CN215222562U - Printed circuit board and electronic product - Google Patents
Printed circuit board and electronic product Download PDFInfo
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- CN215222562U CN215222562U CN202121439563.2U CN202121439563U CN215222562U CN 215222562 U CN215222562 U CN 215222562U CN 202121439563 U CN202121439563 U CN 202121439563U CN 215222562 U CN215222562 U CN 215222562U
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- printed circuit
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Abstract
The present disclosure provides a printed circuit board and an electronic product, a partial region of a surface of the printed circuit board is formed as a metal exposed region (Pm), the metal exposed region (Pm) exposes a metal layer inside the printed circuit board, and a plurality of solder joints (Pw) are formed on the surface of the metal exposed region (Pm), the solder joints (Pw) are used for directly contacting with a conductive connecting member connected to the printed circuit board and functioning to ground the printed circuit board. The circuit board has the advantages of simple structure, good grounding effect and good antistatic property. The electronic product according to the present disclosure has the same advantages.
Description
Technical Field
The present disclosure relates to the field of electronic products, and more particularly, to a printed circuit board and an electronic product including the same.
Background
In order to achieve the anti-static effect of electronic products, especially miniaturized and/or handheld electronic products, in addition to adding an anti-static device on the product, a metal layer is usually formed by a chemical gold deposition process before a printed circuit board is covered with an organic solderability preservative (abbreviated as OSP), and conductive foam is added.
The above-mentioned scheme for preventing static electricity not only needs to add extra processes and increase cost, but also has low reliability and affects the appearance of the product.
SUMMERY OF THE UTILITY MODEL
The present disclosure aims to overcome or at least alleviate the above-mentioned deficiencies of the prior art and to provide a printed circuit board and an electronic product.
According to a first aspect of the present disclosure, there is provided a printed circuit board, wherein a partial area of a surface of the printed circuit board is formed as a metal exposed area, the metal exposed area exposes a metal layer inside the printed circuit board, and a plurality of solder joints are formed on the surface of the metal exposed area,
the solder joint is used for directly contacting with a conductive connecting piece connected with the printed circuit board and plays a role of grounding the printed circuit board.
In at least one embodiment, the solder points are solder points that can be used for surface mount technology.
In at least one embodiment, the metal bare area is located at least at an edge of the printed circuit board.
In at least one embodiment, the metal bare region includes a first region formed in a ring shape surrounding an edge of the printed circuit board, and a surface of the first region is formed with a plurality of solder points.
In at least one embodiment, the width of the first zone is not less than 3 mm.
In at least one embodiment, the printed circuit board is formed with a plurality of through holes for connecting the printed circuit board with the conductive connectors, the metal exposed area includes a second area formed at an edge of the through holes, and a surface of the second area is formed with a plurality of pads.
In at least one embodiment, the printed circuit board is mounted with a connector for connection to the substrate, the metal denuded zone includes a third zone formed around the connector, and a surface of the third zone is formed with a plurality of pads.
In at least one embodiment, both surfaces of the printed circuit board are formed with metal bare areas.
In at least one embodiment, the metal layer is made of copper.
According to a second aspect of the present disclosure, there is provided an electronic product, comprising a printed circuit board according to the first aspect of the present disclosure and a conductive connector,
the printed circuit board is fixed on the conductive connecting piece.
In at least one embodiment, the electronic product further includes a substrate,
the conductive connector is disposed between the substrate and the printed circuit board, and the printed circuit board is electrically connected to the substrate.
In at least one embodiment, the conductive connector is box-shaped and includes a top cover and a bottom cover with the printed circuit board sandwiched therebetween.
In at least one embodiment, both sides of the printed circuit board are in contact with the edges of the top cover and the bottom cover, respectively,
the edge of the top cover is provided with a first matching part, the edge of the bottom cover is provided with a second matching part, the first matching part and the second matching part are connected in a matching mode, and at least one of the first matching part and the second matching part penetrates through a through hole formed in the printed circuit board.
In at least one embodiment, the electronic product is a computing power box.
The circuit board has the advantages of simple structure, good grounding effect and good antistatic property. The electronic product according to the present disclosure has the same advantages.
Drawings
Fig. 1 and 2 are schematic views of two surfaces of a circuit board according to one embodiment of the present disclosure.
Fig. 3 is a schematic view of a stand of an electronic product according to one embodiment of the present disclosure.
Fig. 4 is a schematic view of a substrate of an electronic product according to one embodiment of the present disclosure.
Fig. 5a is a schematic diagram of a mounting process of a circuit board, a bracket, and a substrate of an electronic product as a server according to one embodiment of the present disclosure.
Fig. 5b is a schematic cross-sectional view of a circuit board, a bracket, and a substrate of an electronic product as a server assembled together according to one embodiment of the present disclosure.
Fig. 6 is a top view of a top cover of an electronic product as a computing power box according to one embodiment of the present disclosure.
Fig. 7 is a front view of fig. 6.
Fig. 8 is a bottom view of a bottom cover of an electronic product as a computing power box according to one embodiment of the present disclosure.
Fig. 9 is a schematic diagram of a process of mounting a circuit board, a top cover, and a bottom cover of an electronic product as a computing power box according to an embodiment of the present disclosure.
Description of reference numerals:
a P circuit board; a first side Pa; a second side of Pb; pm metal bare area; pw welding spots; a P10 through hole; a Pk connection device; a first region of P1; a second region of P2; a third region of P3;
s, supporting; s10 bracket holes; s20, opening;
b, a substrate; b1 bracket mounting area; b2 attachment region;
h1 top cover; h11 first mating portion; h12 first positioning portion;
h2 bottom cover; h20 box opening; h21 backplane; h22 side walls; h221 second mating portion; h222 second positioning portion.
Detailed Description
Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings. It should be understood that the detailed description is intended only to teach one skilled in the art how to practice the disclosure, and is not intended to be exhaustive or to limit the scope of the disclosure.
Referring first to fig. 1 to 5, a printed circuit board and an electronic product according to an embodiment of the present application will be described taking an application in which the printed circuit board is mounted on a server chassis as an example. In this embodiment, the electronic product is a server including a circuit board. Printed circuit boards are also referred to below as circuit boards.
Fig. 1 and 2 show two surfaces (a first face Pa and a second face Pb) of the circuit board P, respectively. A metal bare region Pm is formed in a partial region of the two surfaces. The metal bare region Pm exposes a metal substrate, typically copper, inside the circuit board P.
A plurality of welding points Pw are formed on the surface of the metal exposed area Pm. The solder point Pw is a solder point that can be used in surface mount technology (SMT for short), or in general, the solder point Pw is a solder plated by an SMT stencil (also called a PCB stencil). That is, the solder point Pw is plated during the conventional steel-mesh-opening process of the circuit board P. This makes the formation of the solder joint Pw located in the metal bare region Pm without adding an additional manufacturing process of the circuit board P.
The metal exposed region Pm includes at least a first annular region P1 located at the edge of the two surfaces. The first region P1 is formed with a plurality of welding points Pw.
Alternatively, the circuit board P is formed at an outer peripheral portion thereof with a plurality of through holes P10, and the through holes P10 are used to pass connectors therethrough, thereby fixing the circuit board P to a conductive connector, such as a bracket S described below.
The metal exposing region Pm further includes a second region P2 surrounding around each of the through holes P10. The second region P2 is formed with a plurality of welding points Pw. This not only increases the contact area of the circuit board P with the conductive connector; moreover, since the solder joint Pw has a certain deformation capability after being stressed, when a connector, such as a screw, connects the circuit board P and the conductive connector together in a pressing manner, the solder joint Pw can reduce or eliminate stress caused by the pressure of the connector for the circuit board P in a slightly deformed manner.
Alternatively, one of the two surfaces of the circuit board P, the second surface Pb in this embodiment, is provided with a connecting device Pk for connecting with the substrate B. The metal bare region Pm further includes a third region P3 in a ring shape located around the connection device Pk. The third region P3 is formed with a plurality of welding points Pw.
Optionally, the width of the metal exposed area Pm, that is, the distance between the side of the metal exposed area Pm away from the edge of the circuit board and the side close to the edge of the circuit board, is not less than 3mm, for example, 3mm to 5 mm.
Optionally, the diameter of the weld point Pw is about 0.8 mm; the height of the weld point Pw is about 0.1 mm.
Optionally, the welding points Pw are uniformly distributed in the metal bare area Pm.
Next, the connection manner of the circuit board P with the conductive connector and the substrate B will be described with reference to fig. 3 to 5.
Referring to fig. 3, the conductive connecting member in this embodiment is a bracket S. Optionally, the material of which the bracket S is made comprises metal, for example comprising an aluminum alloy.
The holder S is formed at an outer peripheral portion thereof with a plurality of holder holes S10. The connector can sequentially pass through the through hole P10 and the bracket hole S10 to connect the circuit board P and the bracket S together.
An opening S20 is formed at the center of the bracket S, and a connector Pk on the circuit board P can pass through the opening S20 to be electrically connected to the substrate B.
The outer contour of the support S is equal to or slightly larger than the outer contour of the circuit board P, so that the solder point Pw located in the first region P1 can be electrically connected with the support S in direct contact.
The profile of bracket hole S10 is equal to or slightly smaller than the profile of the inner peripheral edge of second region P2 so that solder point Pw located in second region P2 can make electrical connection with bracket S in direct contact.
The contour of the opening S20 is equal to or slightly smaller than the contour of the inner peripheral edge of the third region P3, so that the solder point Pw located at the third region P3 can make electrical connection with the bracket S in direct contact.
Referring to fig. 4, a substrate B is used for connection with a circuit board P. The substrate B is, for example, a server core board.
A rack mounting area B1 is formed on the substrate B, and a rack S connected to the circuit board P is mounted to the rack mounting area B1.
A connection region B2 is formed in the rack mount region B1, and the connection region B2 has an interface for connecting with the connection device Pk.
Fig. 5a schematically shows the stacked relationship of the circuit board P, the support S, and the substrate B. Fig. 5B schematically shows a cross-sectional view of the circuit board P, the bracket S and the substrate B when assembled together.
The second face Pb of the circuit board P having the connector Pk is mounted toward the bracket S, and the connector Pk is connected to the connection region B2 of the substrate B after passing through the opening S20 of the bracket S.
In mounting, for example, the circuit board P and the bracket S may be connected together by a connector, and then the whole of the circuit board P and the bracket S may be connected to the substrate B. Alternatively, the support S and the substrate B may be connected first, and then the circuit board P may be connected to the support S.
Next, an application of the printed circuit board mounted to the computing power box will be described with reference to fig. 1, 2, and 6 to 9. That is, in the present embodiment, the electronic product is a power calculating case, and the conductive connecting member connected to the circuit board P is a case of the power calculating case.
The computing case includes a top cover H1 and a bottom cover H2 that can be closed together. The top cover H1 and the bottom cover H2 are made of a material including, for example, metal. Alternatively, the top cover H1 and the bottom cover H2 are made of materials each including, for example, aluminum alloy.
The top cover H1 and the bottom cover H2 each have a certain receiving space to receive electronic components protruding from both surfaces of the circuit board P.
Taking the bottom cover H2 as an example, the bottom cover H2 includes a bottom plate H21 and side walls H22 surrounding the edges of the bottom plate H21. A box opening H20 is formed at the middle of the bottom plate H21, and the box opening H20 allows the circuit board P accommodated in the box to be electrically connected to an external device.
A plurality of first engaging portions H11 and at least one (2 in the present embodiment) first positioning portion H12 are formed on a surface of the side wall of the top cover H1 located at the outer peripheral portion and facing the bottom cover H2.
A plurality of second engaging portions H221 and at least one (2 in the present embodiment) second positioning portion H222 are formed on a surface of the side wall H22 facing the top cover H1.
The first positioning portion H12 cooperates with the second positioning portion H222 to determine the fitting positioning of the top cover H1 and the bottom cover H2. The first fitting portion H11 is fitted with the second fitting portion H221 to achieve connection of the top cover H1 and the bottom cover H2.
Alternatively, the first positioning portion H12 is a convex portion located on the top cover H1, and the second positioning portion H222 is a concave portion located on the bottom cover H2; the first engagement portion H11 is a convex portion located on the top cover H1, and the second engagement portion H221 is a concave portion located on the bottom cover H2.
In assembly, the circuit board P is sandwiched between the top cover H1 and the bottom cover H2, and the solder point Pw of the metal exposed region Pm on the first side Pa of the circuit board P contacts the top cover H1, and the solder point Pw of the metal exposed region Pm on the second side Pb of the circuit board P contacts the bottom cover H2. The first mating portion H11 passes through the through hole P10 and then is connected with the second mating portion H221 in a mating manner, for example, the two are inserted in a nesting manner.
The second face Pb of the circuit board P having the connector Pk is mounted toward the bottom cover H2 formed with the cartridge opening H20.
Optionally, the outer contour of the circuit board P, the outer contour of the top cover H1, and the outer contour of the bottom cover H2 are substantially equal or similar.
The present disclosure has at least one of the following advantages:
(i) the circuit board P and the electronic product according to the present disclosure have good antistatic properties.
(ii) The structure of the circuit board P electrically connected with the conductive connecting piece is simple in manufacturing process, can be formed by utilizing a steel mesh forming process of the circuit board, and is low in manufacturing cost.
(iii) The welding point Pw has certain deformability when being connected with the conductive connecting piece, so that the problem of stress concentration formed in the connection process of the circuit board can be relieved.
Of course, the present disclosure is not limited to the above-described embodiments, and those skilled in the art can make various modifications to the above-described embodiments of the present disclosure without departing from the scope of the present disclosure under the teaching of the present disclosure. For example:
(i) the specific position and size structure of the metal exposed area Pm on the circuit board P are not limited in the application, for example, the metal exposed area Pm can also be formed in the middle of the circuit board P, and correspondingly, the middle of the conductive connecting piece can be formed into a connecting column to be in contact with a welding spot Pw located in the metal exposed area Pm.
(ii) The electronic product according to the present disclosure is not limited to being a server or a computing power box.
Claims (14)
1. A printed circuit board is characterized in that a partial area of the surface of the printed circuit board is formed into a metal exposed area, the metal exposed area exposes a metal layer in the printed circuit board, a plurality of welding points are formed on the surface of the metal exposed area,
the solder joint is used for being in direct contact with a conductive connecting piece connected with the printed circuit board and plays a role in grounding the printed circuit board.
2. The printed circuit board of claim 1, wherein the solder joints are solder joints that can be used in surface mount technology.
3. The printed circuit board of claim 1, wherein the metal bare area is located at least at an edge of the printed circuit board.
4. The printed circuit board of claim 1, wherein the metal bare area comprises a first area formed in a ring shape around an edge of the printed circuit board, a surface of the first area being formed with a plurality of solder points.
5. The printed circuit board of claim 4, wherein the width of the first region is not less than 3 mm.
6. The printed circuit board of claim 1, wherein the printed circuit board is formed with a plurality of through holes for connecting the printed circuit board to the conductive connectors, and the metal exposed region includes a second region formed at an edge of the through holes, and a surface of the second region is formed with a plurality of solder points.
7. The printed circuit board of claim 1, wherein the printed circuit board is mounted with a connector for connection to a substrate, and the metal denuded zone comprises a third zone formed around the connector, the third zone having a surface formed with a plurality of solder joints.
8. The printed circuit board of any of claims 1 to 7, wherein both surfaces of the printed circuit board are formed with the metal bare areas.
9. The printed circuit board of any of claims 1 to 7, wherein the metal layer is made of copper.
10. An electronic product, characterized by comprising a conductive connection member and a printed circuit board according to any one of claims 1 to 9,
the printed circuit board is fixed to the conductive connecting member.
11. The electronic product of claim 10, further comprising a substrate,
the conductive connector is disposed between the substrate and the printed circuit board, and the printed circuit board is electrically connected to the substrate.
12. The electronic product according to claim 10, wherein the conductive connector has a box shape and includes a top cover and a bottom cover, the printed circuit board being sandwiched between the top cover and the bottom cover.
13. The electronic product of claim 12, wherein two sides of the printed circuit board are in contact with an edge of the top cover and an edge of the bottom cover,
the edge of top cover is formed with first cooperation portion, the edge of bottom cover is formed with second cooperation portion, first cooperation portion with second cooperation portion is connected with each other cooperateing, first cooperation portion with at least one of second cooperation portion pass form in the through-hole of printed circuit board.
14. An electronic product according to claim 12 or 13, wherein the electronic product is a computing power box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121439563.2U CN215222562U (en) | 2021-06-25 | 2021-06-25 | Printed circuit board and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121439563.2U CN215222562U (en) | 2021-06-25 | 2021-06-25 | Printed circuit board and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215222562U true CN215222562U (en) | 2021-12-17 |
Family
ID=79431511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121439563.2U Active CN215222562U (en) | 2021-06-25 | 2021-06-25 | Printed circuit board and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215222562U (en) |
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2021
- 2021-06-25 CN CN202121439563.2U patent/CN215222562U/en active Active
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