CN217406827U

CN217406827U - Wave soldering jig

Info

Publication number: CN217406827U
Application number: CN202220769823.0U
Authority: CN
Inventors: 蔡国森; 陈婉蓉; 肖玉根
Original assignee: Xiamen Hualian Electronics Co Ltd
Current assignee: Xiamen Hualian Electronics Co Ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-09-09
Anticipated expiration: 2032-04-02

Abstract

The utility model discloses a wave-soldering tool, including the tray body, be provided with the fixed position of PCB board on the tray body, the side position department that corresponds the fixed position of PCB board in tray body bottom is provided with the tinplate that drags the tin usefulness, and the tinplate is through the screw fixation who attaches from the bottom lock on the tray body. The utility model discloses a tinplate is through the screw lock solid that attaches from the bottom lock on the tray body bottom, compare in prior art's tinplate inlay in the tray body top and utilize the screw that attaches from the top lock to carry out the mode of lock solid, can effectively keep away PCB board and tinplate direct contact, be separated by tray body's synthetic stone part between PCB board and the tinplate, therefore, in welding process, can not have the tinplate and lead to the copper foil of PCB board bottom and the condition that the tinplate glues together to appear because of gluing the tin defect, can improve the production quality of PCB board product greatly.

Description

Wave soldering jig

Technical Field

The utility model relates to a PCB board manufacture equipment technical field, concretely relates to wave-soldering tool.

Background

In electronic manufacturing industry, in order to accelerate soldering efficiency of PCB products, wave soldering equipment is basic soldering equipment. The welding principle of the wave-soldering equipment is that the surging wave is adopted as a welding source. Various welding defects inevitably occur, and particularly, a short-circuit defect after welding is prominent. Therefore, higher requirements are also put on the design of the PCB circuit, and the PCB design needs to be ensured to be designed according to the manufacturability design principle of wave soldering. However, as the products are more and more integrated and miniaturized, the design of the PCB is smaller and smaller, and no redundant space is available on the PCB for placing solder pads and the like. At present, as shown in fig. 3 and 4, a tin plate is disposed on a tray body of a conventional wave soldering jig, and is used for replacing a function of dragging a tin soldering tray, and the tin plate has a tensile force and a traction force on tin liquid greater than those of copper foil, so that after tin is dragged to a last row of soldering points, redundant tin liquid is dragged away by the tin plate. The tinplate is made of a tinning material, one surface (bottom surface) contacting with tin liquid needs to be polished to be a bright surface to expose silvery white essential metal, and the other surface (top surface) directly contacts with the surface of the PCB board, so the top surface of the tinplate is usually coated with a corrosion-resistant and high-temperature-resistant coating to protect the tinplate, and a certain gap (approximately the thickness of a nut) exists between the PCB board and the tinplate during welding because a wave soldering jig is corroded by a flux and baked at high temperature in a wave soldering tin furnace during use, and because the nut part of a screw locked from the top cannot sink into the tinplate due to size problems, the coating is easy to corrode and fall off after the tinplate is used for a long time due to frequent permeation corrosion of the flux, and finally the tinplate metal material capable of being sticky in the tinplate is exposed to generate a tinsticky defect, in the welding process, the PCB is easy to adhere to the test points (copper foils) at the bottom of the PCB, and when the PCB is directly taken out, a tinplate can exist to pull out the test points, so that the PCB product is finally scrapped under the condition that operators in the subsequent process do not perceive the test points.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a wave-soldering tool, it mainly solves is that current wave-soldering tool drops because of tinplate cladding material easily and makes and lead to the useless technical problem of PCB board newspaper easily in welding process.

In order to achieve the purpose, the utility model is realized by the following technical proposal:

the utility model provides a wave-soldering tool, includes the tray body, is provided with the fixed position of PCB board on the tray body, and the side position department that corresponds the fixed position of PCB board in tray body bottom is provided with the tinplate that drags the tin and use, and the tinplate is through the screw fixation who attaches from the bottom lock on the tray body.

Furthermore, the bottom of the tray body is provided with an inclined plane corresponding to the side edge position of the PCB fixing position, and the tinplate is tightly attached to the inclined plane and fixed on the inclined plane through screws locked from the bottom.

Furthermore, the tinplate is of a rectangular block structure and is obliquely locked on the inclined plane at the bottom of the tray body through screws.

Furthermore, the included angle between the tinplate tightly attached to the inclined plane and the horizontal plane is 10-30 degrees.

Further, the top surface side of tinplate and the inclined plane laminating is coated with a high temperature resistant and corrosion resistant plating layer, and the bottom surface side of the tinplate is polished to form a bright surface for contacting molten tin.

Further, the plating layer coated on the top surface side of the tin plate is a black teflon plating layer.

Furthermore, be provided with six PCB board fixed position on the tray body, and correspond the side position department of each PCB board fixed position and all set up and be equipped with a tinplate in tray body bottom.

The technical scheme has the following advantages or beneficial effects:

wave-soldering tool in, drag the tinplate of tin usefulness through the screw lock solid that attaches from the bottom lock on tray body bottom, compare in prior art's tinplate inlay in tray body top and utilize the screw that attaches from the top lock to carry out the mode of lock solid, can effectively keep away PCB board and tinplate direct contact, be separated by tray body's synthetic stone part between PCB board and the tinplate, therefore, in welding process, can not have the tinplate because of gluing the tin defect and lead to the copper foil of PCB board bottom and the condition that the tinplate glued together to appear, can improve the production quality of PCB board product greatly.

Drawings

Fig. 1 is a schematic perspective view of a wave soldering fixture according to an embodiment of the present invention.

Fig. 2 is a schematic view of another angle of the wave soldering jig according to the embodiment of the present invention.

Fig. 3 is a schematic perspective view of a wave soldering fixture in the prior art.

Fig. 4 is a schematic perspective view of another angle of a wave soldering fixture in the prior art.

Description of reference numerals:

1. the tray body, 2, tinplate, 3, screw, 11, PCB board fixed position, 12, inclined plane.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1 and 2, an embodiment of the present invention provides a wave soldering jig, including a tray body 1, a PCB fixing position 11 is provided on the tray body 1, a tinplate 2 for dragging tin is provided at a side position corresponding to the PCB fixing position 11 at the bottom of the tray body 1, and the tinplate 2 is fixed on the tray body 1 through a screw 3 locked from the bottom. It can be understood that, in this embodiment, the tinplate 2 for dragging tin is locked on the bottom of the tray body 1 through the screw 3 locked from the bottom, compared with the way that the tinplate in the prior art is embedded on the top of the tray body and locked by the screw locked from the top, the direct contact between the PCB board and the tinplate 2 can be effectively avoided, and the PCB board and the tinplate 2 are separated by the synthetic stone part of the tray body 1, so that, in the welding process, the situation that the copper foil at the bottom of the PCB board is bonded with the tinplate 2 due to the defect of tin bonding of the tinplate 2 does not occur, and the production quality of the PCB board product can be greatly improved.

Referring to fig. 1 and 2, in a preferred embodiment, an inclined surface 12 is formed at a position corresponding to a side edge of the PCB fixing position 11 at the bottom of the tray body 1, and the tinplate 2 is tightly attached to the inclined surface 12 and fixed on the inclined surface 12 by a screw 3 locked from the bottom. In this embodiment, preferably, the tinplate 2 is in a rectangular block structure, and the tinplate 2 is locked on the inclined surface 12 of the bottom of the tray body 1 obliquely by the screw 3. It can be understood that, in this embodiment, the inclined surface 12 corresponding to the side edge position of the PCB fixing position 11 is disposed at the bottom of the tray body 1, and then the tinplate 2 is locked on the inclined surface 12 in an inclined manner, so that the inclined tinplate 2 can generate a tin dragging effect better in the welding process, thereby improving the welding quality of the PCB.

Referring to fig. 1 and fig. 2, in a preferred embodiment, the angle between the tinplate 2 tightly attached to the inclined surface 12 and the horizontal plane is 10-30 °. In this embodiment, the angle between the tinplate 2 tightly attached to the inclined surface 12 and the horizontal plane is preferably 15 °. However, those skilled in the art will appreciate that in other embodiments, the angle of inclination of the tinplate 2 is not limited to the specific embodiment disclosed in the present embodiment, and other angles of inclination are also possible.

Referring to fig. 1 and 2, in a preferred embodiment, a top surface side of the tinplate 2 attached to the inclined surface 12 is coated with a high-temperature-resistant and corrosion-resistant coating, and a bottom surface side of the tinplate 2 is polished to form a bright surface for contacting molten tin. In the present embodiment, the plating layer applied on the top face side of the tinplate 2 is preferably a black teflon plating layer. It can be understood that, by coating the plating layer with high temperature resistance and corrosion resistance on the top surface of the tinplate 2, the tinplate 2 can be better ensured not to have tin-sticking defect in the welding process, and even if the plating layer of the tinplate 2 falls off due to long-term use, the tinplate 2 is assembled at the bottom of the tray body 1, and as mentioned above, the tinplate is difficult to stick with the copper foil at the bottom of the PCB board.

Referring to fig. 1 and 2, in a preferred embodiment, six PCB fixing positions 11 are disposed on the tray body 1, and a tinplate 2 is disposed at a position corresponding to a side edge of each PCB fixing position 11 at the bottom of the tray body 1. However, it should be understood by those skilled in the art that in other embodiments, other numbers of PCB fixing positions 11 may be disposed on the tray body 1, and the number of PCB fixing positions 11 on the tray body 1 may be specifically set by those skilled in the art according to specific needs.

The above-mentioned embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; these modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention, and therefore all other embodiments obtained by those skilled in the art without making creative efforts fall within the protection scope of the present invention.

Claims

1. The utility model provides a wave-soldering tool which characterized in that: the tin-dragging tray comprises a tray body (1), wherein a PCB fixing position (11) is arranged on the tray body (1), a tinplate (2) for dragging tin is arranged at the position of the side edge of the bottom of the tray body (1) corresponding to the PCB fixing position (11), and the tinplate (2) is fixed on the tray body (1) through a screw (3) locked from the bottom.

2. The wave soldering jig according to claim 1, characterized in that: the bottom of the tray body (1) is provided with an inclined plane (12) corresponding to the side edge position of the PCB fixing position (11), and the tinplate (2) is tightly attached to the inclined plane (12) and fixed on the inclined plane (12) through a screw (3) locked from the bottom.

3. The wave soldering jig according to claim 2, characterized in that: the tinplate (2) is of a rectangular block structure, and the tinplate (2) is obliquely locked on the inclined plane (12) at the bottom of the tray body (1) through the screw (3).

4. The wave soldering jig according to claim 3, characterized in that: the angle between the tinplate (2) tightly attached to the inclined plane (12) and the horizontal plane is 10-30 degrees.

5. The wave soldering jig according to claim 2, characterized in that: the top surface side of the tinplate (2) attached to the inclined plane (12) is coated with a high-temperature-resistant and corrosion-resistant coating, and the bottom surface side of the tinplate (2) is polished to form a bright surface for contacting molten tin.

6. The wave soldering jig according to claim 5, characterized in that: the plating layer coated on the top surface side of the tinplate (2) is a black teflon plating layer.

7. The wave soldering jig according to any one of claims 1 to 6, characterized in that: six PCB fixing positions (11) are arranged on the tray body (1), and a tinplate (2) is arranged at the position of the side edge of the bottom of the tray body (1) corresponding to each PCB fixing position (11).