CN109195353A - Printed circuit board, electronic equipment and its production technology - Google Patents
Printed circuit board, electronic equipment and its production technology Download PDFInfo
- Publication number
- CN109195353A CN109195353A CN201811081479.0A CN201811081479A CN109195353A CN 109195353 A CN109195353 A CN 109195353A CN 201811081479 A CN201811081479 A CN 201811081479A CN 109195353 A CN109195353 A CN 109195353A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- supporting element
- attachment area
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The embodiment of the invention provides a kind of printed circuit board, electronic equipment and its production technologies, are related to electronic technology field.The printed circuit board is used for mount electronic device, which includes plate body and multiple supporting elements.Wherein, the attachment area for mount electronic device is provided on plate body.Multiple supporting elements are mounted on attachment area, are used to support electronic device.Printed circuit board, electronic equipment and its production technology provided in an embodiment of the present invention pass through supports support electronic device, electronic device can be effectively improved in attachment due to being flattened the problem of soldered ball causes even tin by high temperature deformation, and supporting element will not influence the attachment of electronic device.In addition, supporting element is mounted on attachment area, automatic mass can be realized, improve the anti-pressure ability of electronic device in an assembling process.
Description
Technical field
The present invention relates to electronic technology fields, in particular to a kind of printed circuit board, electronic equipment and its production work
Skill.
Background technique
With the development of product, welded ball array encapsulates the function of (Ball Grid Array, BGA) integrated chip increasingly
Complexity, so that the size and weight of bga chip are increasing, the assembling processing of bga chip package dimension to become larger to bga chip
Bring huge challenge.For example, the thermal deformation of bga chip at high temperature may flatten soldered ball, soldered ball is caused to connect tin
Problem.
Summary of the invention
One of the objects of the present invention is to provide a kind of printed circuit boards, can be effectively improved electronic device in attachment
Due to being flattened the problem of soldered ball causes even tin by high temperature deformation.
Another object of the present invention is to provide a kind of electronic equipment, can be effectively improved electronic device in attachment by
The problem of connecting tin is caused in being flattened soldered ball by high temperature deformation.
Another object of the present invention is to provide the production technology of a kind of electronic equipment, electronic device can be effectively improved
In attachment due to being flattened the problem of soldered ball causes even tin by high temperature deformation.
The embodiment of the present invention is achieved in that
A kind of printed circuit board is used for mount electronic device, and the printed circuit board includes plate body and multiple supporting elements, institute
The attachment area being provided on plate body for mounting the electronic device is stated, the multiple supporting element is mounted on the attachment area, uses
In the support electronic device.
Further, multiple support pads are provided in the attachment area, one end of the multiple supporting element corresponds
Ground and the multiple support pad solder, the other end are used to support the electronic device.
Further, the supporting element includes matrix, and the surface of described matrix is coated with weld material layer, and described matrix passes through
The weld material layer and the support pad solder.
Further, described matrix is made of copper, aluminium or ceramics.
Further, multiple soldered ball settings area is provided in the attachment area, the multiple soldered ball setting area is used for and institute
It states the soldered ball on electronic device and corresponds welding, the supporting element is set between the multiple soldered ball setting area or described
Mount the corner location in area.
Further, the height of the supporting element is 0.4~0.6 times of the height of the soldered ball.
Further, center line of the multiple supporting element along the attachment area is symmetrical.
The embodiments of the present invention also provide a kind of electronic equipment, including electronic device and printed circuit board, the printings
Circuit board includes plate body and multiple supporting elements, and the attachment area for mounting the electronic device is provided on the plate body, described
Multiple supporting elements are mounted on the attachment area, are used to support the electronic device.The electronic device is mounted on the attachment area,
The multiple supporting element is bonded with the electronic device, to support the electronic device.
The embodiments of the present invention also provide the production technologies of a kind of electronic equipment, comprising:
The deposit weld material on multiple support pads in the attachment area of plate body；
Multiple supporting elements are mounted on the multiple support pad correspondingly；
Electronic device is mounted on the attachment area, is bonded the multiple supporting element with the electronic device, with support
The electronic device.
Further, described that electronic device is mounted on the attachment area, make the multiple supporting element and the electronics device
Part fitting, to support electronic device the step of include:
The electronic device is mounted on the attachment area, is made in soldered ball and the attachment area on the electronic device
Multiple soldered ball settings area corresponds；
The multiple soldered ball is heated, so that the multiple soldered ball melts, so that the electronic device is in self gravitation effect
Lower and the multiple ball bond, and fit in the multiple supporting element.
The beneficial effect of printed circuit board provided in an embodiment of the present invention, electronic equipment and its production technology includes: to pass through
Multiple supports support electronic devices, such as bga chip is supported, thus be effectively improved electronic device in attachment due to
The problem of soldered ball causes even tin is flattened by high temperature deformation, and supporting element will not influence the attachment of electronic device.In addition, multiple
Supporting element is mounted on attachment area, can be realized automatic mass, improves the anti-pressure ability of electronic device in an assembling process.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of printed circuit board provided in an embodiment of the present invention and electronic device, wherein electronic device
It is mounted in attachment area；
Fig. 2 is another structural schematic diagram of printed circuit board provided in an embodiment of the present invention and electronic device, wherein electronics
Device is in the state before being mounted on attachment area；
Fig. 3 is the structural schematic diagram in the attachment area of printed circuit board provided in an embodiment of the present invention；
Fig. 4 is the partial sectional structural schematic diagram of the supporting element of printed circuit board provided in an embodiment of the present invention；
Fig. 5 is the flow chart of the production technology for the printed circuit board that one embodiment of the invention provides；
Fig. 6 be another embodiment of the present invention provides electronic equipment production technology flow chart；
Fig. 7 is the sub-step flow chart of step S300 in Fig. 6.
Icon: 10- printed circuit board；20- electronic device；100- plate body；110- mounts area；120- supports pad；130-
Area is arranged in soldered ball；200- supporting element；210- matrix；220- weld material layer；300- soldered ball.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it is to be understood that, the orientation or position of the instructions such as term " on ", "lower", "inner", "outside"
Set relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when the orientation or position usually put
Set relationship or orientation or positional relationship that those skilled in the art usually understand, be merely for convenience of the description present invention and
Simplify description, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, with specific orientation construction
And operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, it is not understood to indicate or imply
Relative importance.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
Referring to Fig. 1, present embodiments providing a kind of printed circuit board 10, it is applied to electronic equipment.The electronic equipment can
To be communication apparatus, server or storage equipment etc..The electronic equipment includes electronic device 20 and printed circuit board 10.Its
In, electronic device 20 is mounted on printed circuit board 10, is mounted for example, being automated by patch device.Electronic device 20 can be with
The device encapsulated for bga chip etc. using soldered ball 300.In the present embodiment, soldered ball 300 is provided on electronic device 20.The printing
Circuit board 10 can be effectively improved electronic device 20 and be asked in attachment due to being flattened 300 company's of causing tin of soldered ball by high temperature deformation
Topic.
Fig. 1 and Fig. 2 are please referred to, which includes plate body 100 and multiple supporting elements 200.It is arranged on plate body 100
There is the attachment area 110 for mount electronic device 20, multiple supporting elements 200 are mounted on attachment area 110, are used to support electronic device
20。
It should be noted that multiple supporting elements 200 are mounted on attachment area 110, wherein attachment refers to using surface mount skill
Device is attached to the surface of carrier by art, for example, can using with electronic device 20 mount it is similar by the way of, using patch device
Supporting element 200 is automatically mounted on attachment area 110.In addition, attachment area 110 is to be used for mount electronic device on plate body 100
20 region, shapes and sizes are matched with electronic device 20, and optionally, attachment area 110 is rectangle.Supporting element 200 is mounted on
Area 110 is mounted, in this way, supporting element 200 can play branch to electronic device 20 after electronic device 20 is mounted on attachment area 110
Support effect.
By multiple supporting elements 200 support electronic device 20, can be effectively improved electronic device 20 attachment when due to by
High temperature deformation and the problem of flatten 300 company's of causing tin of soldered ball, and supporting element 200 will not influence the attachment of electronic device 20.Separately
Outside, supporting element 200 is mounted on attachment area 110, can be realized automatic mass, improves in an assembling process anti-of electronic device 20
Pressure energy power.
Referring to Fig. 3, further, mount and be provided with multiple support pads 120 in area 110, the one of multiple supporting elements 200
End is welded with multiple support pads 120 correspondingly, and the other end is used to support electronic device 20.It should be appreciated that support pad
120 correspond with supporting element 200, that is to say, that one supporting element 200 of corresponding welding on a support pad 120.
In the present embodiment, support pad 120 etches formation on the panel body 100.When mounting supporting element 200, using steel mesh
Layer, support pad 120 on deposit weld material, can the bottom by way of print solder paste with supporting element 200 be welded on
Together.
In addition, being provided with multiple soldered ball settings area 130 in attachment area 110, multiple soldered ball settings area 130 is used for and electronics device
Soldered ball 300 on part 20 corresponds welding.Supporting element 200 is set between multiple soldered ball settings area 130 or attachment area 110
Corner location.In the present embodiment, multiple soldered ball setting 130 rectangular arrays of area are arranged, so that soldered ball 300 is in rectanglar arrangement,
The distributed areas in multiple soldered ball settings area 130 are located at the central area in attachment area 110.Supporting element 200 can be set in multiple welderings
Ball be arranged area 130 between gap in, can be effectively improved in this way electronic device 20 attachment when thermal deformation and flatten and mount
The problem of corresponding soldered ball 300 of 110 central region of area causes the middle part soldered ball 300 of electronic device 20 to connect tin；Also can be set in
The corner location in entire attachment area 110, can be effectively improved in this way electronic device 20 in attachment thermal deformation and flatten and mount
The problem of corresponding soldered ball 300 of 110 fringe region of area causes the fringe region soldered ball 300 of electronic device 20 to connect tin；Furthermore it is possible to
In gap between multiple soldered balls setting area 130 and supporting element 200 is arranged in the corner location in attachment area 110 simultaneously.
Center line of multiple supporting elements 200 along attachment area 110 is symmetrical, is capable of the weight of balance electronic device 20 in this way
Amount.In the present embodiment, supporting element 200 is eight, wherein four supporting elements 200 are in rectanglar arrangement and are set to multiple soldered balls and set
It sets in the gap between area 130；Other four supporting element 200 is respectively arranged at four corner locations in attachment area 110.
Referring to Fig. 4, further, supporting element 200 includes matrix 210.The surface of matrix 210 is coated with weld material layer
220.Matrix 210 is welded by weld material layer 220 and support pad 120.That is, the surface of matrix 210 is with solderable
Property.Matrix 210 does not melt in welding itself, and the support effect of supporting element 200 can be improved, and improves electronic device 20 and is assembling
In anti-pressure ability.Optionally, matrix 210 can be using melting temperatures such as copper, aluminium or ceramics not less than solder melt point temperature
Material is made.
It should be appreciated that material selected by matrix 210 and being not especially limited, as long as not melting i.e. in welding itself
It can.When electronic device 20 welds, because matrix 210 itself does not melt, when soldered ball 300 melts collapsing, can support
The weight of electronic device 20 prevents because 300 be collapsed of soldered ball is connected tin by the gravity of electronic device 20.
Supporting element 200 is whole to be in the form of a column structure, preferably to support electronic device 20.The cross sectional shape of supporting element 200 is simultaneously
It is not especially limited, can be round, rectangular or other shapes.
Please continue to refer to Fig. 1 and Fig. 2, in addition, the height of supporting element 200 is the height after electronic device 20 welds, it is different
Electronic device 20 welding and assembling height it is different, therefore, the height of supporting element 200 is simultaneously not especially limited.Further, supporting element
200 height is less than the height of soldered ball 300.It should be appreciated that " height of soldered ball 300 " referred herein refers to soldered ball before welding
300 height, i.e., the height of the soldered ball 300 before heating and melting.Optionally, the height of supporting element 200 is the height of soldered ball 300
0.4~0.6 times, in this way when electronic device 20 welds, it can either guarantee the reliability of connection, can also support electronic device
20 weight, can prevent electronic device 20 300 be collapsed of soldered ball the company's of causing tin.By taking 300 spacing of soldered ball is 1mm as an example, branch
The height of support member 200 can be set to 0.30+/- 0.05mm.
In conclusion printed circuit board 10 provided in this embodiment, soldered ball 300 melts during electronic device 20 mounts
The bottom of electronic device 20 is supported by multiple supporting elements 200 when collapsing, such as bga chip is supported, is supported
Part 200 will not influence the attachment of electronic device 20, thus be effectively improved electronic device 20 in attachment due to by high temperature deformation or
Person flattens the problem of 300 company's of causing tin of soldered ball because of gravity, can be greatly reduced electronic device 20 because deformation and caused by not
It is good, reduce maintenance cost.In addition, supporting element 200 is set to attachment area 110 by the way of attachment, automation amount can be realized
It produces, improves the anti-pressure ability of electronic device 20 in an assembling process, such as held when the devices such as radiator after mounting and improve electronics
The external force resistance ability of device 20.
Referring to Fig. 5, the embodiments of the present invention also provide a kind of production technology of printed circuit board 10, for producing
The printed circuit board 10 of embodiment offer is provided, the production technology of the printed circuit board 10 the following steps are included:
Step S100, the deposit weld material on multiple support pads 120 in the attachment area 110 of plate body 100.
In the embodiment, support pad 120 etches formation on the panel body 100.Using steel mesh layer, on support pad 120
Deposit weld material, can the bottom by way of print solder paste with supporting element 200 weld together.It should be noted that
Multiple support pads 120 can be set in the gap between multiple soldered balls setting area 130；Also it can be set in entirely attachment area
110 corner location；Can also multiple soldered balls be arranged area 130 between gap in and attachment area 110 corner location it is equal
Setting support pad 120.
Multiple supporting elements 200 are mounted on multiple support pads 120 by step S200 correspondingly.
In the embodiment, using surface mounting technology, one end of supporting element 200 and support pad 120 are welded, supporting element
200 other end is used to support electronic device 20.In the embodiment, automatically supporting element 200 is welded using patch device
Support pad 120 in attachment area 110.
Referring to Fig. 6, the embodiments of the present invention also provide the production technology of a kind of electronic equipment, for producing above-mentioned reality
The electronic equipment in example is applied, the production technology of the electronic equipment is on the basis of the production technology of above-mentioned printed circuit board 10 into one
It walks further comprising the steps of:
Electronic device 20 is mounted on attachment area 110, is bonded multiple supporting elements 200 with electronic device 20 by step S300,
To support electronic device 20.
Referring to Fig. 7, further, step S300 includes following sub-step:
Electronic device 20 is mounted on attachment area 110 by sub-step S310, makes soldered ball 300 and attachment on electronic device 20
Multiple soldered balls setting area 130 in area 110 corresponds.
In the embodiment, the position of electronic device 20 is corresponding with the attachment position in area 110.In addition, the top surface of supporting element 200
It does not contact with the bottom surface of electronic device 20, and is not also contacted with soldered ball 300.
Sub-step S320 heats multiple soldered balls 300, so that multiple soldered balls 300 melt, so that electronic device 20 is in itself weight
Power effect is lower to be welded in attachment area 110 by multiple soldered balls 300, and fits in multiple supporting elements 200.
In the embodiment, the plate body 100 for being provided with soldered ball 300 and electronic device 20 are placed in together in patch device and carried out
Heating, heated melt of soldered ball 300 are collapsed, and electronic device 20 is welded in attachment by multiple soldered balls 300 under self gravitation effect
Area 110, since supporting element 200 itself does not melt, so that electronic device 20 moves to and supporting element 200 under self gravitation effect
Fitting, so that supporting element 200 be made to support electronic device 20.
The production technology for the electronic equipment that the embodiment provides, the thawing of soldered ball 300 is collapsed during electronic device 20 mounts
Be supported when collapsing by bottom of the supporting element 200 to electronic device 20, thus be effectively improved electronic device 20 attachment when by
In flatten 300 company's of causing tin of soldered ball by high temperature deformation or because of gravity the problem of, electronic device 20 is improved in an assembling process
Anti-pressure ability.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of printed circuit board, it to be used for mount electronic device, which is characterized in that the printed circuit board includes plate body and multiple
Supporting element, the attachment area for mounting the electronic device is provided on the plate body, and the multiple supporting element is mounted on described
Area is mounted, the electronic device is used to support.
2. printed circuit board according to claim 1, which is characterized in that be provided with multiple support welderings in the attachment area
Disk, correspondingly with the multiple support pad solder, the other end is used to support the electricity for one end of the multiple supporting element
Sub- device.
3. printed circuit board according to claim 2, which is characterized in that the supporting element includes matrix, described matrix
Surface is coated with weld material layer, and described matrix passes through the weld material layer and the support pad solder.
4. printed circuit board according to claim 3, which is characterized in that described matrix is made of copper, aluminium or ceramics.
5. printed circuit board according to claim 1, which is characterized in that be provided with multiple soldered ball settings in the attachment area
Area, the multiple soldered ball setting area, which is used to correspond with the soldered ball on the electronic device, welds, and the supporting element is set to
The multiple soldered ball is arranged between area or the corner location in the attachment area.
6. printed circuit board according to claim 5, which is characterized in that the height of the supporting element is the height of the soldered ball
0.4~0.6 times of degree.
7. printed circuit board according to claim 5, which is characterized in that the multiple supporting element is along the attachment area
Heart line is symmetrical.
8. a kind of electronic equipment, which is characterized in that including electronic device and such as the described in any item printed circuits of claim 1-7
Plate, the electronic device are mounted on the attachment area, and the multiple supporting element is bonded with the electronic device, to support the electricity
Sub- device.
9. the production technology of a kind of electronic equipment characterized by comprising
The deposit weld material on multiple support pads in the attachment area of plate body；
Multiple supporting elements are mounted on the multiple support pad correspondingly；
Electronic device is mounted on the attachment area, is bonded the multiple supporting element with the electronic device, described in support
Electronic device.
10. the production technology of electronic equipment according to claim 9, which is characterized in that described to be mounted on electronic device
The attachment area, is bonded the multiple supporting element with the electronic device, and to support electronic device the step of includes:
The electronic device is mounted on the attachment area, make soldered ball on the electronic device with it is multiple in the attachment area
Soldered ball is arranged area and corresponds；
The multiple soldered ball is heated, so that the multiple soldered ball melts, so that the electronic device leads under self gravitation effect
The multiple ball bond is crossed in the attachment area, and fits in the multiple supporting element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811081479.0A CN109195353A (en) | 2018-09-17 | 2018-09-17 | Printed circuit board, electronic equipment and its production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811081479.0A CN109195353A (en) | 2018-09-17 | 2018-09-17 | Printed circuit board, electronic equipment and its production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195353A true CN109195353A (en) | 2019-01-11 |
Family
ID=64911614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811081479.0A Pending CN109195353A (en) | 2018-09-17 | 2018-09-17 | Printed circuit board, electronic equipment and its production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109195353A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021012228A1 (en) * | 2019-07-24 | 2021-01-28 | 深圳市大疆创新科技有限公司 | Electronic packaging assembly, camera, movable platform, and preparation method for electronic packaging assembly |
| CN114664747A (en) * | 2020-12-31 | 2022-06-24 | 华为技术有限公司 | Board level structure and communication equipment |
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| JPH04233294A (en) * | 1990-06-23 | 1992-08-21 | Ant Nachrichtentech Gmbh | Device having board and unit |
| CN103281874A (en) * | 2013-05-08 | 2013-09-04 | 无锡江南计算技术研究所 | Welding method of pasted electronic element |
| CN103874342A (en) * | 2014-03-26 | 2014-06-18 | 杭州华三通信技术有限公司 | Circuit board assembling method and circuit board |
| CN104246997A (en) * | 2012-05-10 | 2014-12-24 | 松下知识产权经营株式会社 | Mounting structure and method for manufacturing same |
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2018
- 2018-09-17 CN CN201811081479.0A patent/CN109195353A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04233294A (en) * | 1990-06-23 | 1992-08-21 | Ant Nachrichtentech Gmbh | Device having board and unit |
| CN104246997A (en) * | 2012-05-10 | 2014-12-24 | 松下知识产权经营株式会社 | Mounting structure and method for manufacturing same |
| CN103281874A (en) * | 2013-05-08 | 2013-09-04 | 无锡江南计算技术研究所 | Welding method of pasted electronic element |
| CN103874342A (en) * | 2014-03-26 | 2014-06-18 | 杭州华三通信技术有限公司 | Circuit board assembling method and circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021012228A1 (en) * | 2019-07-24 | 2021-01-28 | 深圳市大疆创新科技有限公司 | Electronic packaging assembly, camera, movable platform, and preparation method for electronic packaging assembly |
| CN112437979A (en) * | 2019-07-24 | 2021-03-02 | 深圳市大疆创新科技有限公司 | Electronic packaging assembly, camera, movable platform and preparation method thereof |
| CN114664747A (en) * | 2020-12-31 | 2022-06-24 | 华为技术有限公司 | Board level structure and communication equipment |
| CN114664747B (en) * | 2020-12-31 | 2023-02-03 | 华为技术有限公司 | Board level structure and communication equipment |
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Application publication date: 20190111 |