CN103281874A - Welding method of pasted electronic element - Google Patents
Welding method of pasted electronic element Download PDFInfo
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- CN103281874A CN103281874A CN2013101667982A CN201310166798A CN103281874A CN 103281874 A CN103281874 A CN 103281874A CN 2013101667982 A CN2013101667982 A CN 2013101667982A CN 201310166798 A CN201310166798 A CN 201310166798A CN 103281874 A CN103281874 A CN 103281874A
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Abstract
The invention provides a welding method of a pasted electronic element. The method comprises the following steps of a tin paste printing step, namely printing a tin paste on a PCB (Printed Circuit Board) provided with a bonding pad by use of a steel mesh; a packing strip arrangement step, namely arranging an organic material packing strip with a specific thickness beside the bonding pad on which the tin paste is formed in the tin paste printing step; a pasting step, namely performing pasting and arranging a pasting element on a bonding pad position on which the packing strip is arranged; a reflow soldering step, namely welding the pasted PCB in a reflow oven and forming an alloy layer between the PCB bonding pad and the pasting element; and an immersion step, namely putting the PCB subjected to reflow soldering into a cleaning agent which can dissolve the organic material packing strip with the specific thickness, so as to enable the packing strip to be completely immersed into the cleaning agent, and taking out the PCB from the cleaning agent after the packing strip is completely dissolved.
Description
Technical field
The present invention relates to the integrated circuit encapsulation field; Specifically, the present invention relates to welding procedure; More particularly, the present invention relates to a kind of mounted with electronic components welding method.
Background technology
Increasingly sophisticated along with electronic product, PCB(PrintedCircuitBoard, printed circuit board claims printed circuit board (PCB), printed substrate again) each function element kind of going up welding constantly increases.And in the face of the increase in demand of market to the electronic product functional diversities, all kinds of specific function elements that weld on the circuit board as the topmost part of electronic product constantly increase.The element of many new functions has proposed new requirement to the welding of PCB.
For some specific product, the client has proposed a kind of special paster welding requirements, for the deformation needs that guarantee that some special paster part expands with heat and contract with cold, must after welding is finished, reserve and specify the microgap, be after the paster welding is finished, component body and smooth pcb board face keep the gap (for example 0.05-0.12mm) of appointment, are used for reserving the deformation space of expanding with heat and contract with cold.
The surface mount elements of prior art welding, Fig. 1 schematically show the preceding Welding Structure of welding of prior art.Surface mount elements body 5 and the surface of smooth PCB1 are not considered to leave when technological design and are specified the microgap, but by surface mount elements weld pad 4, tin cream 3, and the welding alloy layer that forms of PCB pad 2, alloy-layer supports surface mount elements body 5.Owing to having thickness, alloy-layer formed natural gap T1.The thickness of alloy-layer is exactly the microgap between surface mount elements body 5, the PCB pad 2.This gap is changeable because of changes in process parameters such as the weight of soldering part, tin cream amounts, but general equal＜0.05mm.
In other words, Fig. 2 schematically shows the Welding Structure after the welding of prior art.As shown in Figure 2, because PCB1 plate face is smooth, the ordinary electronic part is after the common process welding is finished, and PCB pad, tin cream and component pads form the alloy-layer 6 of solder joint jointly, the gap T2＜0.05mm between part noumenon and the PCB.
Thus, the surface mount elements of prior art welding can't realize keeping the appointment microgap.
Therefore, be desirable to provide a kind of technical scheme that can realize the welding of this paster electronic component reservation appointment microgap (for example 0.05-0.12mm).
Summary of the invention
Technical problem to be solved by this invention is at having above-mentioned defective in the prior art, providing a kind of paster electronic component of can realizing to keep the mounted with electronic components welding method of specifying the microgap.
According to the present invention, a kind of mounted with electronic components welding method is provided, it comprises:
The paste solder printing step is used for utilizing steel mesh print solder paste on the PCB that has arranged pad;
The filler strip deposition step is used at the other organic material filler strip with appointed thickness of arranging of the pad that forms tin cream through the paste solder printing step;
The paster step is used for carrying out paster, surface mount elements is pasted be placed on the adjacent pad locations of filler strip;
Solder reflow step is used for the PCB behind the paster is welded at the reflow stove, forms alloy-layer between pad and surface mount elements;
Soaking step, be used for to put into through the PCB of reflow soldering and can dissolve described cleaning agent with organic material filler strip of appointed thickness and soak, make described filler strip immerse cleaning agent fully, after described filler strip is dissolved fully, PCB is taken out from cleaning agent.
Preferably, in described filler strip deposition step, described organic material filler strip with appointed thickness is arranged to the tin cream adjacency with the formation of paste solder printing step.
Preferably, in described filler strip deposition step, arrange the organic material filler strip of described appointed thickness adjacently with the part PCB pad that is formed with tin cream on it; The position of described part PCB pad be with expectation reserve on the surface mount elements of specified gap the surface mount elements weld pad one to one.
Preferably, described appointed thickness is 0.05-0.12mm.
Preferably, after being taken out, PCB also PCB is cleaned to remove the pollutant that remains on the PCB from cleaning agent.
Preferably, described cleaning agent does not damage PCB, PCB pad, scolding tin, surface mount elements weld pad and surface mount elements.
Preferably, described organic material filler strip with appointed thickness be rigidity and dimensionally stable.
Thus, in mounted with electronic components welding method according to the present invention, the specified gap size is that the thickness by the organic material filler strip forms and realizes, wherein support filler strip by increasing before the weldering, postwelding forms the cavity with the organic filler strip of organic solvent dissolution and comes the control gap size, and the method for this physics interpolation filler strip, chemistry removal filler strip is very convenient; And all sizes of organic filler strip all can realize by machining easily, within the specific limits, can process organic filler strip of any thickness, so realized that gap size is controlled.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed, will more easily more complete understanding be arranged and more easily understand its attendant advantages and feature the present invention, wherein:
Fig. 1 schematically shows the preceding Welding Structure of welding of prior art.
Fig. 2 schematically shows the Welding Structure after the welding of prior art.
Fig. 3 schematically shows the paste solder printing step according to the mounted with electronic components welding method of the embodiment of the invention.
Fig. 4 schematically shows the filler strip deposition step according to the mounted with electronic components welding method of the embodiment of the invention.
Fig. 5 schematically shows the paster step according to the mounted with electronic components welding method of the embodiment of the invention.
Fig. 6 schematically shows the solder reflow step according to the mounted with electronic components welding method of the embodiment of the invention.
Fig. 7 schematically shows according to the schematic diagram after the reflow soldering of the mounted with electronic components welding method of the embodiment of the invention.
Fig. 8 schematically shows the soaking step according to the mounted with electronic components welding method of the embodiment of the invention.
Fig. 9 schematically shows the welding finished product of making according to the mounted with electronic components welding method of the embodiment of the invention.
Need to prove that accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Notice that the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar elements indicates identical or similar label.
Embodiment
In order to make content of the present invention clear and understandable more, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
Fig. 3 to Fig. 9 schematically shows each step according to the mounted with electronic components welding method of the embodiment of the invention.
Specifically,, comprise according to the mounted with electronic components welding method of the embodiment of the invention to shown in Figure 9 as Fig. 3:
The paste solder printing step is used for utilizing steel mesh 7 print solder paste 3 on the PCB that has arranged pad 2, as shown in Figure 3.Tin cream 3 after the printing as shown in Figure 4.
The filler strip deposition step is used for forming (on the PCB) other organic material filler strip 8 with appointed thickness of arranging of pad of tin cream 3 through the paste solder printing step, as shown in Figure 5; Preferably, described organic material filler strip 8 with appointed thickness is arranged to tin cream 3 adjacency that form with the paste solder printing step; And,
For example, can with its on be formed with tin cream 3 part PCB pad 2 arrange the organic material filler strip 8 of described appointed thickness adjacently; Certainly, the position of described part PCB pad 2 be with expectation reserve on the surface mount elements of specified gap surface mount elements weld pad 4 one to one.And for example, described appointed thickness for example is 0.12mm or other any suitable thickness between 0.05-0.12mm.
The paster step be used for to be carried out paster, the surface mount elements 5 that is furnished with surface mount elements weld pad 4 is pasted be placed on the pad locations adjacent with filler strip 8, as shown in Figure 5.
Solder reflow step is used for the PCB1 behind the paster is welded at the reflow stove, as shown in Figure 6.Specifically, in solder reflow step, utilize refluxing unit, the temperature curve setting by certain makes soldering paste change, and forms the eutectic solder joint.And, Fig. 7 schematically shows according to the schematic diagram after the reflow soldering of the mounted with electronic components welding method of the embodiment of the invention, as shown in Figure 7, between PCB pad 2 and surface mount elements 5, form alloy-layer 6, and the thickness of the height of alloy-layer 6 and described organic material filler strip 8 with appointed thickness about equally, in other words, the height of alloy-layer 6 equals appointed thickness.
Soaking step, be used for putting into through the PCB1 of reflow soldering can dissolve described organic material filler strip 8 with appointed thickness cleaning agent 10 immersions (for example, cleaning agent 10 is contained in the container 9), wherein make described filler strip 8 immerse cleaning agent 10 fully, as shown in Figure 8; After described filler strip 8 is soaked a period of time, organic material filler strip 8 is dissolved fully, then PCB1 is taken out from cleaning agent 10, namely form the microgap of specified altitude assignment.The thickness that this microgap is appointment (for example, 0.12mm).Preferably, after being taken out, PCB1 also PCB1 is cleaned to remove the pollutant that remains on the PCB1 from cleaning agent 10.
Wherein, cleaning agent does not damage assemblies such as PCB1, PCB pad 2, scolding tin 3, surface mount elements weld pad 4 and surface mount elements 5.In other words, cleaning agent does not produce chemical reaction with assemblies such as PCB1, PCB pad 2, scolding tin 3, surface mount elements weld pad 4 and surface mount elements 5.
And, preferably, described organic material filler strip 8 with appointed thickness be rigidity and dimensionally stable.
Thus, in the mounted with electronic components welding method according to the embodiment of the invention, the specified gap size is that the thickness by the organic material filler strip forms and realizes, wherein support filler strip by increasing before the weldering, postwelding forms the cavity with the organic filler strip of organic solvent dissolution and comes the control gap size, and the method for this physics interpolation filler strip, chemistry removal filler strip is very convenient; And all sizes of organic filler strip all can realize by machining easily, within the specific limits, can process organic filler strip of any thickness, so realized that gap size is controlled.
Be understandable that though the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not in order to limit the present invention.For any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (7)
1. mounted with electronic components welding method is characterized in that comprising:
The paste solder printing step is used for utilizing steel mesh print solder paste on the PCB that has arranged the components and parts pads;
The filler strip deposition step is used at the other organic material filler strip with appointed thickness of arranging of the pad that forms tin cream through the paste solder printing step;
The paster step is used for carrying out paster, surface mount elements is pasted be placed on the pad locations adjacent with filler strip;
Solder reflow step is used for the PCB behind the paster is welded at the reflow stove, forms alloy-layer between pad and surface mount elements;
Soaking step, be used for to put into through the PCB of reflow soldering and can dissolve described cleaning agent with organic material filler strip of appointed thickness and soak, make described filler strip immerse cleaning agent fully, after described filler strip is dissolved fully, PCB is taken out from cleaning agent.
2. mounted with electronic components welding method according to claim 1 is characterized in that, in described filler strip deposition step, described organic material filler strip with appointed thickness is arranged to the tin cream adjacency with the formation of paste solder printing step.
3. mounted with electronic components welding method according to claim 1 and 2 is characterized in that, in described filler strip deposition step, arranges the organic material filler strip of described appointed thickness adjacently with the part PCB pad that is formed with tin cream on it; The position of described part PCB pad be with expectation reserve on the surface mount elements of specified gap the surface mount elements weld pad one to one.
4. mounted with electronic components welding method according to claim 1 and 2 is characterized in that, described appointed thickness is 0.05-0.12mm.
5. mounted with electronic components welding method according to claim 1 and 2 is characterized in that, also PCB is cleaned to remove the pollutant that remains on the PCB after PCB is taken out from cleaning agent.
6. mounted with electronic components welding method according to claim 1 and 2 is characterized in that, described cleaning agent does not damage PCB, PCB pad, scolding tin, surface mount elements weld pad and surface mount elements.
7. mounted with electronic components welding method according to claim 1 and 2 is characterized in that, described organic material filler strip with appointed thickness be rigidity and dimensionally stable.
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| CN201310166798.2A CN103281874B (en) | 2013-05-08 | 2013-05-08 | A kind of mounted with electronic components welding method |
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| CN201310166798.2A CN103281874B (en) | 2013-05-08 | 2013-05-08 | A kind of mounted with electronic components welding method |
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| CN103281874B CN103281874B (en) | 2015-11-18 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465663A (en) * | 2013-09-05 | 2013-12-25 | 常州市双进电子有限公司 | Circuit board double-face character printing technology and printing structure thereof |
| CN105234516A (en) * | 2015-10-14 | 2016-01-13 | 桂林市味美园餐饮管理有限公司 | Reflow soldering process for electronic component printed circuit board |
| CN109104827A (en) * | 2018-08-09 | 2018-12-28 | 上海航天设备制造总厂有限公司 | Component raises the circuit assembly welding method of wave soldering automatically |
| CN109195353A (en) * | 2018-09-17 | 2019-01-11 | 新华三技术有限公司 | Printed circuit board, electronic equipment and its production technology |
| CN109587948A (en) * | 2018-12-28 | 2019-04-05 | 维沃移动通信有限公司 | A kind of circuit board arrangement and its processing method |
| CN114071892A (en) * | 2021-09-10 | 2022-02-18 | 北京控制工程研究所 | CQFP240 packaging device reinforcing and mounting method |
| WO2023123761A1 (en) * | 2021-12-29 | 2023-07-06 | 宁德时代新能源科技股份有限公司 | Circuit board, battery module, battery pack, and electrical device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465663A (en) * | 2013-09-05 | 2013-12-25 | 常州市双进电子有限公司 | Circuit board double-face character printing technology and printing structure thereof |
| CN105234516A (en) * | 2015-10-14 | 2016-01-13 | 桂林市味美园餐饮管理有限公司 | Reflow soldering process for electronic component printed circuit board |
| CN109104827A (en) * | 2018-08-09 | 2018-12-28 | 上海航天设备制造总厂有限公司 | Component raises the circuit assembly welding method of wave soldering automatically |
| CN109195353A (en) * | 2018-09-17 | 2019-01-11 | 新华三技术有限公司 | Printed circuit board, electronic equipment and its production technology |
| CN109587948A (en) * | 2018-12-28 | 2019-04-05 | 维沃移动通信有限公司 | A kind of circuit board arrangement and its processing method |
| CN109587948B (en) * | 2018-12-28 | 2021-02-02 | 维沃移动通信有限公司 | Circuit board device and processing method thereof |
| CN114071892A (en) * | 2021-09-10 | 2022-02-18 | 北京控制工程研究所 | CQFP240 packaging device reinforcing and mounting method |
| CN114071892B (en) * | 2021-09-10 | 2023-12-29 | 北京控制工程研究所 | CQFP240 packaging device reinforcing and mounting method |
| WO2023123761A1 (en) * | 2021-12-29 | 2023-07-06 | 宁德时代新能源科技股份有限公司 | Circuit board, battery module, battery pack, and electrical device |
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| CN103281874B (en) | 2015-11-18 |
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