CN208798267U - A kind of printed circuit board and its electronic equipment - Google Patents
A kind of printed circuit board and its electronic equipment Download PDFInfo
- Publication number
- CN208798267U CN208798267U CN201820778146.2U CN201820778146U CN208798267U CN 208798267 U CN208798267 U CN 208798267U CN 201820778146 U CN201820778146 U CN 201820778146U CN 208798267 U CN208798267 U CN 208798267U
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- pad
- via hole
- printed circuit
- circuit board
- reinforcing
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Abstract
The utility model relates to printed circuit board technology field, a kind of printed circuit board and its electronic equipment are disclosed, wherein the printed circuit board includes: substrate and reinforces pad, the surface for reinforcing pad and being set to the substrate；The printed circuit board is provided with via hole, and the via hole is disposed through the reinforcing pad and extends to the substrate；The via hole connects the substrate and the reinforcing pad for filling ruggedized construction, the ruggedized construction.By the above-mentioned means, ruggedized construction connecting substrate and reinforcing pad, realize reinforcing pad and are not easy to separate with pedestal, improve the connection reliability for reinforcing pad and pedestal.
Description
[technical field]
The utility model relates to printed circuit board technology field more particularly to a kind of printed circuit boards and its electronic equipment.
[background technique]
During printed circuit board processing, circuit board surface is provided with pad, and the pad is provided with through described
The electroplating hole of pad, and the electroplating hole extends to the circuit board from the pad, and the pin of grafting component is contained in
In the electroplating hole, the pin and the pad are mutually fixed by welding, since grafting component volume compares
Big and quality is bigger, so pad is easy to fall off from circuit board.
The prior art is by the dispensing between grafting component and circuit board, to reinforce its reliability.
But inventor is in the process of implementing the utility model, the discovery prior art is imitated by the way that mode for dispensing glue is fixed
Fruit is not obvious, especially when doing reliability test, or in circuit board moving process generate collision when, be still easy to lead
Pad is caused to be fallen off to enable circuit board impaired by external force.Therefore, the prior art needs to improve.
[utility model content]
In order to solve the above-mentioned technical problem, the utility model embodiment provides a kind of printed circuit board and its electronic equipment,
Wherein the pad of the printed circuit board is not easy to fall off.
In order to solve the above-mentioned technical problem, the utility model embodiment the following technical schemes are provided:
On the one hand, a kind of printed circuit board is provided, comprising: substrate and reinforcing pad, the reinforcing pad are set to described
The surface of substrate；The printed circuit board is provided with via hole, and the via hole is set to the reinforcing pad, and extends to described
Substrate；The via hole connects the substrate and the reinforcing pad for filling ruggedized construction, the ruggedized construction.
In some embodiments, the substrate includes the first outer layer and internal layer, and first outer layer is bonded the internal layer and sets
It sets；The internal layer is provided with hot wind pad；The via hole runs through first outer layer, and hot gas welding described in the via hole face
Disk setting, the ruggedized construction are also connected with the hot wind pad.
In some embodiments, the printed circuit board is provided with electroplating hole, and the electroplating hole sequentially passes through the reinforcing
Pad, first outer layer and the hot wind pad；The hot wind pad includes around portion, interconnecting piece and main part；It is described
Electroplating hole runs through the circular portion, and the main part surrounds the circular portion, and the main part and the circular portion interval
Setting, one end of the interconnecting piece connect the circular portion, and the other end of the interconnecting piece connects the main part；The via hole
Interconnecting piece described in face, the ruggedized construction are also connected with the interconnecting piece.
In some embodiments, the quantity of the via hole is multiple, multiple via hole interval settings；The ruggedized construction
Including engaging portion and multiple reinforcing portions, multiple reinforcing portions extend the engaging portion；Each reinforcing portion fills one
The corresponding via hole, each reinforcing portion connect the substrate and the reinforcing pad；The engaging portion connection is described to be added
Gu pad deviates from the surface of the substrate.
In some embodiments, multiple via holes are circumferentially distributed around the central axes of the electroplating hole.
In some embodiments, the via hole includes interconnected the first via hole and the second via hole；First via hole
It is set on the substrate；Second via hole is arranged through the reinforcing pad；The ruggedized construction connects first mistake
The hole wall of the hole wall in hole and second via hole.
In some embodiments, the printed circuit board further includes solder pad, and the solder pad is set to the base
Plate is far from the one side for reinforcing pad；The printed circuit board is provided with electroplating hole, and the electroplating hole sequentially passes through described add
Gu pad, the substrate and solder pad setting, the inner wall of the electroplating hole are coated with the coat of metal, the coat of metal
One end connect the reinforcing pad, the other end of the coat of metal connects the solder pad.
In some embodiments, the quantity for reinforcing pad is two, and two reinforcing pads are set to the base
Two opposite faces of plate；The printed circuit board is provided with electroplating hole, and the electroplating hole sequentially passes through one of them described reinforcing weldering
Disk, the substrate and another described reinforcing pad setting, the inner wall of the electroplating hole are coated with the coat of metal, the metal-plated
The side of layer connects one of them described reinforcing pad, and the other side of the coat of metal connects another reinforcing pad.
In some embodiments, the axis parallel of the via hole is in the central axes of the electroplating hole.
On the other hand, a kind of electronic equipment, including printed circuit board as described above are provided.
Compared with prior art, in the printed circuit board and its electronic equipment of the utility model embodiment, institute
It states printed circuit board to include: substrate and reinforce pad, the reinforcing pad is set to the surface of the substrate；The printed circuit
Plate is provided with via hole, and the via hole is disposed through the reinforcing pad and extends to the substrate；The via hole is for filling out
Ruggedized construction is filled, the ruggedized construction connects the substrate and the reinforcing pad.By the above-mentioned means, ruggedized construction linker
Plate and reinforcing pad realize reinforcing pad and are not easy to separate with pedestal, improve the connection reliability for reinforcing pad and pedestal.
[Detailed description of the invention]
One or more embodiments are illustrated by corresponding attached drawing, these exemplary illustrations not structure
The restriction of pairs of embodiment, the element with same reference numbers label is expressed as similar element in attached drawing, unless there are special
It declares, composition does not limit the figure in attached drawing.
Fig. 1 is the diagrammatic cross-section of the utility model printed circuit board that wherein an embodiment provides；
Fig. 2 is the diagrammatic cross-section that printed circuit board shown in FIG. 1 is welded with grafting component；
Fig. 3 is the wire frame perspective view of printed circuit board shown in FIG. 1；
Fig. 4 is the diagrammatic cross-section of another implementation of printed circuit board shown in FIG. 1.
[specific embodiment]
For the ease of understanding the utility model, with reference to the accompanying drawings and detailed description, the utility model is carried out more
Detailed description.It should be noted that it can be directly in another element when element is expressed " being fixed on " another element
Upper or placed in the middle there may be one or more therebetween elements.When an element is expressed " connection " another element, it can
To be directly to another element or elements placed in the middle there may be one or more therebetween.This specification is used
Term "vertical", "horizontal", "left" and "right", "inner", "outside" and similar statement for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification and the skill for belonging to the utility model
The normally understood meaning of the technical staff in art field is identical.Term used in the description of the utility model is intended merely to
The purpose for describing specific embodiment is not intended to limitation the utility model.Term "and/or" packet used in this specification
Include any and all combinations of one or more related listed items.
Please refer to Fig. 1 and Fig. 2, a kind of the utility model printed circuit board 100 that wherein an embodiment provides, including substrate
10, pad 20 and solder pad 30 are reinforced.Wherein, the reinforcing pad 20 and the solder pad 30 are fixedly installed on institute
The surface of substrate 10 is stated, and the reinforcing pad 20 and the solder pad 30 are located at two opposite faces of the substrate 10.
The printed circuit board 100 is provided with electroplating hole 101 and via hole 102, the electroplating hole 101 and the via hole 102
Interval setting.
The electroplating hole 101 sequentially passes through the reinforcing pad 20, substrate 10 and the solder pad 30, the plating
Hole 101 is used to accommodate the pin 201 of grafting component 200.The hole wall of the electroplating hole 101 is covered with the coat of metal 1010, institute
The material for stating the coat of metal 1010 is identical as the reinforcing pad 20, the material of the solder pad 30, be electric conductivity compared with
Good material, preferably copper material.The coat of metal 1010 is tubular structure, and one end of the coat of metal 1010 connects institute
It states and reinforces pad 20, the other end of the coat of metal 1010 connects the solder pad 30.
It is understood that the coat of metal 1010, the solder pad 30 and the reinforcing pad 20 are described
Printed circuit board 100 is integrally formed when processing.
The via hole 102 is set to the reinforcing pad 20, and extends to the substrate 10, and the via hole 102 is used for
Ruggedized construction 300 is filled, the ruggedized construction 300 connects the substrate 10 and the reinforcing pad 20, so that the reinforcing is welded
Disk 20 connect relatively reliable with the substrate 10.The axis parallel of the via hole 102 is in the central axes of the electroplating hole 101.
The quantity of the via hole 102 be it is multiple, the setting of the multiple via holes 102 intervals, multiple via holes 102 are around the electroplating hole
101 central axes are circularly and evenly distributed, and make 300 uniform force of ruggedized construction in each via hole 102, improve described add
Gu the connection reliability of pad 20 and the substrate 10.In the present embodiment, the quantity of the via hole 102 is specially four.It can
With understanding, according to the actual situation, the via hole 102 can be set to other quantity, for example, one, two, three or
Four or more.
Each via hole 102 includes interconnected the first via hole 1020 and the second via hole 1022.
The substrate 10 is layer structure, including the first outer layer 11, internal layer 12 and the second outer layer 13, and the internal layer 12 connects
It is connected between first outer layer 11 and second outer layer 13.
First via hole 1020 is arranged through first outer layer 11.
The reinforcing pad 20 is set to first outer layer 11 away from 12 one side of internal layer, in the present embodiment, institute
Stating and reinforcing pad 20 is disc-shaped structure, it is to be understood that according to the actual situation, the reinforcing pad 20 can be other shapes
Shape, for example, it is rectangular, oval etc., and second via hole 1022 is arranged through the reinforcing pad 20.
Also referring to Fig. 3, the internal layer 12 is provided with hot wind pad 40, and the electroplating hole 101 runs through the hot gas welding
Disk 40 is arranged, and the coat of metal 1010 connects the hot wind pad 40, hot wind pad described in 1020 face of the first via hole
40 settings.The hot wind pad 40 includes around portion 41, interconnecting piece 42 and main part (not shown).The electroplating hole 101 passes through
It wears the circular portion 41 to be arranged, the circular portion 41, which surround and connects the coat of metal 1010, to be arranged；The main part surrounds
The circular portion 41 is arranged, and the main part and the circular interval of portion 41 are arranged；One end of the interconnecting piece 42 connects
The main part, the other end of the interconnecting piece 42 connect the circular portion 41, connect described in 1020 face of the first via hole
Portion 42 is arranged.
It is understood that most substrates 10 are multi-layer board, generally hot wind pad 40 can be set in the internal layer 12 of substrate 10,
Hot wind pad 40 is set, on the one hand in order to avoid the pin of grafting component 200 is connected directly with large area copper foil, and to weld
Pad heat dissipation is too fast in termination process, leads to failure welding；On the other hand, because in the electrical equipment course of work, since heat expansion is cold
Contracting leads to the copper foil telescopic action of internal layer, loads in hole wall, can make the connection of the coat of metal 1010 of the hole wall of electroplating hole 101
Strength reduction, and influence of this effect to the bonding strength of the coat of metal 1010 can be reduced using hot wind pad 40.
The ruggedized construction 300 fills the via hole 102, and the ruggedized construction 300 connects first via hole 1020
The hole wall of hole wall and second via hole 1022, so that the reinforcing pad 20 is not easy to separate with substrate 10.Further, institute
It states ruggedized construction 300 and connects the hole wall of first via hole 1020 and the interconnecting piece 42 of the hot wind pad 40.It is understood that
It is during grafting component 200 is welded on printed circuit board 100, to generally use wave-soldering or manual welding, weldering
Core wire in material, which is heated, is converted into liquid, and the core wire of liquid flows into via hole 102, and liquid core wire fills the first via hole 1020 and second
Via hole 1022, after the cooling period, core wire is converted into solid-state, forms the ruggedized construction 300, and ruggedized construction 300 connects the first via hole
The hole wall of 1020 hole wall and the second via hole 1022 is connect reliably so that reinforcing pad 20 with substrate 10, further, reinforces knot
Structure 300 connects the hole wall of the second via hole 1022 and the interconnecting piece 42 of hot wind pad 40, connect so that reinforcing pad 20 with substrate 10
It is relatively reliable.
The material of the ruggedized construction 300 is tin.It is understood that printed circuit board 100 is in wave-soldering or craft
When welding, core wire is mainly tin, and in a practical situation, core wire may be other materials, or reinforcing is formed using non-core wire
Structure 300, such as resin, lead etc..
The ruggedized construction 300 includes engaging portion 301 and multiple reinforcing portions 302, and multiple reinforcing portions 302 extend
In the engaging portion 301.The engaging portion 301 is connected to the surface that the reinforcing pad 20 deviates from the substrate 10.Each institute
It states reinforcing portion 301 and fills a corresponding via hole 102, each reinforcing portion 302 connects the hole wall of first via hole 1020
With the hole wall of second via hole 1022, and each reinforcing portion 302 far from the engaging portion 301 one end connection described in
The reinforcing portion 42 of hot wind pad 40.It is understood that the ruggedized construction 300 includes engaging portion 301 and multiple reinforcings
Portion 302, the engaging portion 301 make each reinforcing portion 302 be connected as an entirety, further make the reinforcing pad 20
Connection between the substrate 10 is relatively reliable.
The solder pad 30 is set to second outer layer 13 away from the one side for reinforcing pad 20, the grafting member
The main body 202 of device 200 is located at the ipsilateral of the substrate 10 with the solder pad 30.It is understood that the welding weldering
Disk 30 can be substituted with pad 20 is reinforced, and further increase the connective stability of pad Yu substrate 10.
It is understood that according to the actual situation, the main body 202 of the grafting component 200 can also be with the reinforcing
Pad 20 is located at the ipsilateral setting of the substrate 10.
Referring to Fig. 4, the quantity for reinforcing pad 20 is two, two reinforcings in some other embodiment
Pad 20 is set to two opposite faces of the substrate 10；The electroplating hole 101 sequentially pass through one of them described reinforcing pad 20,
The substrate 10 and another described reinforcing pad 20 are arranged, and one end of the coat of metal 1010 connects described in one of them
Pad 20 is reinforced, the other end of the coat of metal 1010 connects another reinforcing pad 20.
Another embodiment of the utility model provides a kind of electronic equipment, the printed circuit board 100 including previous embodiment.
Compared with prior art, the printed circuit board 100 is provided with via hole 102, and the via hole 102 is set to reinforcing
Pad 20, and the substrate 10 is extended to, the via hole 102 is for filling ruggedized construction 300,300 linker of ruggedized construction
Plate 10 and reinforcing pad 20 realize reinforcing pad 20 and are not easy to separate with substrate 10, improve and reinforce pad 20 and substrate 10
Connection reliability.
In addition, hot wind pad 40,300 reinforcement by connection pad 20 of ruggedized construction and heat is arranged in the internal layer 12 in the substrate 10
Wind pad 40 further improves the connection reliability for reinforcing pad 20 and substrate 10.
In addition, the quantity of via hole 102 be it is multiple, ruggedized construction 300 include engaging portion 301 and multiple reinforcing portions 302, each
The reinforcing portion 302 extends the engaging portion 301,301 reinforcement by connection pad 20 of engaging portion, and each reinforcing portion 20 fills one
Corresponding via hole 102, each 20 connecting substrate 10 of reinforcing portion and hot wind pad 40, further improve and reinforce pad 20 and substrate
10 connection reliability.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Under the thinking of the utility model, it can also be combined between the technical characteristic in above embodiments or different embodiments,
Step can be realized with random order, and there are many other variations of the different aspect of the utility model as described above, be
Simplicity, they do not provide in details；Although the utility model is described in detail with reference to the foregoing embodiments, this
The those of ordinary skill in field it is understood that it is still possible to modify the technical solutions described in the foregoing embodiments,
Or equivalent replacement of some of the technical features；And these are modified or replaceed, and do not make the sheet of corresponding technical solution
Matter departs from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. a kind of printed circuit board characterized by comprising substrate and reinforcing pad, the reinforcing pad are set to the base
The surface of plate；
The printed circuit board is provided with via hole, and the via hole is set to the reinforcing pad, and extends to the substrate；
The via hole connects the substrate and the reinforcing pad for filling ruggedized construction, the ruggedized construction.
2. printed circuit board according to claim 1, which is characterized in that the substrate includes the first outer layer and internal layer, institute
It states the first outer layer and is bonded the internal layer setting；
The internal layer is provided with hot wind pad；
The via hole runs through first outer layer, and hot wind pad described in the via hole face is arranged, and the ruggedized construction is also
Connect the hot wind pad.
3. printed circuit board according to claim 2, which is characterized in that the printed circuit board is provided with electroplating hole, institute
It states electroplating hole and sequentially passes through the reinforcing pad, first outer layer and the hot wind pad；
The hot wind pad includes around portion, interconnecting piece and main part；
The electroplating hole runs through the circular portion, and the main part surrounds the circular portion, and the main part and the ring
It is arranged around portion interval, one end of the interconnecting piece connects the circular portion, and the other end of the interconnecting piece connects the main part；
Interconnecting piece described in the via hole face, the ruggedized construction are also connected with the interconnecting piece.
4. printed circuit board according to any one of claims 1 to 3, which is characterized in that the quantity of the via hole be it is multiple,
Multiple via hole interval settings；
The ruggedized construction includes engaging portion and multiple reinforcing portions, and multiple reinforcing portions extend the engaging portion；
Each reinforcing portion fills a corresponding via hole, and each reinforcing portion connects the substrate and the reinforcing
Pad；
The engaging portion connects the surface that the reinforcing pad deviates from the substrate.
5. printed circuit board according to claim 3, which is characterized in that axis of multiple via holes around the electroplating hole
Line is circumferentially distributed.
6. printed circuit board according to any one of claims 1 to 3, which is characterized in that the via hole includes being interconnected
The first via hole and the second via hole；
First via hole is set on the substrate；
Second via hole is arranged through the reinforcing pad；
The ruggedized construction connects the hole wall of first via hole and the hole wall of second via hole.
7. printed circuit board according to claim 1 or 2, which is characterized in that the printed circuit board further includes welding weldering
Disk, the solder pad are set to the substrate far from the one side for reinforcing pad；
The printed circuit board is provided with electroplating hole, and the electroplating hole sequentially passes through the reinforcing pad, the substrate and institute
Solder pad setting is stated, the inner wall of the electroplating hole is coated with the coat of metal, and one end of the coat of metal connects the reinforcing weldering
The other end of disk, the coat of metal connects the solder pad.
8. printed circuit board according to claim 1 or 2, which is characterized in that it is described reinforce pad quantity be two, two
A two opposite faces reinforced pad and be set to the substrate；
The printed circuit board is provided with electroplating hole, and the electroplating hole sequentially passes through one of them described reinforcing pad, the base
Plate and another described reinforcing pad setting, the inner wall of the electroplating hole are coated with the coat of metal, the side of the coat of metal
One of them described reinforcing pad is connected, the other side of the coat of metal connects another reinforcing pad.
9. printed circuit board according to claim 3, which is characterized in that the axis parallel of the via hole is in the plating
The central axes in hole.
10. a kind of electronic equipment, which is characterized in that including the described in any item printed circuit boards of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820778146.2U CN208798267U (en) | 2018-05-23 | 2018-05-23 | A kind of printed circuit board and its electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820778146.2U CN208798267U (en) | 2018-05-23 | 2018-05-23 | A kind of printed circuit board and its electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN208798267U true CN208798267U (en) | 2019-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820778146.2U Active CN208798267U (en) | 2018-05-23 | 2018-05-23 | A kind of printed circuit board and its electronic equipment |
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| CN (1) | CN208798267U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996508A (en) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | Circuit board, manufacturing method thereof and electronic equipment |
| CN111315123A (en) * | 2020-02-26 | 2020-06-19 | 歌尔股份有限公司 | PCB and connecting structure of PCB and connector |
| CN113411953A (en) * | 2021-06-17 | 2021-09-17 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
| CN116709640A (en) * | 2022-12-26 | 2023-09-05 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
-
2018
- 2018-05-23 CN CN201820778146.2U patent/CN208798267U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996508A (en) * | 2019-12-26 | 2020-04-10 | 新华三技术有限公司合肥分公司 | Circuit board, manufacturing method thereof and electronic equipment |
| CN111315123A (en) * | 2020-02-26 | 2020-06-19 | 歌尔股份有限公司 | PCB and connecting structure of PCB and connector |
| CN113411953A (en) * | 2021-06-17 | 2021-09-17 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
| CN113411953B (en) * | 2021-06-17 | 2022-06-10 | 深圳佑驾创新科技有限公司 | Printed circuit board and packaging structure thereof |
| CN116709640A (en) * | 2022-12-26 | 2023-09-05 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
| CN116709640B (en) * | 2022-12-26 | 2024-04-26 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
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