CN221010370U - Circuit board assembly and electronic equipment - Google Patents

Abstract

The application discloses a circuit board assembly and electronic equipment, relates to the technical field of circuit boards, and aims to solve the technical problem that a large forbidden coverage space is required to be arranged around a device to be mounted. The circuit board assembly comprises a PCB, a cushion piece, a device to be assembled and adjacent materials, wherein the cushion piece is electrically connected with the PCB, the device to be assembled is electrically connected with the cushion piece, and an avoidance distance is arranged between the adjacent materials and the cushion piece and is connected with the PCB. The distance between one side of the device to be assembled, which is away from the PCB, and the plate surface is L, the distance between one side of the adjacent material, which is away from the PCB, and the plate surface is D, and L is more than or equal to D. According to the application, the cushion piece is arranged between the PCB and the device to be assembled, and can cushion the height of the device to be assembled on the PCB, so that the device to be assembled can be subjected to operations such as surface mounting or connection on the height of the device to be assembled, and the operation on the surface of the PCB is not needed, thereby improving the operation height of the device to be assembled, further reducing the avoiding interval between adjacent materials and the cushion piece, and being beneficial to improving the space utilization rate on the PCB.

Description

Circuit board assembly and electronic equipment

Technical Field

The present disclosure relates to circuit boards, and particularly to a circuit board assembly and an electronic device.

Background

At present, according to the modeling design and product requirements of the industrial design (industrial design, ID) of electronic products, a chip, a memory and other materials are usually mounted on the surface of a printed circuit board (printed circuit board, PCB) by adopting a chip mounting process. Or adopting the mode that the connector is connected with the PCB, and then switching the materials such as the camera, the battery and the like on the PCB through the connector. However, in order to ensure that the chip, memory or connector waiting device has the necessary on-board operation space, a large forbidden coverage space is usually required to be arranged around the device to be mounted, so as to avoid placing devices such as a patch device, a shell or hardware around the device to be mounted. Therefore, the utilization rate of the space on the PCB is reduced, and the requirement of thinning the ID modeling is not met.

Disclosure of utility model

The application discloses a circuit board assembly and electronic equipment, which are used for solving the technical problem that a large forbidden coverage space is required to be arranged around a device to be installed.

In order to achieve the above purpose, the application adopts the following technical scheme:

The first aspect of the application discloses a circuit board assembly comprising:

PCB；

The pad is arranged on one side plate surface of the PCB and is electrically connected with the PCB;

The device to be mounted is arranged on one side, far away from the PCB, of the pad, and is electrically connected with the pad; and

An avoidance distance is arranged between the adjacent material and the cushion piece, and the adjacent material is connected with the PCB;

the distance between one side of the device to be mounted, which is away from the PCB, and the plate surface is L, and the distance between one side of the adjacent material, which is away from the PCB, and the plate surface is D, wherein L is more than or equal to D.

In some embodiments, the circuit board assembly further comprises a plurality of the adjacent materials;

Among the adjacent materials, the maximum distance between one side of the adjacent materials away from the PCB and the board surface is D _max, and L is more than or equal to D _max.

In some embodiments, the pad includes a pad plate, a bonding pad, and a fillets;

the backing plate is provided with a first surface and a second surface which are oppositely arranged, the bonding pad is arranged on the first surface, the welding leg is arranged on the second surface, and the bonding pad is electrically connected with the welding leg;

The bonding pad is electrically connected with the PCB, and the soldering leg is electrically connected with the device to be mounted.

In some embodiments, the first surface is provided with a plurality of the pads arranged in a first column of pads and a second column of pads arranged at intervals;

the second surface is provided with a plurality of welding pins, and the welding pins are arranged into a first column of welding pins;

The vertical projection of the first column of welding pins on the first surface is positioned between the first column of welding pads and the second column of welding pads, and the number of the welding pads is equal to that of the welding pins.

In some embodiments, a perpendicular projection of each pad within the first column of pads onto the second column of pads is located between two adjacent pads within the second column of pads.

In some embodiments, the device to be mounted comprises a connector comprising two columns of pins arranged side by side;

the second surface is provided with two groups of first-row welding pins, the positions of the two groups of first-row welding pins respectively correspond to the positions of the two rows of pins, and the two groups of first-row welding pins are respectively and electrically connected with the two rows of pins.

In some embodiments, the circuit board assembly further comprises a seal ring;

The sealing ring is wound on the periphery of the device to be mounted and is positioned on one side, far away from the PCB, of the pad.

In some embodiments, the back-off spacing between the adjacent material and the pad is 0.5mm.

The second aspect of the present application discloses an electronic device, comprising:

a housing; and

The circuit board assembly of any of the above embodiments;

the circuit board assembly is mounted within the housing.

In some embodiments, the electronic device further comprises an electrical component and a plurality of electronic components; the adjacent material comprises a shielding case;

The shielding cover is connected with the PCB, and the plurality of electronic devices are electrically connected with the PCB and are positioned in the coverage range of the shielding cover;

The electrical component is connected to one side of the shielding cover, which is away from the PCB, and is electrically connected with the device to be mounted.

Compared with the prior art, the application has the beneficial effects that:

The application can make the cushion piece heighten the height of the device to be mounted on the PCB by arranging the cushion piece between the PCB and the device to be mounted. Meanwhile, the distance between one side of the device to be mounted, which is away from the PCB, and the PCB surface is L, the distance between one side of the adjacent material, which is away from the PCB, and the PCB surface is D, and L is more than or equal to D, so that the height of the device to be mounted after heightening is larger than the height of the adjacent material. Therefore, the device to be mounted can be subjected to operations such as surface mounting or connection on the height of the pad without being subjected to operations on the surface of the PCB, so that the operation height of the device to be mounted is improved, the avoiding interval between adjacent materials and the pad can be reduced, and the space utilization rate of the PCB is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is a schematic top view of a camera module portion of the electronic device of FIG. 2;

FIG. 4 is a schematic cross-sectional structural view of section A-A of the circuit board assembly of FIG. 3;

FIG. 5 is a schematic top view of the rear cover of FIG. 3 after being hidden;

FIG. 6 is a schematic cross-sectional structural view of section B-B of the circuit board assembly of FIG. 5;

FIG. 7 is a schematic top view of the camera module of FIG. 5 after being hidden;

FIG. 8 is a schematic cross-sectional structural view of the circuit board assembly of FIG. 7 in section C-C;

FIG. 9 is a schematic top view of the first surface of the pad of FIG. 8;

FIG. 10 is a schematic top view of the second surface of the pad of FIG. 8;

Fig. 11 is a schematic top view of the pad of fig. 8 with the fillets projected on the first surface.

The main reference numerals illustrate:

01-an electronic device; 10-a display screen; 20-a housing; 21-a rear cover; 22-middle frame; 30-a circuit board assembly; 31-PCB; 32-padding; 32 a-a first surface; 32 b-a second surface; 321-backing plate; 322-bonding pads; 322 a-first column pad; 322 b-second column pad; 323-fillets; 323 a-first column of fillets; 323 b-second row fillets; 33, a device to be assembled; 33 a-male; 33 b-a female seat; 34-adjacent material; 34 a-a shield; 34 b-electrical components; 35-an electronic device; 36-sealing ring; 40-a camera module; 41-a camera body; 42-FPC; 50-cell assembly.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the present application, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the terms "first," "second," etc. are used primarily to distinguish between different devices, elements, or components (the particular species and configurations may be the same or different), and are not used to indicate or imply the relative importance and number of indicated devices, elements, or components. Unless otherwise indicated, the meaning of "a plurality" is two or more.

The technical scheme of the application will be further described with reference to specific embodiments and drawings.

The embodiment of the application provides electronic equipment 01. As shown in fig. 1, the electronic device 01 may be an electronic product such as a mobile phone, a tablet computer, an electronic reader, a notebook computer, a desktop computer, a server, a wearable device, an unmanned aerial vehicle, and the like. The embodiment of the application does not particularly limit the specific kind of the electronic device 01. In the following, in order to better illustrate the content of the embodiments of the present application, an example will be described in which the electronic device 01 is a mobile phone.

As shown in fig. 1, the electronic device 01 may include a display screen 10 and a housing 20. The display screen 10 may be attached to the housing 20 by means of an adhesive, and an accommodating space is provided between the display screen 10 and the housing 20 for mounting the electric components. The electronic apparatus 01 may have a length direction, a width direction, and a thickness direction. For convenience of explanation, the following embodiment will use the X direction as the length direction of the electronic device 01, the Y direction as the width direction of the electronic device 01, and the Z direction as the thickness direction of the electronic device 01. Taking a mobile phone as an example, the mobile phone may have a rectangular outline, and the direction of the long side may be the length direction of the mobile phone, and the direction of the short side may be the width direction of the mobile phone.

In some embodiments, as shown in fig. 2, the housing 20 may include a rear cover 21 and a middle frame 22, where the rear cover 21 may be connected to a side of the middle frame 22 facing away from the display screen 10 by screwing, welding, bonding, or buckling. Of course, in other embodiments, the rear cover 21 and the middle frame 22 may be provided as an integrally formed housing 20. The embodiment of the present application does not particularly limit the specific structure of the housing 20 and the external shape of the electronic apparatus 01.

In addition, as shown in fig. 2, the electronic device 01 may further include a circuit board assembly 30, and the electrical components may include devices such as a camera module 40 and a battery assembly 50, and the camera module 40 and the battery assembly 50 may be electrically connected to the circuit board assembly 30. Depending on the design of the electronic device 01, the camera module 40 may be mounted on the rear cover 21, and the circuit board assembly 30 and the battery assembly 50 may be mounted in the housing 20. By way of example, the circuit board assembly 30 and the battery assembly 50 may be mounted between the center frame 22 and the rear cover 21, or between the center frame 22 and the display screen 10. The specific mounting positions of the circuit board assembly 30, the camera module 40 and the battery assembly 50 are not particularly limited in the embodiment of the present application.

The above embodiment describes the overall structure of the electronic device 01 by taking a mobile phone as an example. In order to better illustrate the content of the embodiments of the present application, the following embodiments will take the camera module 40 in the mobile phone as an example, and the specific structure of the circuit board assembly 30 will be described in detail. As shown in fig. 3 and 4, the circuit board assembly 30 may include a PCB31, a pad 32, a device to be mounted 33, and an adjacent material 34, the device to be mounted 33 and the adjacent material 34 may be electrically connected with the PCB31, and the adjacent material 34 may be disposed around the device to be mounted 33.

The device 33 to be mounted may be a connector, a chip, or a memory. The proximity material 34 may be one or more of a capacitor, resistor, filter, amplifier, operator, etc. These devices may be mounted on PCB31 by surface mount technology (surface mounted technology, SMT), and the specific type and connection manner of the device 33 and the adjacent material 34 are not particularly limited in the embodiments of the present application. Typically, the adjacent material 34 may be pre-disposed on the PCB31, and the device 33 to be mounted needs to be mounted later according to the actual situation.

The embodiment of the present application will be described in detail taking the board-to-board (BTB) connector as an example of the device 33 to be mounted. Of course, the device 33 to be mounted may be other connectors, and the specific type of the connector is not particularly limited in the embodiment of the present application. As shown in fig. 3 and 4, the camera module 40 may include a camera body 41 and a flexible circuit board (flexible printed circuit, FPC) 42, and the camera body 41 and the FPC42 may be compressed between the PCB31 and the rear cover 21. The camera body 41 may be electrically connected to the BTB connector through the FPC42, and the BTB connector may be electrically connected to the PCB31, so that the camera body 41 is electrically connected to the PCB 31.

In some embodiments, the circuit board assembly 30 may further include a plurality of electronic devices 35, the proximity material 34 may further include a shield 34a and an electrical component 34b, the electrical component 34b and the electronic devices 35 may be electrically connected to the PCB31, respectively, and the shield 34a may be connected to the PCB 31. Wherein the shield 34a and the electrical component 34b may be disposed around the BTB connector. In the Z direction, the camera body 41 may be connected to a side of the shield can 34a facing away from the PCB31, and the plurality of electronic devices 35 may be disposed within a range covered by the shield can 34 a.

In this way, the camera body 41 can be erected through the shielding cover 34a, and more electronic devices 35 can be placed between the shielding cover 34a and the PCB31, so as to improve the space utilization rate on the PCB 31. Of course, when the space of the ornament on the PCB31 is enough, the camera body 41 may be directly disposed on the PCB 31. The embodiment of the present application does not particularly limit the specific installation position of the camera body 41.

On this basis, as shown in fig. 5 and 6, a schematic structural view after hiding the rear cover 21 is shown. Wherein the BTB connector may include a male head 33a and a female seat 33b, the fpc42 may be electrically connected with the male head 33 a. The male head 33a may be snapped onto the female seat 33b, thereby implementing the BTB connector on function. In order to compress the male head 33a on the female seat 33b, the rear cover 21 may be additionally provided with foam or steel sheets, or the rear cover 21 may be partially thickened to firmly fasten the male head 33a on the female seat 33b, thereby ensuring connection reliability of the BTB connector.

In assembly, the height of the male head 33a and the female seat 33b of the BTB connector is only 0.6-0.8mm, so that a forbidden cloth space of 0.8-1.2mm needs to be arranged around the female seat 33b in order to fasten the male head 33a on the female seat 33b, thereby providing enough operation space for manual assembly or jig assembly and avoiding damaging adjacent materials 34 in the assembly process. However, in this way, the larger the forbidden space is, the smaller the ornament space is. In order to realize the functions of the electronic apparatus 01, the electronic apparatus 01 has to be increased in size, and the requirement of thinning the ID model is not satisfied. If a BTB connector with a customized height is selected, that is, the fastening height of the male head 33a and the female seat 33b is increased to meet the requirement of process assembly fastening, although the setting of the forbidden space can be reduced, and the space of the ornament is improved, both the BTB connector and the camera module 40 need customized customization, which is not beneficial to the generalization of materials of the BTB connector and the camera module 40, resulting in higher material selection cost.

In order to solve the technical problem of large forbidden space, the pad 32 provided by the embodiment of the application can pad the BTB connector. As shown in fig. 7 and 8, a schematic structural diagram after the camera module 40 is hidden is shown. Specifically, the pad 32 may be disposed at the location of the BTB connector, and the pad 32 may have a first surface 32a and a second surface 32b disposed opposite each other. The first surface 32a of the pad 32 may face the PCB31 side, the second surface 32b of the pad 32 may face away from the PCB31 side, and the female socket 33b of the BTB connector may be disposed on the second surface 32b of the pad 32. The spacer 32 may have an avoiding space S between itself and the shield case 34a or between itself and the electrical element 34b, so as to form the above-mentioned forbidden space.

Thus, as shown in fig. 8, when the female socket 33b of the BTB connector is lifted by the pad 32, the distance between the side of the female socket 33b of the BTB connector facing away from the PCB31 and the board surface of the PCB31 is L. Among the plurality of adjacent materials 34, the distance between the side of the electrical element 34b facing away from the PCB31 and the board surface of the PCB31 is D, but the distance between the side of the shielding cover 34a facing away from the PCB31 and the board surface of the PCB31 is the largest, D _max, and L is larger than or equal to D _max. Of course, in more embodiments, other adjacent materials 34 may have the greatest height on the side facing away from the PCB 31. The maximum height of the side of the adjacent material 34 facing away from the PCB31 is not particularly limited in embodiments of the present application.

At this time, since the raised female seat 33b is higher than the shielding cover 34a, the male head 33a (shown in fig. 6) of the BTB connector can be engaged with the female seat 33b at the height of the cushion member 32. In this way, the male head 33a of the BTB connector does not need to be buckled on the board surface of the PCB31, so that the buckling height of the BTB connector is increased, the operation space for buckling the male head 33a is enlarged, and the avoiding space S between the adjacent material 34 and the pad 32 can be reduced, which is beneficial to improving the space utilization rate of the PCB31 and increasing the space for placing articles on the PCB 31. The cushion 32 provided by the embodiment of the application can reduce the avoiding space S between the adjacent material 34 and the cushion 32 to 0.5mm, which is equivalent to half of the original avoiding space S.

In addition, for the circuit board assembly 30 having the waterproof grade requirement, a waterproof structure may be provided at the position of the BTB connector. As shown in fig. 8, the perpendicular projection area of the female socket 33b of the BTB connector on the PCB31 may be smaller than the perpendicular projection area of the pad 32 on the PCB 31. The circuit board assembly 30 may further include a sealing ring 36, the sealing ring 36 may be wound around the outer circumference of the female socket 33b of the BTB connector, and the sealing ring 36 may be further located at a side of the pad 32 away from the PCB 31. In this way, the waterproof performance of the circuit board assembly 30 can be improved by providing the sealing ring 36 between the female seat 33b of the BTB connector and the pad 32.

To achieve the function that the pad 32 (shown in fig. 8) may pad the BTB connector, the pad 32 may include a pad 321, a pad 322, and a pad 323, as illustrated in fig. 9 and 10, for example. Wherein, the backing plate 321 can be an insulating plate made of FR-4 material. Of course, insulating plates of other materials may be used. The specific material of the pad 321 is not particularly limited in the embodiment of the present application. The pads 322 may be disposed on the first surface 32a of the pad 321, the fillets 323 may be disposed on the second surface 32b of the pad 321, and the number of pads 322 and fillets 323 may be equal. The pad 321 may be provided with a through hole for connecting the pad 322 and the pad 323, so that the pad 322 and the corresponding pad 323 may be electrically connected by plating metal in the through hole.

Thus, soldering portions corresponding to the pads 322 may be provided on the PCB31, so that the pads 322 on the pad member 32 may be electrically connected to the PCB 31. Similarly, pins corresponding to the solder pins 323 may be provided on the female socket 33b of the BTB connector, so that the solder pins 323 of the pad 32 may be electrically connected with the female socket 33b of the BTB connector. Thereby, the pad 32 can realize the function of conducting the female socket 33b of the BTB connector with the PCB 31.

For better illustration of the pad 32, the following embodiment will be exemplified with two rows of 16 pins for the female socket 33b of the mating BTB connector. As shown in fig. 9 and 10, 16 pads 322 (indicated by a numeral mark in fig. 9) may be disposed on the first surface 32a of the pad 321, and the 16 pads 322 may be arranged in four columns disposed at intervals in the Y direction. The four columns of pads 322 may also be symmetrically disposed about the a-a axis along the X-direction. For convenience of explanation, two columns of pads 322 on one side of the a-a axis may be divided into a first column of pads 322a and a second column of pads 322b, and the other two columns of pads 322 may be disposed symmetrically with respect to the a-a axis with respect to the first column of pads 322a and the second column of pads 322 b. In which, in the Y direction, the first and second column pads 322a and 322b may be provided with 4, respectively. In this way, 16 pads 322 can be arranged compactly on the first surface 32a of the pad 321 to avoid oversized pad 321 in the Y direction.

Further, as shown in fig. 9, the perpendicular projection of each pad 322 within the first column of pads 322a onto the second column of pads 322b in the X-direction may be located between two adjacent pads 322 within the second column of pads 322 b. That is, the first column pads 322a may be staggered with the second column pads 322b in the Y direction. In this way, the pitch of the pads 322 in the X direction can be reduced, contributing to a reduction in the size of the pad 321 in the X direction.

Correspondingly, as shown in fig. 10, 16 fillets 323 may be disposed on the second surface 32b of the backing plate 321, the 16 fillets 323 may be arranged in a first column of fillets 323a and a second column of fillets 323b along the Y-direction, and the first column of fillets 323a and the second column of fillets 323b may also be symmetrically disposed about the a-a axis.

After molding, as shown in fig. 11, a schematic view of the fillets 323 on the second surface 32b of the backing plate 321 projected onto the first surface 32a is shown. Wherein the vertical projection of the first column of fillets 323a on the first surface 32a may be positioned between the first column of pads 322a (shown in fig. 9) and the second column of pads 322b (shown in fig. 9). The vertical projection of the second column of fillets 323b on the first surface 32a can be positioned between the other two columns of pads 322.

Since the first and second rows of pads 322a and 322b are staggered with each other in the Y direction, the first row of fillets 323a can be electrically connected to the first and second rows of pads 322a and 322b, respectively, in the Y direction. That is, in the Y direction, a first one of the first column of fillets 323a may be electrically connected with the pad 322 of the left side number 1 and a second one of the first column of fillets 323a may be electrically connected with the pad 322 of the right side number 2. The cycle is thus completed, completing the electrical connection of all pads 322 and fillets 323.

Thus, two columns of 16 pins on the female socket 33b of the BTB connector can be electrically connected with 16 solder pins 323 on the second surface 32b of the pad 321 correspondingly. The 16 pads 322 on the first surface 32a of the pad 321 may be electrically connected to corresponding soldering sites on the PCB31, thereby achieving the effect that the pad 32 conducts the female socket 33b of the BTB connector with the PCB 31.

The above embodiment is exemplified by taking the camera module 40 as an electrical component, and in other embodiments, the electrical component may be the battery module 50. That is, the battery assembly 50 may also be electrically connected with the PCB31 through the BTB connector. The manner of providing the pad 32 can also be used to increase the snap-fit height of the BTB connector when assembled.

In addition, the above embodiment is exemplified by taking the BTB connector as the device 33 to be mounted as an example, and in other embodiments, the device 33 to be mounted may be a chip, a memory, or the like. That is, when a chip or memory or the like needs to be soldered to the PCB31, the soldering height of the chip or memory or the like can be increased by the pad 32 as well.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims (10)

1. A circuit board assembly, comprising:

PCB；

The pad is arranged on one side plate surface of the PCB and is electrically connected with the PCB;

The device to be mounted is arranged on one side, far away from the PCB, of the pad, and is electrically connected with the pad; and

An avoidance distance is arranged between the adjacent material and the cushion piece, and the adjacent material is connected with the PCB;

the distance between one side of the device to be mounted, which is away from the PCB, and the plate surface is L, and the distance between one side of the adjacent material, which is away from the PCB, and the plate surface is D, wherein L is more than or equal to D.

2. The circuit board assembly of claim 1, further comprising a plurality of said proximity items;

Among the adjacent materials, the maximum distance between one side of the adjacent materials away from the PCB and the board surface is D _max, and L is more than or equal to D _max.

3. The circuit board assembly of claim 1, wherein the pad comprises a pad, a land, and a fillet;

the backing plate is provided with a first surface and a second surface which are oppositely arranged, the bonding pad is arranged on the first surface, the welding leg is arranged on the second surface, and the bonding pad is electrically connected with the welding leg;

The bonding pad is electrically connected with the PCB, and the soldering leg is electrically connected with the device to be mounted.

4. The circuit board assembly of claim 3, wherein the first surface is provided with a plurality of the pads, the plurality of pads being arranged in first and second columns of pads arranged in a spaced apart relationship;

the second surface is provided with a plurality of welding pins, and the welding pins are arranged into a first column of welding pins;

The vertical projection of the first column of welding pins on the first surface is positioned between the first column of welding pads and the second column of welding pads, and the number of the welding pads is equal to that of the welding pins.

5. The circuit board assembly of claim 4, wherein a perpendicular projection of each pad within the first column of pads onto the second column of pads is located between two adjacent pads within the second column of pads.

6. The circuit board assembly of claim 4, wherein the device to be mounted comprises a connector comprising two columns of pins arranged side-by-side;

the second surface is provided with two groups of first-row welding pins, the positions of the two groups of first-row welding pins respectively correspond to the positions of the two rows of pins, and the two groups of first-row welding pins are respectively and electrically connected with the two rows of pins.

7. The circuit board assembly of any one of claims 1-6, wherein the circuit board assembly further comprises a seal ring;

The sealing ring is wound on the periphery of the device to be mounted and is positioned on one side, far away from the PCB, of the pad.

8. The circuit board assembly of any one of claims 1-6, wherein the standoff distance between the adjacent material and the pad is 0.5mm.

9. An electronic device, comprising:

a housing; and

The circuit board assembly of any one of claims 1-8;

the circuit board assembly is mounted within the housing.

10. The electronic device of claim 9, further comprising an electrical component and a plurality of electronic components; the adjacent material comprises a shielding case;

The shielding cover is connected with the PCB, and the plurality of electronic devices are electrically connected with the PCB and are positioned in the coverage range of the shielding cover;

The electrical component is connected to one side of the shielding cover, which is away from the PCB, and is electrically connected with the device to be mounted.