CN216775126U - Double-layer circuit board - Google Patents
Double-layer circuit board Download PDFInfo
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- CN216775126U CN216775126U CN202220224687.7U CN202220224687U CN216775126U CN 216775126 U CN216775126 U CN 216775126U CN 202220224687 U CN202220224687 U CN 202220224687U CN 216775126 U CN216775126 U CN 216775126U
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- circuit board
- double
- pad area
- welding
- layer circuit
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Abstract
The double-layer circuit board provided by the utility model comprises a first circuit board and a second circuit board; the first circuit board is provided with a first pad area, and the first pad area is provided with a plurality of first welding points; the second circuit board is provided with a second pad area corresponding to the first pad area, and the second pad area is provided with a plurality of second welding spots; a plurality of supporting pieces are arranged between the first circuit board and the second circuit board. According to the technical scheme, the supporting piece is arranged between the double-layer circuit boards, so that the problems of high welding process requirement and high rear end maintenance difficulty of the double-layer circuit boards are solved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a double-layer circuit board.
Background
The circuit board is used as a necessary component of the electronic product, is the basis of the work of each electronic device of the electronic product, and is also the component occupying the largest space in the electronic product. Under the demand of increasingly miniaturized and highly integrated electronic products, double-layer circuit boards with higher density of electronic elements are produced. The double-layer circuit board is formed by welding two circuit boards, and each circuit board is welded with an electronic device, so that the double-layer circuit board can provide more welding interfaces of the electronic devices in unit volume. For assembly manufacturers adopting large-scale and standardized electronic equipment, a standard welding mode is adopted, and the fixed welding temperature and welding pressure ensure that the welding yield is not difficult. However, the requirement of the welding process is high, and the difficulty in later maintenance is high, so that the existing double-layer circuit board technology needs to be further improved.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a double-layer circuit board, and aims to solve the problems that the requirement of the existing double-layer circuit board welding process is too high, and the later maintenance difficulty is too large.
In order to achieve the above object, the present invention provides a dual-layer circuit board including a first circuit board and a second circuit board; the first circuit board is provided with a first pad area, and the first pad area is provided with a plurality of first welding points; the second circuit board is provided with a second pad area corresponding to the first pad area, and the second pad area is provided with a plurality of second welding spots; a plurality of supporting pieces are arranged between the first circuit board and the second circuit board.
Preferably, the support member is an electrical conductor and is disposed at the first bonding point located at the edge of the first bonding pad region.
Preferably, the first pad area is located at an edge of the first circuit board and protrudes from a board surface of the first circuit board.
Preferably, the first circuit board further comprises a middle frame, and the middle frame is located at the edge of one side board surface of the first circuit board; the first pad area is positioned on one side of the middle frame facing the second circuit board.
Preferably, the support members comprise at least three members that are not collinear.
Preferably, the support is sheet-like and has a thickness of between 0.06mm and 0.15 mm.
Preferably, the support is between 0.2mm and 0.35mm in diameter.
Preferably, the support is spherical or ellipsoidal and the support has a diameter of between 0.18mm and 0.25 mm.
Preferably, the support comprises a metal base body and a surface coating, the metal base body is a stainless steel base body, and the surface coating is 24K gold-plated.
Preferably, the supporting member is a bump fixed to the surface of the first pad region other than the first pad.
According to the technical scheme, the supporting piece is arranged between the double-layer circuit boards, so that the problems of high welding process requirement and high rear end maintenance difficulty of the double-layer circuit boards are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first circuit board according to an embodiment of the utility model;
FIG. 2 is a schematic structural diagram of a second circuit board according to an embodiment of the utility model;
FIG. 3 is a schematic diagram of an overall structure of another embodiment of a dual-layer circuit board according to the present invention;
FIG. 4 is a schematic front view of the structure shown in FIG. 3;
fig. 5 is a schematic view of the cross-sectional structure a-a in fig. 4.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
200 | |
| 101 | First pad region | 201 | Second |
| 102 | First welding point | 202 | |
| 103 | |
300 | Support piece |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
With the development and demand of increasingly miniaturized electronic products, more electronic components are arranged in a unit volume or unit area, and increasing the density of the electronic components is an important design direction. The double-layer circuit board is a new circuit board technical scheme created based on the requirement.
The double-layer circuit board is formed by welding two circuit boards to form a whole. Electronic devices are welded on each circuit board in the double-layer circuit board, so that in unit volume, the double-layer circuit board can provide more welding interfaces of the electronic devices, and the unit density of the electronic components is improved. For assembly manufacturers adopting large-scale and standardized electronic equipment, a high-level welding process is adopted, and the welding yield is not difficult to ensure. However, the extremely high welding process requirement inevitably brings about the improvement of welding cost and the slow welding efficiency, and for the rear end maintenance industry, once the operation of disassembling and re-welding the double-layer circuit board is involved, only manual operation can be adopted, the welding success rate at one time is low, and the rear end maintenance is very difficult. The reason that the welding process is high in requirement and the welding success rate is low in one-time welding is mainly that the pressing force during welding is difficult to control, and the specific welding situation cannot be directly observed because the double-layer circuit board is welded by tin soldering and the welding surfaces of the two circuit boards are opposite. When the pressure is too high during welding, the adjacent solder balls are easy to adhere to cause short circuit, and when the pressure is not enough, the opposite solder balls cannot be adhered to cause insufficient soldering. The adhesion of adjacent tin balls leads to short circuit, electronic products are easily burnt out, and the cold joint can be reworked for further processing, so that in actual operation, the pressure is insufficient, and the defective products of the cold joint are relatively more.
Referring to fig. 1 to 5, in order to reduce the difficulty of the welding process and the difficulty of the rear end maintenance of the double-layer circuit board, the present invention provides a double-layer circuit board, which includes a first circuit board 100 and a second circuit board 200; the first circuit board 100 is provided with a first pad area 101, and the first pad area 101 is provided with a plurality of first welding points 102; the second circuit board 200 is provided with a second pad area 201 corresponding to the first pad area 101, and the second pad area 201 is provided with a plurality of second welding spots 202; a plurality of supporting members 300 are disposed between the first circuit board 100 and the second circuit board 200.
According to the utility model, the supporting piece 300 is arranged between the first circuit board 100 and the second circuit board 200, so that the first circuit board 100 and the second circuit board 200 are prevented from being too close to each other when being stressed and extruded in welding, relatively large pressure can be applied, and the first circuit board 100 and the second circuit board 200 are ensured not to be in false welding or poor welding of adjacent solder balls due to too close to each other. In one embodiment, the support 300 is a conductive body and is disposed at the first pad 102 located at the edge of the first pad region 101. The conductor is used as the supporting piece 300 and is arranged at the welding point, so that the protective layer of the circuit board is not damaged, extra processing is not needed to be carried out on the board of the circuit board, the cost is saved and the integrity of the protective layer of the circuit board is ensured under the condition of realizing the supporting. In addition, the conductor is adopted as the support member 300, so that the influence of resistance value at the welding point caused by the increase of the support member 300 can be avoided, and the electric conductivity after welding can not be obviously reduced.
The welding surface of the double-layer circuit board provided by the utility model faces inwards, namely, the electronic components are welded on the opposite plate surfaces of the first circuit board 100 and the second circuit board 200. The first pad region 101 of the first circuit board 100 is located at an edge of the first circuit board 100 and protrudes from a board surface of the first circuit board 100.
In a specific embodiment, the first circuit board 100 further includes a middle frame 103, and the middle frame 103 is located at an edge of a side board surface of the first circuit board 100; the first pad region 101 is located on a side of the middle frame 103 facing the second circuit board 200. The middle frame 103 and the board body of the first circuit board 100 may be integrally formed, or may be welded on the board body of the first circuit board 100 to form the first circuit board 100.
In order to ensure that the first circuit board 100 and the second circuit board 200 are stable when the soldering is stressed, in an embodiment of the present invention, at least three support members 300 are disposed, which are not in the same straight line.
In one embodiment of the present invention, the supporting member 300 is a sheet, the thickness of the supporting member 300 is between 0.06mm to 0.15mm, and the diameter of the supporting member 300 is between 0.2mm to 0.35 mm. According to the size and density of the welding spots, the supporting members 300 with different sizes are adopted so that the supporting members 300 can play a normal supporting role. For example, in the embodiment with smaller and denser welding spots, a cylinder with a thickness of 0.06mm and a diameter of 0.2mm is adopted; in the embodiment with larger welding spots and larger spacing, a cylinder with a thickness of 0.15mm and a diameter of 0.35mm is used.
In another embodiment of the present invention, the support 300 is spherical or ellipsoidal, and the diameter of the support 300 is between 0.18mm and 0.25 mm.
In order to ensure good fusion between the supporting member 300 and the solder (tin), the present invention provides an embodiment, in which the supporting member 300 includes a metal base and a surface plating layer, the metal base is a stainless steel base, and the surface plating layer is 24K gold plating.
In another embodiment of the present invention, the supporting member 300 is a bump fixed on the surface of the first pad region 101 except the first welding point 102.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A double-layer circuit board is characterized by comprising a first circuit board and a second circuit board; the first circuit board is provided with a first welding pad area, and the first welding pad area is provided with a plurality of first welding spots; the second circuit board is provided with a second pad area corresponding to the first pad area, and the second pad area is provided with a plurality of second welding spots; a plurality of supporting pieces are arranged between the first circuit board and the second circuit board.
2. The double-layer circuit board of claim 1, wherein the supporting member is an electrical conductor and is provided at the first bonding pad at the edge of the first bonding pad region.
3. The double-layer circuit board of claim 2, wherein the first pad area is located at an edge of the first circuit board and protrudes from a board surface of the first circuit board.
4. The double-layer circuit board of claim 2, wherein the first circuit board further comprises a middle frame, the middle frame is positioned at the edge of one side board surface of the first circuit board; the first pad area is located on one side, facing the second circuit board, of the middle frame.
5. The double-layer circuit board of claim 2, wherein the supporting member includes at least three members that are not on the same line.
6. The double-layer circuit board of claim 1, wherein the supporting member is in a sheet shape, and the thickness of the supporting member is between 0.06mm and 0.15 mm.
7. The dual layer circuit board of claim 6, wherein the support member has a diameter between 0.2mm and 0.35 mm.
8. The dual layer circuit board of claim 1, wherein the support is spherical or ellipsoidal and has a diameter of between 0.18mm and 0.25 mm.
9. The double-layer circuit board of claim 1, wherein the support comprises a metal substrate and a surface plating layer, the metal substrate is a stainless steel substrate, and the surface plating layer is 24K gold plating.
10. The double-layer circuit board of claim 1, wherein the supporting member is provided as a bump fixed to a surface of the first pad area other than the first solder joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220224687.7U CN216775126U (en) | 2022-01-26 | 2022-01-26 | Double-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220224687.7U CN216775126U (en) | 2022-01-26 | 2022-01-26 | Double-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216775126U true CN216775126U (en) | 2022-06-17 |
Family
ID=81979247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220224687.7U Active CN216775126U (en) | 2022-01-26 | 2022-01-26 | Double-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216775126U (en) |
-
2022
- 2022-01-26 CN CN202220224687.7U patent/CN216775126U/en active Active
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