CN102157471B - Dual-layer laminated patch rectifying full bridge - Google Patents
Dual-layer laminated patch rectifying full bridge Download PDFInfo
- Publication number
- CN102157471B CN102157471B CN 201010611327 CN201010611327A CN102157471B CN 102157471 B CN102157471 B CN 102157471B CN 201010611327 CN201010611327 CN 201010611327 CN 201010611327 A CN201010611327 A CN 201010611327A CN 102157471 B CN102157471 B CN 102157471B
- Authority
- CN
- China
- Prior art keywords
- tablet
- chip
- crowning
- flat surface
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Rectifiers (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention relates to a dual-layer laminated patch rectifying full bridge. The rectifying full bridge is designed by two layers of copper sheets and required crystal grains. Compared with the conventional rectifying full bridge formed by stacking five layers of copper sheets, copper materials are saved greatly, the cost of the rectifying full bridge is reduced, and the positioning of the crystal grains is more accurate and stable simultaneously, so the improvement on the rectifying effect of the rectifying full bridge is facilitated.
Description
Technical field
The present invention relates to a kind of rectifier bridge, the double-deck KFC tablet intersection of particularly a kind of usefulness stacks the double-deck stacked patch-type rectification full-bridge that fixed chip forms.
Background technology
The rectifier bridge module is the substitute products of the bridge rectifier of discrete rectifying tube, thyristor composition; Be that the rectification circuit that rectifying tube, controllable silicon are formed is encapsulated in the same shell; And the power electronic device product of new generation of circuit and casing insulation; Can be widely used in the power electronics control device, like fields such as inverter, motor, speed regulating device, elevator controls.The rectifier circuit that bridge-type module and discrete device are formed is compared, and it is little, easy for installation to have a volume; The reliability advantages of higher, the pin and the lead frame of existing rectifier bridge all adopt the KFC copper material to process, owing to rising steadily of copper material price; The production cost of rectifier bridge is constantly increased, and the structural design of extensive style and production technology can not be fit to the development of current semiconductor packages industry more in the past, and what the full-bridge of patch-type rectification before adopted is that five layers of lead frame structure are shelved; Be that five lamination sheets are stacked, then chip be arranged at the rectification circuit that forms between this five lamination sheets, this design consumption copper material amount is big; Shelve slowly the chip poor location.Such technology makes after the welding mold pressing when cutting the muscle operation will waste raw material, to such an extent as to production cost is very high with unnecessary copper material cutting away in vain.
Summary of the invention
The objective of the invention is to waste material and the high problem of cost, a kind of double-deck tablet rectification full-bridge is provided to the existing rectification full-bridge existence described in the background technology.
Realize that technical scheme of the present invention is following:
The stacked patch-type rectification of a kind of bilayer full-bridge, it comprises first tablet, second tablet and first chip, second chip, second chip and four-core sheet, the front of first tablet and second tablet is the light face; The back side is hair side; First tablet is provided with several first stations, is provided with and corresponding second station of first station with the corresponding position of first tablet on second tablet, and each station of first tablet is provided with first pin and second pin; First pin connects first flat surface and second flat surface; Second pin connects first crowning and second crowning, and second tablet is provided with second pin and the 4th pin, and the 3rd pin connects second flat surface and the 3rd crowning; The 4th pin connects Siping City's table top and the 4th crowning; Junction between each pin and flat surface or the crowning is provided with respect to the prone bending part of the light of tablet, and described first chip, second chip, the 3rd chip and four-core sheet are arranged at respectively on first flat surface, second flat surface, the 3rd flat surface and Siping City's table top, and the N utmost point of each chip is connected with corresponding flat surface; The P utmost point of first chip is connected with the 4th crowning; The P utmost point of second chip is connected with the 3rd crowning, and the P utmost point of second chip is connected with first crowning, and the P utmost point of four-core sheet is connected with second crowning.
For the ease of the attaching of rectification circuit, described first tablet is provided with first location hole that when being used for cartridge chip first tablet is positioned, and described second tablet is provided with second location hole that when being used for cartridge chip second tablet is positioned.
Discern first tablet and second tablet for the ease of operating personnel, described second location hole is different with the spacing or the quantity of first location hole.
For the ease of the assembling of chip, the height of described bending part is 0.2mm～0.3mm.
Described each chip all is to be connected through solder(ing) paste with flat surface and crowning.
Double-deck lamination rectification full-bridge of the present invention is compared greatly with the rectification full-bridge of existing five laminate structure and is saved material; Only need chip connected with two lamination sheets, form rectification circuit, the N utmost point of each chip connects flat surface; P utmost point connection bump face; Through solder(ing) paste chip and flat surface and crowning are linked together, the chip accurate positioning strengthens rectification circuit stability.
Description of drawings
Fig. 1 is a sketch map of the present invention;
Fig. 2 is the butt joint sketch map of first tablet of the present invention and second tablet;
Fig. 3 is circuit theory diagrams of the present invention;
Fig. 4 is the outline drawing of a station of double-deck stacked patch-type rectification full-bridge;
Among the figure, 1 is first tablet, and 2 is second tablet, and 3 is first chip, and 4 is second chip, and 5 is second chip; 6 is the four-core sheet, and 7 is first pin, and 8 is second pin, and 9 is second pin, and 10 is the 4th pin, and 11 is first flat surface; 12 is second flat surface, and 13 is the 3rd flat surface, and 14 is Siping City's table top, 15 first crownings, and 16 is second crowning; 17 is the 3rd crowning, and 18 is the 4th crowning, and 19 is bending part, and 20 is first location hole, and 21 is second location hole.
Embodiment
Referring to figs. 1 through the stacked patch-type rectification of a kind of bilayer full-bridge shown in Figure 4; It comprises first tablet 1, second tablet 2 and first chip 3, second chip 4, second chip 5 and the four-core sheet 6; The front of first tablet 1 and second tablet 2 is the light face, and the back side is hair side, and first tablet 1 is provided with several first stations; Be provided with and corresponding second station of first station with first tablet, 1 corresponding position on second tablet 2; Each station of first tablet 1 is provided with first pin 7 and second pin, 8, the first pins 7 connect first flat surface 11 and second flat surface, 12, the second pins 8 connect first crowning 15 and second crowning 16; Second tablet 2 is provided with second pin 9 and the 4th pin 10; Second pin 9 connects the 3rd flat surface 13 and the 3rd crowning 17, the four pins 10 connect Siping City's table top 14 and the 4th crowning 18, and the junction between each pin and flat surface or the crowning is provided with respect to the prone bending part 19 of the light of tablet; Described first chip 3, second chip 4, the 3rd chip 5 and four-core sheet 6 are not arranged on first flat surface 11, second flat surface 12, the 3rd flat surface 13 and Siping City's table top 14; The N utmost point of each chip is connected with corresponding flat surface, and the P utmost point of first chip 3 is connected with the 4th crowning 18, and the P utmost point of second chip 4 is connected with the 3rd crowning 17; The P utmost point of second chip 5 is connected with first crowning 15, and the P utmost point of four-core sheet 6 is connected with second crowning 16.Attaching for the ease of rectification circuit; Described first tablet 1 is provided with first location hole 20 that when being used for cartridge chip first tablet 1 is positioned, and described second tablet 2 is provided with second location hole 21 that when being used for cartridge chip second tablet 2 is positioned.Discern first tablet 1 and second tablet 2 for the ease of operating personnel, described second location hole 21 is different with the spacing or the quantity of first location hole 20.For the ease of the assembling of chip, the height of bending part 19 is 0.2mm～0.3mm.Each chip all is to be connected through solder(ing) paste with flat surface and crowning.
In assembling during rectification circuit, at first with first tablet, 1 light towards on be fixed on the frock plate, the frock plate be provided with first tablet 1 on the corresponding reference column of first location hole 20; After fixing, first chip 3 and second chip 4 are fixed on first flat surface 11 and second flat surface 12 with solder(ing) paste respectively, the N utmost point of chip is connected with flat surface; Then second tablet 2 is fixed on the frock plate, in the time of fixedly, second location hole 21 of second tablet 2 is corresponding with the reference column on the frock plate; Second chip 5 and four-core sheet 6 are fixed on second flat surface 13 and Siping City's table top 14, and the N utmost point of chip is connected with flat surface, then second tablet 2 is turned; Light faces down, and hair side upwards makes the light face of light face and first tablet 1 of second tablet 2 relative; Make first crowning 15 of first tablet 1 relative with the 3rd flat surface 13; Second crowning 16 is relative with Siping City's table top 14, and the 3rd crowning 17 is relative with second flat surface 12, and the 4th crowning 18 is relative with first flat surface 11; Through solder(ing) paste each crowning is linked together with the P utmost point of corresponding chip then; Form rectifier bridge, at last rectifier bridge is encapsulated, accomplish the processing of double-deck lamination rectifier bridge.First pin 7 of rectifier bridge is the direct-flow positive pole output, and second pin 8 is the direct current cathode output end, and the 3rd pin 9 and the 4th pin 10 are ac input end.
Claims (5)
1. the stacked patch-type rectification of bilayer full-bridge, it is characterized in that: it comprises first tablet, second tablet and first chip, second chip, second chip and four-core sheet, the front of first tablet and second tablet is the light face; The back side is hair side; First tablet is provided with several first stations, is provided with and corresponding second station of first station with the corresponding position of first tablet on second tablet, and each station of first tablet is provided with first pin and second pin; First pin connects first flat surface and second flat surface; Second pin connects first crowning and second crowning, and second tablet is provided with second pin and the 4th pin, and the 3rd pin connects second flat surface and the 3rd crowning; The 4th pin connects Siping City's table top and the 4th crowning; Junction between each pin and flat surface or the crowning is provided with respect to the prone bending part of the light of tablet, and described first chip, second chip, the 3rd chip and four-core sheet are arranged at respectively on first flat surface, second flat surface, the 3rd flat surface and Siping City's table top, and the N utmost point of each chip is connected with corresponding flat surface; The P utmost point of first chip is connected with the 4th crowning; The P utmost point of second chip is connected with the 3rd crowning, and the P utmost point of second chip is connected with first crowning, and the P utmost point of four-core sheet is connected with second crowning.
2. the stacked patch-type rectification of bilayer according to claim 1 full-bridge; It is characterized in that: described first tablet is provided with first location hole that when being used for cartridge chip first tablet is positioned, and described second tablet is provided with second location hole that when being used for cartridge chip second tablet is positioned.
3. the stacked patch-type rectification of bilayer according to claim 2 full-bridge is characterized in that: described second location hole is different with the spacing or the quantity of first location hole.
4. the stacked patch-type rectification of bilayer according to claim 1 full-bridge, it is characterized in that: the height of described bending part is 0.2mm～0.3mm.
5. the stacked patch-type rectification of bilayer according to claim 1 full-bridge is characterized in that: described each chip all is to be connected through solder(ing) paste with flat surface and crowning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010611327 CN102157471B (en) | 2010-12-29 | 2010-12-29 | Dual-layer laminated patch rectifying full bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010611327 CN102157471B (en) | 2010-12-29 | 2010-12-29 | Dual-layer laminated patch rectifying full bridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102157471A CN102157471A (en) | 2011-08-17 |
| CN102157471B true CN102157471B (en) | 2012-08-15 |
Family
ID=44438847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010611327 Active CN102157471B (en) | 2010-12-29 | 2010-12-29 | Dual-layer laminated patch rectifying full bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102157471B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474412A (en) * | 2013-09-27 | 2013-12-25 | 如皋市易达电子有限责任公司 | Rectangular array MINIDIP lead frame |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5218231A (en) * | 1989-08-30 | 1993-06-08 | Kabushiki Kaisha Toshiba | Mold-type semiconductor device |
| CN2545704Y (en) * | 2002-04-30 | 2003-04-16 | 贾继业 | Full-insulation electric electronic recitifier bridge arm |
| CN2850134Y (en) * | 2005-10-25 | 2006-12-20 | 西安中电变压整流器厂 | Rectifying bridge arm |
| CN201374331Y (en) * | 2009-03-16 | 2009-12-30 | 徐州奥尼克电气有限公司 | Automotive rectifier bridge with press-fit diode |
| CN201590754U (en) * | 2010-01-05 | 2010-09-22 | 海湾电子(山东)有限公司 | Surface mounted bending type rectifying bridge |
| CN201805359U (en) * | 2010-05-11 | 2011-04-20 | 扬州扬杰电子科技有限公司 | Encapsulated photovoltaic rectifier bridge stack |
| CN201918910U (en) * | 2010-12-29 | 2011-08-03 | 常州星海电子有限公司 | Double-layer lamination surface-mounted type rectifying full bridge |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63150954A (en) * | 1986-12-16 | 1988-06-23 | Toshiba Corp | Bridge type semiconductor device |
| US7741703B2 (en) * | 2006-10-06 | 2010-06-22 | Vishay General Semiconductor Llc | Electronic device and lead frame |
| TW201011890A (en) * | 2008-09-04 | 2010-03-16 | Formosa Epitaxy Inc | Alternating current light emitting device |
-
2010
- 2010-12-29 CN CN 201010611327 patent/CN102157471B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5218231A (en) * | 1989-08-30 | 1993-06-08 | Kabushiki Kaisha Toshiba | Mold-type semiconductor device |
| CN2545704Y (en) * | 2002-04-30 | 2003-04-16 | 贾继业 | Full-insulation electric electronic recitifier bridge arm |
| CN2850134Y (en) * | 2005-10-25 | 2006-12-20 | 西安中电变压整流器厂 | Rectifying bridge arm |
| CN201374331Y (en) * | 2009-03-16 | 2009-12-30 | 徐州奥尼克电气有限公司 | Automotive rectifier bridge with press-fit diode |
| CN201590754U (en) * | 2010-01-05 | 2010-09-22 | 海湾电子(山东)有限公司 | Surface mounted bending type rectifying bridge |
| CN201805359U (en) * | 2010-05-11 | 2011-04-20 | 扬州扬杰电子科技有限公司 | Encapsulated photovoltaic rectifier bridge stack |
| CN201918910U (en) * | 2010-12-29 | 2011-08-03 | 常州星海电子有限公司 | Double-layer lamination surface-mounted type rectifying full bridge |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102157471A (en) | 2011-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104022414B (en) | A kind of stack bus bar | |
| CN103400819B (en) | A kind of lead frame and its preparation method and application its encapsulating structure | |
| CN104767417A (en) | Control circuit of intelligent power module, intelligent power module and manufacturing method thereof | |
| CN103346181A (en) | Solar cell module without welding strips and preparation method thereof | |
| CN109301004A (en) | A kind of imbrication photovoltaic module and manufacturing method | |
| CN102569272B (en) | Multilayer spacer type IC (Integrated Circuit) chip stacked package of substrate and production method of package | |
| CN201413823Y (en) | Surface-mounted dual-chip diode rectifying device | |
| CN105704914B (en) | A kind of production method of the thick copper sheet and wiring board of different type wiring board | |
| CN108461459A (en) | A kind of cathode docking biphase rectification diode and its manufacturing process | |
| CN106211564A (en) | A kind of flexible circuit panel element and ground connection steel disc attachment means and method | |
| JP2009302327A (en) | Connection structure of wiring member, solar-battery module comprising the same, and its manufacturing method | |
| CN106898669A (en) | A kind of method that MWT photovoltaic modulies conduction core plate is combined with backboard | |
| CN201181702Y (en) | Thin soldering type commutation bridge stack | |
| CN102157471B (en) | Dual-layer laminated patch rectifying full bridge | |
| CN201918910U (en) | Double-layer lamination surface-mounted type rectifying full bridge | |
| CN211641255U (en) | High-temperature-resistant release film of PET (polyethylene terephthalate) base material | |
| CN108307593A (en) | A kind of thin plate core plate beats rivet fixture | |
| CN201118457Y (en) | Micro surface mount single-phase full wave bridge commutator | |
| CN105845764A (en) | Solar cell luminescent plate and manufacture method therefor | |
| CN107887352A (en) | It is easy to the rectifying device of radiating | |
| CN202084542U (en) | Chip in-line small bridge | |
| CN202394964U (en) | Multilayer-spacer IC (integrated circuit) chip laminated package for substrate | |
| CN115498069A (en) | Solar cell string connection method and photovoltaic module | |
| CN109244225A (en) | A kind of packaging method of flip-over type LED chip | |
| CN104952958B (en) | Exempt to weld photovoltaic module and processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Patentee after: Changzhou Xinghai Electronic Limited by Share Ltd Address before: 213022 Changzhou, Jiangsu new North District, Tianmu Lake Road, No. 1 Patentee before: Changzhou Star Sea Electronics Co., Ltd. |