CN204929399U - Pad / circuit connection structure of PCB circuit board - Google Patents
Pad / circuit connection structure of PCB circuit board Download PDFInfo
- Publication number
- CN204929399U CN204929399U CN201520502845.0U CN201520502845U CN204929399U CN 204929399 U CN204929399 U CN 204929399U CN 201520502845 U CN201520502845 U CN 201520502845U CN 204929399 U CN204929399 U CN 204929399U
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- pad
- length
- pcb
- circuit board
- tear drop
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Abstract
The utility model discloses a pad / circuit connection structure of PCB circuit board, this PCB circuit board include the base plate, be provided with the pad and the circuit that are connected on the base plate, still add the junction of pad and gate has the tear drop structure, and the length of this tear drop structure satisfies following formula: L >= o+e+a, wherein, L are the length of interpolation tear drop structure, unilateral size that o windowed for the solder mask, and e is for preventing welding the offset, an is printing ink lateral erosion volume, weld the skew condition and the printing ink lateral erosion condition through taking all factors into consideration the solder mask condition of windowing, preventing, obtain the tear drop of suitable size for the tear drop length that adds in the connection place of pad and gate is greater than the yin jiafanni effect and the value -at -risk that produces, and the phenomenon of losing the disconnection is stung in the effectual junction of having avoided the pad and gate, thereby has effectively guaranteed the finished product quality of PCB circuit board, has guaranteed that the electric property of PCB circuit board is stable.
Description
Technical field
The utility model relates to circuit board technology field, specifically provides a kind of pad/wire connection structure of PCB.
Background technology
The microetch of carrying out before PCB surface treatment, easily makes the junction between pad and circuit produce micro-breaking phenomena, is Jafani effect.Therefore PCB is when CAM designs, and usually needs to add in the junction of pad and circuit the electric property that tear (Teardrop) ensures finished product circuit.
In current CAM designs, the monolateral length that solder mask is windowed is typically designed to 2.5mil, and tear adds length and is typically designed to 3mil; But because also there will be the side-play amount (1.5mil) produced because of solder mask skew and the side etching quantity (1mil) produced because of ink corrosion in PCB, and the Jafani effect value-at-risk that solder mask is windowed, welding resistance offsets and ink lateral erosion produces jointly is 5mil, exceed tear and add length, therefore circuit just can be made to be directly exposed to Jia Fanni high risk area, cause the junction of pad and circuit to be snapped losing disconnecting, be unfavorable for PCB quality.
Summary of the invention
In order to overcome above-mentioned defect, the utility model provides a kind of pad/wire connection structure of PCB, the tear structure size of adding in this pad/wire connection structure is suitable, has both substantially increased the product yield of PCB, effectively ensure that again the electric property of PCB is stablized.
The utility model in order to the technical scheme solving its technical problem and adopt is: a kind of pad/wire connection structure of PCB, and this PCB comprises substrate, and described substrate is provided with the pad be connected and circuit; Also be added with tear structure in the junction of described pad and circuit, and the length of this tear structure meets following formula:
L≥o+e+a
In formula, L by the length of interpolation tear structure, o is the monolateral size that solder mask is windowed, and e is anti-welding side-play amount, and a is ink side etching quantity.
As further improvement of the utility model, in the formula of described calculating tear structure length, the value of o is 1.5mil; The value of e is 1.5mil; The value of a is 1mil.
As further improvement of the utility model, the length of this tear structure is 4mil ~ 5mil.
The beneficial effects of the utility model are: to window situation, anti-welding drift condition and ink lateral erosion situation by considering solder mask, obtain the tear of suitable size, the tear length that the connection place of pad and circuit is added is greater than the value-at-risk produced because of Jafani effect, the junction effectively avoiding pad and circuit is snapped the phenomenon of losing and disconnecting, thus effectively ensure that the quality of finished of PCB, ensure that the electric property of PCB is stablized.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pad/wire connection structure of PCB described in the utility model.
By reference to the accompanying drawings, make the following instructions:
1---pad 2---circuit
3---tear structure
Embodiment
Referring to figure, preferred embodiment of the present utility model is described in detail.
Pad/the wire connection structure of a kind of PCB described in the utility model, this PCB comprises substrate, described substrate is provided with the pad 1 and circuit 2 that are connected; Also be added with tear structure 3 in the junction of described pad and circuit, and the length of this tear structure meets following formula:
L≥o+e+a
In formula, L by the length of interpolation tear structure, o is the monolateral size that solder mask is windowed, and e is anti-welding side-play amount, and a is ink side etching quantity.
The present embodiment is less than the PCB of 9mil for distance between centers of tracks, and in the formula of above-mentioned calculating tear structure length, o value is the monolateral maximum that solder mask is windowed, and is 1.5mil; E value is anti-welding skew maximum, is 1.5mil; A value is ink lateral erosion maximum, is 1mil; Therefore can obtain: the length of this tear structure should meet L >=4mil.
And preferred, the length of this tear structure is preferably 4mil ~ 5mil.
Claims (3)
1. pad/wire connection structure of PCB, this PCB comprises substrate, described substrate is provided with the pad (1) and circuit (2) that are connected; It is characterized in that: be also added with tear structure (3) in the junction of described pad and circuit, and the length of this tear structure meets following formula:
L≥o+e+a
In formula, L by the length of interpolation tear structure, o is the monolateral size that solder mask is windowed, and e is anti-welding side-play amount, and a is ink side etching quantity.
2. pad/the wire connection structure of PCB according to claim 1, is characterized in that: in the formula of described calculating tear structure length, and the value of o is 1.5mil; The value of e is 1.5mil; The value of a is 1mil.
3. pad/the wire connection structure of PCB according to claim 2, is characterized in that: the length of this tear structure is 4mil ~ 5mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520502845.0U CN204929399U (en) | 2015-07-13 | 2015-07-13 | Pad / circuit connection structure of PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520502845.0U CN204929399U (en) | 2015-07-13 | 2015-07-13 | Pad / circuit connection structure of PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204929399U true CN204929399U (en) | 2015-12-30 |
Family
ID=54978491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520502845.0U Expired - Fee Related CN204929399U (en) | 2015-07-13 | 2015-07-13 | Pad / circuit connection structure of PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204929399U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994685A (en) * | 2015-07-13 | 2015-10-21 | 竞陆电子(昆山)有限公司 | PCB bonding pad/line connection structure |
-
2015
- 2015-07-13 CN CN201520502845.0U patent/CN204929399U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994685A (en) * | 2015-07-13 | 2015-10-21 | 竞陆电子(昆山)有限公司 | PCB bonding pad/line connection structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20180713 |