CN217134609U

CN217134609U - Circuit board, battery module, battery package and electric device

Info

Publication number: CN217134609U
Application number: CN202123382798.5U
Authority: CN
Inventors: 郦昕; 石兆航
Original assignee: Contemporary Amperex Technology Co Ltd
Current assignee: Contemporary Amperex Technology Co Ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-08-05
Anticipated expiration: 2031-12-29
Also published as: WO2023123761A1

Abstract

The application discloses circuit board, battery module, battery package and electric installation. Wherein, a circuit board includes: the tin paste layer is arranged above the substrate, the tin paste layer is arranged above the bonding pad, the element body is arranged above the tin paste layer, the supporting component is arranged between the bonding pad and the element body, and an exhaust space is formed between the element body and the tin paste layer. Through optimizing and setting up the supporting component, set up the supporting component of symmetry in component body bottom, built on stilts exhaust space that forms utilizes the melting point difference of supporting component and tin cream, when guaranteeing that the tin cream melts, the supporting component melts the in-process gas gradually and can volatilize to all around through exhaust space to reduce and form empty scope in tin cream melting contact position. The thickness of the solder paste area at the bottom end of the element pin is increased, so that the element pin can be in contact with the solder paste when the element pin is not welded, and the offset of the element body is prevented.

Description

Circuit board, battery module, battery package and electric device

Technical Field

The application relates to the technical field of batteries, in particular to a circuit board, a battery module, a battery pack and an electric device.

Background

Energy conservation and emission reduction are the key points of sustainable development of the automobile industry, and electric vehicles become important components of the sustainable development of the automobile industry due to the advantages of energy conservation and environmental protection. For electric vehicles, battery technology is an important factor in its development.

The circuit board is the circuit board of often using on the battery module, and common components and parts need weld and connect on the pad of PCB base plate, but the welding effect receives the multiple factor influence, and components and parts welding finished product effect is not good often, influences the normal use of circuit board easily.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present application provides a circuit board, a battery module, a battery pack and an electric device, which can alleviate the problems of 30% -40% of void ratio at the bottom end of the device body 4 and reduction of offset degree of the device body (MOS transistor) in the prior art.

In a first aspect, the present application provides a circuit board, including: base plate, pad, tin cream layer, component body, supporting component, the pad setting is in the top of base plate, and the tin cream layer sets up in the top of pad, and the component body sets up in the top on tin cream layer, is provided with supporting component between pad and the component body for form exhaust space between component body and the tin cream layer.

Among the technical scheme of this application embodiment, the soldering tin piece is placed to the symmetry in components and parts bottom for steadily hold components and parts and form the aerial structure in components and parts bottom gas escape space, it is different with the soldering tin piece melting point to recycle tin cream, when the tin cream melts and produces gas, can evacuate gas through aerial structure, avoid gaseous formation cavity in tin cream position, after the tin cream melts, the soldering tin piece just begins to melt, rationally guaranteed that most gas can be to volatilizing all around. The components and parts side is spacing through the locating part to components and parts, satisfies the spacing to the locating part through the thickness that changes the locating part bottom tin cream, and then prevents that components and parts from squinting when melting the welding.

In some embodiments, one end of the support member is connected to the device body, and the other end of the support member extends into the solder paste layer to be connected to the pad. The solder paste layer and the supporting component are melted at high temperature through the soldering furnace, and then the element body and the limiting columns thereof are efficiently fixed on the bonding pads on the substrate.

In some embodiments, the support assembly includes at least two support columns. Be convenient for support the component body, the supporting component is convenient for built on stilts component body simultaneously, is favorable to guaranteeing gaseous volatilizing and welded connection's speed.

In some embodiments, the support assemblies are disposed axisymmetrically along the vertical center line of the element body. The supporting component arranged in an axisymmetric manner can ensure that the supporting component body is balanced, and horizontal deviation can be reduced as far as possible in the descending process of the component body when the supporting component is melted.

In some embodiments, the support posts are tin posts. The melting point of the tin column is larger than that of the tin paste, so that the exhaust space can be effectively ensured to play a role.

In some embodiments, the melting point of the support member is greater than or equal to the melting point of the solder paste layer. The solder paste layer is effectively guaranteed to be melted before the supporting component, and then gas can be discharged from the exhaust space before the melting process of the supporting component.

In some embodiments, the height of the support posts is greater than the thickness of the solder paste layer. Effectively guarantee the support column and can lift up the component body and form exhaust space.

In some embodiments, a fixing component for preventing the component body from shifting when being connected with the bonding pad is arranged between the component body and the bonding pad. Further reducing the offset degree in the welding process of the element body.

In some embodiments, the fixing component includes a solder paste area and a limiting post, the solder paste area is disposed on the bonding pad, one end of the limiting post is connected with the component body, and the other end of the limiting post is connected with the solder paste area. The limiting column is convenient for forming a stable supporting and limiting structure at the side end of the element body.

In some embodiments, the thickness of the solder paste region is greater than the thickness of the solder paste layer. Through increasing the thickness in tin cream district for originally unsettled spacing post and the laminating of the tin cream of bodiness prevent the skew of component body.

In some embodiments, the limiting posts are pins, and the pins are component pins of the component body. The pin structures are usually two, but not limited to two, and may be multiple, so as to facilitate the limiting of the component body.

In some embodiments, the restraint posts are inverted L-shaped. The stable supporting and limiting structure is convenient to form at the side end of the element body.

In a second aspect, the present application provides a battery module including the circuit board in the above embodiments.

In a third aspect, the present application provides a battery pack including the battery module in the above embodiment.

In a fourth aspect, the present application provides an electric device, which includes the battery pack in the above embodiments, wherein the battery pack is used for providing electric energy.

Through adopting foretell technical scheme, the beneficial effect of this application is:

1. through optimizing and setting up supporting component, set up the supporting component of symmetry in component body bottom, built on stilts exhaust space that forms utilizes the melting point difference of supporting component and tin cream, when guaranteeing that the tin cream melts, supporting component melts the in-process gas gradually and can volatilize to all around through exhaust space to reduce the scope at tin cream melting contact position formation cavity.

2. Through optimizing and setting up fixed subassembly, when fixed subassembly is the component pin of component body self, utilize the component pin to carry on spacingly, increase the thickness in component pin bottom tin cream district and make the component pin can contact with tin cream when not welding, through the tin cream contact on component pin and the pad, prevent the skew of component body.

The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.

In the drawings, like parts are designated with like reference numerals, and the drawings are schematic and not necessarily drawn to scale.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only one or several embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to such drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a vehicle according to some embodiments of the present application;

FIG. 2 is a schematic structural diagram of a wiring board according to some embodiments of the present application;

fig. 3 is a schematic structural diagram of a circuit board in the prior art.

Description of the main reference numerals:

1. a substrate;

2. a pad;

3. a solder paste layer;

4. an element body;

5. a support assembly;

6. a fixing assembly;

61. a solder paste area; 62. a limiting column.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are merely used to more clearly illustrate the technical solutions of the present application, and therefore are only examples, and the protection scope of the present application is not limited thereby.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first", "second", and the like are used only for distinguishing different objects, and are not to be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary-secondary relationship of the technical features indicated. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is only one kind of association relationship describing the association object, and means that three relationships may exist, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), and similarly, "plural sets" refers to two or more (including two), and "plural pieces" refers to two or more (including two).

In the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the directions or positional relationships indicated in the drawings, and are only for convenience of description of the embodiments of the present application and for simplicity of description, but do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, may be fixedly connected, detachably connected, or integrated; mechanical connection or electrical connection is also possible; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

At present, the application of the power battery is more and more extensive from the development of market situation. The power battery is not only applied to energy storage power supply systems such as hydraulic power, firepower, wind power and solar power stations, but also widely applied to electric vehicles such as electric bicycles, electric motorcycles, electric automobiles and the like, and a plurality of fields such as military equipment and aerospace. With the continuous expansion of the application field of the power battery, the market demand is also continuously expanding.

The power battery system is used as an electric energy storage device and is one of core parts of the new energy electric automobile. The electric vehicle needs to have a high power to meet the driving conditions and needs to have a special condition to be dealt with. At present, the battery pack 100 for the new energy automobile can use a plurality of single battery cells with certain specifications, such as a cylindrical 18650 battery cell and a square battery cell. At present, a matched power battery system is manufactured according to specific voltage and capacity required by different electric automobiles, and the main process is as follows: firstly, a plurality of single battery cores with the same specification are assembled into a battery module, then a plurality of battery modules are assembled into a battery pack 100, and finally the plurality of battery packs 100 are assembled into a power battery box to be used as an electric energy storage device for an electric automobile. The battery module is provided with a circuit board, the complete structure of the circuit board is that an element body 4 is welded on a substrate 1, the following element bodies 4 are all taken as MOS tubes for example, when the substrate 1 is welded with the MOS tubes, a solder paste with proper thickness is printed on a bonding pad 2 on the substrate 1 through a steel mesh, the MOS tubes are directly placed on the solder paste and sent into a welding furnace for welding, when the temperature reaches 217 ℃, the solder paste is melted, after the melting and cooling, the MOS tubes are fixed on the bonding pad 2 by using the solder paste, but gas generated in the melting process cannot volatilize in time, a plurality of cavities are formed on the solder paste, namely, the gas remains in the solder paste to form so-called bubbles; when the bottom end of the MOS tube is provided with the supporting component 5, solder paste with the same thickness is printed by using a steel mesh, the limitation of element pins at the side end of the MOS tube, namely the limitation of the limiting column 62, cannot be ensured by the element pins of the MOS tube in the welding process, and the deviation of the MOS tube out of the bonding pad 2 is larger than 25%.

In order to solve the problem of the void ratio of the original 30% -40% MOS tube, the applicant researches and discovers that symmetrical support components 5 can be arranged at the bottom ends of the MOS tubes, the melting point of solder paste is 217 ℃, when the support components 5 select solder pieces, the melting point of the solder pieces is 217 ℃ and 227 ℃, and when the solder paste is melted, the solder pieces are still solid, so that a gas escape space is formed. The temperature continues to rise, the soldering tin pieces melt, and the component body 4 descends to form a soldering point with the solder paste. By lifting the MOS tube, a gas escape space is formed, and gas can volatilize all around, so that the range of forming a cavity at the melting contact position of the solder paste is reduced. In order to alleviate the problem of large offset of the MOS transistor, the applicant has found that the solder element leads of the MOS transistor are lower than the body itself, and when the MOS transistor body is in contact with the solder sheet, the element leads of the MOS transistor are also in contact with the solder paste on the pad 2, thereby preventing the element body 4 from being offset. But set up the soldering tin piece, the easy and rather than the tin cream of bottom of component pin bottom has the gap, will treat that the welding member sends into the stove of welder this moment, causes the skew easily in melting process, consequently can increase component pin bottom tin cream thickness, makes the component pin can carry out the side spacing with the tin cream contact to the MOS pipe when not welding. Effectively guarantee to weld the stove melting process, MOS pipe's offset reduces by a wide margin.

Based on the consideration, in order to relieve the problems of 30% -40% of the void ratio of the original MOS tube and reduce the offset degree of the MOS tube, the inventor designs a circuit board through deep research, and by arranging the symmetrical supporting components 5 at the bottom end of the MOS tube, the symmetrical supporting components 5 can ensure that the MOS tube is stably arranged above the solder paste, and meanwhile, a gas escape space is formed. Through the thickness that increases MOS pipe component pin bottom tin cream district 61 for before the MOS pipe is not sent into the stove of welding, component pin bottom and the contact of tin cream district 61, the MOS pipe can carry on spacingly through the component pin.

In such a wiring board, the MOS transistor bottom end can be elevated due to the symmetrical support member 5. After the solder paste is melted, the supporting component 5 begins to be slowly melted, the MOS tube descends gradually at the moment, and meanwhile, gas generated by melting can volatilize to the periphery from the space at the bottom end of the MOS tube, so that the problem of the void ratio of the MOS tube can be effectively relieved, and the void ratio of the MOS tube can be reduced to the existing 10% -20% from the original 30% -40%. And the thickened solder paste area 61 below the element pin can synchronously descend along with the melting of the solder paste area 61 when the MOS tube descends, the offset problem of the MOS tube in the welding process can be effectively relieved by the element pin, and the offset of the MOS tube is reduced to only slight offset from more than 25 percent of the original offset of the bonding pad 2.

The battery pack 100 disclosed in the embodiment of the present application may be used in an electric device such as a vehicle, a ship, or an aircraft, but is not limited thereto.

The embodiment of the application provides an electric device using a battery pack as a power supply, wherein the electric device can be but is not limited to a mobile phone, a tablet, a notebook computer, an electric toy, an electric tool, a battery car, an electric automobile, a ship, a spacecraft and the like. The electric toy may include a stationary or mobile electric toy, such as a game machine, an electric car toy, an electric ship toy, an electric airplane toy, and the like, and the spacecraft may include an airplane, a rocket, a space shuttle, a spacecraft, and the like.

For convenience of description, the following embodiments take an example in which a power consuming apparatus according to an embodiment of the present application is a vehicle 1000.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a vehicle 1000 according to some embodiments of the present disclosure. The vehicle 1000 may be a fuel automobile, a gas automobile, or a new energy automobile, and the new energy automobile may be a pure electric automobile, a hybrid electric automobile, or a range-extended automobile, etc. The battery pack 100 is disposed inside the vehicle 1000, and the battery pack 100 may be disposed at the bottom or the head or the tail of the vehicle 1000. The battery pack 100 may be used for power supply of the vehicle 1000, and for example, the battery pack 100 may serve as an operating power source of the vehicle 1000. The vehicle 1000 may further include a controller 200 and a motor 300, the controller 200 being configured to control the battery pack 100 to supply power to the motor 300, for example, for starting, navigation, and operational power requirements while the vehicle 1000 is traveling.

In some embodiments of the present application, the battery pack 100 may be used not only as an operating power source of the vehicle 1000, but also as a driving power source of the vehicle 1000, instead of or in part of fuel or natural gas, to provide driving power for the vehicle 1000.

According to some embodiments of the present application, referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of a circuit board according to some embodiments of the present application, and fig. 3 is a schematic structural diagram of a circuit board according to the prior art.

According to some embodiments of the present application, there is provided a wiring board including: the solder paste structure comprises a substrate 1, a bonding pad 2, a solder paste layer 3, an element body 4 and a supporting component 5, wherein the bonding pad 2 is arranged above the substrate 1, the solder paste layer 3 is arranged above the bonding pad 2, the element body 4 is arranged above the solder paste layer 3, and the supporting component 5 is arranged between the bonding pad 2 and the element body 4, so that an exhaust space is formed between the element body 4 and the solder paste layer 3.

The substrate 1 is a copper clad laminate, and the substrate materials for the common printed board can be divided into two major types, namely rigid substrate materials and flexible substrate materials, wherein the important variety of the common rigid substrate materials is the copper clad laminate. The reinforced plastic composite material is prepared by soaking a reinforced material in a resin adhesive, drying, cutting and overlapping to form a blank, then coating a copper foil, using a steel plate as a mould, and performing high-temperature and high-pressure forming processing in a hot press;

the pad 2 is a basic constituent unit of a surface mount assembly, and is used for constituting a pad pattern of a circuit board, namely various pad combinations designed for special component types;

the solder paste layer 3 is a layer structure formed by solder paste, the solder paste is also called solder paste, and gray paste is a novel welding material produced along with SMT, and is a paste mixture formed by mixing solder powder, soldering flux, other surfactants, thixotropic agents and the like. The method is mainly used for welding electronic components such as PCB surface resistance, capacitance, IC and the like in the SMT industry;

the component body 4 is an independent entity in the electronic circuit, the entity through which the current can produce a frequency amplitude variation or change the flow direction is called a device, otherwise called a component. In a semiconductor circuit, a transistor (a triode, a diode, a silicon controlled rectifier and the like) is a device, and a resistor, a capacitor and an inductor are elements which are called components together;

the support member 5 may be a solder tab, which is a welding rod for soldering, and has a sheet structure, and soldering can be used for sealed metal welding without requiring high temperature and high pressure.

The supporting components 5 (soldering tin sheets) are symmetrically placed at the bottom end of the component body 4 and used for stably supporting the component body 4 and forming an overhead structure of a gas exhaust space at the bottom end of the component body 4, the melting point of the solder paste and the melting point of the soldering tin sheets are different, and when the solder paste is melted to generate gas, the gas can be evacuated through the overhead structure, so that the gas is prevented from forming a cavity at the position of the solder paste layer 3. After the solder paste is melted, the soldering tin sheet begins to melt, and therefore, most of gas can be reasonably ensured to volatilize to the periphery. The side end of the element body 4 limits the element body 4 through the limiting column 62, and the thickness of the solder paste area 61 at the bottom end of the limiting column 62 is changed to limit the limiting column 62, so that the element body 4 is prevented from deviating during melting and welding.

According to some embodiments of the present application, optionally, one end of the supporting member 5 is connected to the element body 4, and the other end of the supporting member 5 extends into the solder paste layer 3 to be connected to the pad 2. The solder paste layer 3 and the supporting component 5 are melted at high temperature through the soldering furnace, and then the element body 4 and the limiting columns 62 thereof are efficiently fixed on the soldering pad 2 on the substrate 1.

According to some embodiments of the present application, optionally, the support assembly 5 comprises at least two support columns. Be convenient for support component body 4, the supporting component 5 is convenient for overhead component body 4 simultaneously, is favorable to guaranteeing gaseous volatilizing and welded connection's speed.

According to some embodiments of the present application, optionally, the support assemblies 5 are disposed axisymmetrically along the vertical center line of the element body 4. The axisymmetrically arranged support members 5 ensure that the support member body 4 is balanced, and horizontal deviation can be reduced as much as possible during the process of melting the support members 5 and lowering the member body 4.

According to some embodiments of the application, optionally, the support posts are tin posts. The melting point of the tin column is larger than that of the tin paste, so that the exhaust space can be effectively ensured to play a role.

According to some embodiments of the present application, optionally, the melting point of the support member 5 is ≧ the melting point of the solder paste layer 3. It is effectively ensured that the solder paste layer 3 melts before the support element 5, and that the gas can have time to escape from the venting space before the melting process of the support element 5.

According to some embodiments of the present application, optionally, the height of the support pillar is greater than the thickness of the solder paste layer 3. Effectively ensuring that the supporting column can lift the element body 4 to form an exhaust space.

According to some embodiments of the present application, optionally, a fixing member 6 for preventing the component body 4 from being displaced when the component body 4 is connected to the pad 2 is provided between the component body 4 and the pad 2. The degree of offset during welding of the element body 4 is further reduced.

According to some embodiments of the present application, optionally, the fixing component 6 includes a solder paste area 61 and a position-limiting pillar 62, the solder paste area 61 is disposed on the bonding pad 2, one end of the position-limiting pillar 62 is connected to the component body 4, and the other end of the position-limiting pillar 62 is connected to the solder paste area 61. The position-limiting column 62 is convenient for forming a stable supporting and position-limiting structure at the side end of the element body 4.

The limiting posts 62 in the circuit board can be pins, which are also called pins, and Pin in English. The wiring is led out from the internal circuit of the integrated circuit (chip) and connected with the peripheral circuit, and all pins form the interface of the chip. And a section of the tail end of the lead is soldered to form a solder joint together with the pad on the printed board. The pins can be divided into a heel (bottom), a toe (toe), a side of the foot (side), and the like.

Optionally, the thickness of the solder paste region 61 is greater than the thickness of the solder paste layer 3, according to some embodiments of the present application. Through the thickness that increases tin cream district 61 for the laminating of spacing post 62 that unsettled originally and the tin cream of bodiness prevents the skew of component body.

According to some embodiments of the present application, optionally, the limiting column 62 is a pin, the pin is a component pin of the component body 4 itself, and the pin structure is generally two, but not limited to two, and may be multiple, so as to facilitate limiting the component body 4. The fixing component 6 for limiting the deviation of the element body 4 is an element pin on the element body 4, so that the use cost of a limiting scheme can be reduced.

According to some embodiments of the present application, the restraint posts 62 are optionally inverted L-shaped. The stable supporting and limiting structure is convenient to form at the side end of the element body.

According to some embodiments of the present application, there is provided a battery module including the circuit board in the above embodiments.

According to some embodiments of the present application, there is provided a battery pack 100, the battery pack 100 including the above-described battery module.

According to some embodiments of the present application, there is provided an electric device including a battery pack 100, the battery pack 100 being configured to provide electric energy.

The powered device may be any of the aforementioned battery-powered devices or systems.

According to some embodiments of the present application, referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of a circuit board according to some embodiments of the present application, and fig. 3 is a schematic structural diagram of a circuit board according to the prior art. The application provides a circuit board, 4 bottom symmetries of component body are placed the soldering tin piece and are formed on solder paste layer 3 and wait to weld the piece, the built on stilts gas volatilization space that forms between soldering tin piece and the component body 4, component body side is through the contact of its self pin and solder paste district 61, increase the thickness in the solder paste district 61 with the contact of component pin, component pin and solder paste district 61 contact back can guarantee that component body 4 does not squint in welding process.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure, and the present disclosure should be construed as being covered by the claims and the specification. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.

Claims

1. A circuit board, comprising:

a substrate (1);

a pad (2) disposed above the substrate (1);

a solder paste layer (3) provided above the pad (2);

an element body (4) provided above the solder paste layer (3);

a support component (5) is arranged between the bonding pad (2) and the element body (4), so that an exhaust space is formed between the element body (4) and the solder paste layer (3).

2. The wiring board of claim 1, wherein one end of the support member (5) is connected to the element body (4), and the other end of the support member (5) extends into the solder paste layer (3) to be connected to the pad (2).

3. Wiring board according to claim 2, characterized in that the support assembly (5) comprises at least two support posts.

4. Wiring board according to claim 3, characterized in that the support assemblies (5) are arranged axisymmetrically along the vertical center line of the component body (4).

5. The wiring board of claim 3, wherein the support posts are tin posts.

6. Wiring board according to any of claims 1 to 5, characterized in that the melting point of the support member (5) is greater than or equal to the melting point of the solder paste layer (3).

7. Wiring board according to any of claims 3-5, characterized in that the height of the support posts is larger than the thickness of the solder paste layer (3).

8. Wiring board according to any of claims 1 to 5, characterized in that a fixing member (6) for preventing the component body (4) from shifting when connected to the pad (2) is provided between the component body (4) and the pad (2).

9. The wiring board of claim 8, wherein the fixing component (6) comprises a solder paste area (61) and a limiting column (62), the solder paste area (61) is arranged on the soldering land (2), one end of the limiting column (62) is connected with the element body (4), and the other end of the limiting column (62) is connected with the solder paste area (61).

10. A wiring board according to claim 9, characterized in that the thickness of the solder paste area (61) is larger than the thickness of the solder paste layer (3).

11. The wiring board of claim 10, wherein the retention posts (62) are pins, which are component pins of the component body (4) itself.

12. The circuit board according to any one of claims 9 to 11, wherein the limiting posts (62) are of an inverted L shape.

13. A battery module, characterized in that the battery module comprises the wiring board according to any one of claims 1 to 12, the wiring board being located inside the battery module.

14. A battery pack (100), wherein the battery pack (100) comprises the battery module according to claim 13.

15. An electric consumer, characterized in that the electric consumer comprises a battery pack (100) according to claim 14, the battery pack (100) being adapted to provide electric energy.