CN102984890A - Positioning structure and positioning method for component placement - Google Patents
Positioning structure and positioning method for component placement Download PDFInfo
- Publication number
- CN102984890A CN102984890A CN2012104037472A CN201210403747A CN102984890A CN 102984890 A CN102984890 A CN 102984890A CN 2012104037472 A CN2012104037472 A CN 2012104037472A CN 201210403747 A CN201210403747 A CN 201210403747A CN 102984890 A CN102984890 A CN 102984890A
- Authority
- CN
- China
- Prior art keywords
- solder mask
- component mounter
- square
- wire casing
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 53
- 230000004807 localization Effects 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- 238000007665 sagging Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 5
- 230000003064 anti-oxidating effect Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a positioning structure for component placement. The positioning structure comprises a printed circuit board (PCB) used for placing components, the PCB comprises a solder mask layer, concave wire casings are arranged on the solder mask layer along projection lines of outlines of to-be-mounted components on the solder mask layer, and windowing lines of the solder mask layer are formed. The invention further discloses a corresponding positioning method for the component placement. When the components need to be replaced, the windowing lines of the solder mask layer are used for positioning the to-be-mounted components. By means of the positioning structure and the positioning method for the component placement, when the components are replaced, component positioning precision is improved, printed circuit board assembly (PCBA) rejection rate caused by manual repair is lowered, and PCB cost is lowered.
Description
Technical field
The present invention relates to hardware electronic, particularly relate to a kind of component mounter location structure and localization method.
Background technology
Along with the development of electronic product, electronic devices and components are more and more less, and placement accuracy requires more and more higher.Often need to change electronic component in the electronic product maintenance process.As shown in Figure 1, take the BGA(ball grid array) structure is example, traditional scheme is normally at the PCB(printed circuit board (PCB)) and the position of upper installation elements 4, silk-screen white oil line 6 on solder mask 3, form white oil silk-screen frame, the location when implementing the element installation with reference to this white oil silk-screen frame.But the white oil line has certain tolerance, is difficult to precise positioning, causes easily element to paste partially, causes rosin joint, when serious even can cause product rejection.Simultaneously, need silk-screen one deck white oil on the PCB, increased cost.
Summary of the invention
Main purpose of the present invention is exactly for the deficiencies in the prior art, and a kind of component mounter location structure and localization method are provided, and improves positioning accuracy and saves cost.
For achieving the above object, the present invention is by the following technical solutions:
A kind of component mounter location structure comprises the PCB for mount components, and described PCB comprises solder mask, on described solder mask, offers sagging wire casing along the projection line of profile on described solder mask of element to be installed, forms the solder mask windowed thread.
Preferably, described solder mask windowed thread is made of discrete several wire casings.
Preferably, the live width of each bar wire casing is not less than 0.125mm, and length is not less than 1mm.
Preferably, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove that is positioned on the square first side, be positioned at the second straight-line groove on the Second Edge adjacent with square first side, and be positioned at the tri linear groove on square the 3rd limit and the angle that quadrangle becomes.
Preferably, described wire casing exposes the copper foil layer of described solder mask below, and the copper foil layer surface in the described wire casing is coated with metal anti-oxidation and corrosion.
Preferably, gold-plated in the described wire casing.
A kind of component mounter localization method said method comprising the steps of:
Along the projection line of element profile to be installed on the solder mask of PCB, offer sagging wire casing at described solder mask, form the solder mask windowed thread;
When changing element, treat installation elements by described solder mask windowed thread and implement the location.
Preferably, described solder mask windowed thread is made of discrete several wire casings.
Preferably, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove that is positioned on the square first side, be positioned at the second straight-line groove on the Second Edge adjacent with square first side, and be positioned at the tri linear groove on square the 3rd limit and the angle that quadrangle becomes.
Preferably, gold-plated in the described wire casing.
The technique effect that the present invention is useful is:
The present invention utilizes the solder mask windowed thread on the PCB to locate components and parts, and welding resistance is windowed and formed welding resistance line sign, and its positioning accuracy will far above the precision of silk-screen white oil frame, be conducive to the precise positioning of element when changing element.The present invention can solve element when maintenance and easily paste the problem that partially causes rosin joint, reduces when manually reprocessing because element location and is forbidden the PCB scrappage that causes.In addition, owing to economized one deck silk-screen white oil layer on the PCB, reduced the PCB cost.
Description of drawings
Fig. 1 is the cutaway view that traditional element mounts location structure;
Fig. 2 is the schematic top plan view that traditional element mounts location structure;
Fig. 3 is the cutaway view of an embodiment of component mounter location structure of the present invention;
Fig. 4 is the schematic top plan view of an embodiment of component mounter location structure of the present invention.
Embodiment
By reference to the accompanying drawings the present invention is further described in detail by the following examples.
See also Fig. 3, in some embodiments, the component mounter location structure comprises the PCB for mount components, described PCB comprises base material 1, copper foil layer 2 and solder mask 3, on described solder mask 3, the projection line of profile on described solder mask 3 along element 4 to be installed offers sagging wire casing 5, forms the solder mask windowed thread.
Can be gold-plated in the described wire casing.
Described wire casing 5 can be to hollow out described solder mask and the groove that exposes the copper foil layer 2 of described solder mask 3 belows, and the copper foil layer surfaces in the described wire casing 5 are coated with metal anti-oxidation and corrosion.Preferably gold-plated, can effectively protect copper foil layer, can form again the solder mask gold thread of windowing, be convenient to identification.
Preferably, described solder mask windowed thread is made of discrete several wire casings.It is fixed that the concrete number of wire casing can be come according to element profile.
As shown in Figure 4, take the BGA structure as example, the projection line of element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove 501 that is positioned on the square first side, be positioned at the second straight-line groove 502 on the Second Edge adjacent with square first side, and be positioned at the tri linear groove 503 on square the 3rd limit and the angle that quadrangle becomes.
Form solder mask by short discontinuous wire casing rather than continuous wire casing and window, the convenient making saved cost of manufacture, improved the efficient of windowing.
The live width of wire casing and length should be convenient to identification.Preferably, the live width of each bar wire casing is not less than 0.125mm, and length is not less than 1mm.
In an embodiment, the component mounter localization method may further comprise the steps:
Along the projection line of element profile to be installed on the solder mask of PCB, offer sagging wire casing at described solder mask, form the solder mask windowed thread;
When changing element, treat installation elements by described solder mask windowed thread and implement the location.
Preferably, described solder mask windowed thread is made of discrete several wire casings.
Above content is the further description of the present invention being done in conjunction with concrete preferred implementation, can not assert that implementation of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a component mounter location structure comprises the PCB for mount components, and described PCB comprises solder mask, it is characterized in that, on described solder mask, offer sagging wire casing along the projection line of profile on described solder mask of element to be installed, form the solder mask windowed thread.
2. component mounter location structure as claimed in claim 1 is characterized in that, described solder mask windowed thread is made of discrete several wire casings.
3. component mounter location structure as claimed in claim 2 is characterized in that, the live width of each bar wire casing is not less than 0.125mm, and length is not less than 1mm.
4. component mounter location structure as claimed in claim 2, it is characterized in that, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove that is positioned on the square first side, be positioned at the second straight-line groove on the Second Edge adjacent with square first side, and be positioned at the tri linear groove on square the 3rd limit and the angle that quadrangle becomes.
5. such as each described component mounter location structure of claim 1 to 4, it is characterized in that described wire casing exposes the copper foil layer of described solder mask below, the copper foil layer surface in the described wire casing is coated with metal anti-oxidation and corrosion.
6. such as each described component mounter location structure of claim 1 to 5, it is characterized in that, gold-plated in the described wire casing.
7. a component mounter localization method is characterized in that, said method comprising the steps of:
Along the projection line of element profile to be installed on the solder mask of PCB, offer sagging wire casing at described solder mask, form the solder mask windowed thread;
When changing element, treat installation elements by described solder mask windowed thread and implement the location.
8. component mounter localization method as claimed in claim 7 is characterized in that, described solder mask windowed thread is made of discrete several wire casings.
9. component mounter localization method as claimed in claim 8, it is characterized in that, the projection line of described element profile on described solder mask is square, described solder mask windowed thread comprises the first straight-line groove that is positioned on the square first side, be positioned at the second straight-line groove on the Second Edge adjacent with square first side, and be positioned at the tri linear groove on square the 3rd limit and the angle that quadrangle becomes.
10. such as each described component mounter localization method of claim 7 to 9, it is characterized in that, gold-plated in the described wire casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403747.2A CN102984890B (en) | 2012-10-22 | 2012-10-22 | A kind of component mounter location structure and localization method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210403747.2A CN102984890B (en) | 2012-10-22 | 2012-10-22 | A kind of component mounter location structure and localization method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102984890A true CN102984890A (en) | 2013-03-20 |
| CN102984890B CN102984890B (en) | 2015-08-19 |
Family
ID=47858501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210403747.2A Expired - Fee Related CN102984890B (en) | 2012-10-22 | 2012-10-22 | A kind of component mounter location structure and localization method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102984890B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934074A (en) * | 2016-06-28 | 2016-09-07 | 广东欧珀移动通信有限公司 | PCB (Printed Circuit Board) and mobile terminal provided with same |
| CN106413243A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Substrate and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080068308A (en) * | 2007-01-19 | 2008-07-23 | 엘지이노텍 주식회사 | Module pcb and manufacturing method thereof |
| CN101231983A (en) * | 2007-01-23 | 2008-07-30 | 南茂科技股份有限公司 | Thin film crystal-covering package substrate |
| CN202374560U (en) * | 2011-12-15 | 2012-08-08 | 群光电子(苏州)有限公司 | Chip attachment printed circuit board (PCB) |
| CN202444693U (en) * | 2011-12-15 | 2012-09-19 | 群光电子(苏州)有限公司 | Chip mounting PCB |
| CN202889803U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Mounting and positioning structure of element |
-
2012
- 2012-10-22 CN CN201210403747.2A patent/CN102984890B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080068308A (en) * | 2007-01-19 | 2008-07-23 | 엘지이노텍 주식회사 | Module pcb and manufacturing method thereof |
| CN101231983A (en) * | 2007-01-23 | 2008-07-30 | 南茂科技股份有限公司 | Thin film crystal-covering package substrate |
| CN202374560U (en) * | 2011-12-15 | 2012-08-08 | 群光电子(苏州)有限公司 | Chip attachment printed circuit board (PCB) |
| CN202444693U (en) * | 2011-12-15 | 2012-09-19 | 群光电子(苏州)有限公司 | Chip mounting PCB |
| CN202889803U (en) * | 2012-10-22 | 2013-04-17 | 广东欧珀移动通信有限公司 | Mounting and positioning structure of element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934074A (en) * | 2016-06-28 | 2016-09-07 | 广东欧珀移动通信有限公司 | PCB (Printed Circuit Board) and mobile terminal provided with same |
| CN105934074B (en) * | 2016-06-28 | 2019-02-12 | Oppo广东移动通信有限公司 | Pcb board and mobile terminal with it |
| CN106413243A (en) * | 2016-10-31 | 2017-02-15 | 努比亚技术有限公司 | Substrate and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102984890B (en) | 2015-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106122824A (en) | LED lamp bar SMT low temperature process | |
| CN102984890B (en) | A kind of component mounter location structure and localization method | |
| CN103582302A (en) | Printed circuit board and method for manufacturing printed circuit board | |
| CN104507251A (en) | Wire harness template and manufacture method thereof | |
| CN202889803U (en) | Mounting and positioning structure of element | |
| CN203368924U (en) | PCB board welding pad structure | |
| US20130248237A1 (en) | Printed circuit board | |
| CN203691749U (en) | Circuit board assembly | |
| CN202374560U (en) | Chip attachment printed circuit board (PCB) | |
| CN203368905U (en) | Printed circuit board | |
| CN205912323U (en) | Printed circuit board | |
| CN108990266A (en) | A kind of pcb board | |
| EP3695692A1 (en) | Method for mechanical contacting of a potting frame on a printed circuit board | |
| CN203708617U (en) | Printed circuit board | |
| CN202738275U (en) | Wave soldering jig capable of preventing solder bridge | |
| CN203608449U (en) | A printed circuit board repairing copper foil | |
| CN203912337U (en) | Circuit board assembly | |
| CN107039384B (en) | Surface-mounted element | |
| CN1190116C (en) | Method for preventing production of tin ball and its mould | |
| CN102984883B (en) | Structure capable of avoiding cold solder joint of elements and method thereof | |
| CN204795985U (en) | PCB board mounting panel | |
| CN203872457U (en) | Protective device for welding of rigid-flexible printed circuit board | |
| CN117580249B (en) | Display module circuit board and processing method thereof | |
| CN203801159U (en) | Angle adjustable wave soldering jig | |
| CN104302114A (en) | Positioning device and method for chip mounter surface mounting bulk device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |