CN201805359U - Encapsulated photovoltaic rectifier bridge stack - Google Patents
Encapsulated photovoltaic rectifier bridge stack Download PDFInfo
- Publication number
- CN201805359U CN201805359U CN 201020185452 CN201020185452U CN201805359U CN 201805359 U CN201805359 U CN 201805359U CN 201020185452 CN201020185452 CN 201020185452 CN 201020185452 U CN201020185452 U CN 201020185452U CN 201805359 U CN201805359 U CN 201805359U
- Authority
- CN
- China
- Prior art keywords
- rectifier bridge
- bridge stack
- diode chip
- photovoltaic
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/56—Power conversion systems, e.g. maximum power point trackers
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The utility model discloses an encapsulated photovoltaic rectifier bridge stack, and relates to an improved structure of the encapsulated photovoltaic rectifier bridge stack. The rectifier bridge stack has better electric performance and more reasonable structure. The rectifier bridge stack comprises a framework, a jumper, a diode chip and an encapsulation body, wherein the framework is provided with four pins extending out of the encapsulation body; the diode chip is a photovoltaic diode chip; and the middle part of the encapsulation body is provided with a through hole. A photovoltaic diode is adopted in the rectifier bridge stack, can realize forward voltage of below 0.5V, and has strong current electrifying capability. The integral electric performance of the product is promoted. The rectifier bridge stack can be connected with a support through the through hole in the middle of the encapsulation body so as to ensure the stability of the whole spatial position of a device.
Description
Technical field
The utility model relates to the improvement to encapsulation photovoltaic rectifier bridge pile structure.
Background technology
At present, the forward voltage of encapsulation bridge heap is more than 0.7V, and electric current energising ability is lower, causes in the customer line power consumption bigger.
From a structural point, the pin interconnect function that not only will electrify plays the interconnect function of device self simultaneously.Because pin is thinner, crack conditions in use often appears in insufficient strength, and then influences the work of entire circuit.
Summary of the invention
The utility model provides a kind of electrical property better at above problem, and structure more reasonably encapsulates the rectifier bridge heap.
The technical solution of the utility model is: comprise framework, wire jumper, diode chip for backlight unit and packaging body, described framework has four pins to stretch out outside the packaging body, and described diode chip for backlight unit is the photovoltaic diode chip; Described packaging body middle part is provided with through hole.
Described through hole is an elliptical aperture.
The utility model adopts photovoltaic diode, and photovoltaic diode can be realized forward voltage below 0.5V, and electric current energising ability is stronger.Promoted the electrical property of product integral body.Be provided with through hole at packaging body middle part, can realize and being connected of strutting piece by it, thereby guarantee the steadiness of the locus of device integral body.
Description of drawings
Fig. 1 is a structural representation of the present utility model
Fig. 2 is the left view of Fig. 1
Fig. 3 is a fundamental diagram of the present utility model
1 is pin among the figure, the 2nd, and wire jumper, the 3rd, diode chip for backlight unit, the 4th, framework, the 5th, through hole, the 6th, packaging body.
Embodiment
The utility model comprises framework 4, wire jumper 2, diode chip for backlight unit 3 and packaging body 6 as Figure 1-3, and described framework 4 has four pins 1 to stretch out outside the packaging body 6, and described diode chip for backlight unit 3 is the photovoltaic diode chip; Described packaging body 6 middle parts are provided with through hole 5.
Regulate for ease of installing, through hole 5 can be set to elliptical aperture.
Claims (2)
1. encapsulation photovoltaic rectifier bridge heap comprises framework, wire jumper, diode chip for backlight unit and packaging body, and described framework has four pins to stretch out outside the packaging body, it is characterized in that, described diode chip for backlight unit is the photovoltaic diode chip; Described packaging body middle part is provided with through hole.
2. encapsulation photovoltaic rectifier bridge heap according to claim 1 is characterized in that described through hole is an elliptical aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020185452 CN201805359U (en) | 2010-05-11 | 2010-05-11 | Encapsulated photovoltaic rectifier bridge stack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020185452 CN201805359U (en) | 2010-05-11 | 2010-05-11 | Encapsulated photovoltaic rectifier bridge stack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201805359U true CN201805359U (en) | 2011-04-20 |
Family
ID=43874859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020185452 Expired - Fee Related CN201805359U (en) | 2010-05-11 | 2010-05-11 | Encapsulated photovoltaic rectifier bridge stack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201805359U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157471A (en) * | 2010-12-29 | 2011-08-17 | 常州星海电子有限公司 | Dual-layer laminated patch rectifying full bridge |
| CN102723327A (en) * | 2012-06-15 | 2012-10-10 | 佛山市顺德区瑞淞电子实业有限公司 | Novel rectifier bridge for soybean milk maker |
-
2010
- 2010-05-11 CN CN 201020185452 patent/CN201805359U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157471A (en) * | 2010-12-29 | 2011-08-17 | 常州星海电子有限公司 | Dual-layer laminated patch rectifying full bridge |
| CN102157471B (en) * | 2010-12-29 | 2012-08-15 | 常州星海电子有限公司 | Dual-layer laminated patch rectifying full bridge |
| CN102723327A (en) * | 2012-06-15 | 2012-10-10 | 佛山市顺德区瑞淞电子实业有限公司 | Novel rectifier bridge for soybean milk maker |
| CN102723327B (en) * | 2012-06-15 | 2015-05-13 | 佛山市顺德区瑞淞电子实业有限公司 | Novel rectifier bridge for soybean milk maker |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Weiyang District pingshantang road Jiangyang Industrial Park 225008 Jiangsu city of Yangzhou Province three Patentee after: Yangzhou Yangjie Electronic Co., Ltd. Address before: 225008 Jiangsu province Yangzhou City Hall North Jiangyang Park three period Patentee before: Yangzhou Yangjie Electronic Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110420 Termination date: 20170511 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |