WO2023123761A1

WO2023123761A1 - Circuit board, battery module, battery pack, and electrical device

Info

Publication number: WO2023123761A1
Application number: PCT/CN2022/088389
Authority: WO
Inventors: 郦昕; 石兆航
Original assignee: 宁德时代新能源科技股份有限公司
Priority date: 2021-12-29
Filing date: 2022-04-22
Publication date: 2023-07-06
Also published as: CN217134609U

Abstract

Disclosed in the present application are a circuit board, a battery module, a battery pack, and an electrical device. The circuit board comprises: a substrate, a pad, a solder paste layer, an element body, and a supporting assembly; the pad is arranged above the substrate, the solder paste layer is arranged above the pad, the element body is arranged above the solder paste layer, and the supporting assembly is arranged between the pad and the element body, allowing a gas discharge space to be formed between the element body and the solder paste layer.

Description

A circuit board, battery module, battery pack and electrical device

Cross References to Related Applications

This application claims priority to the Chinese patent application 202123382798.5 entitled "A Circuit Board, Battery Module, Battery Pack, and Electrical Device" filed on December 29, 2021, the entire content of which is incorporated by reference In this article.

technical field

The present application relates to the technical field of batteries, in particular to a circuit board, a battery module, a battery pack and an electrical device.

Background technique

Energy conservation and emission reduction is the key to the sustainable development of the automobile industry, and electric vehicles have become an important part of the sustainable development of the automobile industry due to their advantages in energy conservation and environmental protection. For electric vehicles, battery technology is an important factor in its development.

The circuit board is a circuit board that is often used on battery modules. Common components need to be soldered on the pads of the PCB (Printed Circuit Board, Chinese name printed circuit board) substrate for connection, but the welding effect is affected by many factors, often The finished product of component welding is not good, which will easily affect the normal use of the circuit board.

Contents of the invention

In view of the above problems, the present application provides a circuit board, a battery module, a battery pack and an electrical device, which can alleviate the 30%-40% void rate at the bottom of the component body and reduce the deviation of the component body (MOS tube) in the related art The problem.

In a first aspect, the present application provides a circuit board, including: a substrate, a solder pad, a solder paste layer, a component body, and a support assembly, the solder pad is disposed above the substrate, the solder paste layer is disposed above the pad, and the component body It is arranged above the solder paste layer, and a supporting component is arranged between the pad and the component body, so that an exhaust space is formed between the component body and the solder paste layer.

In the technical solution of the embodiment of the present application, the solder sheet is symmetrically placed at the bottom of the component, which is used to stably support the component and form an overhead structure for the gas escape space at the bottom of the component, and then utilize the different melting points of the solder paste and the solder sheet, When the solder paste melts to generate gas, the gas can be evacuated through the overhead structure to prevent the gas from forming a cavity in the position of the solder paste. After the solder paste melts, the solder sheet starts to melt, which reasonably ensures that most of the gas can volatilize to the surroundings. The side ends of the components are limited by the limiter, and the thickness of the solder paste at the bottom of the limiter is changed to meet the limit of the limiter, thereby preventing the components from shifting during melting and welding.

In some embodiments, one end of the support component is connected to the component body, and the other end of the support component extends into the solder paste layer and connects to the pad. The solder paste layer and supporting components are melted at high temperature by a soldering furnace, and the component body and its limiting posts are efficiently fixed to the pads on the substrate.

In some embodiments, the support assembly includes at least two support columns. It is convenient to support the component body, and at the same time, the support component is convenient for the overhead component body, which is beneficial to ensure the volatilization of gas and the speed of welding connection.

In some embodiments, the support assembly is arranged axially symmetrically along the vertical centerline of the element body. The axisymmetrically arranged support components can ensure the balance of the support component body, and the horizontal deviation can be reduced as much as possible during the process of the support component melting and the component body descending.

In some embodiments, the support pillars are tin pillars. The melting point of the tin pillar is higher than the melting point of the solder paste, which can effectively ensure the function of the exhaust space.

In some embodiments, the melting point of the support component is ≥ the melting point of the solder paste layer. Effectively ensure that the solder paste layer is melted before the support component, so that the gas can have time to escape from the exhaust space before the support component is melted.

In some embodiments, the height of the support pillar is greater than the thickness of the solder paste layer. Effectively ensure that the support column can lift the component body to form an exhaust space.

In some embodiments, a fixing component is provided between the component body and the pad to prevent deviation when the component body is connected to the pad. Further reduce the degree of deviation during the welding process of the component body.

In some embodiments, the fixing component includes a solder paste area and a limiting column, the solder paste area is disposed on the pad, one end of the limiting column is connected to the component body, and the other end of the limiting column is connected to the solder paste area. The limit post facilitates the formation of a stable support and limit structure at the side end of the component body.

In some embodiments, the thickness of the solder paste region is greater than the thickness of the solder paste layer. By increasing the thickness of the solder paste area, the original suspended limit column is attached to the thickened solder paste to prevent the deviation of the component body.

In some embodiments, the limiting posts are pins, and the pins are component pins of the component body itself. There are usually two pin structures, but not limited to two, and there may be multiple pins, which is convenient for positioning the component body.

In some embodiments, the limiting post is in an inverted L shape. It is convenient to form a stable supporting and limiting structure at the side end of the component body.

In a second aspect, the present application provides a battery module, which includes the circuit board in the above embodiment.

In a third aspect, the present application provides a battery pack, which includes the battery module in the above embodiment.

In a fourth aspect, the present application provides an electric device, which includes the battery pack in the above embodiment, and the battery pack is used to provide electric energy.

By adopting above-mentioned technical scheme, the beneficial effect of the present application is:

By optimizing the setting of the support component, a symmetrical support component is set at the bottom of the component body, and the exhaust space is formed overhead, and the melting point difference between the support component and the solder paste is used to ensure that the gas can pass through the exhaust when the solder paste melts and the support component gradually melts. The space evaporates to the surroundings, thereby reducing the range of voids formed at the solder paste melting contact position.

By optimizing the setting of the fixed component, when the fixed component is the component pin of the component body itself, the component pin is used to limit the position, and the thickness of the solder paste area at the bottom of the component pin is increased so that the component pin can be connected to the tin when it is not soldered. Paste contact, through the contact of the component lead and the solder paste on the pad, to prevent the deviation of the component body.

The above description is only an overview of the technical solution of the present application. In order to better understand the technical means of the present application, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and understandable , the following specifically cites the specific implementation manner of the present application.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the description, and are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention.

In the drawings, the same components are given the same reference numerals, and the drawings are schematic and not necessarily drawn to actual scale.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the following will briefly introduce the drawings that need to be used in the descriptions of the embodiments or related technologies. Obviously, the drawings in the following description are only For one or several embodiments of the invention, those skilled in the art can also obtain other drawings based on such drawings without creative work.

FIG. 1 is a schematic structural view of a vehicle in some embodiments of the present application;

Fig. 2 is the structural representation of the circuit board of some embodiments of the present application;

FIG. 3 is a schematic structural diagram of a related art circuit board.

Explanation of main reference signs:

1. Substrate; 2. Pad; 2. Solder paste layer; component body; support component; fixed component; 61. Solder paste area; 62. Limiting post.

Detailed ways

Embodiments of the technical solutions of the present application will be described in detail below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present application more clearly, and therefore are only examples, rather than limiting the protection scope of the present application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the application; the terms used herein are only for the purpose of describing specific embodiments, and are not intended to To limit this application; the terms "comprising" and "having" and any variations thereof in the specification and claims of this application and the description of the above drawings are intended to cover a non-exclusive inclusion.

In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects, and should not be understood as indicating or implying relative importance or implicitly indicating the number, specificity, or specificity of the indicated technical features. Sequence or primary-secondary relationship. In the description of the embodiments of the present application, "plurality" means two or more, unless otherwise specifically defined.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

In the description of the embodiment of the present application, the term "and/or" is only a kind of association relationship describing associated objects, which means that there may be three kinds of relationships, such as A and/or B, which may mean: A exists alone, and A exists at the same time and B, there are three cases of B alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship.

In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two), similarly, "multiple groups" refers to more than two groups (including two), and "multiple pieces" refers to More than two pieces (including two pieces).

In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical" "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", "Radial", "Circumferential", etc. indicate the orientation or positional relationship based on the drawings Orientation or positional relationship is only for the convenience of describing the embodiment of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as an implementation of the present application. Example limitations.

In the description of the embodiments of this application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it can be a fixed connection or a fixed connection. Disassembled connection, or integration; it can also be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application according to specific situations.

At present, judging from the development of the market situation, the application of power batteries is becoming more and more extensive. Power batteries are not only used in energy storage power systems such as hydraulic, thermal, wind and solar power plants, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, electric vehicles, as well as military equipment and aerospace and other fields . With the continuous expansion of power battery application fields, its market demand is also constantly expanding.

As an electric energy storage device, the power battery system is one of the core components of new energy electric vehicles. Electric vehicles not only need high power to meet their driving conditions, but also need to have the ability to cope with some special situations. At present, the battery pack 100 on new energy vehicles can use a variety of single cells with certain specifications, such as cylindrical 18650 cells and square cells. At present, the matching power battery system is manufactured according to the specific voltage and capacity required by different electric vehicles. The main process is as follows: First, multiple single cells of the same specification are assembled into a battery module, and then multiple battery modules are assembled into a battery. Finally, a plurality of battery packs 100 are assembled in a power battery box as an electric energy storage device for electric vehicles. The battery module is equipped with a circuit board. The complete structure of the circuit board is to weld the component body 4 on the substrate 1. The following component body 4 is an example of a MOS tube. When the substrate 1 is welded to the MOS tube, the pad on the substrate 1 2. Print solder paste of appropriate thickness through the stencil, place the MOS tube directly on the solder paste, and send it into the soldering furnace for welding. When the temperature reaches 217°C, the solder paste melts, and after melting and cooling, the MOS tube is fixed on the pad 2 by the solder paste. However, the gas generated during the melting process cannot be volatilized in time, and some Void, that is, the gas remains in the solder paste to form so-called air bubbles; and when the support component 5 is set up at the bottom of the MOS tube, the use of stencil printing of the same thickness of solder paste is no longer sufficient to limit the component pins at the side end of the MOS tube , that is, the limit of the limit column 62 causes the MOS tube to be unable to ensure that the component pin does not shift during the welding process, resulting in the offset of the MOS tube being greater than 25% of the value of the pad 2.

In order to alleviate the original problem of 30%-40% MOS tube void ratio, the applicant found that a symmetrical support component 5 can be arranged at the bottom of the MOS tube. , The melting point of the solder sheet is 217-227°C. When the solder paste melts, the solder sheet is still solid, forming a gas escape space. As the temperature continues to rise, the solder sheet melts, and the component body 4 descends to form a solder joint with the solder paste. By raising the MOS tube, a gas escape space is formed, and the gas can volatilize to the surroundings, thereby reducing the range of voids formed at the solder paste melting contact position. In order to alleviate the problem of the large offset of the MOS tube, the applicant found that the welding component pin of the MOS tube itself will be lower than the body. When the MOS tube body is in contact with the solder sheet, the component pin of the MOS tube is also in contact with the pad The contact of the solder paste on 2 can prevent the component body 4 from shifting. However, if the solder sheet is installed, there will be a gap between the bottom of the component pin and the solder paste at the bottom. At this time, sending the part to be welded into the soldering furnace will easily cause deviation during the melting process, so the thickness of the solder paste at the bottom of the component pin can be increased. , so that the component pins can be in contact with the solder paste, and limit the side end of the MOS tube when it is not soldered. Effectively ensure that the offset of the MOS tube is greatly reduced during the melting process of the welding furnace.

Based on the above considerations, in order to alleviate the original 30%-40% MOS tube void rate and reduce the problem of MOS tube offset, the inventor has conducted in-depth research and designed a circuit board, by setting a symmetrical support at the bottom of the MOS tube Component 5, the symmetrical support component 5 can ensure that the MOS tube is stably placed above the solder paste, and at the same time forms a gas escape space. By increasing the thickness of the solder paste area 61 at the bottom of the component pins of the MOS tube, the bottom of the component pins is in contact with the solder paste area 61 before the MOS tube is sent into the soldering furnace, and the MOS tube can be limited by the component pins.

In such a circuit board, due to the symmetrical support assembly 5, the bottom end of the MOS tube can be suspended. After the solder paste is melted, the supporting component 5 also begins to melt slowly. At this time, the MOS tube gradually descends. At the same time, the gas generated by melting can volatilize from the space at the bottom of the MOS tube to the surroundings, which can effectively alleviate the problem of the void ratio of the MOS tube. The void rate of the MOS tube is reduced from the original 30%-40% to the current 10%-20%. And the thickened solder paste area 61 under the component pins, when the MOS tube is lowered, the component pins can also drop synchronously with the melting of the solder paste area 61, and the component pins can effectively alleviate the offset problem of the MOS tube during the soldering process , the offset of the MOS tube is reduced from more than 25% of the original offset pad 2 to only a slight offset.

The battery pack 100 disclosed in the embodiment of the present application can be used, but not limited to, in electric devices such as vehicles, ships or aircrafts.

The embodiment of the present application provides an electric device using a battery pack as a power source. The electric device can be, but not limited to, a mobile phone, a tablet, a notebook computer, an electric toy, an electric tool, a battery car, an electric car, a ship, a spacecraft, and the like. Among them, electric toys may include fixed or mobile electric toys, such as game consoles, electric car toys, electric boat toys, electric airplane toys, etc., and spacecraft may include airplanes, rockets, space shuttles, spaceships, etc.

In the following embodiments, for the convenience of description, a vehicle 1000 as an electric device according to an embodiment of the present application is taken as an example for description.

Please refer to FIG. 1 , which is a schematic structural diagram of a vehicle 1000 provided by some embodiments of the present application. The vehicle 1000 can be a fuel vehicle, a gas vehicle or a new energy vehicle, and the new energy vehicle can be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle. The interior of the vehicle 1000 is provided with a battery pack 100 , and the battery pack 100 may be provided at the bottom, head or tail of the vehicle 1000 . The battery pack 100 can be used for power supply of the vehicle 1000 , for example, the battery pack 100 can be used as an operating power source of the vehicle 1000 . The vehicle 1000 may further include a controller 200 and a motor 300 , the controller 200 is used to control the battery pack 100 to supply power to the motor 300 , for example, for starting, navigating, and working power requirements of the vehicle 1000 during driving.

In some embodiments of the present application, the battery pack 100 can not only be used as an operating power source for the vehicle 1000 , but can also be used as a driving power source for the vehicle 1000 to provide driving power for the vehicle 1000 instead of or partially replacing fuel oil or natural gas.

According to some embodiments of the present application, refer to FIG. 2 and FIG. 3 . FIG. 2 is a schematic structural diagram of a circuit board in some embodiments of the present application, and FIG. 3 is a schematic structural diagram of a circuit board in a related technology.

According to some embodiments of the present application, the present application provides a circuit board, including: a substrate 1, a pad 2, a solder paste layer 3, a component body 4, and a support assembly 5, the pad 2 is arranged above the substrate 1, and the tin The paste layer 3 is arranged above the pad 2, the element body 4 is arranged above the solder paste layer 3, and a support assembly 5 is arranged between the pad 2 and the element body 4, so that a formation is formed between the element body 4 and the solder paste layer 3. Exhaust space.

Substrate 1 is a copper-clad laminate. Generally, substrate materials for printed boards can be divided into two categories: rigid substrate materials and flexible substrate materials. The important variety of general rigid substrate materials is copper-clad laminates. It is made of reinforced material, impregnated with resin adhesive, dried, cut, laminated into a billet, and then covered with copper foil, using steel plate as a mold, and processed by high temperature and high pressure forming in a hot press.

Pad 2 is the basic constituent unit of surface mount assembly, which is used to form the pad pattern of the circuit board, that is, various pad combinations designed for special component types.

Solder paste layer 3 is the layer structure formed by solder paste. Solder paste is also called solder paste, gray paste. It is a new type of soldering material that emerged with the SMT (abbreviation for Surface Mounted Technology) surface assembly technology. It is made of Solder powder, flux, and other surfactants, thixotropic agents, etc. are mixed to form a paste mixture. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry.

The component body 4 is an independent entity in the electronic circuit. The individual parts through which the current passes can produce frequency amplitude changes or change the flow direction are called devices, otherwise they are called components. In semiconductor circuits, transistors (transistors, diodes, thyristors, etc.) are devices, while resistors, capacitors, and inductors are components, and they are collectively called components.

The supporting component 5 can be a solder sheet, which is an electrode used for soldering, and has a sheet-like structure. The soldering can be used for sealed metal welding under conditions that do not require high temperature and high pressure.

The support assembly 5 (solder sheet) is symmetrically placed at the bottom of the component body 4, which is used to stably support the component body 4 and form an overhead structure for the gas discharge space at the bottom of the component body 4, and then use the melting point of the solder paste and the solder sheet to be different. When the solder paste melts to generate gas, the gas can be evacuated through the overhead structure to prevent the gas from forming a cavity at the position of the solder paste layer 3 . After the solder paste melts, the solder sheet starts to melt, which reasonably ensures that most of the gas can volatilize to the surroundings. The side ends of the component body 4 limit the position of the component body 4 through the limit post 62, and the limit of the limit post 62 is met by changing the thickness of the solder paste area 61 at the bottom of the limit post 62, thereby preventing the component body 4 from melting during welding. offset.

According to some embodiments of the present application, optionally, one end of the support component 5 is connected to the component body 4 , and the other end of the support component 5 extends into the solder paste layer 3 to connect to the pad 2 . The solder paste layer 3 and the supporting component 5 are melted at a high temperature in a soldering furnace, and the component body 4 and its limiting posts 62 are efficiently fixed to the pads 2 on the substrate 1 .

According to some embodiments of the present application, optionally, the support assembly 5 includes at least two support columns. It is convenient to support the component body 4, and at the same time, the support component 5 is convenient to lift the component body 4, which is beneficial to ensure the volatilization of gas and the speed of welding connection.

According to some embodiments of the present application, optionally, the support assembly 5 is arranged axially symmetrically along the vertical centerline of the element body 4 . The axisymmetrically arranged support assembly 5 can ensure the balance of the support element body 4, and the horizontal deviation can be reduced as much as possible when the support assembly 5 melts and the element body 4 descends.

According to some embodiments of the present application, optionally, the support pillars are tin pillars. The melting point of the tin pillar is higher than the melting point of the solder paste, which can effectively ensure the function of the exhaust space.

According to some embodiments of the present application, optionally, the melting point of the support component 5 is greater than or equal to the melting point of the solder paste layer 3 . It is effectively ensured that the solder paste layer 3 is melted before the support component 5 , so that the gas can have time to be discharged from the exhaust space before the support component 5 is melted.

According to some embodiments of the present application, optionally, the height of the supporting pillars is greater than the thickness of the solder paste layer 3 . Effectively ensure that the support column can lift the element body 4 to form an exhaust space.

According to some embodiments of the present application, optionally, a fixing component 6 is provided between the component body 4 and the pad 2 to prevent deviation when the component body 4 is connected to the pad 2 . The degree of deviation during the welding process of the component body 4 is further reduced.

According to some embodiments of the present application, optionally, the fixing assembly 6 includes a solder paste area 61 and a limiting column 62, the solder paste area 61 is arranged on the pad 2, and one end of the limiting column 62 is connected to the component body 4, and the limit The other end of the post 62 is connected to the solder paste area 61 . The limit post 62 is convenient to form a stable support and limit structure at the side end of the element body 4.

The limit column 62 in the circuit board can be a pin, and the pin is also called a pin, which is called Pin in English. It is the connection between the internal circuit of the integrated circuit (chip) and the peripheral circuit, and all the pins constitute the interface of the chip. A section of the end of a lead that is soldered to form a solder joint with a pad on a printed board. Pins can be divided into heel (bottom), toe (toe), foot side (side) and other parts.

According to some embodiments of the present application, optionally, the thickness of the solder paste region 61 is greater than the thickness of the solder paste layer 3 . By increasing the thickness of the solder paste area 61 , the originally suspended limit post 62 is attached to the thickened solder paste to prevent the component body from shifting.

According to some embodiments of the present application, optionally, the limit column 62 is a pin, and the pin is the component pin of the component body 4 itself. The pin structure is usually two, but not limited to two, and can be multiple , it is convenient to limit the position of the element body 4 . The fixing component 6 that restricts the displacement of the component body 4 is the component pin on the component body 4, which can reduce the use cost of the positioning scheme.

According to some embodiments of the present application, optionally, the limiting post 62 is in an inverted L shape. It is convenient to form a stable supporting and limiting structure at the side end of the component body.

According to some embodiments of the present application, the present application provides a battery module, and the battery module includes the circuit board in the above embodiments.

According to some embodiments of the present application, the present application provides a battery pack 100, and the battery pack 100 includes the above-mentioned battery module.

According to some embodiments of the present application, the present application provides an electric device, the electric device includes a battery pack 100, and the battery pack 100 is used to provide electric energy.

The electric device may be any of the aforementioned devices or systems using batteries.

According to some embodiments of the present application, referring to Fig. 2 and Fig. 3, Fig. 2 is a schematic structural view of a circuit board according to some embodiments of the present application, and Fig. 3 is a schematic structural view of a circuit board in a related art. The present application provides a circuit board. The solder sheet is symmetrically placed on the bottom of the component body 4 to form a part to be welded on the solder paste layer 3. The space between the solder sheet and the component body 4 is overhead to form a gas volatilization space, and the side end of the component body passes through itself. The pins are in contact with the solder paste area 61, and the thickness of the solder paste area 61 in contact with the component pins is increased. After the component pins are in contact with the solder paste area 61, it can ensure that the component body 4 does not deviate during the soldering process.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present application. All of them should be covered by the scope of the claims and description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

A circuit board, comprising:

Substrate (1);

a welding pad (2), which is arranged above the substrate (1);

A solder paste layer (3), which is arranged above the pad (2);

A component body (4), which is arranged above the solder paste layer (3);

A supporting component (5) is arranged between the pad (2) and the element body (4), so that an exhaust space is formed between the element body (4) and the solder paste layer (3).
The circuit board according to claim 1, wherein one end of the support component (5) is connected to the component body (4), and the other end of the support component (5) extends into the solder paste layer (3 ) is connected to the pad (2).
The circuit board according to claim 1 or 2, wherein the support assembly (5) comprises at least two support columns.
The circuit board according to any one of claims 1 to 3, wherein the support assembly (5) is arranged axially symmetrically along the vertical center line of the element body (4).
The circuit board according to claim 3 or 4, wherein the support pillars are tin pillars.
The circuit board according to any one of claims 1 to 5, wherein the melting point of the supporting component (5) is ≥ the melting point of the solder paste layer (3).
The circuit board according to any one of claims 1 to 6, wherein the height of the supporting columns is greater than the thickness of the solder paste layer (3).
The circuit board according to any one of claims 1 to 7, wherein a device is provided between the component body (4) and the pad (2) to prevent the component body (4) from (2) Fixing assembly (6) that is deflected when connected.
The circuit board according to claim 8, wherein the fixing component (6) comprises a solder paste area (61) and a limiting post (62), and the solder paste area (61) is arranged on the pad (2 ), one end of the limiting column (62) is connected to the component body (4), and the other end of the limiting column (62) is connected to the solder paste area (61).
The circuit board according to claim 9, wherein the thickness of the solder paste region (61) is greater than the thickness of the solder paste layer (3).
The circuit board according to any one of claims 9 or 10, wherein the limiting column (62) is a pin, and the pin is a component pin of the component body (4) itself.
The circuit board according to any one of claims 9 to 11, wherein the limiting column (62) is in an inverted L shape.
A battery module, wherein the battery module includes the circuit board according to any one of claims 1-12, and the circuit board is located in the battery module.
A battery pack (100), wherein the battery pack (100) comprises the battery module according to claim 13.
An electric device, wherein the electric device comprises the battery pack (100) according to claim 14, and the battery pack (100) is used for providing electric energy.