CN112437979A

CN112437979A - Electronic packaging assembly, camera, movable platform and preparation method thereof

Info

Publication number: CN112437979A
Application number: CN201980033537.9A
Authority: CN
Inventors: 闫绍盟; 王玮; 王翰骏; 单学君
Original assignee: SZ DJI Technology Co Ltd
Current assignee: SZ DJI Technology Co Ltd
Priority date: 2019-07-24
Filing date: 2019-07-24
Publication date: 2021-03-02
Also published as: WO2021012228A1

Abstract

An electronic package assembly (10), comprising: a first main device (1), a first circuit board (2), a support (3); the first circuit board and the first main device (1) are arranged in a stacked mode (2), and a plurality of second welding parts (21) of the first circuit board (2) are opposite to a plurality of first welding parts (11) of the first main device (1) and connected through welding points (4); the support (3) is arranged between the first main component (1) and the first circuit board (2) and is used for determining the gap height between the first main component (1) and the first circuit board (2) so that the gap height is matched with the height of the support (3).

Description

Electronic packaging assembly, camera, movable platform and preparation method thereof

Technical Field

The present application relates to the field of packaging technologies, and in particular, to an electronic package assembly, a camera, a movable platform, and a method for manufacturing the electronic package assembly.

Background

With the development of electronic products towards performance improvement, volume reduction and higher integration level, flip chip devices (BGA \ CSP \ POP \ LGA, etc.) are increasingly applied to electronic products. However, during the soldering process of the large-size flip chip device, the problems of short circuit, tin bead and the like often occur, for example, when the large-size device is soldered on a PCB, the problems of short circuit, tin bead and the like caused by poor coplanarity between the large-size device and the PCB.

For example, LGA devices are generally soldered to a Printed Circuit Board (PCB) by Surface Mounting Technology (SMT), and specifically, solder paste is Printed on the PCB, then attached to the PCB, and finally reflowed. However, during reflow soldering, the coplanarity between large-size LGA devices and PCBs is poor, the solder joints are not uniform, and problems such as short circuits and solder balls often occur, which results in the repair of PCBA (Printed Circuit Board + Assembly).

Disclosure of Invention

Based on this, the application provides an electronic packaging component, a camera, a movable platform and a preparation method of the electronic packaging component, and aims to solve the problems of short circuit, tin balls and the like which often occur in the welding process of the existing large-size flip chip welding device.

In a first aspect, the present application provides an electronic package assembly comprising:

the first main device is provided with a plurality of first welding parts at intervals on a first side;

the first circuit board is stacked with the first main device, wherein a first side of the first circuit board is arranged opposite to a first side of the first main device, a plurality of second welding parts are arranged at intervals on the first side of the first circuit board, the plurality of second welding parts are arranged opposite to the plurality of first welding parts, and the oppositely arranged first welding parts and the second welding parts are connected through welding spots so as to realize the electric connection between the first main device and the first circuit board; and the number of the first and second groups,

and the supporting piece is arranged between the first main part and the first circuit board, is respectively connected with the first main part and the first circuit board, and is used for determining the gap height between the first main part and the first circuit board so as to enable the gap height to be matched with the height of the supporting piece.

In a second aspect, the present application provides a camera comprising: the image sensor converts a sensed optical signal into an electrical signal and transmits the electrical signal to the image processor, the image processor performs operation processing on the electrical signal and transmits data after the operation processing to the memory for storage, at least one of the image sensor, the image processor and the memory comprises an electronic packaging component, and the electronic packaging component comprises:

In a third aspect, the present application provides a movable platform comprising a processor including an electronic package assembly comprising:

In a fourth aspect, the present application provides a method of making an electronic package assembly, comprising:

providing a first main device, a first circuit board and a support member, wherein a plurality of first welding parts are arranged on a first side of the first main device at intervals, a plurality of second welding parts are arranged on a first side of the first circuit board at intervals, and the support member is used for determining the gap height between the first main device and the first circuit board;

pre-connecting a first soldering part of the first main device and a second soldering part of the first circuit board by solder, and pre-connecting the support member between the first main device and the first circuit board by solder to form a pre-packaged assembly;

and welding the pre-packaging assembly to form a plurality of welding points between the first welding part and the second welding part which are oppositely arranged, so that the first main device and the first circuit board are arranged in a stacked manner, and the gap height between the first main device and the first circuit board is matched with the height of the supporting piece.

The embodiment of the application provides an electronic packaging assembly, a camera, a movable platform and a preparation method of the electronic packaging assembly, wherein a support piece is arranged between a first main device and a first circuit board and is respectively connected with the first main device and the first circuit board for determining the gap height between the first main device and the first circuit board so as to enable the gap height to be matched with the height of the support piece, a first welding part and a second welding part which are oppositely arranged on the first main device and the first circuit board are connected in the gap height determined by the support piece through welding points, the gap height is determined by the height of the support piece and is not determined by the coplanarity between the first main device and the first circuit board, and by the method, the influence of good and bad coplanarity between the first main device and the first circuit board can be avoided, so that the welding quality of the first welding part and the second welding part can be ensured, the solder joint is ensured to be even, and the problems of short circuit, tin bead and the like are avoided.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic package assembly of the present application;

FIG. 2 is a schematic structural view of another embodiment of an electronic package assembly of the present application;

FIG. 3 is a schematic structural view of yet another embodiment of the electronic package assembly of the present application;

FIG. 4 is a schematic view of the occurrence of warp deformation of a BGA device during cooling or during heating;

fig. 5 is a schematic view of the BGA device of fig. 4 warped to easily cause an open solder ball;

FIG. 6 is a schematic structural diagram of an embodiment of a camera according to the present application;

FIG. 7 is a schematic structural diagram of an embodiment of a movable stage of the present application;

fig. 8 is a schematic flow chart diagram illustrating an embodiment of a method for fabricating an electronic package assembly according to the present application.

Description of the main elements and symbols:

10. an electronic package assembly;

1. a first master device; 11. a first weld; 12. a first surface of a first master device;

2. a first circuit board; 21. a second weld; 22. a first surface of a first circuit board;

3. a support member; 31. a jig; 311. a groove; 312. a protrusion; 4. welding spots; 5. an electronic device;

100. a camera; 20. an image sensor; 30. an image processor; 40. a memory;

200. a movable platform; 50. a processor.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The flow diagrams depicted in the figures are merely illustrative and do not necessarily include all of the elements and operations/steps, nor do they necessarily have to be performed in the order depicted. For example, some operations/steps may be decomposed, combined or partially combined, so that the actual execution sequence may be changed according to the actual situation.

In the process of welding a large-size flip chip device, the problems of short circuit, tin beads and the like often occur. The application aims at the technical problem and provides a support piece arranged between a first main device and a first circuit board which are welded, and the height of a gap between the first main device and the first circuit board is determined through the support piece. Determining the gap height here has two main implications: one is to adjust the gap height through the supporting piece to ensure that the welding between the first main device and the first circuit board is good at the proper gap height, and the poor problems of short circuit, tin bead and the like are avoided; the other is to fix the gap height between the first main device and the first circuit board to prevent the gap height from changing, which causes the bad problems of short circuit, tin bead and the like. Wherein the large size flip chip device can be used in sub-equipment including but not limited to cameras, movable platforms. The movable platform includes, but is not limited to, an unmanned aerial vehicle, a handheld tripod head, and a tripod head vehicle.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an electronic package assembly of the present application, the electronic package assembly including: a first main device 1, a first circuit board 2 and a support 3.

The first circuit board 2 is stacked with the first main device 1. The supporting member 3 is disposed between the first main device 1 and the first circuit board 2, and the supporting member 3 is connected to the first main device 1 and the first circuit board 2, respectively, for determining a gap height between the first main device 1 and the first circuit board 2 so that the gap height matches a height of the supporting member 3. The height of the support 3 may serve to fix and adjust the height of the gap between the first main device 1 and the first circuit board 2. In some embodiments, the height of the gap between the first main device 1 and the first circuit board 2 is adjustable, i.e. the height of the gap between the first main device 1 and the first circuit board 2 can be adjusted depending on the height of the support 3. In other embodiments, the height of the gap between the first main device 1 and the first circuit board 2 is not adjustable, i.e. the height of the gap between the first main device 1 and the first circuit board 2 can be further fixed according to the height of the support 3, preventing the height of the gap between the first main device 1 and the first circuit board 2 from being changed due to changes in external conditions.

Meanwhile, the first main device 1 and the first circuit board 2 are connected by the solder joint 4 in a normal electrical connection manner by the first solder part 11 and the second solder part 21, respectively, so as to achieve electrical connection. Wherein a first side of the first circuit board 2 is arranged opposite to a first side of the first master 1. A plurality of first welding parts 11 are arranged at intervals on the first side of the first main device 1. The first side of the first circuit board 2 is provided with a plurality of second soldering portions 21 at intervals, and the plurality of second soldering portions 21 are arranged opposite to the plurality of first soldering portions 11. The first soldering portion 11 and the second soldering portion 21 are connected by the soldering point 4 to electrically connect the first main device 1 and the first circuit board 2.

The embodiment of the application provides an electronic packaging assembly, a supporting piece 3 is arranged between a first main device 1 and a first circuit board 2, the supporting piece 3 is respectively connected with the first main device 1 and the first circuit board 2 and is used for determining the gap height between the first main device 1 and the first circuit board 2 so as to enable the gap height to be matched with the height of the supporting piece 3, the gap height is determined by the height of the supporting piece 3 and not determined by the coplanarity between the first main device 1 and the first circuit board 3, and the height of the supporting piece 3 is equivalent to the fixed gap height, the gap height can be prevented from changing, by the method, the influence of the coplanarity between the first main device 1 and the first circuit board 2 can be avoided, the influence of external conditions on the gap height between the first main device 1 and the first circuit board 2 can be avoided, and the welding quality of a first welding part 11 and a second welding part 21 can be ensured, the welding spot 4 is ensured to be even, and the problems of short circuit, tin bead and the like are avoided.

In the embodiment of the present application, the first main device 1 includes, but is not limited to, a flip chip device (e.g., BGA device, CSP device, POP device, LGA device, etc.), especially a large-sized flip chip device (e.g., flip chip device with diagonal length of about 80 mm), and the first main device 1 may also be another circuit board (e.g., printed circuit board, flexible circuit board, rigid-flex board, etc.). The first circuit board 2 includes, but is not limited to, a printed circuit board, a flexible circuit board, a rigid-flex board, and the like.

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components; the printed circuit board can be divided into single-sided boards, double-sided boards, four-layered boards, six-layered boards and other multi-layered circuit boards according to the number of layers of the printed circuit board. The main advantages of using a printed circuit board are that wiring and assembly errors can be greatly reduced, and the level of automation and production labor can be improved.

A Flexible Printed Circuit Board (FPC), referred to as a "Flexible Board" for short, is a Printed Circuit Board made of a Flexible insulating base material (mainly polyimide or polyester film), can be freely bent, wound, and folded, and has the advantages of good heat dissipation and solderability, easy assembly and connection, low comprehensive cost, and the like; the flexible circuit board is divided into a single-sided board, a double-sided board and a multilayer board. The FPC can be used for greatly reducing the volume of electronic products, and is suitable for the development of the electronic products in the directions of high density, miniaturization and high reliability.

In the present embodiment, the electronic device that can be used as the first main device 1 is wide in range, and the circuit board that can be used as the first circuit board 2 is also wide in range, which makes the electronic package assembly of the embodiments of the present application have a wide application range.

Wherein, when the height of the gap between the first main device 1 and the first circuit board 2 is adjustable, the first circuit board 2 and the first main device 1 may be stacked and spaced apart. When the gap height between the first main device 1 and the first circuit board 2 is not adjustable, the first circuit board 2 and the first main device 1 are merely stacked.

Specifically, since the BGA device has solder balls formed on the bottom thereof as I/O terminals of the circuit to be interconnected with the circuit board, if the first main device 1 is a BGA device, the first circuit board 2 and the BGA device can only be stacked. When the first main device 1 is not a BGA device, the first circuit board 2 and the first main device 1 may be disposed at a lamination interval.

When the first circuit board 2 and the first main device 1 may be stacked and spaced apart, a gap height between the first circuit board 2 and the first main device 1 can be adjusted by the support 3. When the first circuit board 2 and the first main device 1 are merely stacked, the gap height between the first circuit board 2 and the first main device 1 can be fixed by the support 3, and the gap height between the first circuit board 2 and the first main device 1 can be prevented from changing.

The size of the first main device 1 matches the size of the first circuit board 2, that is, the electronic package assembly 10 of the embodiment of the present application does not limit the size of the first main device 1 and the size of the first circuit board 2, and further expands the application range. In some embodiments, the size of the first master device 1 may be larger than the size of the first circuit board 2. In other embodiments, the size of the first master device 1 may be equal to the size of the first circuit board 2. In still other embodiments, the size of the first master device 1 may be smaller than the size of the first circuit board 2.

The supporting member 3 is used to determine a gap height between the first main device 1 and the first circuit board 2, and any structure capable of determining the gap height may be used as the supporting member 3 in the embodiment of the present application, and the structure of the supporting member 3 is not limited herein.

The position where the support 3 is disposed is not limited. In an embodiment, the support 3 is arranged close to an edge position of the first master 3. The support member 3 is disposed at an edge position close to the first main device 1, and on one hand, it is easier to dispose the support member 3 at the edge position, and on the other hand, normal soldering between the first main device 1 and the first circuit board 2 is not affected.

The number and shape of the supports 3 are not limited. In some embodiments, the number of the support 3 is one, and the shape thereof includes at least one of: a square, a triangle and a U shape. In the present embodiment, the number of the supporting members 3 is small, the cost is low, and the shape of the supporting members 3 is simple and easy to obtain. In other embodiments, the number of the supporting members 3 is plural, and the shape thereof may be a column shape, and the plural supporting members are arranged at intervals between the first main device 1 and the first circuit board 2. In this embodiment, the shape of the support 3 is simple, very easily available and widely selectable.

The height of the support 3 is not limited and is determined according to the specific application. In some embodiments, the height of the support 3 may be uniform. Wherein, when the number of the supporters 3 is plural, the heights of the plural supporters 3 are uniform. Since the heights of the plurality of supporting members 3 are consistent, the supporting members are convenient to manufacture, and the heights of gaps between the first main device 1 and the first circuit board 2 can be ensured to be consistent. Further, the height of each support is in the range of 0.2-0.4mm, i.e. the gap height is in the range of 0.2-0.4mm, for example: 0.2mm, 0.3mm, 0.4mm, etc. In other embodiments, the height of the supports may not be uniform. For example, when the first side of the first main device 1 and/or the first side of the first circuit board 2 are/is rugged, the height of the support member 3 may be non-uniform in order to keep the first main device 1 as horizontal or parallel as possible after being soldered to the first circuit board 2.

In a specific application, when the size of the first main device 1 is smaller than that of the first circuit board 2, the supporting member 3 includes a chip device, and the chip device in this embodiment includes a mountable component and a non-mountable component, for example: unpackaged die (die). Further, the support 3 includes a patch element. Patch components include, but are not limited to: various mountable small-sized components, such as 01005, 0201, 0805, and the like.

In another specific application, when the size of the first main device 1 is equal to or larger than the size of the first circuit board 2, the support 3 includes a jig 31. Typically, the fixture 31 is a tool of the general type used by carpenters, ironmen, pliers, machinery, electrical control and other handicraft articles, and is used mainly as a tool for assisting in controlling position and/or motion. In the present embodiment, the jig 31 is used to determine the gap height between the first main device 1 and the first circuit board 2, so that the gap height matches the height of the supporting member 3.

Specifically, referring to fig. 2, in an embodiment, the jig 31 includes a groove 311 and a protrusion 312 at an edge of the groove 311, the groove 311 is used for accommodating the first circuit board 2, and the protrusion 312 is used for determining a gap height between the first main device 1 and the first circuit board 2. Because the groove 311 of the jig 31 is used for accommodating the first circuit board 2, the jig 31 can fix the first circuit board 2 and prevent the first circuit board 2 from moving in addition to determining the gap height. Further, the groove 311 is square, and the first circuit board 2 can be accommodated at the bottom of the groove 311. The first circuit board 2 can be accommodated at the bottom of the recess 311, which makes the position of the first circuit board 2 more stable.

The first welding portion 11 and the second welding portion 21 are used for welding and electrically connecting by the welding spot 4 formed by welding, and as long as the first welding portion 11 and the second welding portion 21 which are oppositely arranged are matched in structure, the electrically connecting by the welding spot 4 formed by welding can be realized, and the structure of the first welding portion 11 and the second welding portion 21 is not limited herein.

Specifically, the first solder part 11 includes a first pad or a first solder ball. The second soldering part 21 includes a second pad or a second solder ball. When the second soldering portion 21 includes a second solder ball, the second solder ball may be fabricated on the first circuit board 2 as the second soldering portion 21. The pad and the solder ball are soldering portions with a wider range of practical applications, which makes the electronic package assembly 10 of the embodiment of the present application suitable for both the first soldering portion 11 and the second soldering portion 21 with a common soldering portion structure. Of course, the first welding part 11 and the second welding part 21 may have other structures, such as a welding column, a welding pin, and the like.

Note that, typically, solder balls are matched to pads; and the pads may be matched to pads, or balls. Taking the general soldering part structure as an example, in a practical application, the first soldering part 11 is a first pad, the second soldering part 21 is a second pad, and the solder joint 4 is formed by soldering the first pad of the first main device 1 and the second pad of the first circuit board 2 with a cream solder. For example: when the first main device 1 is an LGA device or a printed circuit board, the first solder part 11 may be a first pad. When the first circuit board 2 is a printed circuit board or a flexible circuit board, the second soldering part 21 may be a first pad.

In another practical application, the first soldering portion 11 is a first solder ball, the second soldering portion 21 is a second pad, and the solder joint 4 is formed by soldering the first solder ball of the first main device 1 and the second pad of the first circuit board 2. For example: when the first main device 1 is a BGA device, the first solder part 11 may be a first solder ball. Or when the first main device 1 is a printed circuit board, the first solder ball may be exclusively made as the first solder part 11. When the first circuit board 2 is a printed circuit board or a flexible circuit board, the second soldering part 21 may be a first pad.

Specifically, the cream solder includes a solder paste. The cream solder is commonly called soldering paste, and the main component of the existing soldering paste is tin-lead alloy, so the soldering paste is also called tin-lead soldering paste or soldering paste (also called tin paste). The solder paste should be sufficiently viscous to adhere the SMT components to the printed circuit board until reflow is complete. The solder paste consists of solder powder and pasty soldering flux. The solder powder is alloy powder and is the main component of the solder paste. The alloy composition, particle shape and size of the solder powder have a critical influence on the characteristics of the solder paste and the quality of the solder joint (wetting, height and reliability of the solder joint).

Tin-lead eutectic solder paste is most widely applied in soldering electronic equipment. The gold-tin solder has good welding quality on the surface of a gold conductor and is commonly used for welding high-density SMT components. The addition of silver to the tin-lead alloy can increase the strength of the solder, improve the heat resistance and wettability and reduce the leaching of the surface of the silver-plated wire. The bismuth is added into the tin-lead alloy, so that the strength can be improved, the melting point can be reduced, and the welding at low temperature is facilitated. The lead-indium solder has good ductility and low leaching rate to a gold conductor, and is suitable for welding SMT components and general circuits.

In an embodiment, the plurality of first welding parts 11 may be disposed on the entire area of one surface of the first main device 1, or may be disposed on a partial area of one surface of the first main device 1. In particular, the first master device 1 comprises a first surface 12, the first surface 12 of the first master device 1 being located at a first side of the first master device 1. In a practical application, a plurality of first welding portions 11 are arranged at intervals on the whole area of the first surface 12 of the first main device 1. In another practical application, a plurality of first welding portions 11 are arranged at intervals on partial areas of the first surface 12 of the first main device 1.

In general, in order to increase the connection stability between the first main device 1 and the first circuit board 2, a plurality of first solder parts 11 may be provided at intervals over the entire area of the first surface 12 of the first main device 1; when it is necessary to increase the transmission speed of the electrical signal, it is possible to increase the number of first welds 11 of the first main device 1 and to space the plurality of first welds 11 over the entire area of the first surface 12 of the first main device 1. In other cases, in order to reduce the solder 4 connection between the first main component 1 and the first circuit board 2, a plurality of first solder portions 11 may be provided at intervals in a partial area of the first surface 12 of the first main component 1.

In an embodiment, the plurality of second soldering portions 21 may be disposed on the whole area of the surface of the first circuit board 2, or may be disposed on a partial area of the surface of the first circuit board 2. Specifically, the first circuit board 2 includes a first surface 22, and the first surface 22 of the first circuit board 2 is located on a first side of the first circuit board 2. In a practical application, a plurality of second soldering portions 21 are spaced apart from each other on the entire area of the first surface 22 of the first circuit board 2. In another practical application, a plurality of second soldering portions 21 are arranged at intervals on a partial area of the first surface 22 of the first circuit board 2.

In general, in order to increase the connection stability between the first main device 1 and the first circuit board 2, a plurality of second solder portions 21 may be provided at intervals over the entire area of the first surface 22 of the first circuit board 2; when it is necessary to increase the transmission speed of the electrical signal, the number of the second soldering portions 21 of the first circuit board 2 may be increased, and the plurality of second soldering portions 21 may be spaced apart over the entire area of the first surface 22 of the first circuit board 2. In other cases, in order to reduce the solder 4 connection between the first main device 1 and the first circuit board 2, a plurality of second solder portions 21 may be provided at intervals in a partial area of the first surface 22 of the first circuit board 2.

In practical applications, the second side of the first circuit board 2 is also connectable to electronic devices, the second side of the first circuit board 2 being the side opposite to the first side of the first circuit board 2.

Referring to fig. 3, the second side of the first circuit board 2 is connected with an electronic device 5, and further the electronic device 5 comprises a second circuit board, which may also be another electronic device. Wherein the second circuit board comprises a printed circuit board, and may also comprise a flexible circuit board, etc. In this way, further functions of the electronic package assembly 10 can be added, since the second side of the first circuit board 2 can be connected with further electronic devices 5.

The electronic package assembly 10 according to the embodiment of the present application will be specifically described below by taking the first main device 1 as an example including an LGA device, a BGA device, or a printed circuit board, and taking the first circuit board 2 as an example including a printed circuit board.

In an embodiment, the first master device 1 comprises an LGA device, in particular an LGA device with a diagonal length of 70-90 mm. The first circuit board 2 comprises a printed circuit board PCB.

In practical application, due to poor coplanarity of the LGA device and the PCB, poor problems such as open short circuit and solder balls often occur, resulting in repair of the PCBA.

In the embodiment of the application, set up support piece 3 between LGA device and PCB, clearance between increase LGA device and the PCB, when the welding, increase the solder simultaneously, can avoid taking place to open bad problems such as short circuit and tin pearl very effectively to promote PCBA's processing yield. In practical application, the support member 3 is arranged between the LGA device and the PCB, so that the gap between the LGA device and the PCB is increased, nearly hundreds of single boards are mounted, and no defect is found. In the past, the LGA device was soldered to a PCB with a defect rate of about 50%. The clearance between the LGA device and the PCB is increased, and the temperature cycle reliability of the PCBA is improved.

In another embodiment, the first main device 1 comprises a BGA device, in particular a large-sized BGA device. The first circuit board 2 comprises a printed circuit board PCB.

The BGA device has solder balls formed on the bottom thereof for interconnecting the I/O terminals of the circuit with the printed circuit board. In practical use, warpage deformation of the BGA device is liable to occur, which occurs due to a difference in the degree of shrinkage (cooling process) or expansion (heating process) between the BGA device and the printed circuit board during cooling or heating (see fig. 4); referring to fig. 5, warpage of the BGA device tends to open the solder balls (position a in the figure), causing solder failure between the BGA device and the printed circuit board.

A support member 3 is provided between the BGA device and the printed circuit board, and since the support member 3 is connected to the BGA device and the printed circuit board, respectively, it functions to determine a gap height between the BGA device and the printed circuit board so that the gap height matches a height of the support member 3. That is, it can be guaranteed that the gap height between the BGA device and the printed circuit board is matched with the height of the support 3 by the support 3, in other words, the gap height between the BGA device and the printed circuit board can be fixed by the support 3, and it can be prevented that the gap height between the BGA device and the printed circuit board is changed due to a change in external conditions (e.g., a cooling process or a heating process), so that it is possible to avoid occurrence of warpage of the BGA device, and it is possible to avoid occurrence of undesirable problems such as open circuit of solder balls and failure of soldering.

In a further embodiment, the first master device 1 comprises a printed circuit board. The first circuit board 2 comprises a printed circuit board PCB. I.e. when the printed circuit board is electrically connected to the printed circuit board by soldering, a support 3 may also be provided. The supporting member 3 adjusts the height of the gap between the printed circuit board and the pcb to a proper height so that the soldering quality between the pcb and the pcb is good. By the mode, the problems of open short circuit, tin balls and the like can be effectively avoided, and the processing yield is improved.

Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of the camera of the present application, where the camera 100 includes: the image sensor 20 converts a sensed optical signal into an electrical signal and transmits the electrical signal to the image processor 30, the image processor 30 performs an operation on the electrical signal and transmits data after the operation to the memory 40 for storage, the image sensor 20, the image processor 30 and the memory 40 are connected by a bus 101, at least one of the image sensor 20, the image processor 30 and the memory 40 includes the electronic package 10 (the memory 40 includes the electronic package 10 in the figure is taken as an example), and the electronic package 10 is described in detail in the above description, which will not be described again.

The electronic package assembly 10 includes: the first main device, the first circuit board and the support member.

A plurality of first welding parts are arranged on the first side of the first main device at intervals; the first circuit board and the first main device are arranged in a stacked mode, wherein the first side of the first circuit board is opposite to the first side of the first main device, a plurality of second welding parts are arranged on the first side of the first circuit board at intervals, the plurality of second welding parts are opposite to the plurality of first welding parts, and the first welding parts and the second welding parts which are opposite to each other are connected through welding spots so as to achieve electric connection of the first main device and the first circuit board; the supporting piece is arranged between the first main device and the first circuit board, and the supporting piece is connected with the first main device and the first circuit board respectively and used for determining the gap height between the first main device and the first circuit board so as to enable the gap height to be matched with the height of the supporting piece.

The camera provided by the embodiment of the application comprises an electronic packaging assembly, a first main device, a first circuit board and a second main device, wherein a supporting piece is arranged between the first main device and the first circuit board and is respectively connected with the first main device and the first circuit board, used for determining the gap height between the first main device and the first circuit board so as to ensure that the gap height is matched with the height of the supporting piece, a first welding part and a second welding part which are oppositely arranged on the first main device and the first circuit board are connected by welding points in the gap height determined by the supporting piece, since the gap height is determined by the height of the support, and not by the coplanarity between the first master and the first circuit board, by this method, the influence of good coplanarity between the first main device and the first circuit board can be avoided, thereby can guarantee the welding quality of first welding part and second welding part, guarantee that the solder joint is even, avoid bad problems such as short circuit and tin pearl.

Wherein the first master device comprises an LGA device.

Wherein the first master device comprises a BGA device.

Wherein the first master device comprises a printed circuit board.

Wherein the first master device includes a first surface, the first surface of the first master device being located on a first side of the first master device.

Wherein, a plurality of first welding parts are arranged at intervals on the whole area of the first surface of the first main device.

The first main device comprises a first surface and a second surface, wherein a plurality of first welding parts are arranged on the first surface of the first main device at intervals.

Wherein the first welding part comprises a first pad.

The first welding part comprises a first welding ball.

Wherein the first circuit board comprises a printed circuit board.

Wherein the first circuit board comprises a flexible circuit board.

The second side of the first circuit board is connected with an electronic device, and the second side of the first circuit board is the side opposite to the first side of the first circuit board.

Wherein the electronic device includes a second circuit board.

The first circuit board and the first main device are arranged at intervals in a stacked mode.

The first circuit board comprises a first surface, and the first surface of the first circuit board is positioned on the first side of the first circuit board.

And a plurality of second welding parts are arranged at intervals on the whole area of the first surface of the first circuit board.

The first circuit board is provided with a first surface and a second surface, wherein the first surface of the first circuit board is provided with a plurality of first welding parts at intervals.

Wherein the second soldering part comprises a second pad.

The second welding part comprises a second welding ball.

The first welding part is a first bonding pad, the second welding part is a second bonding pad, and the welding point is formed by welding the first bonding pad of the first main device and the second bonding pad of the first circuit board through cream solder.

The first welding part is a first welding ball, the second welding part is a second welding disc, and the welding spot is formed by welding the first welding ball of the first main device and the second welding disc of the first circuit board.

Wherein the number of the supporting members is one.

Wherein the shape of the support comprises at least one of: a square, a triangle and a U shape.

Wherein the support member is disposed near an edge of the first main device.

Wherein the number of the supporting members is plural.

Wherein, the support piece is the cylindricality, and a plurality of support piece intervals set up between first master and first circuit board.

Wherein the heights of the plurality of supporting pieces are consistent.

Wherein the gap height is in the range of 0.2-0.4 mm.

Wherein the heights of the plurality of supports are not uniform.

Wherein the size of the first master device matches the size of the first circuit board.

Wherein the size of the first master device is smaller than the size of the first circuit board.

Wherein the support comprises a chip device.

Wherein, support piece includes the paster components and parts.

Wherein the size of the first master device is larger than the size of the first circuit board.

Wherein the size of the first master device is equal to the size of the first circuit board.

Wherein, the support piece comprises a jig.

The jig comprises a groove and a protrusion on the edge of the groove, the groove is used for containing the first circuit board, and the protrusion is used for determining the height of a gap between the first main device and the first circuit board.

Wherein, the recess is square, and first circuit board can the holding in the bottom of recess.

Referring to fig. 7, fig. 7 is a schematic structural diagram of an embodiment of the movable platform of the present application, where the movable platform of the present embodiment refers to various platforms that can move automatically or under controlled conditions, for example: unmanned aerial vehicles, ground based robots, and the like. The moveable platform 200 includes a processor 50, the processor 50 including an electronic package 10 as described above, and the detailed description of the electronic package 10 is provided above and not described herein.

Embodiments of the present application provide a movable platform including an electronic package assembly, wherein the electronic package assembly includes a first main device and a first circuit board, a support member disposed between the first main device and the first circuit board, the support member being connected to the first main device and the first circuit board, used for determining the gap height between the first main device and the first circuit board so as to ensure that the gap height is matched with the height of the supporting piece, a first welding part and a second welding part which are oppositely arranged on the first main device and the first circuit board are connected by welding points in the gap height determined by the supporting piece, since the gap height is determined by the height of the support, and not by the coplanarity between the first master and the first circuit board, by this method, the influence of good coplanarity between the first main device and the first circuit board can be avoided, thereby can guarantee the welding quality of first welding part and second welding part, guarantee that the solder joint is even, avoid bad problems such as short circuit and tin pearl.

Wherein the first master device comprises an LGA device.

Wherein the first master device comprises a BGA device.

Wherein the first master device comprises a printed circuit board.

Wherein the first welding part comprises a first pad.

The first welding part comprises a first welding ball.

Wherein the first circuit board comprises a printed circuit board.

Wherein the first circuit board comprises a flexible circuit board.

Wherein the electronic device includes a second circuit board.

Wherein the second soldering part comprises a second pad.

The second welding part comprises a second welding ball.

Wherein the cream solder comprises solder paste.

Wherein the number of the supporting members is one.

Wherein the support member is disposed near an edge of the first main device.

Wherein the number of the supporting members is plural.

Wherein the heights of the plurality of supporting pieces are consistent.

Wherein the gap height is in the range of 0.2-0.4 mm.

Wherein the heights of the plurality of supports are not uniform.

Wherein the support comprises a chip device.

Wherein, support piece includes the paster components and parts.

Wherein, the support piece comprises a jig.

Referring to fig. 8, fig. 8 is a schematic flow chart of an embodiment of a method for manufacturing an electronic package assembly according to the present application, wherein the method for manufacturing the electronic package assembly of the present application can manufacture any of the electronic package assemblies described above. The method comprises the following steps:

step S101: the method comprises the steps of providing a first main device, a first circuit board and a support piece, wherein a plurality of first welding parts are arranged on the first side of the first main device at intervals, a plurality of second welding parts are arranged on the first side of the first circuit board at intervals, and the support piece is used for determining the height of a gap between the first main device and the first circuit board.

Step S102: the first soldering part of the first main device and the second soldering part of the first circuit board are pre-connected through solder, and the support member is pre-connected between the first main device and the first circuit board through solder to form a pre-packaged component.

Step S103: and welding the pre-packaging assembly to form a plurality of welding points between the first welding part and the second welding part which are oppositely arranged, so that the first main device and the first circuit board are arranged in a stacked manner, and the height of a gap between the first main device and the first circuit board is matched with the height of the supporting piece.

The electronic packaging assembly prepared by the preparation method provided by the embodiment of the application is characterized in that the support piece is arranged between the first main device and the first circuit board and is respectively connected with the first main device and the first circuit board for determining the gap height between the first main device and the first circuit board so as to enable the gap height to be matched with the height of the support piece, the first welding part and the second welding part which are oppositely arranged on the first main device and the first circuit board are connected through the welding point in the gap height determined by the support piece, and the gap height is determined by the height of the support piece and is not determined by the coplanarity between the first main device and the first circuit board, so that the influence of good coplanarity between the first main device and the first circuit board can be avoided, the welding quality of the first welding part and the second welding part can be ensured, and the welding point is ensured to be uniform, avoiding the problems of short circuit, tin bead and the like.

Wherein the solder comprises cream solder.

In step S103, the pre-package assembly is soldered to form a plurality of solder joints between the first soldering portion and the second soldering portion, which may specifically include: and performing reflow soldering on the pre-packaging assembly to form a plurality of welding points between the first welding parts and the second welding parts which are oppositely arranged.

Wherein the first master device comprises an LGA device.

Wherein the first master device comprises a BGA device.

Wherein the first master device comprises a printed circuit board.

Wherein the first welding part comprises a first pad.

The first welding part comprises a first welding ball.

Wherein the first circuit board comprises a printed circuit board.

Wherein the first circuit board comprises a flexible circuit board.

Wherein the electronic device includes a second circuit board.

Wherein the second soldering part comprises a second pad.

The second welding part comprises a second welding ball.

Wherein the cream solder comprises solder paste.

Wherein the number of the supporting members is one.

Wherein the support member is disposed near an edge of the first main device.

Wherein the number of the supporting members is plural.

Wherein the heights of the plurality of supporting pieces are consistent.

Wherein the gap height is in the range of 0.2-0.4 mm.

Wherein the heights of the plurality of supports are not uniform.

Wherein the support comprises a chip device.

Wherein, support piece includes the paster components and parts.

Wherein, the support piece comprises a jig.

It is to be understood that the terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

The above description is only for the specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic package assembly, comprising:

2. The electronic package of claim 1, wherein the first master device comprises an LGA device.

3. The electronic package of claim 1, wherein the first master device comprises a BGA device.

4. The electronic package of claim 1, wherein the first master device comprises a printed circuit board.

5. The electronic package of claim 1, wherein the first master device includes a first surface, the first surface of the first master device being located on a first side of the first master device.

6. The electronic package of claim 5, wherein the first main device has a first surface and a plurality of first solder portions spaced over the first surface.

7. The electronic package assembly of claim 5, wherein the first main device has a first plurality of solder portions spaced apart from a portion of the first surface of the first main device.

8. The electronic package of claim 1, wherein the first solder comprises a first pad.

9. The electronic package of claim 1, wherein the first solder comprises a first solder ball.

10. The electronic package of claim 1, wherein the first circuit board comprises a printed circuit board.

11. The electronic package of claim 1, wherein the first circuit board comprises a flexible circuit board.

12. The electronic package of claim 1, wherein an electronic device is connected to the second side of the first circuit board, the second side of the first circuit board being the side opposite the first side of the first circuit board.

13. The electronic package of claim 12, wherein the electronic device comprises a second circuit board.

14. The electronic package of claim 1, wherein the first circuit board is stacked spaced apart from the first main device.

15. The electronic package of claim 1, wherein the first circuit board includes a first surface, the first surface of the first circuit board being located on a first side of the first circuit board.

16. The electronic package of claim 15, wherein the second solder portions are spaced apart over an entire area of the first surface of the first circuit board.

17. The electronic package assembly of claim 15, wherein the first surface of the first circuit board is provided with a plurality of second solder portions at intervals in a partial area.

18. The electronic package of claim 1, wherein the second solder comprises a second pad.

19. The electronic package of claim 1, wherein the second solder comprises a second solder ball.

20. The electronic package of claim 1, wherein the first solder portion is a first pad, the second solder portion is a second pad, and the solder joint is formed by soldering a first pad of the first main device to a second pad of the first circuit board with a cream solder.

21. The electronic package of claim 20, wherein the cream solder comprises a tin paste.

22. The electronic package of claim 1, wherein the first solder joint is a first solder ball, the second solder joint is a second pad, and the solder joint is formed by soldering the first solder ball of the first main device and the second pad of the first circuit board.

23. The electronic package of claim 1, wherein the number of supports is one.

24. The electronic package of claim 23, wherein the shape of the support comprises at least one of: a square, a triangle and a U shape.

25. The electronic package of claim 1, wherein the support member is disposed proximate to an edge of the first primary device.

26. The electronic package of claim 1, wherein the number of supports is plural.

27. The electronic package of claim 26, wherein the support member is cylindrical, and a plurality of the support members are spaced apart between the first main device and the first circuit board.

28. The electronic package of claim 27, wherein the plurality of supports are uniform in height.

29. The electronic package of claim 28, wherein the gap height is in a range of 0.2-0.4 mm.

30. The electronic package of claim 27, wherein the heights of the plurality of support members are non-uniform.

31. The electronic package of claim 1, wherein a size of the first master matches a size of the first circuit board.

32. The electronic package of claim 31, wherein the first master device has a size smaller than a size of the first circuit board.

33. The electronic package of claim 32, wherein the support comprises a chip device.

34. The electronic package of claim 33, wherein the support member comprises a chip component.

35. The electronic package of claim 31, wherein the first master device has a size larger than a size of the first circuit board.

36. The electronic package of claim 31, wherein the first master device has a size equal to a size of the first circuit board.

37. The electronic package of claim 35 or 36, wherein the support comprises a jig.

38. The electronic package of claim 37, wherein the jig includes a recess for receiving the first circuit board and a protrusion at an edge of the recess for determining a gap height between the first master and the first circuit board.

39. The electronic package of claim 38, wherein the recess is square and the first circuit board is receivable in a bottom of the recess.

40. A camera, characterized in that the camera comprises: the image sensor converts a sensed optical signal into an electrical signal and transmits the electrical signal to the image processor, the image processor performs operation processing on the electrical signal and transmits data after the operation processing to the memory for storage, at least one of the image sensor, the image processor and the memory comprises an electronic packaging component, and the electronic packaging component comprises:

41. The camera of claim 40, wherein the first host device comprises an LGA device.

42. The camera of claim 40, wherein the first master device comprises a BGA device.

43. The camera of claim 40, wherein the first master device comprises a printed circuit board.

44. The camera of claim 40, wherein the first master device comprises a first surface, the first surface of the first master device being located on a first side of the first master device.

45. The camera of claim 44, wherein the first main device has a first surface and a first solder portion spaced apart from the first main device.

46. The camera of claim 44, wherein a plurality of first welding parts are arranged at intervals on partial areas of the first surface of the first main device.

47. The camera of claim 40, wherein the first solder comprises a first pad.

48. The camera of claim 40, wherein the first solder comprises a first solder ball.

49. The camera of claim 40, wherein the first circuit board comprises a printed circuit board.

50. The camera of claim 40, wherein the first circuit board comprises a flexible circuit board.

51. The camera of claim 40, wherein electronics are connected to a second side of the first circuit board, the second side of the first circuit board being a side opposite the first side of the first circuit board.

52. The camera of claim 51, wherein the electronics comprise a second circuit board.

53. The camera of claim 40, wherein the first circuit board is stacked and spaced apart from the first master device.

54. The camera of claim 40, wherein the first circuit board comprises a first surface, the first surface of the first circuit board being located on a first side of the first circuit board.

55. The camera of claim 54, wherein the second solder portions are spaced apart across an area of the first surface of the first circuit board.

56. The camera of claim 54, wherein a plurality of second solder portions are disposed at intervals on a partial area of the first surface of the first circuit board.

57. The camera of claim 40, wherein the second solder comprises a second pad.

58. The camera of claim 40, wherein the second solder comprises a second solder ball.

59. The camera according to claim 40, wherein the first soldering part is a first pad, the second soldering part is a second pad, and the solder joint is formed by soldering a first pad of the first main device and a second pad of the first circuit board with a cream solder.

60. The camera of claim 59, wherein the cream solder comprises solder paste.

61. The camera of claim 40, wherein the first solder joint is a first solder ball, the second solder joint is a second solder pad, and the solder joint is formed by soldering the first solder ball of the first main device and the second solder pad of the first circuit board.

62. The camera of claim 40, wherein the number of supports is one.

63. The camera of claim 62, wherein the shape of the support comprises at least one of: a square, a triangle and a U shape.

64. The camera of claim 40, wherein the support is disposed near an edge of the first master.

65. The camera of claim 40, wherein the number of supports is plural.

66. The camera of claim 65, wherein the support member is cylindrical, and a plurality of the support members are spaced apart between the first master device and the first circuit board.

67. The camera of claim 66, wherein the plurality of supports are uniform in height.

68. The camera of claim 67, wherein the gap height is in the range of 0.2-0.4 mm.

69. The camera of claim 66, wherein the heights of the plurality of supports are not uniform.

70. The camera of claim 40, wherein a size of the first master matches a size of the first circuit board.

71. The camera of claim 70, wherein a size of the first master device is smaller than a size of the first circuit board.

72. The camera of claim 71, wherein the support comprises a chip device.

73. The camera of claim 72, wherein the support comprises a chip component.

74. The camera of claim 70, wherein the first master device has a size larger than a size of the first circuit board.

75. The camera of claim 70, wherein the first master device has a size equal to a size of the first circuit board.

76. The camera of claim 74 or 75, wherein the support comprises a jig.

77. The camera as claimed in claim 76, wherein the fixture includes a groove for receiving the first circuit board and a protrusion at an edge of the groove for determining a gap height between the first master and the first circuit board.

78. The camera of claim 77, wherein the recess is square and the first circuit board is receivable in a bottom of the recess.

79. A movable platform comprising a processor, the processor including an electronic package assembly, the electronic package assembly comprising:

80. The movable platform of claim 79, wherein the first master device comprises an LGA device.

81. The movable platform of claim 79 wherein the first master device comprises a BGA device.

82. The movable platform of claim 79, wherein the first master device comprises a printed circuit board.

83. The movable platform of claim 79, wherein the first master comprises a first surface, the first surface of the first master being located on a first side of the first master.

84. The movable platform of claim 83, wherein the first primary device first surface is spaced throughout a region thereof with a plurality of first welds.

85. The movable platform of claim 83, wherein a plurality of first welds are spaced apart from a portion of the area of the first surface of the first master.

86. The movable platform of claim 79, wherein the first bond comprises a first pad.

87. The movable platform of claim 79, wherein the first solder comprises a first solder ball.

88. The movable platform of claim 79, wherein the first circuit board comprises a printed circuit board.

89. The movable platform of claim 79, wherein the first circuit board comprises a flexible circuit board.

90. The movable platform of claim 79, wherein electronics are connected to a second side of the first circuit board, the second side of the first circuit board being a side opposite the first side of the first circuit board.

91. The movable platform of claim 90, wherein the electronics comprise a second circuit board.

92. The movable platform of claim 79, wherein the first circuit board is stacked spaced apart from the first master.

93. The movable platform of claim 79, wherein the first circuit board comprises a first surface, the first surface of the first circuit board being located on a first side of the first circuit board.

94. The movable platform of claim 93, wherein the second solder portions are spaced across an area of the first surface of the first circuit board.

95. The movable platform of claim 93, wherein a plurality of second solder portions are provided at intervals on a portion of the first surface of the first circuit board.

96. The movable platform of claim 79, wherein the second solder comprises a second pad.

97. The movable platform of claim 79, wherein the second solder comprises a second solder ball.

98. The movable platform of claim 79, wherein the first solder portion is a first pad, the second solder portion is a second pad, and the solder joint is formed by soldering a first pad of the first master device to a second pad of the first circuit board with a cream solder.

99. The movable platform of claim 98, wherein the cream solder comprises solder paste.

100. The movable platform of claim 79, wherein the first solder joint is a first solder ball, the second solder joint is a second solder pad, and the solder joint is formed by soldering the first solder ball of the first master device to the second solder pad of the first circuit board.

101. The movable platform of claim 79 wherein the number of supports is one.

102. The movable platform of claim 101, wherein the shape of the support comprises at least one of: a square, a triangle and a U shape.

103. The movable platform of claim 79, wherein the support is positioned proximate to an edge of the first master.

104. The movable platform of claim 79, wherein the number of supports is plural.

105. The movable platform of claim 104, wherein the support member is cylindrical and a plurality of the support members are spaced between the first master and the first circuit board.

106. The movable platform of claim 105, wherein a plurality of the supports are uniform in height.

107. The movable platform of claim 106, wherein the gap height is in a range of 0.2-0.4 mm.

108. The movable platform of claim 105, wherein the heights of the plurality of supports are non-uniform.

109. The movable platform of claim 79 in which the first master device is sized to match the size of the first circuit board.

110. The movable platform of claim 109, wherein the first master device has a size that is smaller than a size of the first circuit board.

111. The movable platform of claim 110, wherein the support comprises a chip device.

112. The movable platform of claim 111, wherein the support comprises a chip component.

113. The movable platform of claim 109, wherein the first master device has a size that is larger than a size of the first circuit board.

114. The movable platform of claim 109, wherein the first master device has a size equal to a size of the first circuit board.

115. The movable platform of claim 113 or 114, wherein the support comprises a jig.

116. The movable platform of claim 115, wherein the fixture comprises a groove for receiving the first circuit board and a protrusion at an edge of the groove for determining a height of a gap between the first master device and the first circuit board.

117. The movable platform of claim 116, wherein the recess is square and the first circuit board is receivable in a bottom of the recess.

118. A method of making an electronic package, comprising:

119. The method of claim 118 wherein said solder comprises cream solder.

120. The method of claim 119, wherein the soldering the pre-package assembly to form a plurality of solder joints between the first and second oppositely disposed solder joints comprises:

and carrying out reflow soldering on the pre-packaging assembly so as to form a plurality of welding points between the first welding part and the second welding part which are oppositely arranged.

121. The method of claim 118, wherein the first master device comprises an LGA device.

122. The method of claim 118 wherein the first master device comprises a BGA device.

123. The method of claim 118, wherein the first master device comprises a printed circuit board.

124. The method of claim 118, wherein the first master device comprises a first surface, the first surface of the first master device being located on a first side of the first master device.

125. The method of claim 124, wherein the first primary device first surface is spaced throughout a region thereof with a plurality of first welds.

126. The method of claim 124, wherein a plurality of first welds are provided at spaced intervals across a portion of the first surface of the first master device.

127. The method of claim 118, wherein the first bond comprises a first pad.

128. The method of claim 118 wherein the first bond comprises a first solder ball.

129. The method of claim 118, wherein the first circuit board comprises a printed circuit board.

130. The method of claim 118, wherein the first circuit board comprises a flexible circuit board.

131. The method of claim 118 wherein electronics are attached to a second side of the first circuit board, the second side of the first circuit board being the side opposite the first side of the first circuit board.

132. The method of claim 131, wherein the electronic device comprises a second circuit board.

133. The method of claim 118 wherein the first circuit board is stacked in spaced relation to the first master device.

134. The method of claim 118 wherein the first circuit board includes a first surface, the first surface of the first circuit board being located on a first side of the first circuit board.

135. The method of claim 134, wherein the second solder portions are spaced across an area of the first surface of the first circuit board.

136. The method of claim 134, wherein a plurality of second solder portions are provided at spaced intervals on a portion of the first surface of the first circuit board.

137. The method of claim 118, wherein the second bond comprises a second pad.

138. The method of claim 118 wherein the second solder comprises a second solder ball.

139. The method of claim 119 wherein the first solder portion is a first pad, the second solder portion is a second pad, and the solder joint is formed by soldering the first pad of the first master device to the second pad of the first circuit board with the cream solder.

140. The method of claim 139 wherein said cream solder comprises a solder paste.

141. The method of claim 118 wherein the first bond is a first solder ball, the second bond is a second bond pad, and the solder joint is formed by bonding a first solder ball of the first master device to a second bond pad of the first circuit board.

142. The method of claim 118, wherein the number of supports is one.

143. The method of claim 142, wherein the shape of the support comprises at least one of: a square, a triangle and a U shape.

144. The method of claim 118, wherein the support is positioned proximate to an edge of the first master.

145. The method of claim 118, wherein the number of supports is plural.

146. The method of claim 145, wherein the support member is cylindrical and a plurality of support members are spaced between the first master device and the first circuit board.

147. The method of claim 146, wherein a plurality of said supports are uniform in height.

148. The method of claim 147 wherein the gap height is in the range of 0.2-0.4 mm.

149. The method of claim 146, wherein the heights of the plurality of supports are non-uniform.

150. The method of claim 118, wherein a size of the first master device matches a size of the first circuit board.

151. The method of claim 150, wherein a size of the first master device is smaller than a size of the first circuit board.

152. The method of claim 151, wherein the support comprises a chip device.

153. The method of claim 152, wherein the support member comprises a patch component.

154. The method of claim 150, wherein a size of the first master device is larger than a size of the first circuit board.

155. The method of claim 150, wherein a size of the first master device is equal to a size of the first circuit board.

156. The method of claim 154 or 155, wherein the support comprises a jig.

157. The method of claim 156, wherein the fixture comprises a recess for receiving the first circuit board and a protrusion at an edge of the recess for determining a gap height between the first master and the first circuit board.

158. The method of claim 157, wherein the recess is square and the first circuit board is receivable in a bottom of the recess.