CN104994685A - PCB bonding pad/line connection structure - Google Patents
PCB bonding pad/line connection structure Download PDFInfo
- Publication number
- CN104994685A CN104994685A CN201510407803.3A CN201510407803A CN104994685A CN 104994685 A CN104994685 A CN 104994685A CN 201510407803 A CN201510407803 A CN 201510407803A CN 104994685 A CN104994685 A CN 104994685A
- Authority
- CN
- China
- Prior art keywords
- pcb
- length
- bonding pad
- pad
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a PCB bonding pad/line connection structure. A PCB comprises a substrate. The substrate is provided with a bonding pad and a line which are connected. The connection place of the bonding pad and the line is provided with a teardrop structure, and the length of the teardrop structure meets the following formula: L>=o+e+a, wherein the L is the length of the teardrop structure, the o is the dimension of a single edge of a solder mask window, the e is solder resist offset and the a is ink lateral erosion amount. By comprehensively considering the solder mask window information, the solder resist offset and the ink lateral erosion information, a teardrop in a suitable size is obtained, and the length of the teardrop added to the connection place between the bonding pad and the line is allowed to be larger than the risk value generated due to the galvanic effect, thereby preventing the phenomenon that the connection place between the bonding pad and the line is etched broken, ensuring quality of finished products of a PCB effectively and ensuring stability of electrical performance of the PCB.
Description
Technical field
The present invention relates to circuit board technology field, a kind of pad/wire connection structure of PCB is specifically provided.
Background technology
The microetch of carrying out before PCB surface treatment, easily makes the junction between pad and circuit produce micro-breaking phenomena, is Jafani effect.Therefore PCB is when CAM designs, and usually needs to add in the junction of pad and circuit the electric property that tear (Teardrop) ensures finished product circuit.
In current CAM designs, the monolateral length that solder mask is windowed is typically designed to 2.5mil, and tear adds length and is typically designed to 3mil; But because also there will be the side-play amount (1.5mil) produced because of solder mask skew and the side etching quantity (1mil) produced because of ink corrosion in PCB, and the Jafani effect value-at-risk that solder mask is windowed, welding resistance offsets and ink lateral erosion produces jointly is 5mil, exceed tear and add length, therefore circuit just can be made to be directly exposed to Jia Fanni high risk area, cause the junction of pad and circuit to be snapped losing disconnecting, be unfavorable for PCB quality.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of pad/wire connection structure of PCB, the tear structure size of adding in this pad/wire connection structure is suitable, has both substantially increased the product yield of PCB, effectively ensure that again the electric property of PCB is stablized.
The present invention in order to the technical scheme solving its technical problem and adopt is: a kind of pad/wire connection structure of PCB, and this PCB comprises substrate, and described substrate is provided with the pad be connected and circuit; Also be added with tear structure in the junction of described pad and circuit, and the length of this tear structure meets following formula:
L≥o+e+a
In formula, L by the length of interpolation tear structure, o is the monolateral size that solder mask is windowed, and e is anti-welding side-play amount, and a is ink side etching quantity.
As a further improvement on the present invention, in the formula of described calculating tear structure length, the value of o is 1.5mil; The value of e is 1.5mil; The value of a is 1mil.
As a further improvement on the present invention, the length of this tear structure is 4mil ~ 5mil.
The invention has the beneficial effects as follows: to window situation, anti-welding drift condition and ink lateral erosion situation by considering solder mask, obtain the tear of suitable size, the tear length that the connection place of pad and circuit is added is greater than the value-at-risk produced because of Jafani effect, the junction effectively avoiding pad and circuit is snapped the phenomenon of losing and disconnecting, thus effectively ensure that the quality of finished of PCB, ensure that the electric property of PCB is stablized.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pad/wire connection structure of PCB of the present invention.
By reference to the accompanying drawings, make the following instructions:
1---pad 2---circuit
3---tear structure
Embodiment
Referring to figure to a preferred embodiment of the present invention will be described in detail.
Pad/the wire connection structure of a kind of PCB of the present invention, this PCB comprises substrate, described substrate is provided with the pad 1 and circuit 2 that are connected; Also be added with tear structure 3 in the junction of described pad and circuit, and the length of this tear structure meets following formula:
L≥o+e+a
In formula, L by the length of interpolation tear structure, o is the monolateral size that solder mask is windowed, and e is anti-welding side-play amount, and a is ink side etching quantity.
The present embodiment is less than the PCB of 9mil for distance between centers of tracks, and in the formula of above-mentioned calculating tear structure length, o value is the monolateral maximum that solder mask is windowed, and is 1.5mil; E value is anti-welding skew maximum, is 1.5mil; A value is ink lateral erosion maximum, is 1mil; Therefore can obtain: the length of this tear structure should meet L >=4mil.
And preferred, the length of this tear structure is preferably 4mil ~ 5mil.
Claims (3)
1. pad/wire connection structure of PCB, this PCB comprises substrate, described substrate is provided with the pad (1) and circuit (2) that are connected; It is characterized in that: be also added with tear structure (3) in the junction of described pad and circuit, and the length of this tear structure meets following formula:
L≥o+e+a
In formula, L by the length of interpolation tear structure, o is the monolateral size that solder mask is windowed, and e is anti-welding side-play amount, and a is ink side etching quantity.
2. pad/the wire connection structure of PCB according to claim 1, is characterized in that: in the formula of described calculating tear structure length, and the value of o is 1.5mil; The value of e is 1.5mil; The value of a is 1mil.
3. pad/the wire connection structure of PCB according to claim 2, is characterized in that: the length of this tear structure is 4mil ~ 5mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510407803.3A CN104994685A (en) | 2015-07-13 | 2015-07-13 | PCB bonding pad/line connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510407803.3A CN104994685A (en) | 2015-07-13 | 2015-07-13 | PCB bonding pad/line connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104994685A true CN104994685A (en) | 2015-10-21 |
Family
ID=54306399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510407803.3A Pending CN104994685A (en) | 2015-07-13 | 2015-07-13 | PCB bonding pad/line connection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104994685A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555047A (en) * | 2016-02-04 | 2016-05-04 | 广州兴森快捷电路科技有限公司 | Method for producing leadless gold-plated circuit board |
| CN105792532A (en) * | 2016-05-06 | 2016-07-20 | 浪潮电子信息产业股份有限公司 | Tear drop selecting method and PCB |
| CN113453423A (en) * | 2021-07-14 | 2021-09-28 | 广东合通建业科技股份有限公司 | Resistance welding windowing structure of miniLED circuit board bonding pad |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060125081A1 (en) * | 2004-12-10 | 2006-06-15 | Keihin Corporation | Printed circuit board |
| CN101626011A (en) * | 2008-07-08 | 2010-01-13 | 矽品精密工业股份有限公司 | Base plate having pad-free type conductive traces and using for encapsulation |
| CN102510676A (en) * | 2011-10-20 | 2012-06-20 | 东莞生益电子有限公司 | Method for adding teardrop in printed circuit board (PCB) during computer aided manufacturing (CAM) |
| CN204929399U (en) * | 2015-07-13 | 2015-12-30 | 竞陆电子(昆山)有限公司 | Pad / circuit connection structure of PCB circuit board |
-
2015
- 2015-07-13 CN CN201510407803.3A patent/CN104994685A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060125081A1 (en) * | 2004-12-10 | 2006-06-15 | Keihin Corporation | Printed circuit board |
| CN101626011A (en) * | 2008-07-08 | 2010-01-13 | 矽品精密工业股份有限公司 | Base plate having pad-free type conductive traces and using for encapsulation |
| CN102510676A (en) * | 2011-10-20 | 2012-06-20 | 东莞生益电子有限公司 | Method for adding teardrop in printed circuit board (PCB) during computer aided manufacturing (CAM) |
| CN204929399U (en) * | 2015-07-13 | 2015-12-30 | 竞陆电子(昆山)有限公司 | Pad / circuit connection structure of PCB circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555047A (en) * | 2016-02-04 | 2016-05-04 | 广州兴森快捷电路科技有限公司 | Method for producing leadless gold-plated circuit board |
| CN105555047B (en) * | 2016-02-04 | 2018-09-25 | 广州兴森快捷电路科技有限公司 | A kind of production method of leadless gold plating wiring board |
| CN105792532A (en) * | 2016-05-06 | 2016-07-20 | 浪潮电子信息产业股份有限公司 | Tear drop selecting method and PCB |
| CN105792532B (en) * | 2016-05-06 | 2018-05-08 | 浪潮电子信息产业股份有限公司 | A kind of tear system of selection and PCB |
| CN113453423A (en) * | 2021-07-14 | 2021-09-28 | 广东合通建业科技股份有限公司 | Resistance welding windowing structure of miniLED circuit board bonding pad |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151021 |