CN216291596U

CN216291596U - Welding pad structure capable of checking welding condition

Info

Publication number: CN216291596U
Application number: CN202122002031.9U
Authority: CN
Inventors: 李强
Original assignee: Jieyandi Electronic Technology Shanghai Co ltd
Current assignee: Jieyandi Electronic Technology Shanghai Co ltd
Priority date: 2021-08-24
Filing date: 2021-08-24
Publication date: 2022-04-12
Anticipated expiration: 2031-08-24

Abstract

The bonding pad structure can be used for checking the welding condition, the winding plate is electrically connected with the main circuit board through the bonding pad, the bonding pad is provided with an extension section, the extension section extends to the edge of the plate surface of the winding plate, and the side surface of the plate surface of the winding plate is bent to form a side metal part which can be directly observed. The utility model can extend the tin-climbing phenomenon generated on the completely shielded bonding pad to the side gold part, and the welding condition of the bonding pad can be determined by observing the tin-climbing degree of the side gold part at the bonding pad after welding, thereby ensuring the overcurrent capacity at the welding position.

Description

Welding pad structure capable of checking welding condition

Technical Field

The utility model relates to the technical field of module power supplies, in particular to a pad structure capable of checking welding conditions.

Background

In the power module, the printed circuit board is a key component, and the printed circuit board carries other electronic parts and is connected with a circuit in parallel so as to provide a stable circuit working environment. Where a multi-layer board is a typical circuit configuration, the circuits of the multi-layer board may be arranged in a multi-layer structure and laminated together. With the development of power electronic technology towards high power, the number of layers of the printed circuit board is gradually increased, and the number of layers of the printed circuit board is more and more, which brings about two effects: 1, the high multilayer circuit board has high processing difficulty and long production period; 2, the price of a high multilayer wiring board varies greatly as the number of layers increases, resulting in a very expensive price.

Especially in a module power supply, the bottleneck of increasing the number of layers of the printed circuit board is the winding distribution design of the transformer and the inductor, so that the transformer and the winding at the inductor are made into independent small plates to reduce the number of layers of the main board, which has important discussion value, and the connection mode between the winding board and the main board greatly affects the performance of the whole product. The connection is now common: the winding board and the main board are connected with a plurality of pads on the contact surface of the main board through the winding board.

In the connection of the winding board and the main board, the position of the connection point is positioned on the contact surface of the winding board and the main board, and the welding pad is positioned inside the winding board and is not close to the edge, so that the welding condition cannot be directly checked in production. When bubbles are generated at the welding position and the welding is poor, the overcurrent capacity of the welding is limited, hot spots are easily formed on the welding point, and the quality of products is affected.

Disclosure of Invention

The present invention is directed to solving the existing problems and providing a pad structure that can be inspected for soldering conditions.

In order to achieve the purpose, the technical scheme adopted by the utility model is arranged on a winding plate, a plurality of bonding pads are distributed on the surface of the winding plate, the winding plate is electrically connected with a main circuit board through the bonding pads, the bonding pads are provided with extension sections, the extension sections are extended to the edge of the surface of the winding plate, and side metal parts capable of being directly observed are formed by bending the side surfaces of the surface of the winding plate.

In some embodiments, the side webs wrap around the sides of the winding plate, and the height of the side webs is provided by the thickness of the winding plate for viewing. Further, the side gold part is vertical, and can facilitate observation.

In some embodiments, the bonding pad is positioned at the edge of the surface of the winding board so as to be connected with the side gold part, the length of the connecting section is reduced, and the tin climbing phenomenon is easier to observe.

In some embodiments, the winding plate is rectangular, and the bonding pads are arranged at corners of the rectangle.

The utility model also provides a winding plate, and any one of the pad structures is arranged on the plate surface of the winding plate.

The utility model also provides a circuit board, the circuit board is electrically connected with the winding of the transformer/inductor through the winding board, and the bonding pad on the side where the winding board is connected with the main board is provided with any bonding pad structure.

The utility model also provides a module power supply which comprises a main circuit board, wherein the main circuit board is connected with the magnetic core of the transformer/inductor through a winding board, and any one of the pad structures is arranged on a pad on the side, connected with the main circuit board, of the winding board.

Compared with the prior art, the soldering terminal has the advantages that the soldering terminal has the structure that the soldering pad extends to the side edge of the winding board, so that the tin climbing phenomenon generated on the fully shielded soldering pad can extend to the side gold part, the soldering condition of the soldering pad can be determined by observing the tin climbing degree of the side gold part at the soldering pad after soldering, whether soldering is good or not can be checked, and the overcurrent capacity of the soldering part can be ensured.

Drawings

FIG. 1 is a schematic diagram of a modular power supply;

fig. 2 is a schematic structural view of a conventional winding plate;

FIG. 3 is a schematic structural diagram of an embodiment of the present invention;

referring to the drawing, the main circuit board 1, the winding board 2, the upper magnetic core 3, the lower magnetic core 4, the bonding pad 5, the side metal part 6 and the extension 7.

Detailed Description

The utility model will now be further described with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 shows a conventional modular power supply, which mainly includes a main circuit board (PCB board) of the power supply, a winding board of a transformer (or inductor), and an upper magnetic core and a lower magnetic core. One part of the winding of the transformer is arranged on the main circuit board, the other part of the winding is arranged on the winding board, and the winding and the magnetic core form a complete transformer through the electrical connection of the bonding pads, so that the conversion and the transmission of energy are provided.

The winding board is connected with the main circuit board through a bonding pad on the surface of the winding board, and the winding board is used for moving part of the transformer winding out of the main circuit board. Referring to fig. 2, the existing bonding pad is located inside the board surface of the winding board; after the welding of winding board and mainboard is accomplished, because the welding condition of pad can not observed by shielding completely, also can't know the welding whether qualified. If a bubble (cold solder joint) occurs, the overcurrent capacity of the bonding pad is reduced, which is likely to become a hot spot, and the performance of the product is further reduced.

Referring to fig. 3, fig. 1 shows a winding plate structure of the present embodiment. The pad in this embodiment is equipped with the extension section towards face side, and the extension section extends to the edge of winding board face from the pad, and the outside end of extension section is bent downwards at the side of winding board face to live side parcel, and then form the side gold portion that can direct observation.

The solder-creeping phenomenon is one of the common soldering defects, and is a severe cold solder phenomenon caused by the solder being separated from the pad, because the solder moves to a place with higher temperature along with the soldering flux. The extending section is made of the same material as the bonding pad, so that the tin-climbing phenomenon generated by the welding point of the bonding pad can move along the extending section and finally appears on the side gold part.

Since the winding plate is located between the winding of the transformer and the main circuit board, the side surface of the winding plate can be seen from the side surface of the space between the winding and the main circuit board, and the side gold part at the end part of the extending section is easier to be observed relative to the position of the winding plate bonding pad in fig. 2.

In the use, after the operation of welding the winding board and the main board is finished, the welding condition of the bonding pad can be determined only by observing the tin climbing degree of the side gold part of the bonding pad, whether the welding is good or not can be checked, and the overcurrent capacity of the welding position is ensured.

Referring to fig. 3, preferably, in some embodiments, the side metal part may wrap around the entire or most of the side surface of the winding plate, and the area of the side metal part is increased by the thickness of the winding plate for better viewing. Further, the side golden part is vertical (perpendicular to the plate surface), and convenience can also be provided for observation.

Referring to fig. 2 and 3, in some embodiments, the bonding pads are preferably located at the edge of the surface of the winding board so as to be connected with the side gold portions, so that the length of the connecting segments is reduced, and tin-climbing is easier to observe. Furthermore, the winding plate surface is rectangular, and the four bonding pads are preferably arranged at four corners close to the rectangular plate surface.

Referring to fig. 3, the present invention may further provide an embodiment of a winding board, wherein any one of the pad structures is disposed on a board surface of the winding board, so as to achieve the above technical advantages.

The utility model can also provide an embodiment of a circuit board, wherein the circuit board is electrically connected with a winding of a transformer through a winding board, and a bonding pad on one side of the winding board, which is connected with the main board, is provided with any one of the bonding pad structures.

Referring to fig. 1, the present invention also provides a modular power supply including a main circuit board. The main circuit board is connected with the magnetic core of the transformer through the winding board, and the bonding pad on one side of the winding board connected with the main circuit board is provided with any bonding pad structure, so that the technical advantage effect can be achieved.

If the main circuit board is connected with the inductor through the winding board, the pad structure, the winding board and the circuit board can be adopted for implementation, and similar technical advantage effects can be achieved.

The embodiments of the present invention have been described in conjunction with the accompanying drawings and examples, the structures of which are given by way of illustration and not limitation, and those skilled in the art can make modifications as required, and various changes and modifications can be made within the scope of the appended claims.

Claims

1. The utility model provides a can inspect pad structure of welding condition sets up in the winding board, it has a plurality of pads to distribute on the face of winding board, and the winding board passes through the pad and forms electrical connection with main circuit board, its characterized in that: the bonding pad is provided with an extension section, the extension section extends to the edge of the winding plate surface, and a side metal part capable of being directly observed is formed by bending the side surface of the winding plate surface.

2. Pad structure for verifiable soldering conditions according to claim 1, characterized in that: the side gold part is vertical setting.

3. Pad structure for verifiable soldering situations according to claim 1 or 2, characterized in that: the bonding pad is located at the edge of the surface of the winding board.

4. Pad structure for verifiable soldering situations according to claim 1 or 2, characterized in that: the winding plate is rectangular, and the bonding pads are arranged at the corners of the rectangle.