CN217546425U

CN217546425U - Circuit board with horizontal chip architecture of COB

Info

Publication number: CN217546425U
Application number: CN202221275594.3U
Authority: CN
Inventors: 谭刚
Original assignee: Jiangmen Lensen Electronic Technology Co ltd
Current assignee: Jiangmen Lensen Electronic Technology Co ltd
Priority date: 2022-05-26
Filing date: 2022-05-26
Publication date: 2022-10-04
Anticipated expiration: 2032-05-26

Abstract

The utility model relates to a circuit board technical field specifically discloses a circuit board with horizontal chip architecture of COB, including the circuit layer, be provided with the layer of windowing on the circuit layer, the circuit layer includes anodal circuit layer, negative pole circuit layer and a plurality of pad circuit, the layer of windowing includes anodal pad, negative pole pad and a plurality of COB horizontal chip, the pad circuit respectively with anodal circuit layer and negative pole circuit layer electric connection, anodal pad, negative pole pad and COB horizontal chip respectively with anodal circuit layer, negative pole circuit layer and pad circuit electric connection. The utility model discloses a set up the horizontal chip of COB and be connected with the pad circuit cooperation on the circuit layer, the horizontal chip of COB is bigger with the area of contact of pad circuit, can increase the laminating space of pad greatly, avoids appearing the bad phenomenon of paster during production, promotes the quality efficiency of circuit board.

Description

Circuit board with horizontal chip architecture of COB

Technical Field

The utility model relates to a circuit board technical field, in particular to circuit board with horizontal chip architecture of COB.

Background

A Flexible Printed Circuit Board (hereinafter referred to as a "Flexible Printed Circuit Board"), commonly referred to as an FPC in the industry, is a Printed Circuit Board made of a Flexible insulating base material (mainly polyimide or polyester film) and can be freely bent, wound, and folded. The FPC can be used for greatly reducing the volume of electronic products, and is suitable for the development of the electronic products in the directions of high density, miniaturization and high reliability. The flexible printed circuit board has a single-sided surface, a double-sided surface and a multi-layer board. The adopted base material is mainly a polyimide copper clad laminate. The material has high heat resistance and good dimensional stability, and is pressed with a covering film with mechanical protection and good electrical insulation performance to form a final product. The surface layer and the inner layer conductor of the double-sided and multi-layer printed circuit board are electrically connected with the inner and outer layer circuits through metallization. However, the window opening mode of the existing FPC circuit board is mostly an oval window opening mode, so that the bonding space of the bonding pad is small, the phenomenon of poor surface mounting is easy to occur, and the product quality of the circuit board is reduced.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem lies in, to the above-mentioned defect of prior art, provides a circuit board with horizontal chip architecture of COB, is connected through setting up the pad circuit cooperation on horizontal chip of COB and the circuit layer, and the area of contact of horizontal chip of COB and pad circuit is bigger, can increase the laminating space of pad greatly, avoids appearing the bad phenomenon of paster during production, promotes the quality efficiency of circuit board.

In order to solve the technical problem, the technical scheme of the utility model is that:

the utility model provides a circuit board with horizontal chip architecture of COB, includes the circuit layer, be provided with the layer of windowing on the circuit layer, the circuit layer includes anodal circuit layer, negative pole circuit layer and a plurality of pad circuit, the layer of windowing includes anodal pad, negative pole pad and the horizontal chip of a plurality of COB, the pad circuit respectively with anodal circuit layer and negative pole circuit layer electric connection, anodal pad, negative pole pad and COB horizontal chip respectively with anodal circuit layer, negative pole circuit layer and pad circuit electric connection.

Preferably, the pad circuit includes a plurality of first circuit portions, second circuit portions, third circuit portions, fourth circuit portions, fifth circuit portions, sixth circuit portions, seventh circuit portions, and eighth circuit portions arranged in sequence from left to right, and the first circuit portions and the eighth circuit portions are electrically connected to the positive electrode circuit layer and the negative electrode circuit layer, respectively.

Preferably, a plurality of rectangular solder finger strips are arranged on the first circuit portion, the second circuit portion, the third circuit portion, the fourth circuit portion, the fifth circuit portion, the sixth circuit portion, the seventh circuit portion and the eighth circuit portion.

Preferably, the positive electrode pad includes a first positive electrode pad and a second positive electrode pad, the negative electrode pad includes a first negative electrode pad and a second negative electrode pad, the first positive electrode pad and the second positive electrode pad are welded on the positive electrode circuit layer, and the first negative electrode pad and the second negative electrode pad are welded on the negative electrode circuit layer.

Preferably, the horizontal chips of the COBs comprise a first horizontal chip of the COB, a second horizontal chip of the COB, a third horizontal chip of the COB, a fourth horizontal chip of the COB, a fifth horizontal chip of the COB, a sixth horizontal chip of the COB, a seventh horizontal chip of the COB, an eighth horizontal chip of the COB, a ninth horizontal chip of the COB, a tenth horizontal chip of the COB, an eleventh horizontal chip of the COB, a twelfth horizontal chip of the COB and a thirteenth horizontal chip of the COB, the first horizontal chip of the COB and the second horizontal chip of the COB are respectively electrically connected with the first circuit portion and the second circuit portion, the third horizontal chip of the COB and the fourth horizontal chip of the COB are respectively electrically connected with the second circuit portion and the third circuit portion, the horizontal chip of fifth COB respectively with third circuit portion and fourth circuit portion electric connection, the horizontal chip of sixth COB respectively with third circuit portion, fourth circuit portion and fifth circuit portion electric connection, the horizontal chip of seventh COB respectively with fourth circuit portion and fifth circuit portion electric connection, the horizontal chip of eighth COB and ninth COB equally divide respectively with fifth circuit portion and sixth circuit portion electric connection, the horizontal chip of tenth COB and eleventh COB equally divide respectively with sixth circuit portion and seventh circuit portion electric connection, the horizontal chip of twelfth COB and thirteenth COB equally divide respectively with seventh circuit portion and eighth circuit portion electric connection.

Preferably, the distance between each adjacent COB transverse chips is equal; the cross section of the rectangular welding finger strip is rectangular.

Adopt above-mentioned technical scheme, the utility model provides a pair of circuit board with horizontal chip architecture of COB has following beneficial effect: pad circuit in this circuit board respectively with anodal circuit layer and negative pole circuit layer electric connection, anodal pad, negative pole pad and horizontal chip of COB respectively with anodal circuit layer, negative pole circuit layer and pad circuit electric connection, be connected through setting up the cooperation of the horizontal chip of COB and the pad circuit on the circuit layer, the horizontal chip of COB is bigger with the area of contact of pad circuit, the laminating space of pad can be greatly increased, avoid appearing the bad phenomenon of paster during production, prevent the phenomenon that the chip drops, can solve the easy problem of warping of circuit board simultaneously, promote the product quality of this FPC circuit board, the later maintenance cost is lower, market prospect is good.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is an exploded view of the present invention;

in the figure, 1-circuit layer, 2-windowing layer, 3-character marking layer, 4-positive circuit layer, 5-negative circuit layer, 6-first circuit portion, 7-second circuit portion, 8-third circuit portion, 9-fourth circuit portion, 10-fifth circuit portion, 11-sixth circuit portion, 12-seventh circuit portion, 13-eighth circuit portion, 14-rectangular welding finger strip, 15-first positive pad, 16-second positive pad, 17-first negative pad, 18-second negative pad, 19-first COB transverse chip, 20-second transverse chip, 21-third COB transverse chip, 22-fourth COB transverse chip, 23-fifth transverse chip, 24-sixth COB transverse chip, 25-seventh transverse chip, 26-eighth transverse chip, 27-ninth transverse chip, 28-thirteenth transverse chip, 29-twelfth transverse chip, and twelfth transverse chip.

Detailed Description

The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

As shown in fig. 1, the utility model discloses an among the schematic structure diagram, combine fig. 1, fig. 2 can know, this circuit board with horizontal chip architecture of COB includes circuit layer 1, be provided with windowing layer 2 on this circuit layer 1, this circuit layer 1 includes anodal circuit layer 4, negative pole circuit layer 5 and a plurality of pad circuit, this windowing layer 2 includes anodal pad, negative pole pad and a plurality of COB horizontal chip, the pad circuit respectively with this

anodal circuit layer

4 and 5 electric connection of negative pole circuit layer, this anodal pad, negative pole pad and COB horizontal chip respectively with this anodal circuit layer 4, negative pole circuit layer 5 and pad circuit electric connection. As can be understood, the line layer is also provided with a character identification layer 3 for identifying the positive and negative line layers; the COB transverse chip can be a universal two-color COB chip and the like; the length of this circuit board can set up as required, the utility model discloses do not do the injecing.

Specifically, the land line includes a plurality of first line portions 6, second line portions 7, third line portions 8, fourth line portions 9, fifth line portions 10, sixth line portions 11, seventh line portions 12, and eighth line portions 13, which are sequentially arranged from left to right, and the first line portions 6 and the eighth line portions 13 are electrically connected to the positive electrode line layer 4 and the negative electrode line layer 5, respectively; a plurality of rectangular welding finger strips 14 are arranged on the first circuit part 6, the second circuit part 7, the third circuit part 8, the fourth circuit part 9, the fifth circuit part 10, the sixth circuit part 11, the seventh circuit part 12 and the eighth circuit part 13; the positive electrode bonding pad comprises a first positive electrode bonding pad 15 and a second positive electrode bonding pad 16, the negative electrode bonding pad comprises a first negative electrode bonding pad 17 and a second negative electrode bonding pad 18, the first positive electrode bonding pad 15 and the second positive electrode bonding pad 16 are welded on the positive electrode circuit layer 4, and the first negative electrode bonding pad 17 and the second negative electrode bonding pad 18 are welded on the negative electrode circuit layer 5; the horizontal Chip On Board (COB) comprises a first COB horizontal chip 19, a second COB horizontal chip 20, a third COB horizontal chip 21, a fourth COB horizontal chip 22, a fifth COB horizontal chip 23, a sixth COB horizontal chip 24, a seventh COB horizontal chip 25, an eighth COB horizontal chip 26, a ninth COB horizontal chip 27, a tenth COB horizontal chip 28, an eleventh COB horizontal chip 29, a twelfth COB horizontal chip 30 and a thirteenth COB horizontal chip 31, the first COB horizontal chip 19 and the second COB horizontal chip 20 are respectively electrically connected with the first circuit portion 6 and the second circuit portion 7, the third COB horizontal chip 21 and the fourth COB horizontal chip 22 are respectively electrically connected with the second circuit portion 7 and the third circuit portion 8, the fifth COB horizontal chip 23 is respectively electrically connected with the third circuit portion 8 and the sixth circuit portion 9, the sixth COB horizontal chip 23 is electrically connected with the sixth circuit portion 9, the seventh COB horizontal chip 24 and the seventh COB horizontal chip 12, the ninth COB horizontal chip 23 and the twelfth COB horizontal chip 20 are respectively electrically connected with the fifth circuit portion 10, the ninth COB horizontal chip 12 and the twelfth COB horizontal chip 12, the ninth COB horizontal chip 12 and the ninth COB horizontal chip 12 are respectively, the ninth COB horizontal chip 12 and the eleventh COB horizontal chip 12; the distance between every two adjacent COB transverse chips is equal; the rectangular shaped weld finger 14 is rectangular in cross-section.

Can understand, the utility model relates to a rationally, the structure is unique, be connected through setting up the cooperation of the horizontal chip of COB and the pad circuit on the circuit layer, compare in traditional oval metal pad, this horizontal chip of COB is bigger with the area of contact of pad circuit, the laminating space of pad can be greatly increased, avoid appearing the bad phenomenon of paster during production, prevent the phenomenon that the chip drops, can solve the easy problem of warping of circuit board simultaneously, the circuit board is difficult for warping, promote the product quality of this circuit board, the later maintenance cost is lower, market prospect is good.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

Claims

1. The utility model provides a circuit board with horizontal chip architecture of COB which characterized in that: including the circuit layer, be provided with the layer of windowing on the circuit layer, the circuit layer includes anodal circuit layer, negative pole circuit layer and a plurality of pad circuit, the layer of windowing includes anodal pad, negative pole pad and the horizontal chip of a plurality of COB, the pad circuit respectively with anodal circuit layer and negative pole circuit layer electric connection, anodal pad, negative pole pad and the horizontal chip of COB respectively with anodal circuit layer, negative pole circuit layer and pad circuit electric connection.

2. The wiring board with horizontal Chip On Board (COB) structure of claim 1, characterized in that: the pad circuit comprises a plurality of first circuit parts, second circuit parts, third circuit parts, fourth circuit parts, fifth circuit parts, sixth circuit parts, seventh circuit parts and eighth circuit parts which are sequentially arranged from left to right, and the first circuit parts and the eighth circuit parts are respectively electrically connected with the positive circuit layer and the negative circuit layer.

3. The wiring board with COB cross chip structure of claim 2, characterized in that: and the first circuit part, the second circuit part, the third circuit part, the fourth circuit part, the fifth circuit part, the sixth circuit part, the seventh circuit part and the eighth circuit part are all provided with a plurality of rectangular welding finger strips.

4. The wiring board with horizontal Chip On Board (COB) structure of claim 1, characterized in that: the positive electrode pad comprises a first positive electrode pad and a second positive electrode pad, the negative electrode pad comprises a first negative electrode pad and a second negative electrode pad, the first positive electrode pad and the second positive electrode pad are welded on the positive electrode circuit layer, and the first negative electrode pad and the second negative electrode pad are welded on the negative electrode circuit layer.

5. Circuit board with COB horizontal chip architecture according to claim 3, characterized in that: the horizontal chip of COB includes horizontal chip of first COB, horizontal chip of second COB, horizontal chip of third COB, horizontal chip of fourth COB, horizontal chip of fifth COB, horizontal chip of sixth COB, horizontal chip of seventh COB, horizontal chip of eighth COB, horizontal chip of ninth COB, horizontal chip of tenth COB, horizontal chip of eleventh COB, horizontal chip of twelfth COB and horizontal chip of thirteenth COB, horizontal chip of first COB and second COB equally divide do not with first circuit portion and second circuit portion electric connection, horizontal chip of third COB and fourth COB divide do not with horizontal chip of third circuit portion and third circuit portion electric connection, horizontal chip of fifth COB respectively with horizontal chip of third COB and seventh COB and horizontal circuit portion electric connection of seventh COB and horizontal connection of ninth COB and seventh circuit portion and seventh COB and horizontal connection of seventh COB and seventh circuit portion electric connection, horizontal chip of sixth COB and ninth COB respectively and ninth circuit portion and twelfth circuit portion electric connection.

6. Circuit board with COB horizontal chip architecture according to claim 3, characterized in that: the distance between every two adjacent COB transverse chips is equal; the cross section of the rectangular welding finger strip is rectangular.