JP2010062412A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the reliability in electrical connection of an electronic component. <P>SOLUTION: The electronic component includes an element 11, a conductive pattern 13 buried in conductor forming layers 12 in the element 11, and an external electrode 14 which is electrically connected to the conductive pattern 13 and is extended out of the element 11. The element 11 has the conductor forming layers 12 and conductor non-forming layers 15. The filler containing rate of at least one layer of the conductor non-forming layers 15 is determined to be higher than the filler containing rate of at least one layer of the conductor forming layers 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component used for a mobile phone or the like.

  Conventionally, as shown in FIG. 2, this type of electronic component includes an element body 1, a conductive pattern 2 embedded in the element body 1, an electric connection to the conductive pattern 2, and an outside of the element body 1. And the external electrode 3 is joined to the mounting substrate 4 and the solder fillet 5.

As prior art document information relating to this application, for example, Patent Document 1 is known.
JP 2005-317604 A

  Such a conventional electronic component has a problem of low electrical connection reliability.

  That is, in the above-described conventional configuration, the linear expansion coefficient of the mounting substrate 4 and the linear expansion coefficient of the element body 1 are different, so that the solder fillet is peeled off due to a change in the temperature state surrounding the electronic component, and the electrical Connection reliability was low.

  Accordingly, an object of the present invention is to improve electrical connection reliability of electronic components.

  In order to achieve this object, the present invention provides an element body, a conductive pattern embedded in a conductor formation layer in the element body, and an electrical connection to the conductive pattern and the outside of the element body. An external electrode, and the element body includes the conductor formation layer and a conductor non-formation layer, and the filler content of at least one layer of the conductor non-formation layer is determined in the conductor formation layer. The electronic component is higher than the filler content of at least one layer.

  With this configuration, since the linear expansion coefficient of the conductor non-forming layer in the element body can be lowered and the linear expansion coefficient as the entire element body can be reduced, the linear expansion coefficient between the element body and the mounting substrate can be reduced. Thus, the solder fillet peeling can be suppressed, and as a result, the electrical connection reliability can be improved.

(Embodiment 1)
Hereinafter, the electronic component according to Embodiment 1 of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the electronic component shown in the present embodiment is electrically connected to the element body 11, the conductive pattern 13 embedded in the conductor forming layer 12 in the element body 11, and the conductive pattern 13. And an external electrode 14 drawn out of the element body 11, and the element body 11 includes the conductor forming layer 12 and a conductor non-forming layer 15. The filler content of at least one layer is set higher than the filler content of at least one layer of the conductor forming layer 12.

  Specifically, a conductive pattern 12 such as a coil or a via made of a conductive material having a high conductivity such as copper or silver is embedded in the conductor forming layer 12 of the element body 11 made of a resin such as epoxy or polyimide. Similarly, an external electrode 14 made of a conductive material having a high conductivity such as copper or silver is electrically connected to the conductive pattern 12 and drawn out of the element body 11. The filler content of 15 is higher than the filler content of at least one of the conductor forming layers 12.

  With such a configuration, the linear expansion coefficient of the conductor non-forming layer 15 in the element body 11 can be lowered, and the linear expansion coefficient of the element body 11 as a whole can be reduced. The difference in linear expansion coefficient with the substrate 16 can be reduced, and the peeling of the solder fillet 17 that electrically connects the external electrode 14 and the mounting substrate 16 can be suppressed. As a result, the electrical connection reliability is improved. It can be improved.

  Furthermore, since the filler content of at least one layer of the conductor forming layer 12 is lower than the filler content of at least one layer of the conductor non-forming layer 15, the formation accuracy of the conductive pattern 13 is ensured. Therefore, it is possible to achieve both the improvement of the electrical connection reliability and the guarantee of the formation accuracy of the conductive pattern 13 described above.

  Furthermore, since the filler content of at least one layer of the conductor non-forming layer 15 is set higher than the filler content of at least one layer of the conductor forming layer 12, the Young of the conductor non-forming layer 15 The rate and the glass transition point can be increased, and as a result, the strength of the entire element body 11 can be improved.

  Furthermore, since the filler content of at least one layer of the conductor forming layer 12 is lower than the filler content of at least one layer of the conductor non-forming layer 15, the conductive pattern 13 and the element body 11 Therefore, it is possible to relieve the internal stress caused by the difference in the linear expansion coefficient, and it is possible to further improve the electrical connection reliability.

  In addition, as said filler, it is desirable that it is spherical shape and the particle system is 0.2 micrometer or less. By making it spherical, the applicability as a paste can be improved, and the productivity of the electronic component can be improved. In addition, by setting the grain system to 0.2 μm or less, even when the electronic component is formed by a photolithography process, the grain shape is sufficiently smaller than the wavelength of light to be exposed, so that adverse effects on exposure can be suppressed. It can be done.

  The electronic component of the present invention has an effect of improving electrical connection reliability, and is useful in various electronic devices such as mobile phones.

Sectional drawing of the electronic component in Embodiment 1 of this invention Sectional view of conventional electronic components

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Element body 12 Conductor formation layer 13 Conductive pattern 14 External electrode 15 Conductor non-formation layer

Claims (2)

With the body,
A conductive pattern embedded in a conductor forming layer in the element body;
An external electrode electrically connected to the conductive pattern and drawn out of the element body,
The element body includes the conductor forming layer and a conductor non-forming layer,
The electronic component which made the filler content rate of at least one layer in the said conductor non-formation layer higher than the filler content rate of at least one layer in the said conductor formation layer. The electronic component according to claim 1, wherein a particle system of the filler is 0.2 μm or less.

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