole coating 7 to be damaged.Even if sheet metal 10
For the diameter roughly the same with through-hole 6 insert action of sheet metal 10 also can be swimmingly carried out by the way that there are through-hole coating 7.
That is, through-hole coating 7 is pre-formed before the insertion of sheet metal 10, and thus, it is possible to ensure the conducting reliability between circuit, gold
Belonging to piece 10 can also be smoothly inserted into.By forming through-hole coating 7, can sheet metal 10 and through-hole coating 7 be realized by plated film 13
Electrochemistry connection.Also can expect the plated film 13 the surface layer close with lid coating 12 connection effect.
Reference sign
1：Substrate, 2：Conductive layer, 3：Stacking wiring plate, 4：Insulating layer, 5：Glass cloth, 6：Through-hole, 7：Through-hole coating, 8：Drum
Go out portion, 9：Bulging hole, 10：Sheet metal, 11：Pore, 12：Lid coating, 13：Plated film, 14：Packing material.
Claims (6)
1. a kind of substrate, which is characterized in that
The substrate has：
Wiring plate is laminated, is formed with multiple conductive layers being constructed from a material that be electrically conducting；
Through-hole is formed through the stacking wiring plate；
Sheet metal is disposed in the inside of the through-hole in the range of through-hole overall length；
Bellying is bulged from the outer rim of the through-hole, and is cut off and formed on the whole length direction of the through-hole；
Hole is bloated, is surrounded and is formed by the surface of the bellying and the sheet metal being exposed in the bellying；With
And
Plated film covers the inner wall in the bulging hole.
2. substrate according to claim 1, which is characterized in that
It is accompanied between the through-hole and the sheet metal and between the bellying and the plated film as the logical of metal film
Hole coating.
3. substrate according to claim 1 or 2, which is characterized in that
The substrate also has pore, which is the space surrounded by the plated film,
It is filled by packing material in the pore.
4. a kind of manufacturing method of substrate, for the substrate described in manufacturing claims 1, which is characterized in that
The manufacturing method of the substrate has：
Wiring plate formation process is laminated, in the stacking wiring plate formation process, by insulating layer and conductive layer overlapping and edge
Stacking direction pressurization and form the stacking wiring plate, the insulating layer is made of dielectric resin material, the conductive layer with
The form of pattern is formed with the conductive material；
Trepanning process forms the through-hole through the stacking wiring plate and the bellying in the trepanning process；
The sheet metal is being disposed in the shape in the through-hole by pressing process in the pressing process across the through-hole
Under state, the sheet metal is pressed, thus makes the sheet metal expanding, the sheet metal is temporarily kept in the through-hole
It is interior；And
Plated film formation process forms the plated film in the plated film formation process to carrying out plating processing in the bulging hole.
5. the manufacturing method of substrate according to claim 4, which is characterized in that
Through-hole coating formation process is carried out after the trepanning process, in the through-hole coating formation process, in the through-hole
And the inner wall of the bellying forms the through-hole coating being electrically connected with the conductive layer.
6. the manufacturing method of substrate according to claim 4 or 5, which is characterized in that
The manufacturing method of the substrate has filling work procedure, after the plated film formation process, in the filling work procedure, to work
Packing material is inserted in inside for the pore in the space surrounded by the plated film.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/060990 WO2017175263A1 (en) | 2016-04-04 | 2016-04-04 | Substrate and method for producing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108353499A true CN108353499A (en) | 2018-07-31 |
| CN108353499B CN108353499B (en) | 2020-10-09 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680063337.4A Expired - Fee Related CN108353499B (en) | 2016-04-04 | 2016-04-04 | Substrate and method for manufacturing substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6047688B1 (en) |
| CN (1) | CN108353499B (en) |
| TW (1) | TW201803419A (en) |
| WO (1) | WO2017175263A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110730575A (en) * | 2019-10-18 | 2020-01-24 | 苏州浪潮智能科技有限公司 | Method for manufacturing solid through hole |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009153A (en) * | 2017-06-20 | 2019-01-17 | 大陽工業株式会社 | Wiring board, electronic device, and method of manufacturing electronic device |
| TWI694756B (en) * | 2018-12-27 | 2020-05-21 | 欣興電子股份有限公司 | A circuit board with heat-dissipation block and method of manufacturing thereof |
| US11445596B2 (en) | 2018-12-27 | 2022-09-13 | Unimicron Technology Corp. | Circuit board having heat-dissipation block and method of manufacturing the same |
| JP7255403B2 (en) * | 2019-07-19 | 2023-04-11 | 株式会社オートネットワーク技術研究所 | Substrate with metal member |
| KR20240121548A (en) * | 2023-02-02 | 2024-08-09 | 주식회사 아모텍 | Wireless charging antenna and manufacturing method thereof |
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| JP2004200448A (en) * | 2002-12-19 | 2004-07-15 | Nissan Motor Co Ltd | Method for mounting electronic part on substrate |
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| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6454265U (en) * | 1987-09-25 | 1989-04-04 | ||
| JPH01120780A (en) * | 1987-11-04 | 1989-05-12 | Hitachi Chem Co Ltd | Press fit pin |
-
2016
- 2016-04-04 CN CN201680063337.4A patent/CN108353499B/en not_active Expired - Fee Related
- 2016-04-04 WO PCT/JP2016/060990 patent/WO2017175263A1/en active Application Filing
- 2016-04-04 JP JP2016532010A patent/JP6047688B1/en active Active
-
2017
- 2017-03-17 TW TW106109011A patent/TW201803419A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004200448A (en) * | 2002-12-19 | 2004-07-15 | Nissan Motor Co Ltd | Method for mounting electronic part on substrate |
| JP2007214277A (en) * | 2006-02-08 | 2007-08-23 | Meidensha Corp | Printed circuit board |
| CN101257770A (en) * | 2008-04-16 | 2008-09-03 | 汕头超声印制板公司 | Manufacturing method for embedding heat radiating fin on printed circuit board |
| CN102647853A (en) * | 2011-02-18 | 2012-08-22 | 昆山华扬电子有限公司 | High-accuracy through-hole resistance printed board and manufacture method thereof |
| CN104472022A (en) * | 2013-06-12 | 2015-03-25 | 名幸电子股份有限公司 | Manufacturing method for heat-dissipating substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110730575A (en) * | 2019-10-18 | 2020-01-24 | 苏州浪潮智能科技有限公司 | Method for manufacturing solid through hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108353499B (en) | 2020-10-09 |
| WO2017175263A1 (en) | 2017-10-12 |
| TW201803419A (en) | 2018-01-16 |
| JP6047688B1 (en) | 2016-12-21 |
| JPWO2017175263A1 (en) | 2018-04-12 |
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