CN114390805A - Double-layer circuit board welding method - Google Patents
Double-layer circuit board welding method Download PDFInfo
- Publication number
- CN114390805A CN114390805A CN202210094633.8A CN202210094633A CN114390805A CN 114390805 A CN114390805 A CN 114390805A CN 202210094633 A CN202210094633 A CN 202210094633A CN 114390805 A CN114390805 A CN 114390805A
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- Prior art keywords
- circuit board
- double
- welding
- pad area
- solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a welding method of a double-layer circuit board, which comprises the following steps: cleaning the first bonding pad region and the second bonding pad region; coating solder paste on the first welding spots; placing at least three supports that are not on the same straight line at the first pad area, wherein each support is located at one first welding point; heating the first bonding pad area to melt the solder paste into a solder ball, wherein the support is melted into the solder ball; stacking a second circuit board on the first circuit board, and enabling the second pad area to be opposite to the first pad area; and heating the first circuit board and/or the second circuit board, and pressing the second circuit board to the first circuit board to melt the solder balls and weld the corresponding first welding points and the second welding points. The technical scheme of the invention can solve the problem that the double-layer circuit board is easy to adhere or cold solder during maintenance welding.
Description
Technical Field
The invention relates to the technical field of welding, in particular to a welding method of a double-layer circuit board.
Background
The circuit board is used as a necessary component of the electronic product, is the basis of the work of each electronic device of the electronic product, and is also the component occupying the largest space in the electronic product. Under the demand of increasingly miniaturized and highly integrated electronic products, double-layer circuit boards with higher density of electronic elements are produced. The double-layer circuit board is formed by welding two circuit boards, and each circuit board is welded with an electronic device, so that the double-layer circuit board can provide more welding interfaces of the electronic devices in unit volume. For assembly manufacturers adopting large-scale and standardized electronic equipment, a standard welding mode is adopted, and the fixed welding temperature and welding pressure ensure that the welding yield is not difficult. However, in the rear-end maintenance industry, the operations are manual operations, and when the double-layer circuit board needs to be detached, the specific welding parameters are difficult to control accurately, so that the bad conditions of adhesion or insufficient welding easily occur when the double-layer circuit board is welded again. When in welding, the electrodes are easy to adhere when the pressing force is too large, and the insufficient force is easy to cause insufficient welding and poor welding of part of the contacts; the adhesion can cause short circuit, easily burn out electronic products, and the insufficient force can be used for further processing, so that in actual operation, the insufficient force is used for producing more defective products of the insufficient solder joint. Therefore, a soldering method for re-soldering a double-layer circuit board at the time of repair is required to be further improved.
Disclosure of Invention
The invention mainly aims to provide a double-layer circuit board welding method, which aims to solve the problem that the existing double-layer circuit board is easy to adhere or rosin joint in maintenance welding.
In order to achieve the purpose, the invention provides a double-layer circuit board welding method, which is used for welding the split and maintained double-layer circuit boards together again; the double-layer circuit board comprises a first circuit board and a second circuit board; the first circuit board is provided with a first pad area, and the first pad area is provided with a plurality of first welding points; the second circuit board is provided with a second pad area, the second pad area is provided with a plurality of second welding points, and the welding method of the double-layer circuit board comprises the following steps: cleaning the first bonding pad region and the second bonding pad region; coating solder paste on the first welding spots; placing at least three supports that are not on the same straight line at the first pad area, wherein each support is located at one first welding point; heating the first bonding pad area to melt the solder paste into a solder ball, wherein the support is melted into the solder ball; stacking a second circuit board on the first circuit board, and enabling the second pad area to be opposite to the first pad area; and heating the first circuit board and/or the second circuit board, and pressing the second circuit board to the first circuit board to melt the solder balls and weld the corresponding first welding points and the second welding points.
Preferably, the first pad area is located at an edge of the first circuit board and protrudes from a board surface of the first circuit board.
Preferably, the first circuit board further comprises a middle frame, and the middle frame is located at the edge of one side board surface of the first circuit board; the first pad area is positioned on one side of the middle frame facing the second circuit board.
Preferably, before the support member is placed at the first welding point, a tin paste is coated on the first welding pad area by using a tin implanting net in advance; and after removing the tin-implanted net, placing the support on the tin paste on the first welding points.
Preferably, before a plurality of the first welding points are coated with solder paste, the first circuit board is fixed on an operation table with a heating function in advance.
Preferably, before the second circuit board is stacked on the first circuit board, a tin paste is applied to the second pad area by using a tin-implanting net, and the second pad area is heated to melt the tin paste at the second bonding point to form a solder ball.
Preferably, the support is sheet-like and has a thickness of between 0.06mm and 0.15 mm.
Preferably, the support is between 0.2mm and 0.35mm in diameter.
Preferably, the support is spherical and has a diameter of between 0.18mm and 0.25 mm.
Preferably, the support comprises a metal base body and a surface coating, the metal base body is a stainless steel base body, and the surface coating is 24K gold-plated.
According to the technical scheme, at least three non-collinear supporting pieces are arranged between the two circuit boards of the double-layer circuit board, and the supporting pieces are melted into the welded tin balls, so that the difficulty in maintaining the two double-layer circuit boards is reduced, and the problems of adhesion and insufficient welding easily occurring when the rear ends of the two double-layer circuit boards are maintained and welded are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a welding method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an overall structure of a dual-layer circuit board according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a front view structure and a corresponding cross-sectional view of a dual-layer circuit board according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram illustrating a front view of a first circuit board according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a front view of a second circuit board according to an embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
200 | |
| 101 | |
201 | Second |
| 102 | |
202 | |
| 103 | |
300 | Support piece |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
With the development and demand of increasingly miniaturized electronic products, more electronic components are arranged in a unit volume or unit area, and increasing the density of the electronic components is an important design direction. The double-layer circuit board is a new circuit board technical scheme created based on the requirement.
The double-layer circuit board is formed by welding two circuit boards to form a whole. Electronic devices are welded on each circuit board in the double-layer circuit board, so that in unit volume, the double-layer circuit board can provide more welding interfaces of the electronic devices, and the unit density of the electronic components is improved. For assembly manufacturers adopting large-scale and standardized electronic equipment, a standard welding mode is adopted, and the fixed welding temperature and welding pressure ensure that the welding yield is not difficult. However, in the rear end maintenance industry, once the operations of disassembling and re-welding the double-layer circuit board are involved, only manual operation is adopted, and the welding success rate is low at one time, so that the rear end maintenance is very difficult. The reason why the success rate of one-time welding is low is mainly that the press force during welding is difficult to control, and because the double-layer circuit board is welded by tin soldering, and the welding surfaces of the two circuit boards are opposite, the specific condition of welding cannot be directly observed, and only trial and error judgment can be carried out according to experience. When the force is too large during welding, the adjacent solder balls are easy to adhere to cause short circuit, and when the force is insufficient, the opposite solder balls cannot be adhered to cause insufficient soldering. The adhesion of the adjacent solder balls causes short circuit, electronic products are easily burnt out, and the cold solder can be reworked for further processing, so that in actual operation, the poor products with cold solder caused by insufficient force are relatively more
Referring to fig. 1 to 5, in order to solve the problems that the requirement of the welding process of the double-layer circuit board is too high and adhesion or welding is easily caused by manual welding during rear-end maintenance, the invention provides a welding method of the double-layer circuit board, which is used for re-welding the split and maintained double-layer circuit boards together; the double-layer circuit board includes a first circuit board 100 and a second circuit board 200; the first circuit board 100 is provided with a first pad area 101, and the first pad area 101 is provided with a plurality of first welding points 102; the second circuit board 200 is provided with a second pad area 201, the second pad area 201 is provided with a plurality of second welding points 202, and the welding method of the double-layer circuit board comprises the following steps:
step 1: cleaning the first pad region 101 and the second pad region 201; coating solder paste on the first welding spots 102;
step 2: placing at least three supports 300 which are not on the same straight line at the first pad area 101, wherein each support 300 is located at one first welding point 102;
and step 3: heating the first pad area 101 to melt the solder paste into solder balls, and the supporting member 300 is melted into the solder balls;
and 4, step 4: stacking a second circuit board 200 on the first circuit board 100 with the second pad region 201 facing the first pad region 101;
and 5: and heating the first circuit board 100 and/or the second circuit board 200, and pressing the second circuit board 200 against the first circuit board 100 to melt the solder balls and weld the corresponding first welding points 102 and second welding points 202.
In the welding method of the double-layer circuit board, the first circuit board 100 and the second circuit board 200 are separated by a distance by placing at least three support pieces 300 which are not collinear in the first bonding pad area 101, so that the first circuit board 100 and the second circuit board 200 are prevented from being too close to the pressure explosion solder balls to cause adhesion of the adjacent solder balls during welding, and simultaneously, the phenomenon that false welding is caused by too small pressure applied during welding because the pressure explosion solder balls are prevented can be avoided. The support member 300 is placed after the solder paste is applied, so that the solder amount of the solder ball can be ensured, the negative influence of the placement of the support member 300 on the resistance of the soldering circuit is reduced, and the resistance value of each solder ball after soldering is ensured to be uniform. Specifically, before the support 300 is placed at the first solder joint 102, a tin paste is applied to the first pad area 101 in advance by using a tin-implanting net; after removing the tin-plated mesh, the support 300 is placed on the solder paste on the first solder joint 102.
The double-layer circuit board welds each electronic device between the two circuit boards, and a gap for accommodating the electronic device is arranged between the board surfaces of the two circuit boards. Specifically, the first circuit board 100 further includes a middle frame 103, and the middle frame 103 is located at an edge of a side board surface of the first circuit board 100; the first pad region 101 is located on a side of the middle frame 103 facing the second circuit board 200. The middle frame 103 may be integrally formed on the first circuit board 100, or may be pre-soldered to a board body of the first circuit board 100 by a soldering method. In a preferred embodiment, the plurality of supporting members 300 are disposed, and the plurality of supporting members 300 are disposed at intervals, such as four, in the first pad area 101 and distributed in a quadrilateral shape, or as shown in fig. 4, four supporting members 300 are disposed at intervals at two long sides, and one supporting member 300 is disposed at the middle of two short sides. The present invention does not limit the specific number of the supporters 300.
The heating method for the circuit board during soldering is various, a hot air gun can be adopted, an operation table with a heating function can be adopted, before the first welding points 102 are coated with the solder paste, the first circuit board 100 is fixed on the operation table with the heating function in advance, the support piece 300 is placed on the operation table for coating the solder paste, the heating function of the operation table is started to heat the circuit board, the solder paste is melted into a ball, and the support piece 300 is melted into the solder ball.
For a double-layer circuit board requiring tin plating on two circuit boards, before the second circuit board 200 is stacked on the first circuit board 100, a tin plating net is used to coat tin paste on the second pad area 201, and the second pad area 201 is heated to melt the tin paste at the second solder joint 202 to form a solder ball.
The support 300 supports two circuit boards during soldering, so as to prevent the two circuit boards from being soldered together due to an excessively small distance or from being soldered together due to an insufficient distance, and should have physical properties of high temperature resistance (melting point temperature higher than soldering temperature).
Meanwhile, the thickness of the support member 300 in the present invention is set to be between 0.06mm and 0.15mm, not less than 0.06mm, and not more than 0.15mm, and the support member 300 is set to be a sheet shape, such as a thin disk shape or a thin column shape (a column with a low height), etc. In the present invention, the diameter of the supporter 300 is not less than 0.2mm and not more than 0.35 mm. For example, in the case of soldering a circuit board having a small solder joint, the cylindrical support 300300 having a height of 0.06mm and a diameter of 0.2mm is used, and in the case of soldering a circuit board having a large solder joint, the cylindrical support 300 having a height of 0.15mm and a diameter of 0.35mm is used.
In the present invention, another embodiment of the supporting member 300 is also provided, in which the supporting member 300 is spherical or ellipsoidal, and has a diameter of not less than 0.18mm and not more than 0.25 mm.
The size and shape of the support 300 provided by the invention provide proper space and volume between two circuit boards, and after the support 300 is melted into the solder balls, the support function can be achieved to avoid the solder balls from being adhered, and the phenomenon that the support space is too large to cause solder joint false soldering can be avoided.
To prevent the support 300 from adversely affecting the conductivity of the solder joints, the support 300 is preferably made of a metal material, including a metal matrix and a plating layer. Wherein, the plating layer adopts 24K gold, and the metal matrix adopts stainless steel matrix. The stainless steel and the gold have conductivity, and after the solder balls are dissolved, the stainless steel and the gold are conducted together with the solder balls, so that the resistance of a welding point where the support member 300 is placed is not additionally increased, the gold has good compatibility with common solder tin, and when the solder paste is dissolved into the solder balls, the support member 300 can be well melted into the solder balls.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A welding method of double-layer circuit board is used for welding the split and repaired double-layer circuit board together again; the double-layer circuit board comprises a first circuit board and a second circuit board; the first circuit board is provided with a first pad area, and the first pad area is provided with a plurality of first welding points; the second circuit board is provided with a second pad area, and the second pad area is provided with a plurality of second welding points;
the welding method of the double-layer circuit board is characterized by comprising the following steps:
cleaning the first bonding pad region and the second bonding pad region; coating solder paste on the first welding spots;
placing at least three supports that are not on the same straight line at the first pad area, wherein each support is located at one first welding point;
heating the first bonding pad area to melt the solder paste into a solder ball, wherein the support is melted into the solder ball;
stacking a second circuit board on the first circuit board, and enabling the second pad area to be opposite to the first pad area;
and heating the first circuit board and/or the second circuit board, and pressing the second circuit board to the first circuit board to melt the solder balls and weld the corresponding first welding points and the second welding points.
2. The double-layer circuit board welding method according to claim 1, wherein the first pad area is located at the edge of the first circuit board and protrudes from the surface of the first circuit board.
3. The double-layer circuit board welding method according to claim 1, wherein the first circuit board further comprises a middle frame, and the middle frame is positioned at the edge of one side board surface of the first circuit board; the first pad area is positioned on one side of the middle frame facing the second circuit board.
4. The double-layer circuit board soldering method according to any one of claims 1 to 3, wherein before the support member is placed at the first soldering site, solder paste is applied to the first land area in advance by using a solder-implanting net; and after removing the tin-implanted net, placing the support on the tin paste on the first welding points.
5. The double-layer circuit board soldering method according to claim 2, wherein the first circuit board is previously fixed to a stage having a heating function before a plurality of the first pads are applied with solder paste.
6. The method for soldering a double-layered circuit board according to claim 1, wherein before the second circuit board is stacked on the first circuit board, a solder paste is applied to the second land areas by using a solder-implanting net, and the second land areas are heated to melt the solder paste at the second lands to form solder balls.
7. The method for soldering the double-layered circuit board according to claim 1, wherein the supporting member has a sheet shape and a thickness of 0.06mm to 0.15 mm.
8. The method of soldering a two-layer circuit board according to claim 7, wherein the diameter of the supporting member is between 0.2mm and 0.35 mm.
9. The method of soldering a double-layered circuit board according to claim 1, wherein the support member has a spherical shape and a diameter of 0.18mm to 0.25 mm.
10. The method for soldering a double-layered circuit board according to claim 1, wherein the support comprises a metal base and a surface plating layer, the metal base is a stainless steel base, and the surface plating layer is 24K gold plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210094633.8A CN114390805A (en) | 2022-01-26 | 2022-01-26 | Double-layer circuit board welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210094633.8A CN114390805A (en) | 2022-01-26 | 2022-01-26 | Double-layer circuit board welding method |
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| Publication Number | Publication Date |
|---|---|
| CN114390805A true CN114390805A (en) | 2022-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210094633.8A Pending CN114390805A (en) | 2022-01-26 | 2022-01-26 | Double-layer circuit board welding method |
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Citations (7)
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| US20110211322A1 (en) * | 2010-03-01 | 2011-09-01 | Lotes Co., Ltd. | Electronic device |
| CN102956575A (en) * | 2011-08-24 | 2013-03-06 | 国碁电子(中山)有限公司 | Package structure and manufacture method thereof |
| CN103687327A (en) * | 2012-09-21 | 2014-03-26 | 联想(北京)有限公司 | Printed circuit board and method for arranging elements on printed circuit board |
| CN209592372U (en) * | 2019-04-10 | 2019-11-05 | 欣兴电子股份有限公司 | Printed circuit board stacking structure |
| CN112437979A (en) * | 2019-07-24 | 2021-03-02 | 深圳市大疆创新科技有限公司 | Electronic packaging assembly, camera, movable platform and preparation method thereof |
| CN112735956A (en) * | 2019-10-14 | 2021-04-30 | 昇贸科技股份有限公司 | Method for welding packaging assembly on circuit substrate and thermosetting resin composition |
| CN113498314A (en) * | 2020-03-20 | 2021-10-12 | 天芯互联科技有限公司 | Method for mounting electronic component on circuit board |
-
2022
- 2022-01-26 CN CN202210094633.8A patent/CN114390805A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110211322A1 (en) * | 2010-03-01 | 2011-09-01 | Lotes Co., Ltd. | Electronic device |
| CN102956575A (en) * | 2011-08-24 | 2013-03-06 | 国碁电子(中山)有限公司 | Package structure and manufacture method thereof |
| CN103687327A (en) * | 2012-09-21 | 2014-03-26 | 联想(北京)有限公司 | Printed circuit board and method for arranging elements on printed circuit board |
| CN209592372U (en) * | 2019-04-10 | 2019-11-05 | 欣兴电子股份有限公司 | Printed circuit board stacking structure |
| CN112437979A (en) * | 2019-07-24 | 2021-03-02 | 深圳市大疆创新科技有限公司 | Electronic packaging assembly, camera, movable platform and preparation method thereof |
| CN112735956A (en) * | 2019-10-14 | 2021-04-30 | 昇贸科技股份有限公司 | Method for welding packaging assembly on circuit substrate and thermosetting resin composition |
| CN113498314A (en) * | 2020-03-20 | 2021-10-12 | 天芯互联科技有限公司 | Method for mounting electronic component on circuit board |
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