CN210351766U

CN210351766U - PCB board of ultra-thin multilayer

Info

Publication number: CN210351766U
Application number: CN201920983671.2U
Authority: CN
Inventors: 王建民
Original assignee: Xingning Jingweijin Electronics Co ltd
Current assignee: Xingning Jingweijin Electronics Co ltd
Priority date: 2019-06-27
Filing date: 2019-06-27
Publication date: 2020-04-17
Anticipated expiration: 2029-06-27

Abstract

The utility model discloses an ultrathin multilayer PCB, which comprises a copper foil, a plurality of board cores, an insulating layer and base boards covered on two sides of the copper foil; the copper foil is provided with the through-hole of installation board core, is equipped with the insulating circle around the through-hole, be connected through the insulating layer between board core and the board core lateral wall, first board core, second board core, third board core and the fourth board core of board core package, wherein first board core and second board core are above, third board core and fourth board core are located below. The utility model discloses a keep apart between with board core and the board core, keep apart through the insulating layer, so the effectual problem of avoiding ultra-thin circuit board short circuit, simultaneously through the both sides with the base plate cover copper foil layer, so can realize the multilayer effect to make the thickness of PCB board reach the minimum.

Description

PCB board of ultra-thin multilayer

Technical Field

The utility model belongs to the technical field of the circuit board and specifically relates to a PCB board of ultra-thin multilayer.

Background

With the increasingly complex electrical characteristics of modern electronic products and the high requirements on power supply, signals and the like caused by the complex electrical characteristics, the number of layers of the corresponding PCB circuit board in the production process is increasing, for example, the products such as the graphics card have four layers and six layers, so that the high-end graphics card needs eight layers and ten layers of PCBs to provide reasonable electrical characteristics, and the requirements on the PCB fixing mode are generated. Traditional PCB multiply wood all adopts welding or copper nail to fix, but this kind of fixed approach faces a defect, no matter welding or copper nail, all is difficult to avoid appearing the metal granule, for example the problem that the copper granule falls into between the circuit board, and this kind of problem can cause the PCB short circuit to make it scrap.

With the development of electronic products, the products are lighter and thinner due to the adoption of an ultrathin design, the thickness of the PCB is increased at the present stage, if the thickness of the PCB is reduced, the thickness of the board core can only be reduced, and when the PCB is manufactured after the thickness of the board core is reduced, the upper-layer circuit board and the lower-layer circuit board are in short circuit due to the thinner thickness, so that the upper-layer circuit board and the lower-layer circuit board are scrapped.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a PCB board of ultra-thin multilayer aims at solving the easy short circuit of current ultra-thin PCB board, reduces the technical problem of multilayer PCB board thickness simultaneously.

In order to achieve the above purpose, the technical scheme of the utility model is as follows: an ultrathin multilayer PCB comprises a copper foil, a plurality of board cores, an insulating layer and base plates, wherein the base plates cover two sides of the copper foil; the copper foil is provided with the through-hole of installation board core, is equipped with the insulating circle around the through-hole, be connected through the insulating layer between board core and the board core lateral wall, first board core, second board core, third board core and the fourth board core of board core package, wherein first board core and second board core are above, third board core and fourth board core are located below.

The PCB board of ultra-thin multilayer, wherein, the base plate includes first base plate and second base plate, first base plate and second base plate set up the both sides at the copper foil respectively.

The PCB board of ultra-thin multilayer, wherein, the lateral wall of insulating layer is provided with the winding displacement hole.

The PCB board of ultra-thin multilayer, wherein, the inside in row line hole is provided with the winding displacement.

The PCB board of ultra-thin multilayer, wherein, the base plate is provided with the preformed hole that corresponds the through-hole, the installation of the core of the board of being convenient for.

Has the advantages that: the utility model has the advantages that the board core is arranged at the central position of the copper foil, so that the whole thickness of the PCB is only the thickness of a single-layer PCB, the thickness of the PCB is minimized, and the copper foil and the board core can be firmly combined through the first substrate and the second substrate; the inner wall of the through hole is provided with the insulating ring, so that short circuit can be effectively prevented; in addition, because the board cores are separated by the insulating layers, a plurality of board cores can be arranged in the through holes, and circuits are arranged on the front and back surfaces of the copper foil and the board cores; the PCB board that sets up like this only has copper foil, first base plate and the superimposed thickness of second base plate in fact, and the lateral wall that the board core passes through the insulating layer is provided with row line hole, the inside in row line hole is provided with the winding displacement, and the winding displacement is located the base plane of first board core and third board core, and just through arranging the line hole for the circuit board number of piles reduces, but function, usage, effect do not change, reach ultra-thin effect.

Drawings

Fig. 1 is a cross-sectional view of the present invention.

Fig. 2 is a plan view of the copper foil of the present invention.

Fig. 3 is a plan view of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention will be described in further detail below with reference to the accompanying drawings and examples.

As shown in fig. 1-3, the utility model discloses an ultra-thin multilayer PCB board, which comprises a copper foil 1, a plurality of board cores 2, an insulating layer 3 and a substrate 4 covering both sides of the copper foil 1; the copper foil 1 is provided with a through hole 5 for installing the plate core 2, an insulating ring 6 is arranged around the through hole 5, the plate core 2 is connected with the side wall of the plate core 2 through an insulating layer 3, the plate core 2 comprises a first plate core 20, a second plate core 21, a third plate core 22 and a fourth plate core 23, the first plate core 20 and the second plate core 21 are arranged on the upper surface, and the third plate core 22 and the fourth plate core 23 are arranged on the lower surface.

Adopt above-mentioned structure, the utility model discloses a cross insulating layer with crossing between board core and the board core and keep apart, and realize keeping apart through the insulating circle between board core and the copper foil, so the effectual problem of avoiding ultra-thin circuit board short circuit, simultaneously through the both sides with base plate cover copper foil layer, so can realize the multilayer effect to make the thickness of PCB board reach minimum

The ultrathin multilayer PCB is characterized in that the substrate 4 comprises a first substrate 40 and a second substrate 41, and the first substrate 40 and the second substrate 41 are respectively arranged on two sides of the copper foil 1.

The ultrathin multilayer PCB is characterized in that a wire arranging hole 30 is formed in the side wall of the insulating layer 3.

In the ultrathin multilayer PCB, a flat cable 31 is disposed inside the flat cable hole 30.

The PCB board of ultra-thin multilayer, wherein, base plate 4 is provided with the preformed hole that corresponds the through-hole, the installation of the board core 2 of being convenient for.

The utility model has the advantages that the board core is arranged at the central position of the copper foil, so that the whole thickness of the PCB is only the thickness of a single-layer PCB, the thickness of the PCB is minimized, and the copper foil and the board core can be firmly combined through the first substrate and the second substrate; the inner wall of the through hole is provided with the insulating ring, so that short circuit can be effectively prevented; in addition, because the board cores are separated by the insulating layers, a plurality of board cores can be arranged in the through holes, and circuits are arranged on the front and back surfaces of the copper foil and the board cores; the PCB board that sets up like this only has copper foil, first base plate and the superimposed thickness of second base plate in fact, and the lateral wall that the board core passes through the insulating layer is provided with row line hole, the inside in row line hole is provided with the winding displacement, and the winding displacement is located the base plane of first board core and third board core, and just through arranging the line hole for the circuit board number of piles reduces, but function, usage, effect do not change, reach ultra-thin effect.

The above is a preferred embodiment of the present invention, and certainly not to limit the scope of the present invention, it should be noted that, for those skilled in the art, modifications or equivalent substitutions of the technical solutions of the present invention without creative efforts may not depart from the protection scope of the technical solutions of the present invention.

Claims

1. An ultrathin multilayer PCB is characterized by comprising a copper foil, a plurality of board cores, an insulating layer and substrates covering two sides of the copper foil; the copper foil is provided with the through-hole of installation board core, is equipped with the insulating circle around the through-hole, be connected through the insulating layer between board core and the board core lateral wall, first board core, second board core, third board core and the fourth board core of board core package, wherein first board core and second board core are above, third board core and fourth board core are located below.

2. The ultra-thin multi-layered PCB panel as claimed in claim 1, wherein the substrate includes a first substrate and a second substrate, which are disposed at both sides of a copper foil, respectively.

3. The ultra-thin multi-layered PCB panel as claimed in claim 1, wherein the sidewall of the insulating layer is provided with line arranging holes.

4. The ultra-thin multi-layered PCB panel as claimed in claim 3, wherein a bus bar is disposed inside the bus bar hole.

5. The ultra-thin multi-layered PCB panel as claimed in claim 1, wherein the substrate is provided with a prepared hole corresponding to the through hole to facilitate the installation of the core.