CN210736196U - Solder paste flow-resisting electroplating lead and MEMS-MIC circuit board - Google Patents
Solder paste flow-resisting electroplating lead and MEMS-MIC circuit board Download PDFInfo
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- CN210736196U CN210736196U CN201920994490.XU CN201920994490U CN210736196U CN 210736196 U CN210736196 U CN 210736196U CN 201920994490 U CN201920994490 U CN 201920994490U CN 210736196 U CN210736196 U CN 210736196U
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- Prior art keywords
- connecting section
- circuit board
- solder paste
- paste flow
- lead
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 64
- 238000009713 electroplating Methods 0.000 title claims abstract description 30
- 239000000178 monomer Substances 0.000 claims abstract description 28
- 230000000903 blocking effect Effects 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 20
- 230000001154 acute effect Effects 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 35
- 239000006071 cream Substances 0.000 abstract description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 230000009194 climbing Effects 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Images
Abstract
The utility model belongs to the technical field of the circuit board, a solder paste choked flow electroplating lead and an MEMS-MIC circuit board are provided, wherein the solder paste choked flow electroplating lead comprises a first connecting section, a second connecting section and an intermediate connecting section, two ends of the intermediate connecting section are respectively connected with the first connecting section and the second connecting section at a preset angle, and one ends of the first connecting section and the second connecting section which are not connected with the intermediate connecting section are respectively connected with different circuit board monomers; and a solder paste flow blocking part is arranged on the middle connecting section. The utility model discloses tin cream flows between the circuit board monomer through electroplating the lead wire when can prevent reflow soldering to prevent that tin cream volume is uneven and climb the bad problem of tin.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically relates to a lead wire and MEMS-MIC circuit board are electroplated in tin cream choked flow.
Background
The MEMS-MIC (Micro Electro Mechanical Systems-Microphone) circuit board is an independent intelligent system, the size of the MEMS-MIC circuit board is several millimeters, the MEMS-MIC circuit board can be produced in a large scale, in order to realize current conduction of each circuit board monomer during electroplating when the MEMS-MIC circuit board is produced in a large scale, a plating material can be electroplated on all the circuit board monomers, and electroplating leads are designed among the circuit board monomers so as to electrically connect the circuit board monomers.
Fig. 1 is a schematic diagram of a plating lead between existing MEMS-MIC circuit board units, and as shown in fig. 1, annular pads are disposed on the outer periphery of the MEMS-MIC circuit board units, and a cross-shaped plating lead is connected between the pads of each circuit board unit, so as to electrically connect the circuit board units. The four right-angled vertices of the cross-shaped plating lead can be used as positioning reference points for the AOI (Automated Optical Inspection) process of the package. AOI is a device based on optical principles to detect common defects encountered in welding production.
When the MEMS-MIC is used for packaging the microphone unit, solder paste is required to be coated on the bonding pads on the periphery of the circuit board monomer, the shell of the microphone monomer is attached to the circuit board monomer, and then reflow soldering is carried out to realize the welding of the shell and the bonding pads of the microphone monomer.
However, the solder paste is easy to flow along the metal, and after the solder paste is coated on the solder pads on the periphery of the circuit board single bodies, the electroplating lead made of the metal material can cause the solder paste to flow among different circuit board single bodies through the electroplating lead, so that the problem of uneven amount of the solder paste is caused, and the microphone single body shell has poor tin climbing on the inner wall and the outer wall and has uneven tin paste.
Not only the MEMS-MIC Circuit Board unit has plated leads during mass production, but also other PCBs (Printed Circuit boards) having pads also have plated leads during mass production, and there is a problem that solder paste on the PCB pads flows to other PCB units along the plated leads.
Therefore, a need exists for a plated lead that can block the flow of solder paste between circuit board elements.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, it is an object of the present invention to provide a solder paste flow-resistant plating lead and a MEMS-MIC circuit board to prevent solder paste from flowing between circuit board cells through the plating lead during reflow soldering, thereby preventing the problems of non-uniformity of solder paste amount and poor solder-creep during the MEMS-MIC packaging process.
The utility model provides a solder paste choked flow electroplating lead, which comprises a first connecting section, a second connecting section and an intermediate connecting section, wherein two ends of the intermediate connecting section are respectively connected with the first connecting section and the second connecting section at preset angles, and one ends of the first connecting section and the second connecting section which are not connected with the intermediate connecting section are respectively connected with different circuit board monomers; and a solder paste flow blocking part is arranged on the middle connecting section.
Preferably, the solder paste flow resisting part is a solder mask layer covering the intermediate connecting section.
Preferably, the solder paste flow blocking portion is disposed at an intermediate position of the intermediate connection section.
Preferably, the solder paste flow-resisting part covers 1/3-3/4 of the length of the middle connecting section.
Preferably, the first connecting section and the second connecting section have the same length.
Preferably, the first connecting section and the second connecting section are parallel.
Preferably, the first connecting section and the second connecting section are parallel and equal in length.
Preferably, the predetermined angle is a right angle, an obtuse angle, or an acute angle.
The utility model also provides a MEMS-MIC circuit board, be in including circuit board body, setting circuit board monomer on the circuit board body and connection electroplate the lead wire between the circuit board monomer, it electroplates the lead wire for foretell tin cream choked flow to electroplate the lead wire.
From the above description, the utility model provides a lead wire is electroplated in tin cream choked flow has tin cream choked flow portion, and the tin cream flows between the circuit board monomer through electroplating the lead wire when can eliminating reflow soldering to the inhomogeneous and bad problem of tin climbing of tin cream volume that arouses, the location datum point that the junction angle of the intermediate junction section of electroplating the lead wire simultaneously and first linkage section, second linkage section can regard as the AOI process.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description and appended claims, taken in conjunction with the accompanying drawings.
In the drawings:
FIG. 1 is a schematic diagram of plated leads between MEMS-MIC circuit board cells in the prior art;
FIG. 2 is a schematic view of a solder paste flow-impeding electroplating lead according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a solder paste flow-impeding plated lead of the first embodiment;
FIG. 4 is an enlarged view of a solder paste flow-impeding plating lead according to a second embodiment of the present invention;
FIG. 5 is an enlarged view of a solder paste flow-impeding plating lead according to a third embodiment of the present invention;
wherein: 1-electroplating lead, 2-solder paste flow resisting part, 3-circuit board monomer, 4-bonding pad, 11-first connecting section, 12-second connecting section and 13-middle connecting section.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
Example one
Fig. 2 is a schematic structural view of a solder paste flow-resisting electroplating lead according to an embodiment of the present invention.
As shown in fig. 2, the solder paste flow-blocking electroplating lead 1 provided in this embodiment includes a first connecting section 11, a second connecting section 12 and an intermediate connecting section 13, wherein two ends of the intermediate connecting section 13 are respectively connected with the first connecting section 11 and the second connecting section 12 at a predetermined angle, and ends of the first connecting section 11 and the second connecting section 12, which are not connected with the intermediate connecting section 13, are respectively connected with different circuit board units 3; and, a solder paste flow blocking portion 2 is provided on the intermediate connection section 13.
Fig. 3 is an enlarged view of the solder paste flow-impeding plated lead provided in this embodiment.
As shown in fig. 3, the solder resist portion 2 may be a solder resist layer covering the intermediate connection section 13, a solder resist layer is formed on or coated on the intermediate connection section 13 to form the solder resist layer as the solder resist portion 2, the solder resist layer may be disposed at a middle position of the intermediate connection section 13, but is not limited to the middle position of the intermediate connection section 13, and may cover 1/3-3/4 of the length of the intermediate connection section 13, but cannot cover the entire intermediate connection section 13, and a connection angle between two ends of the intermediate connection section 13 and the first connection section 11 and the second connection section 13 is set aside to be a reference point for positioning in the AOI process.
In the present embodiment, the first connecting section 11 and the second connecting section 12 have the same length and are parallel, but the lengths of the first connecting section 11 and the second connecting section 12 are not limited to the same length and the first connecting section 11 and the second connecting section 12 are not limited to the parallel.
The predetermined angles between the first connecting section 11, the second connecting section 12 and the intermediate connecting section 13 are all right angles.
After coating tin cream on the pad 4 of circuit board monomer 3 periphery, when tin cream flows along electroplating lead 1, tin cream choked flow portion 2 in this embodiment can prevent that tin cream from continuing to flow at electroplating lead 1, avoided because of the circulation of the tin cream that electroplating lead 1 arouses between circuit board monomer 3, the inhomogeneous and bad problem of climbing tin of tin cream volume that leads to. The vertex of the right angle formed by the first connecting section 11 and the middle connecting section 13 and the vertex of the right angle formed by the second connecting section 12 and the middle connecting section 13 can be used as the AOI process positioning datum points of the shell package.
Example two
Fig. 4 is an enlarged view of a solder paste flow-impeding plating lead according to a second embodiment of the present invention.
As shown in fig. 4, in the first embodiment, the predetermined angles between the first connecting section 11, the second connecting section 12 and the intermediate connecting section 13 are all obtuse angles.
After coating tin cream on the pad 4 of circuit board monomer 3 periphery, when tin cream flows along electroplating lead 1, tin cream choked flow portion 2 in this embodiment can prevent that tin cream from continuing to flow at electroplating lead 1, avoided because of the circulation of the tin cream that electroplating lead 1 arouses between circuit board monomer 3, the inhomogeneous and bad problem of climbing tin of tin cream volume that leads to. The vertex of the obtuse angle formed by the first connecting section 11 and the middle connecting section 13 and the vertex of the obtuse angle formed by the second connecting section 12 and the middle connecting section 13 can be used as the positioning reference points of the AOI process of the shell packaging.
EXAMPLE III
Fig. 5 is an enlarged view of a solder paste flow-impeding plating lead according to a third embodiment of the present invention.
As shown in fig. 5, in the first embodiment, the predetermined angles between the first connecting section 11, the second connecting section 12 and the intermediate connecting section 13 are all acute angles.
After coating tin cream on the pad 4 of circuit board monomer 3 periphery, when tin cream flows along electroplating lead 1, tin cream choked flow portion 2 in this embodiment can prevent that tin cream from continuing to flow at electroplating lead 1, avoided because of the circulation of the tin cream that electroplating lead 1 arouses between circuit board monomer 3, the inhomogeneous and bad problem of climbing tin of tin cream volume that leads to. The vertex of the acute angle formed by the first connecting section 11 and the middle connecting section 13 and the vertex of the acute angle formed by the second connecting section 12 and the middle connecting section 13 can be used as the positioning reference points of the AOI process of the shell packaging.
Example four
The embodiment provides a plating lead between single MEMS-MIC circuit boards, which comprises the solder paste flow-resisting plating lead in any one of the first embodiment, the second embodiment or the third embodiment.
After the solder paste is coated on the solder pads 4 on the periphery of the MEMS-MIC circuit board monomer 3, the solder paste flows along the electroplating lead 1, the solder paste flow resisting part 2 in the embodiment can prevent the solder paste from continuously flowing on the electroplating lead 1, and the problems of uneven solder paste amount and poor solder climbing of the packaging shell caused by the circulation of the solder paste between the circuit board monomers 3 due to the electroplating lead 1 are avoided. The vertex of the angle formed by the first connecting section 11 and the middle connecting section 13 and the vertex of the angle formed by the second connecting section 12 and the middle connecting section 13 can be used as the positioning reference points of the AOI process of the shell packaging.
EXAMPLE five
The embodiment provides an MEMS-MIC circuit board, which includes a circuit board body, circuit board monomers 3 disposed on the circuit board body, and plating leads 1 connected between the circuit board monomers 3, wherein the plating leads 1 are the solder paste flow-blocking plating leads described in the above embodiments. The structure of the solder paste flow-resistant plating lead has been described in detail above, and thus will not be described herein.
Can find out through above-mentioned technical scheme, the utility model provides a lead wire is electroplated in tin cream choked flow can solve for a long time so that the tin cream on the circuit board pad easily flows to the problem of other circuit board pads along electroplating the lead wire in welding process.
The solder paste flow-resistant plated lead and the MEMS-MIC circuit board according to the present invention are described above by way of example with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that various modifications may be made to the solder paste flow-resistant plated leads and MEMS-MIC circuit board as set forth above without departing from the scope of the invention. Therefore, the scope of the present invention should be determined by the content of the appended claims.
Claims (9)
1. A solder paste flow-resisting electroplating lead is characterized by comprising a first connecting section, a second connecting section and an intermediate connecting section, wherein two ends of the intermediate connecting section are respectively connected with the first connecting section and the second connecting section at a preset angle, and the ends of the first connecting section and the second connecting section, which are not connected with the intermediate connecting section, are respectively connected with different circuit board monomers; and a solder paste flow blocking part is arranged on the middle connecting section.
2. The solder paste flow-resistant plated lead of claim 1, wherein the solder paste flow-resistant portion is a solder resist layer overlying the intermediate connection section.
3. The solder-paste flow-impeding plating lead of claim 1, in which the solder-paste flow-impeding portion is disposed at an intermediate position of the intermediate connection section.
4. The solder paste flow-resistant plated lead of claim 1, wherein the solder paste flow-resistant portion wraps 1/3-3/4 of the length of the intermediate connection section.
5. The solder paste flow-resistant plated lead of claim 1, wherein the first and second connection sections are the same length.
6. The solder paste flow-resistant plated lead of claim 1, wherein the first and second connection sections are parallel.
7. The solder paste flow-resistant plated lead of claim 1, wherein the first and second connection sections are parallel and equal in length.
8. The solder paste flow-resistant plated lead of claim 1, wherein the predetermined angle is a right angle, an obtuse angle, or an acute angle.
9. An MEMS-MIC circuit board, comprising a circuit board body, circuit board monomers arranged on the circuit board body and plating leads connected between the circuit board monomers, wherein the plating leads are the solder paste flow-resisting plating leads according to any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920994490.XU CN210736196U (en) | 2019-06-28 | 2019-06-28 | Solder paste flow-resisting electroplating lead and MEMS-MIC circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920994490.XU CN210736196U (en) | 2019-06-28 | 2019-06-28 | Solder paste flow-resisting electroplating lead and MEMS-MIC circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210736196U true CN210736196U (en) | 2020-06-12 |
Family
ID=70988909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920994490.XU Active CN210736196U (en) | 2019-06-28 | 2019-06-28 | Solder paste flow-resisting electroplating lead and MEMS-MIC circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210736196U (en) |
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2019
- 2019-06-28 CN CN201920994490.XU patent/CN210736196U/en active Active
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Effective date of registration: 20200810 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |