CN203733806U - Axial SMD Diode Devices - Google Patents

Abstract

The utility model discloses an axial type chip diode device, which comprises: a diode chip, a first copper lead and a second copper lead; The connection of the positive electrode surface; a cylindrical epoxy package covers the diode chip, the first welding area and the second welding area, and the first bending area and the second bending area are respectively located on both sides of the epoxy package, The bottom of the epoxy package is a strip-shaped flat bottom, the anode terminal area and the cathode terminal area are located under the epoxy package and contact with the strip-shaped flat bottom, and the width of the anode terminal area and the cathode terminal area is greater than that of the first bending area , the second bending zone. The chip diode device of the utility model not only avoids the rolling of the axial type diode device during installation, but also avoids the deformation of the copper lead wire and reduces the volume. At the same time, it is convenient for installation, and greatly reduces the cracking between the epoxy package body and the copper lead wire, and Greatly reduce the risk of weak soldering between the diode chip and the copper lead in subsequent use.

Description

Axial SMD Diode Devices

technical field

The utility model relates to an axial patch diode device, which belongs to the field of semiconductor components.

Background technique

SMD rectifier device is the most basic semiconductor device, its main function is to convert alternating current into direct current, and it is widely used in various electronic circuits. The existing rectifier diode device has a large volume and is inconvenient to install, and when installed, it is easy to cause cracks between the epoxy package body and the copper lead wire, and affect the welding fastness of the diode chip and the copper lead wire. Therefore, how to design a rectifier diode device that is easy to install and has high reliability is the problem studied by the utility model.

Contents of the invention

The utility model provides an axial type chip diode device. The chip diode device not only avoids the rolling of the axial type diode device during installation, but also avoids the deformation of the copper lead wire and reduces the volume. At the same time, it is convenient for installation and greatly reduces the Cracks between the epoxy package and the copper leads, and greatly reduce the risk of weak soldering between the diode chip and the copper leads in subsequent use.

In order to achieve the above purpose, the technical solution adopted by the utility model is: an axial type chip diode device, comprising:

a diode chip having a positive side and a negative side;

The first copper lead, one end of the first copper lead is the first welding area, the other end of the first copper lead is the anode terminal area of the rectifier diode device, and there is a first bend between one end of the anode terminal area and one end of the first welding area zone, the first welding zone is parallel to the anode terminal zone;

The second copper lead, one end of the second copper lead is the second welding area, the other end of the second copper lead is the cathode terminal area of the rectifier diode device, and there is a second bend between one end of the cathode terminal area and one end of the second welding area area, the second welding area is parallel to the cathode terminal area;

The first lead end located at the other end of the first welding area is connected to the anode surface of the diode chip through the solder paste layer, and the second lead end located at the other end of the second welding area is connected to the diode chip through the solder paste layer. The connection of the negative side of the

Both the first welding area of the first copper lead and the middle part of the second welding area of the second copper lead are provided with raised lines;

A cylindrical epoxy package covers the diode chip, the first welding area and the second welding area, and the first bending area and the second bending area are respectively located on both sides of the epoxy package. The epoxy package The bottom is a strip-shaped flat bottom, and the anode terminal area and the cathode terminal area are located under the epoxy package and are in contact with the strip-shaped flat bottom. The width of the anode terminal area and the cathode terminal area is larger than that of the first bending area and the second bending area. district.

The scheme of further improvement in above-mentioned technical scheme is as follows:

1. In the above solution, the convex strips are arranged perpendicular to the first welding area and the second welding area, and the length of the convex strips is greater than the length of the first lead end and the second lead end.

2. In the above solution, the first welding zone is perpendicular to the first bending zone, and the second welding zone is perpendicular to the second bending zone.

Due to the application of the above-mentioned technical solutions, the utility model has the following advantages compared with the prior art:

The utility model axial type patch diode device comprises a cylindrical epoxy package body covering the diode chip, a first welding area and a second welding area, and the first bending area and the second bending area are respectively located in the epoxy On both sides of the package, the bottom of the epoxy package is a strip-shaped flat bottom, and the anode terminal area and the cathode terminal area are located below the epoxy package and are in contact with the strip-shaped flat bottom. The width of the anode terminal area and the cathode terminal area is greater than The first bending area and the second bending area not only avoid the rolling of the axial diode device during installation, but also avoid the deformation of the copper lead and reduce the volume. At the same time, it is convenient for installation; secondly, it includes the diode chip, the first copper lead , The second copper lead, the first welding area of the first copper lead, and the middle part of the second welding area of the second copper lead are provided with raised lines, which greatly reduces the cracking between the epoxy package and the copper lead, and greatly reduces the follow-up The risk of weak soldering between the diode chip and the copper lead during use.

Description of drawings

Accompanying drawing 1 is the structure schematic diagram of axial type chip diode device of the present invention;

Accompanying drawing 2 is A-A sectional structural schematic diagram in accompanying drawing 1.

In the above drawings: 1. Diode chip; 2. The first copper lead; 21. The first welding area; 22. The anode terminal area; 23. The first bending area; 3. The second copper lead; 31. The second welding 32. Cathode terminal area; 33. Second bending area; 4. First lead terminal; 5. Solder paste layer; 6. Second lead terminal; 7. Epoxy package; 8. Raised bar; 9. Strip flat bottom.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is further described:

Embodiment 1: an axial type patch diode device, comprising:

Diode chip 1, which has a positive side and a negative side;

The first copper lead 2, one end of the first copper lead 2 is the first welding area 21, the other end of the first copper lead 2 is used as the anode terminal area 22 of the rectifier diode device, one end of the anode terminal area 22 is connected to the first welding area 21. There is a first bending area 23 between them, the first welding area 21 is parallel to the anode terminal area 22 and perpendicular to the first bending area 23;

The second copper lead 3, one end of the second copper lead 3 is the second welding area 31, the other end of the second copper lead 3 is the cathode terminal area 32 of the rectifier diode device, one end of the cathode terminal area 32 is connected to the second welding area 31. There is a second bending area 33 between them, the second welding area 31 is parallel to the cathode terminal area 32 and perpendicular to the second bending area 33;

The first lead terminal 4 located at the other end of the first welding area 21 is connected to the anode surface of the diode chip 1 through the solder paste layer 5, and the second lead terminal 6 located at the other end of the second welding area 31 is connected through the solder paste layer 5. The connection of layer 5 to the negative side of said diode chip 1;

Both the first welding area 21 of the first copper lead 2 and the middle of the second welding area 31 of the second copper lead 3 are provided with convex lines 8;

A cylindrical epoxy package body 7 covers the diode chip 2, the first welding area 21 and the second welding area 31, and the first bending area 23 and the second bending area 33 are respectively located on both sides of the epoxy package body 7. side, the bottom of the epoxy package 7 is a strip-shaped flat bottom 9, the anode terminal area 22 and the cathode terminal area 32 are located below the epoxy package 7 and are in contact with the strip-shaped flat bottom 9, the anode terminal area 22, the cathode terminal area The width of the area 32 is larger than that of the first bending area 23 and the second bending area 33 .

Embodiment 2: an axial type patch diode device, comprising:

Diode chip 1, which has a positive side and a negative side;

The first copper lead 2, one end of the first copper lead 2 is the first welding area 21, the other end of the first copper lead 2 is used as the anode terminal area 22 of the rectifier diode device, one end of the anode terminal area 22 is connected to the first welding area 21. There is a first bending area 23 between them, and the first welding area 21 is parallel to the anode terminal area 22;

The second copper lead 3, one end of the second copper lead 3 is the second welding area 31, the other end of the second copper lead 3 is the cathode terminal area 32 of the rectifier diode device, one end of the cathode terminal area 32 is connected to the second welding area 31. There is a second bending area 33 between them, and the second welding area 31 is parallel to the cathode terminal area 32;

The first lead terminal 4 located at the other end of the first welding area 21 is connected to the anode surface of the diode chip 1 through the solder paste layer 5, and the second lead terminal 6 located at the other end of the second welding area 31 is connected through the solder paste layer 5. The connection of layer 5 to the negative side of said diode chip 1;

Both the first welding area 21 of the first copper lead 2 and the middle of the second welding area 31 of the second copper lead 3 are provided with convex lines 8;

A cylindrical epoxy package body 7 covers the diode chip 2, the first welding area 21 and the second welding area 31, and the first bending area 23 and the second bending area 33 are respectively located on both sides of the epoxy package body 7. side, the bottom of the epoxy package 7 is a strip-shaped flat bottom 9, the anode terminal area 22 and the cathode terminal area 32 are located below the epoxy package 7 and are in contact with the strip-shaped flat bottom 9, the anode terminal area 22, the cathode terminal area The width of the area 32 is larger than that of the first bending area 23 and the second bending area 33 .

The protruding strips 8 are arranged vertically to the first welding area 21 and the second welding area 31 respectively;

When the above-mentioned axial type chip diode device is used, it includes a cylindrical epoxy package covering the diode chip, the first welding area and the second welding area, and the first bending area and the second bending area are respectively located in the epoxy On both sides of the package, the bottom of the epoxy package is a strip-shaped flat bottom, and the anode terminal area and the cathode terminal area are located below the epoxy package and are in contact with the strip-shaped flat bottom. The width of the anode terminal area and the cathode terminal area is greater than The first bending area and the second bending area not only avoid the rolling of the axial diode device during installation, but also avoid the deformation of the copper lead and reduce the volume. At the same time, it is convenient for installation; secondly, it includes the diode chip, the first copper lead , The second copper lead, the first welding area of the first copper lead, and the middle part of the second welding area of the second copper lead are provided with raised lines, which greatly reduces the cracking between the epoxy package and the copper lead, and greatly reduces the follow-up The risk of weak soldering between the diode chip and the copper lead during use.

The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present utility model, and its purpose is to enable those familiar with this technology to understand the content of the present utility model and implement it accordingly, and not to limit the protection scope of the present utility model. All equivalent changes or modifications made according to the spirit of the utility model shall fall within the protection scope of the utility model.

Claims (3)

1. an axialmode stamp-mounting-paper diode device, is characterized in that: comprising:

Diode chip for backlight unit (1), it has positive pole-face and negative pole face;

The first bronze medal lead-in wire (2), this the first bronze medal lead-in wire (2) one end is the first weld zone (21), this the first bronze medal lead-in wire (2) other end is as the anode tap subarea (22) of rectifier diode device, between (22) one end, anode tap subarea and one end, the first weld zone (21), have the first flex area (23), the first weld zone (21) are parallel with anode tap subarea (22);

The second bronze medal lead-in wire (3), this the second bronze medal lead-in wire (3) one end is the second weld zone (31), this the second bronze medal lead-in wire (3) other end is as the cathode terminal subarea (32) of rectifier diode device, between (32) one end, cathode terminal subarea and one end, the second weld zone (31), have the second flex area (33), the second weld zone (31) are parallel with cathode terminal subarea (32);

Being connected of the positive pole-face of the first lead ends (4) that is positioned at the first weld zone (21) other end by layer of solder paste (5) and described diode chip for backlight unit (1), the second lead ends (6) that is positioned at the second weld zone (31) other end is passed through being connected of negative pole face of layer of solder paste (5) and described diode chip for backlight unit (1);

First weld zone (21) of described the first bronze medal lead-in wire (2), the middle part, the second weld zone (31) of the second bronze medal lead-in wire (3) are equipped with raised line (8);

One columniform epoxy packages body (7) is coated described diode chip for backlight unit (2), the first weld zone (21) and the second weld zone (31), the first flex area (23), the second flex area (33) lays respectively at epoxy packages body (7) both sides, this epoxy packages body (7) bottom is (9) at the bottom of a stripe-shape plane, anode tap subarea (22), cathode terminal subarea (32) is positioned at epoxy packages body (7) below and contacts with (9) at the bottom of stripe-shape plane, described anode tap subarea (22), the width in cathode terminal subarea (32) is greater than the first flex area (23), the second flex area (33).

2. axialmode stamp-mounting-paper diode device according to claim 1, it is characterized in that: described raised line (8) respectively with the first weld zone (21), the second weld zone (31) vertical setting, the length of described raised line (8) is greater than the length of the first lead ends (4), the second lead ends (6).

3. axialmode stamp-mounting-paper diode device according to claim 1, is characterized in that: described the first weld zone (21) is vertical with the first flex area (23), described the second weld zone (31) is vertical with the second flex area (33).