CN103474412A - Rectangular array MINIDIP lead frame - Google Patents
Rectangular array MINIDIP lead frame Download PDFInfo
- Publication number
- CN103474412A CN103474412A CN2013104466129A CN201310446612A CN103474412A CN 103474412 A CN103474412 A CN 103474412A CN 2013104466129 A CN2013104466129 A CN 2013104466129A CN 201310446612 A CN201310446612 A CN 201310446612A CN 103474412 A CN103474412 A CN 103474412A
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- lead frame
- unit
- minidip
- rectangular array
- frame body
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Abstract
The invention discloses a semiconductor packaged lead frame in the field of micro-electronic production, and particularly relates to a rectangular array MINIDIP lead frame. The rectangular array MINIDIP lead frame is formed by a lead frame body and a plurality of unit lead frame bodies, and the unit lead frame bodies are arranged in the lead frame body. The rectangular array MINIDIP lead frame is characterized in that the unit lead frame bodies are arranged on the lead frame body in a matrix mode, the lead frame body is composed of an upper sheet lead frame body and a lower sheet lead frame body, the unit lead frame bodies in the upper sheet lead frame body and the lower sheet lead frame body are alternatively arranged in an outer lead pin mode, and the unit lead frame bodies are connected with the borders of the lead frame body through grid bars. The rectangular array MINIDIP lead frame has the advantages of being simple in structure and reliable in process, reducing copper frame bodies, reducing the cost and the like.
Description
Technical field
The present invention relates to the lead frame of a kind of semiconductor packages of microelectronics production field, specifically for a kind of rectangular array MINIDIP lead frame.
Background technology
The series of DIP encapsulation is early development lead frame pattern out, at that time because being subject to the impact of lead frame rolled copper foil manufacturing technology, diel and stamping technology, the encapsulation aspect is subject to plastic package die, electroplate the restriction select coating technology, to cut the conditions such as the accuracy of identification of muscle shaping dies technology, upper core/pressure welding device and operation window scope, lead frame generally designs at loam mono-30mm with interior width, be double or single design, every 10-20 unit do not wait.At present list/double DIP series of products belong to people intensive encapsulating products, have that production efficiency is low, material is sharp
Low by rate, course of processing error rate is high, use equipment is many, cause the problems such as floor space is large, energy resource consumption is large, the manual processing mold security risk of DIP is large, using framework when the MINIDIP bridge is produced is five chips, and the overlapping series connection of chip parallel connection again is combined into rectifier bridge; After the body encapsulation, thickness reaches 2.5mm; Required copper framework cost is higher.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of employing rectangular array MINIDIP lead frame is provided, chip plane arrangement mode is produced, and can effectively reduce the thickness after encapsulation, and has reduced the cost of copper framework.
The present invention is achieved by the following technical solutions:
A kind of rectangular array MINIDIP lead frame, by lead frame and several unit lead frames of being located in lead frame, formed, it is characterized in that: described unit lead frame is matrix form and arranges on described framework, lead frame is comprised of upper slice lead frame and lower lead frame, unit lead frame in the fluctuating plate lead frame is the outer lead pin and is staggered, and is connected with described framework border by grizzly bar; Described lead wire unit framework is that two carrier structures are that each unit lead frame has two carriers, and the pin of unit lead frame is connected with carrier; Unit lead frame in described lead frame consists of 18 row 10 row; The carrier of the unit lead frame on upper slice lead frame is placed first, second IC chip, and the carrier of the unit lead frame on lower lead frame is placed the 3rd, the 4th IC chip.
The present invention compared with prior art has following beneficial effect:
1. frame structure is simple, process;
2. reduced the copper framework, reduced costs.
The accompanying drawing explanation
Fig. 1 is rectangular array MINIDIP lead frame structure figure;
Fig. 2 is unit lead frame connection layout;
Fig. 3 is the rectifier bridge electrical schematic diagram.
In figure: lead frame 1, unit lead frame 2, chip carrier 3 and go between 4.
Embodiment
Below in conjunction with accompanying drawing, content of the present invention is further described:
Be illustrated in figure 1 rectangular array MINIDIP lead frame structure figure, be comprised of upper and lower two lead frames, using framework when old MINIDIP bridge is produced is five chips, and the overlapping series connection of chip parallel connection again is combined into rectifier bridge; After the body encapsulation, thickness reaches 2.5mm; Required copper framework cost is higher; The new mode of production adopts rectangular array, chip plane arrangement mode to produce, and thickness can be reduced to 1.4mm.
Lead frame of the present invention consists of several unit lead frames that are located in lead frame, described unit lead frame is matrix form and arranges on described framework, lead frame is comprised of upper slice lead frame and lower lead frame, unit lead frame in the fluctuating plate lead frame is the outer lead pin and is staggered, and is connected with described framework border by grizzly bar; Described lead wire unit framework is that two carrier structures are that each unit lead frame has two carriers, and the pin of unit lead frame is connected with carrier; Unit lead frame in described lead frame consists of 18 row 10 row; The carrier of the unit lead frame on upper slice lead frame is placed first, second IC chip, and the carrier of the unit lead frame on lower lead frame is placed the 3rd, the 4th IC chip.
Claims (4)
1. a rectangular array MINIDIP lead frame, by lead frame and several unit lead frames of being located in lead frame, formed, it is characterized in that: described unit lead frame is matrix form and arranges on described framework, lead frame is comprised of upper slice lead frame and lower lead frame, unit lead frame in the fluctuating plate lead frame is the outer lead pin and is staggered, and is connected with described framework border by grizzly bar.
2. rectangular array MINIDIP lead frame according to claim 1 is characterized in that: described lead wire unit framework is that two carrier structures are that each unit lead frame has two carriers, and the pin of unit lead frame is connected with carrier.
3. rectangular array MINIDIP lead frame according to claim 1 is characterized in that: the unit lead frame in lead frame consists of 18 row 10 row.
4. rectangular array MINIDIP lead frame according to claim 1, it is characterized in that: the carrier of the unit lead frame on upper slice lead frame is placed first, second IC chip, and the carrier of the unit lead frame on lower lead frame is placed the 3rd, the 4th IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013104466129A CN103474412A (en) | 2013-09-27 | 2013-09-27 | Rectangular array MINIDIP lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013104466129A CN103474412A (en) | 2013-09-27 | 2013-09-27 | Rectangular array MINIDIP lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103474412A true CN103474412A (en) | 2013-12-25 |
Family
ID=49799209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013104466129A Pending CN103474412A (en) | 2013-09-27 | 2013-09-27 | Rectangular array MINIDIP lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103474412A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614759A (en) * | 1994-07-12 | 1997-03-25 | General Instrument Corp. | Automated assembly of semiconductor devices using a pair of lead frames |
| CN102157471A (en) * | 2010-12-29 | 2011-08-17 | 常州星海电子有限公司 | Dual-layer laminated patch rectifying full bridge |
| CN202651102U (en) * | 2012-05-15 | 2013-01-02 | 常州银河世纪微电子有限公司 | Lead frame of bridge rectifier |
| CN203553142U (en) * | 2013-09-27 | 2014-04-16 | 如皋市易达电子有限责任公司 | Matrix array minidip lead frame |
-
2013
- 2013-09-27 CN CN2013104466129A patent/CN103474412A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614759A (en) * | 1994-07-12 | 1997-03-25 | General Instrument Corp. | Automated assembly of semiconductor devices using a pair of lead frames |
| CN102157471A (en) * | 2010-12-29 | 2011-08-17 | 常州星海电子有限公司 | Dual-layer laminated patch rectifying full bridge |
| CN202651102U (en) * | 2012-05-15 | 2013-01-02 | 常州银河世纪微电子有限公司 | Lead frame of bridge rectifier |
| CN203553142U (en) * | 2013-09-27 | 2014-04-16 | 如皋市易达电子有限责任公司 | Matrix array minidip lead frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131225 |