CN212034437U - Multilayer stack structure for printed circuits - Google Patents
Multilayer stack structure for printed circuits Download PDFInfo
- Publication number
- CN212034437U CN212034437U CN202020869563.5U CN202020869563U CN212034437U CN 212034437 U CN212034437 U CN 212034437U CN 202020869563 U CN202020869563 U CN 202020869563U CN 212034437 U CN212034437 U CN 212034437U
- Authority
- CN
- China
- Prior art keywords
- shell
- edge
- circuit board
- copper foil
- metal contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011889 copper foil Substances 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims description 14
- 239000010410 layer Substances 0.000 description 40
- 238000009957 hemming Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model relates to a multilayer stacking structure of a printed circuit, which comprises a circuit board and a wrapping shell, wherein the circuit board is stacked in multiple layers and comprises a base plate, a copper foil layer and an insulating layer, the copper foil layer is arranged on the upper surface of the base plate, and the insulating layer is arranged on the upper surface of the copper foil layer and the lower surface of the base plate; the inner side of the edge-covering shell is provided with a plurality of clamping grooves for mounting a circuit board, the edge of the circuit board is arranged in the clamping grooves, metal contact pieces are arranged in the clamping grooves, one ends of the metal contact pieces are in contact with the copper foil layer, and the other ends of the metal contact pieces penetrate through and are arranged on the outer surface of the edge-covering shell; the multi-layer structure of the circuit board is fixed by arranging the edge-wrapping shell, so that the multi-layer circuit board is prevented from falling off due to collision or other reasons; meanwhile, the connecting structures among the circuit boards are moved to the outer side face of the edge-covered shell through the metal contact pieces in the edge-covered shell, the internal circuit boards are isolated through the insulating layers, connection is not needed through the open blind holes, and internal signal interference is avoided.
Description
Technical Field
The utility model relates to a printed circuit board technical field specifically is printed circuit board's multilayer stacked structure.
Background
Printed circuit boards (PCB boards), also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. In recent ten years, the printed circuit board (PCB for short) manufacturing industry in China develops rapidly, and the total output value and the total output are the first in the world. Due to the fact that electronic products are changing day by day, price war changes the structure of a supply chain, China has industrial distribution, cost and market advantages, and the price war becomes the most important production base of the printed circuit board in the world. Printed circuit boards have evolved from single-layer to double-sided, multi-layer and flex boards, and have continued to evolve toward high precision, high density and high reliability. The size is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products.
However, the conventional PCB has a short life, and each layer is easily separated, and the conventional multi-layer printed circuit board is connected by using the blind holes when being connected to different circuit boards, thus easily causing signal interference, and easily causing short circuit during assembly and maintenance.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to a multilayer stacked structure of printed circuits, which can solve the technical drawbacks mentioned in the background art.
The utility model discloses a multilayer stacking structure of printed circuit, including circuit board and the shell of borduring that multilayer stacked up and set up, the circuit board includes base plate, copper foil layer and insulating layer, the copper foil layer sets up the upper surface of base plate, the insulating layer sets up the upper surface on copper foil layer and the lower surface of base plate; the inner side of the edge-covering shell is provided with a plurality of clamping grooves for mounting the circuit board, the edge of the circuit board is arranged in the clamping grooves, metal contact pieces are arranged in the clamping grooves, one ends of the metal contact pieces are in contact with the copper foil layer, and the other ends of the metal contact pieces penetrate through and are arranged on the outer surface of the edge-covering shell.
Furthermore, the outer side surface of the wrapping shell is provided with a plurality of bonding pads, and the bonding pads are fixedly connected with the metal contact pieces in a one-to-one correspondence mode.
Furthermore, the metal contact piece is positioned in the clamping groove and is in a bent V shape, and the bottom of the V shape is abutted to the copper foil layer.
Further, the bound edge shell comprises a door-shaped first bound edge shell and a door-shaped second bound edge shell, and the first bound edge shell and the second bound edge shell are fixed through bolts and form the mouth-shaped bound edge shell.
Furthermore, the copper foil layer positioned at the edge of the substrate corresponds to the metal contact sheet in the clamping groove and is used for being connected with the copper foil layers of other circuit boards, the insulating layer is arranged in the middle of the substrate, and the edge of the insulating layer is abutted to the inner side face of the edge-covering shell.
The utility model has the advantages that: the multilayer stacking structure of the printed circuit of the utility model avoids the falling off of the multilayer circuit board caused by collision or other reasons by arranging the multilayer structure of the edge-covering shell fixed circuit board; simultaneously, connect a plurality of circuit boards through the metal contact piece in the shell of borduring, the metal contact piece moves the connection structure between a plurality of circuit boards to the lateral surface of the shell of borduring on, keeps apart through the insulating layer between the inside circuit board of the shell of borduring to need not connect through opening the blind hole, thereby avoid inside signal interference.
Drawings
The invention will be further described with reference to the following figures and examples:
fig. 1 is a schematic side view of the present invention;
fig. 2 is a schematic top view of the present invention;
fig. 3 is an enlarged schematic view of a partial structure of the present invention.
The reference numbers are as follows: 1-a circuit board; 2-wrapping the outer shell; 3-a bolt; 11-a substrate; 12-copper foil layer; 13-an insulating layer; 21-a first envelope shell; 22-a second rimmed shell; 211-card slot; 212-metal contact pads.
Detailed Description
As shown in fig. 1-2: the multilayer stack structure of the printed circuit of the embodiment comprises a circuit board 1 and a covered edge shell 2 which are arranged in a multilayer stack mode, wherein the circuit board 1 comprises a substrate 11, a copper foil layer 12 and an insulating layer 13, the copper foil layer 12 is arranged on the upper surface of the substrate 11, and the insulating layer 13 is arranged on the upper surface of the copper foil layer 12 and the lower surface of the substrate 11; the inner side of the edge-covering shell 2 is provided with a plurality of clamping grooves 211 used for installing the circuit board 1, the edge of the circuit board 1 is arranged in the clamping grooves 211, metal contact pieces 212 are arranged in the clamping grooves 211, one ends of the metal contact pieces 212 are in contact with the copper foil layer 12, and the other ends of the metal contact pieces 212 penetrate through and are arranged on the outer surface of the edge-covering shell 2.
The multilayer stacking structure of the printed circuit of the utility model, through arranging the edge-covering shell 2 to fix the multilayer structure of the circuit board 1, avoids the falling off of the multilayer circuit board 1 caused by collision or other reasons; meanwhile, the metal contact pieces 212 in the edge-covering shell 2 are connected with the circuit boards 1, the metal contact pieces 212 move the connection structures among the circuit boards 1 to the outer side face of the edge-covering shell 2, and the circuit boards 1 in the edge-covering shell 2 are isolated through the insulating layer 13, so that connection through opening blind holes is not needed, and signal interference inside the circuit boards is avoided.
In this embodiment, the lateral surface of the shell 2 of borduring is equipped with a plurality of pads, pad and metallic contact piece 212 one-to-one fixed connection, thereby move the coupling mechanism of polylith circuit board 1 to on the lateral surface of the shell 2 of borduring, only need during the connection according to predetermineeing the connection point position, pass through the wire welding with the pad that corresponds the position can, can set up a plurality of metallic contact pieces 212 and pad as required on the same circuit board 1, carry out complicated ground circuit board 1 and connect, can set up the winding displacement socket on the pad simultaneously, thereby connect through the winding displacement, make connection structure between the circuit board 1 can dismantle.
In this embodiment, the portion of the metal contact piece 212 located in the slot 211 is a bent V-shape, the bottom of the V-shape abuts against the copper foil layer 12, and the bent V-shape makes the portion of the metal contact piece 212 located in the slot 211 have certain elasticity, so that the metal contact piece 212 is in closer contact with the copper foil layer 12, and the condition of poor contact is avoided.
In this embodiment, the hemming shell 2 includes the first hemming shell 21 and the second hemming shell 22 of door font, the first hemming shell 21 and the second hemming shell 22 pass through bolt 3 to be fixed and constitute the hemming shell 2 of mouth font, the first hemming shell 21 and the second hemming shell 22 of door font are convenient for the installation of circuit board 1, one side of circuit board 1 slides in draw-in groove 211 in the first hemming shell 21 until all copper foil layers 12 contact with corresponding metal contact piece 212 after, the second hemming shell 22 is installed at the opposite side of circuit board 1 together, the corresponding position of first hemming shell 21 and second hemming shell 22 is fixed through fixed spiral.
In this embodiment, the position of the copper foil layer 12 located at the edge of the substrate 11 corresponds to the position of the metal contact piece 212 in the card slot 211, and is used for being connected with the copper foil layers 12 of other circuit boards 1, the insulating layer 13 is disposed in the middle of the substrate 11, the edge of the insulating layer 13 abuts against the inner side surface of the covered edge shell 2, the insulating layer 13 is used for shielding signals on a plurality of circuit boards 1, the insulating layer 13 is fixedly disposed on the bottom surface of the substrate 11 and the upper surface of the copper foil layer 12, the insulating layer 13 on the upper surface of the copper foil layer 12 is provided with a plurality of grooves for accommodating electronic components, and the upper surface and the lower surface of different circuit.
Finally, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the present invention can be modified or replaced by other means without departing from the spirit and scope of the present invention, which should be construed as limited only by the appended claims.
Claims (5)
1. A multilayer stack of printed circuits, characterized by: the circuit board comprises a circuit board and a wrapping shell, wherein the circuit board is stacked in multiple layers and comprises a substrate, a copper foil layer and an insulating layer, the copper foil layer is arranged on the upper surface of the substrate, and the insulating layer is arranged on the upper surface of the copper foil layer and the lower surface of the substrate; the inner side of the edge-covering shell is provided with a plurality of clamping grooves for mounting the circuit board, the edge of the circuit board is arranged in the clamping grooves, metal contact pieces are arranged in the clamping grooves, one ends of the metal contact pieces are in contact with the copper foil layer, and the other ends of the metal contact pieces penetrate through and are arranged on the outer surface of the edge-covering shell.
2. The multilayer stack of printed circuits of claim 1, wherein: and a plurality of bonding pads are arranged on the outer side surface of the edge-covering shell and fixedly connected with the metal contact pieces in a one-to-one correspondence manner.
3. The multilayer stack of printed circuits of claim 1, wherein: the metal contact piece is located in the clamping groove and is in a bent V shape, and the bottom of the V shape is abutted to the copper foil layer.
4. The multilayer stack of printed circuits of claim 1, wherein: the binding shell comprises a door-shaped first binding shell and a door-shaped second binding shell, and the first binding shell and the second binding shell are fixed through bolts and form a square-shaped binding shell.
5. The multilayer stack of printed circuits of claim 1, wherein: the copper foil layer positioned at the edge of the substrate corresponds to the metal contact piece in the clamping groove and is used for being connected with the copper foil layers of other circuit boards, the insulating layer is arranged in the middle of the substrate, and the edge of the insulating layer is abutted to the inner side face of the edge-covered shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020869563.5U CN212034437U (en) | 2020-05-21 | 2020-05-21 | Multilayer stack structure for printed circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020869563.5U CN212034437U (en) | 2020-05-21 | 2020-05-21 | Multilayer stack structure for printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212034437U true CN212034437U (en) | 2020-11-27 |
Family
ID=73480067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020869563.5U Expired - Fee Related CN212034437U (en) | 2020-05-21 | 2020-05-21 | Multilayer stack structure for printed circuits |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212034437U (en) |
-
2020
- 2020-05-21 CN CN202020869563.5U patent/CN212034437U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201127 |