CN209592372U - Printed circuit board stacking structure - Google Patents
Printed circuit board stacking structure Download PDFInfo
- Publication number
- CN209592372U CN209592372U CN201920759221.5U CN201920759221U CN209592372U CN 209592372 U CN209592372 U CN 209592372U CN 201920759221 U CN201920759221 U CN 201920759221U CN 209592372 U CN209592372 U CN 209592372U
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- printed circuit
- circuit board
- connector
- stacking construction
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000010276 construction Methods 0.000 claims description 37
- 239000007787 solid Substances 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 238000012958 reprocessing Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 229910001092 metal group alloy Inorganic materials 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000000994 depressogenic effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model provides a printed circuit board stacked structure, including first printed circuit board, second printed circuit board, connector and bearer bar. The first printed circuit board includes a first pad. The second printed circuit board includes a second pad. The connector is configured between the first printed circuit board and the second printed circuit board and is connected with the first printed circuit board and the second printed circuit board through the separable fastener. The connector comprises a substrate, a first conductive elastic sheet and a second conductive elastic sheet. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic sheet is positioned on the first surface and is in contact with the first connecting pad. The second conductive elastic sheet is positioned on the second surface and is in contact with the second connecting pad. The protective frame and the connector are arranged between the first printed circuit board and the second printed circuit board side by side. Therefore, the utility model discloses a printed circuit board stacked structure can be favorable to the reprocessing of product.
Description
Technical field
The utility model relates to a kind of stacking construction of printed circuit board.
Background technique
In order to reduce printed circuit board area shared in electronic product (for example, mobile phone, computer etc.), the prior art is logical
It crosses and printed circuit board is cut into two panels, and two panels printed circuit board is connected to each other with shape by intermediate plate (interposer)
At stacking construction of printed circuit board.In general, intermediate plate is ball grid array (ball grid array, BGA) intermediate plate, and
With the solder ball being set on its apparent surface.Via (the surface mounting of surface mounting technique twice
Technology, SMT) printed circuit board is soldered to the apparent surface of intermediate plate by solder ball, so that printed circuit
Plate is electrically connected to each other by intermediate plate.However, in above-mentioned SMT processing procedure, probably due to high temperature tin furnace is on printed circuit board
Integrated circuit (integrated circuit, IC) part damage or cause printed circuit board warpage due to thermal stress
Deformation.
On the other hand, intermediate plate is separated from each other by being difficult to again after solder ball and printed circuit board welding, if after
Part in continuous stacking construction of printed circuit board, which breaks down, causes product bad, will be unfavorable for disassembling the stacked structure and come
It places under repair.
Utility model content
The utility model provides a kind of stacking construction of printed circuit board, and the connector in the stacking construction of printed circuit board is adopted
It is designed with elastic slice, there is the electroconductive elastic sheet being located on its apparent surface, to be electrically connected printed circuit board.Printed circuit board and company
Device is connect to be fixed together using detachable assembling mode.In this way, SMT processing procedure can be omitted, avoid as caused by SMT processing procedure
The problem of.In addition, reprocessing for product can be conducive to using detachable assembling mode.The printed circuit sheetpile of the utility model
Stack structure can be applied in the electronic product such as mobile phone, computer.
The utility model creates a kind of stacking construction of printed circuit board comprising the first printed circuit board, the second printing electricity
Road plate, connector and protecting frame.First printed circuit board includes the first connection pad.Second printed circuit board includes the second connection pad.Even
It connects device to be configured between the first printed circuit board and the second printed circuit board, and passes through separable fastener and the first printed circuit
Plate and the connection of the second printed circuit board.Connector includes substrate, the first electroconductive elastic sheet and the second electroconductive elastic sheet.Substrate has each other
Opposite first surface and second surface.First electroconductive elastic sheet is located on first surface and contacts with the first connection pad.Second is conductive
Elastic slice is located on second surface and contacts with the second connection pad.Protecting frame and connector are arranged side by side in the first printed circuit board and the
Between two printed circuit boards.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein first electroconductive elastic sheet includes connecting each other
The first fixed part connect and the first freedom portion, second electroconductive elastic sheet include that the second fixed part being connected to each other and second are free
Portion.
The stacking construction of printed circuit board of an embodiment of the present invention is located at wherein the connector further includes perforation
In the substrate and the substrate is passed through, to be electrically connected first electroconductive elastic sheet and second electroconductive elastic sheet.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein the separable fastener includes: first
Positioning column and the second positioning column are located at the first surface and the second surface of the substrate of the connector
On；First positioning hole is located in first printed circuit board；And second location hole, it is located at second printed circuit board
In, wherein first positioning column and second positioning column are each passed through the first positioning hole and the second location hole,
First printed circuit board, the connector, second printed circuit board to be connected and fixed to together.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein first printed circuit board further includes
One element is laterally surround by the protecting frame.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein second printed circuit board further includes
Two element is laterally surround by the protecting frame.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein the protecting frame include annular framework with
The fastener of the top surface of the framework is protruded from, the bottom surface of the protecting frame is welded in second printed circuit board, the card
Component is sticked in the engaging slot of first printed circuit board.
The printed circuit board stacked structure of an embodiment of the present invention, wherein the connector is configured at the protecting frame
Other than lateral wall.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein the lateral wall of the protecting frame and institute
The sidewall spacers for stating the substrate of connector are opened.
The stacking construction of printed circuit board of an embodiment of the present invention, wherein the connector includes multiple connectors,
And the protecting frame is between the multiple connector.
The stacking construction of printed circuit board of an embodiment of the present invention further includes frame solid plate, is configured at first print
On printed circuit board.
Based on above-mentioned, different printed circuit boards is electrically connected by the utility model by the connector with electroconductive elastic sheet
To each other, and printed circuit board and connector are fixed together using separable fastener.In this way, make compared to tradition
With BGA/BGA intermediate plate by the mode of printed circuit board welding conducting, SMT processing procedure twice is omitted in the utility model, avoid or
It reduces because high temperature tin furnace causes the buckling deformation of the damage parts welded on printed circuit board or printed circuit board.This
Outside, since the printed circuit board of the utility model and connector are to carry out detachable assembling by separable fastener, because
If the element in this stacking construction of printed circuit board breaks down, the stacking construction of printed circuit board can also be disassembled easily
It comes, in order to place under repair.
In order to make the above-mentioned features and advantages of the utility model more obvious and understandable, special embodiment below, and cooperate attached drawing
It is described in detail below.
Detailed description of the invention
Fig. 1 is the exploded perspective figure according to the stacking construction of printed circuit board of some embodiments of the utility model；
Fig. 2A to Fig. 2 D is the assembling schematic diagram according to the stacking construction of printed circuit board of some embodiments of the utility model；
Fig. 3 A is according to the diagrammatic cross-section of the connector of some embodiments of the utility model, and Fig. 3 A is, for example, along Fig. 1
The cross-sectional view of the line I-I ' of connector 100；
Fig. 3 B and Fig. 3 C be according to the diagrammatic cross-section of the stacking construction of printed circuit board of some embodiments of the utility model,
Wherein Fig. 3 B is the cross-sectional view along Fig. 2 D middle line A-A ', and Fig. 3 C is the cross-sectional view along Fig. 2 D middle line B-B '；
Fig. 4 is the partial schematic diagram according to the connector of some embodiments of the utility model.
Description of symbols
100: connector
101: substrate
101a: first surface
101b: second surface
102,103: conductive terminal
102a, 103a: fixed part
102b, 103b: freedom portion
104: perforation
107: connector
108a, 108b: positioning column
150: protecting frame
151: framework
152: fastener
200,300: printed circuit board
201a, 301a: top surface
201b, 301b: bottom surface
202,302: connection pad
205,210,305: element
208,308: location hole
252: engaging slot
350: solder joint
400: frame solid plate
500: stacking construction of printed circuit board
510: locating piece
ER: closed area
R, R ': annular region
A-A ', B-B ', I-I ': line
S1: inner sidewall
S2: lateral wall
Specific embodiment
Referring to the attached drawing of the present embodiment more fully to illustrate the utility model.However, the utility model also can be with various
Different forms embodies, and should not necessarily be limited by embodiments described herein.The same or similar element numbers indicate identical or phase
As element, following paragraphs will repeat no longer one by one.
Referring to Fig.1, in some embodiments, stacking construction of printed circuit board 500 includes printed circuit board 300, connector
100, protecting frame 150, printed circuit board 200 and frame solid plate 400.At least one connector 100 is located at printed circuit board 200 and print
Between printed circuit board 300, printed circuit board 200 and printed circuit board 300 are electrically connected to each other.In some embodiments
In, connector 100 is connected and fixed to together with printed circuit board 200 and 300 by separable fastener.The separable fastening
Part includes locating piece, fastener, screws togather element, its analog or combinations thereof.For example, locating piece includes being located at connector
Positioning column 108a and 108b and the location hole 208 and 308 on printed circuit board 200 and 300 on 100.Protecting frame 150
It is arranged side by side between printed circuit board 200 and printed circuit board 300 with connector 100, for protecting printed circuit board
Electromagnetic interference caused by element and the shielding element.
Referring to Fig.1 and Fig. 3 A, in the embodiments of the present invention, connector 100 includes substrate 101, conductive terminal
102, conductive terminal 103, perforation (through via) 104, positioning column 108a and positioning column 108b.Substrate 101 is insulation base
Plate, e.g. FR4 substrate, but the utility model is not limited thereto.Substrate 101 have each other relative first surface (for example,
Top surface) 101a and second surface (for example, bottom surface) 101b.Conductive terminal 102 and conductive terminal 103 are respectively arranged at substrate 101
First surface 101a and second surface 101b on, and 104 be electrically connected to each other by perforation.Conductive terminal 102 and 103 is wrapped
Include conductive material, e.g. metal or metal alloy.For example, conductive terminal 102 and 103 may include copper, copper alloy or its
Analog.In some embodiments, connector 100 be two-sided ground lattice array (land grid array, LGA) connector (or
For LGA/LGA connector), but the utility model is not limited thereto.
In some embodiments, conductive terminal 102 and 103 is electroconductive elastic sheet or electrically conductive elastic cantilever.For example, conductive
Terminal 102 includes the fixed part 102a and freedom portion 102b being connected to each other.Fixed part 102a is fixed on the first surface of substrate 101
On the top surface of 101a and/or perforation 104, and contacted with the first surface 101a of perforation 104 and/or substrate 101.Freedom portion 102b
It is suspended from above the first surface 101a of substrate 101, and is not contacted with first surface 101a and perforation 104.Conductive terminal 103 is wrapped
Include the fixed part 103a and freedom portion 103b being connected to each other.Fixed part 103a be fixed on substrate 101 second surface 101b and/or
It on the bottom surface of perforation 104, and is contacted with the second surface 101b of perforation 104 and/or substrate 101, freedom portion 103b is suspended from substrate
Below 101 second surface 101b, and do not contacted with second surface 101b and perforation 104.It should be noted that Fig. 3 A is connector
100 state when being not yet fixed together with printed circuit board.
In some embodiments, such as shown in Fig. 3 A, conductive terminal 102 is right relative to substrate 101 with conductive terminal 103
Claiming setting, the freedom portion 102b of conductive terminal 102 and the freedom portion 103b of conductive terminal 103 extend towards identical direction, but
The disclosure is not limited thereto.In further embodiments, such as shown in Fig. 4, conductive terminal 102 and conductive terminal 103 are opposite
It is in asymmetric setting in substrate 101, the freedom portion 102b of conductive terminal 102 and the freedom portion 103b of conductive terminal 103 be not towards
Same direction, e.g. opposite direction extend.The first surface 101a of conductive terminal 102 and conductive terminal 103 in substrate 101
Or the projection on second surface 101b can overlap each other, it is e.g. completely overlapping or partially overlapping.It should be noted that for the sake of clarity
And convenient for illustrating, the conductive terminal 102 and 103 in cross-sectional view 3A is shown as along parallel with the length direction of connector 100
Direction extend, but the disclosure is not limited thereto.It should be understood that depend on printed circuit board 200 and 300 in respectively with conducting end
102 and 103 connection pads 202 (Fig. 3 B) that are correspondingly arranged of son and 302 position, conductive terminal 102 and 103 can be respectively configured to edge
Any appropriate direction extends.
With continued reference to Fig. 1 and Fig. 3 A, perforation 104 is located at conductive terminal 102 and conductive terminal in substrate 101
Between 103.In some embodiments, 104 top surface of perforating substantially is flushed with the first surface 101a of substrate 101, perforation 104
Bottom surface substantially flushed with the second surface 101b of substrate 101.Perforation 104 passes through substrate 101, will be located at substrate 101
Conductive terminal 102 and conductive terminal 103 on apparent surface are electrically connected to each other.Perforation 104 includes conductive material, e.g.
Metal or metal alloy.For example, perforation 104 may include copper, copper alloy or its analog.
In some embodiments, one group of conductive terminal 102 and 103 that each 104 connection of perforation corresponds to each other.The correspondence
One group of conductive terminal 102 and 103 and positioned between the two perforation 104 constitute connector 107.In other words, connector 100 wraps
Include multiple connectors 107.In some embodiments, multiple connectors 107 are separated from each other and electrically isolate.Multiple connectors
107 may include connector for being electrically connected printed circuit board 200 and 300 and for transmitting signal, ground connections and/or
Illusory connector, but the utility model is not limited thereto.
Positioning column 108a is set on the first surface 101a of substrate 101, and positioning column 108b is set to the second of substrate 101
On the 101b of surface.In some embodiments, positioning column 108a and positioning column 108b are in the first surface 101a perpendicular to substrate 101
Or it is in alignment with each other on the direction of second surface 101b, but the disclosure is not limited thereto.Positioning column 108a and positioning column 108b
It can stagger arrangement setting.
Referring to Fig.1, Fig. 2A, Fig. 3 B and Fig. 3 C, provide printed circuit board 300.The shape of printed circuit board 300 can be pros
The regular shapes such as shape, rectangle, polygon or other irregular shapes.Depending on product design and need, printed circuit board
300 can have any appropriate shape.
Printed circuit board 300 includes connection pad 302, solder joint 350 and location hole 308.Connection pad 302 is arranged in printed circuit board
On the 300 top surface 301a opposite with connector 100, to be electrically connected with connector 100.Connection pad 302 includes such as metal
Or the conductors material such as metal alloy.For example, connection pad 302 may include copper, aluminium, its alloy or its analog.Multiple solder joints 350
It is set on the top surface 301a of printed circuit board 300, to weld protecting frame 150.Multiple solder joints 350 are arranged in a ring, and enclose
Circularize region R.Herein, annular includes rule annular, such as Q-RING, circular rings, elliptical ring etc. or irregular ring
Shape.Connection pad 302 is for example set to except the annular region R that solder joint 350 is surrounded.In some embodiments, two groups of connection pads 302 are set
The two sides of annular region R are placed in, but the disclosure is not limited thereto.Location hole 308 passes through printed circuit board 300, and is set to
At position corresponding with the positioning column 108b of connector 100.
In some embodiments, printed circuit board 300 includes the multiple element 305 being set on the 301a of its top surface, such as
IC chip etc..Element 305 may include active member, passive device or combinations thereof.Active member for example including transistor,
Diode etc..Passive device is for example including capacitor, resistor, inductor etc..The size of multiple element 305 can it is mutually the same or
Difference, and can be same type or different types of element.In some embodiments, element 305 is arranged in printed circuit board 300
The top surface 301a opposite with 100 bottom surface 101b of connector on, and be located in the annular region R that is surrounded of solder joint 350.Some
In embodiment, element 305 is, for example, to be electrically connected to printed circuit board 300 by soldered ball (solder ball).It should be understood that diagram
The number of middle element 305 and position are only to illustrate, and the disclosure is not limited thereto.Depending on product demand and design,
It can be at the other positions of the top surface 301a of printed circuit board 300 (such as except annular region R), bottom surface 301b or top surface
Various elements are arranged in any appropriate position on both 301a and bottom surface 301b.
Referring to Fig.1, connector 100 is connect by Fig. 2 B and Fig. 3 B with printed circuit board 300.For example, by connector
100 positioning column 108b is aligned with the location hole 308 of printed circuit board 300, and positioning column 108b is then passed through location hole 308,
Connector 100 to be connect with printed circuit board 300.The conductive terminal 103 of connector 100 and the connection pad of printed circuit board 300
302 are configured in position to correspond to each other, after connector 100 is connect with printed circuit board 300, conductive terminal 103 with connect
Pad 302 electrically and is physically contacted each other.In some embodiments, positioning column 108b and location hole 308 engage with each other fixation, in turn
Connector 100 is fixed on printed circuit board 300.In some embodiments, printed circuit board is fixed in connector 100
After on 300, the freedom portion 103b of conductive terminal 103 is depressed into the bottom surface with the second surface 101b of substrate 101 and perforation 104
Physical contact.In further embodiments, after connector 100 is fixed on printed circuit board 300, conductive terminal 103
Freedom portion 103b is depressed into close with the bottom surface of the second surface 101b of substrate 101 and perforation 104 but does not contact or partially contact.
Although the entire freedom portion 103b for showing conductive terminal 103 in figure is completely attached to after being pressed with substrate 101 and perforation 104, this
It is open to be not limited thereto.It is conductive after connector 100 is fixed on printed circuit board 300 depending on product demand and design
The freedom portion 103b of terminal 103 can be completely attached to substrate 101 and/or perforation 104, part contacts or does not contact.Although in figure
Two connectors 100 are shown, but the disclosure is not limited thereto.
Referring to Fig.1, Fig. 2 C and Fig. 3 C, protecting frame 150 is configured on the top surface 301a of printed circuit board 300.Some
In embodiment, protecting frame 150 is the top surface 301a for being welded in printed circuit board 300, and on the top surface 301a of printed circuit board 300
With the solder joint 350 for the welding, but the disclosure is not limited thereto.In alternative embodiments, it can also be used separable
Protecting frame 150 is mounted on printed circuit board 300 by the assembling mode of formula.The detachable assembling mode is for example including benefit
It is attached with snap-fit element, locating piece etc., carries out screw locking or combinations thereof using screwing togather element etc..
Protecting frame 150 includes metal, metal alloy etc., such as copper or its alloy.Protecting frame 150 has hollow ring framework
Structure.The profile of protecting frame 150 and the profile of solder joint 350 are correspondingly arranged.In some embodiments, protecting frame 150 includes annular
Framework 151, and the annular region R ' that is surrounded of the inner sidewall S1 of framework 151 and the solder joint 350 of printed circuit board 300 are surrounded
Annular region R ' it is corresponding.In some embodiments, protecting frame 150 further includes fastener (or the positioning in the framework 151
Part) 152.Fastener 152 is connect with framework 151, and protrudes from the top surface of framework 151, and is referred to alternatively as engaging convex block again.Engaging
Part 152 with printed circuit board 200 for being connected together.
In some embodiments, connector 100 is configured at the annular region R ' of protecting frame 150 outside.In other words, connector
100 are located at other than the lateral wall S2 of protecting frame 150.The lateral wall S2 of protecting frame 150 can be contacted with connector 100 or not contacted.
For example, part protecting frame 150 can be laterally set between two connectors 100, so that connector 100 is spaced each other
It opens.In some embodiments, the portion outboard wall S2 of protecting frame 150 can be contacted with the side wall of the substrate 101 of connector 100.Print
The element 305 of printed circuit board 300 is located in the annular region R ' of protecting frame 150, by 150 side of protecting frame to surrounding.According to product
Design and demand, protecting frame 150 can have any appropriate shape and profile.
Referring to Fig.1, printed circuit board 200 is configured on connector 100 and protecting frame 150 by Fig. 2 D, Fig. 3 B and Fig. 3 C
And it is connected thereto.The regular shapes such as the shape of printed circuit board 200 can be square, rectangle, polygon other are not advised
Then shape.It depending on product design and needs, printed circuit board 200 can have any appropriate shape.Printed circuit board 200 with
Printed circuit board 300 can have identical or different shape and size.In some embodiments, the size of printed circuit board 200
(for example, width, length, area etc.) is less than the size of printed circuit board 300.
Referring to Fig.1, Fig. 3 B and Fig. 3 C, in some embodiments, printed circuit board 200 include connection pad 202, location hole 208,
Engaging slot 252 and multiple element 205 and 210.The bottom surface opposite with connector 100 of printed circuit board 200 is arranged in connection pad 202
It on 201b, and is set at position corresponding with the conductive terminal 102 of connector 100, to be electrically connected with connector 100.
Connection pad 202 includes the conductor material such as metal or metal alloy.For example, connection pad 202 may include copper, aluminium, its alloy or
Its analog.
Location hole 208 passes through printed circuit board 300, and is set to position corresponding with the positioning column 108a of connector 100
Place.Engaging slot 252 (Fig. 1) is set at position corresponding with the fastener 152 of protecting frame 150.In some embodiments, engage
Slot 252 passes through printed circuit board 200, but the disclosure is not limited thereto.In alternative embodiments, engaging slot 252 is electric from printing
The bottom surface 201b of road plate 200 is recessed, and is not passed through printed circuit board 200.
Referring to Fig.1 with Fig. 3 C, in some embodiments, printed circuit board 200 includes multiple element 205 and 210, such as is collected
At circuit chip etc..Element 205 and 210 may include active member, passive device or combinations thereof.Active member is for example including crystal
Pipe, diode etc..Passive device is for example including capacitor, resistor, inductor etc..But the size of multiple element 205 and 210 that
This is identical or different, and can be same type or different types of element.In some embodiments, the setting of element 205 is being printed
On the bottom surface 201b opposite with the top surface 101a of connector 100 of circuit board 200, and it is located at the annular region R ' of protecting frame 150
It is interior, by 150 side of protecting frame to surround.Element 210 is arranged on the top surface 201a of printed circuit board 200.In some embodiments,
Element 205 and 210 is, for example, to be electrically connected to printed circuit board 200 by soldered ball (solder ball).It should be understood that member in diagram
The number of part 205 and 210 and position are only to illustrate, and the disclosure is not limited thereto.Depending on product demand and design,
It can be any appropriate on the top surface 201a, bottom surface 201b or both top surface 201a and bottom surface 201b of printed circuit board 200
Various elements are arranged in position.
With continued reference to Fig. 1, Fig. 2 D, Fig. 3 B and Fig. 3 C, the positioning column 108a of connector 100 passes through printed circuit board 200
Location hole 208, the fastener 152 of protecting frame 150 are engaged with each other with the engaging slot 252 of printed circuit board 200, and then will printing electricity
Road plate 200, connector 100, protecting frame 150 and printed circuit board 300 are connected and fixed to together.In some embodiments, In
After printed circuit board 200 is connect with connector 100, the freedom portion 102b of the conductive terminal 102 of connector 100 is depressed into and base
The top surface 101a of plate 101 and the top surface physical contact of perforation 104.In further embodiments, printed circuit board 200 with connect
After device 100 connects, the freedom portion 102b of the conductive terminal 102 of connector 100 is depressed into the top surface 101a with substrate 101 and wears
The top surface in hole 104 is close but does not contact or partially contacts.Although the entire freedom portion 102b for showing conductive terminal 102 in figure is pressed
It is completely attached to afterwards with substrate 101 and perforation 104, but the disclosure is not limited thereto.Depending on product demand and design, printing
After circuit board 200 is connect with connector 100, the freedom portion 102b of conductive terminal 102 can be complete with substrate 101 and/or perforation 104
Full connected, part contact or do not contact.
Referring to Fig. 3 C, the inner sidewall S1 of protecting frame 150, the portion bottom surface 201b of printed circuit board 200 and printed circuit
The top surface 301a of plate 300 surrounds closed area ER.Element 205 and element 305 are set in the ER of the closed area, by protecting frame
150 sides to surround and protection.In some embodiments, element 205 and element 305 are the element that need to carry out electromagnetic interference shielding,
And protecting frame 150 can be used for shielding electromagnetic interference caused by the element 205 and element 305 being located in the ER of the closed area.To the greatest extent
It includes the element in the ER of the closed area that pipe shows printed circuit board 200 and printed circuit board 300 in fig. 3 c, but this
It is open to be not limited thereto.Depending on product design and needs, in closed area, ER can also only include being set to printed circuit board
Element on 200 bottom surfaces only includes the element being set on 300 top surface of printed circuit board.
Referring to Fig.1 with Fig. 2 D, in some embodiments, stacking construction of printed circuit board 500 can further include frame solid plate 400,
It is configured on printed circuit board 200.Frame solid plate 400 is, for example, to be welded in printed circuit board 200, and printed circuit board 200 wraps
The solder joint 240 for the welding is included, but the disclosure is not limited thereto.In alternative embodiments, frame solid plate is to be attached to print
Printed circuit board 200.Frame solid plate includes rigid material, such as metal.Frame solid plate 400 can be used to prevent sticking up for printed circuit board 200
It is bent.In embodiment of the disclosure, frame solid plate 400 is optionally configured on printed circuit board 200.For the sake of brevity, scheme
Frame solid plate 400 is not shown in 3B and Fig. 3 C.
In the above-described embodiments, printed circuit board 200 and printed circuit board 300 and connector 100 be (can by locating piece
Separation fastener) it 510 is connected to each other and is fixed together.Locating piece 510 include positioning column 108a on the connector 100 with
108b, and the location hole 208 and 308 being located on printed circuit board 200 and 300.However, the disclosure not as
Limit.In alternative embodiments, it is possible to use other types of separable fastener.For example, printed circuit board 200, printed circuit
Plate 300 can be locked together in a manner of screw locking with connector 100 screwing togather element.Alternatively, printed circuit board 200 with
Printed circuit board 300 and connector 100 first pass through locating piece 510 and position the position of three, and again by screwing togather element for three
Person locks together.
In the above-described embodiments, protecting frame 150 is to be welded in printed circuit board 300, and be sticked in printed circuit board 200,
But the disclosure is not limited thereto.Welding can be respectively adopted between protecting frame 150 and printed circuit board 200 and 300, engage, spiral shell
The suitable mode such as silk locking connects.
In conclusion different printed circuit boards is electrically connected by the utility model by the connector with electroconductive elastic sheet
To each other, and printed circuit board and connector are fixed together using separable fastener.In this way, make compared to tradition
With BGA/BGA intermediate plate by the mode of printed circuit board welding conducting, SMT processing procedure twice is omitted in the utility model, avoid or
It reduces because high temperature tin furnace causes the buckling deformation of the damage parts welded on printed circuit board or printed circuit board.This
Outside, since the printed circuit board of the utility model and connector are to carry out detachable assembling by separable fastener, because
It, can also be easily by the stacking construction of printed circuit board if the subelement in this stacking construction of printed circuit board is broken down
Dismantling is come, and in order to place under repair, and after repairing completion, can pass through separable fastener again for printed circuit board stacking
Structure is retightened together.
Although the utility model is disclosed as above with embodiment, so it is not intended to limit the utility model, any affiliated
Technical staff in technical field, without departing from the spirit and scope of the utility model, when can make a little change and retouching, therefore
Subject to the protection scope of the utility model ought be defined depending on claim.
Claims (11)
1. a kind of stacking construction of printed circuit board characterized by comprising
First printed circuit board, including the first connection pad；
Second printed circuit board, including the second connection pad；
Connector is configured between first printed circuit board and second printed circuit board, and passes through separable fastening
Part is connect with first printed circuit board and second printed circuit board, and the connector includes:
Substrate has each other relative first surface and second surface；
First electroconductive elastic sheet contacts on the first surface and with first connection pad；And
Second electroconductive elastic sheet contacts on the second surface and with second connection pad；And
Protecting frame is arranged side by side between first printed circuit board and second printed circuit board with the connector.
2. stacking construction of printed circuit board according to claim 1, which is characterized in that first electroconductive elastic sheet includes that
The first fixed part and the first freedom portion, second electroconductive elastic sheet of this connection include the second fixed part and second being connected to each other
Freedom portion.
3. stacking construction of printed circuit board according to claim 1, which is characterized in that the connector further includes perforation,
In the substrate and the substrate is passed through, to be electrically connected first electroconductive elastic sheet and second electroconductive elastic sheet.
4. stacking construction of printed circuit board according to claim 1, which is characterized in that the separable fastener includes:
First positioning column and the second positioning column are located at the first surface and described the of the substrate of the connector
On two surfaces；
First positioning hole is located in first printed circuit board；And
Second location hole is located in second printed circuit board,
Wherein first positioning column and second positioning column are each passed through the first positioning hole and the second location hole,
First printed circuit board, the connector, second printed circuit board to be connected and fixed to together.
5. stacking construction of printed circuit board according to claim 1, which is characterized in that first printed circuit board also wraps
First element is included, is laterally surround by the protecting frame.
6. stacking construction of printed circuit board according to claim 5, which is characterized in that second printed circuit board also wraps
Second element is included, is laterally surround by the protecting frame.
7. stacking construction of printed circuit board according to claim 1, which is characterized in that the protecting frame includes the frame of annular
The fastener of body and the top surface for protruding from the framework, the bottom surface of the protecting frame is welded in second printed circuit board, institute
State the engaging slot that fastener is sticked in first printed circuit board.
8. stacking construction of printed circuit board according to claim 1, which is characterized in that the connector is configured at the guarantor
It protects other than the lateral wall of frame.
9. stacking construction of printed circuit board according to claim 8, which is characterized in that the lateral wall of the protecting frame
It is opened with the sidewall spacers of the substrate of the connector.
10. stacking construction of printed circuit board according to claim 1, which is characterized in that the connector includes multiple companies
Device is connect, and the protecting frame is between the multiple connector.
11. stacking construction of printed circuit board according to claim 1, which is characterized in that further include frame solid plate, be configured at institute
It states on the first printed circuit board.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108204339U TWM581353U (en) | 2019-04-10 | 2019-04-10 | Printed circuit board stack structure |
| TW108204339 | 2019-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209592372U true CN209592372U (en) | 2019-11-05 |
Family
ID=68050702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920759221.5U Active CN209592372U (en) | 2019-04-10 | 2019-05-24 | Printed circuit board stacking structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN209592372U (en) |
| TW (1) | TWM581353U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112768974A (en) * | 2019-10-21 | 2021-05-07 | 北京小米移动软件有限公司 | Laminated plate structure and electronic equipment |
| WO2022062196A1 (en) * | 2020-09-22 | 2022-03-31 | 深圳市大疆创新科技有限公司 | Interposer circuit board, stacked circuit board structure, and electronic device |
| WO2022064074A1 (en) * | 2020-09-28 | 2022-03-31 | Softiron Limited | Interposer for printed circuit boards |
| CN114390805A (en) * | 2022-01-26 | 2022-04-22 | 深圳市潜力创新科技有限公司 | Double-layer circuit board welding method |
| CN114828404A (en) * | 2021-01-21 | 2022-07-29 | 欣兴电子股份有限公司 | Circuit board structure and spliced circuit board |
| WO2023115539A1 (en) * | 2021-12-24 | 2023-06-29 | Intel Corporation | Pcb spacer |
-
2019
- 2019-04-10 TW TW108204339U patent/TWM581353U/en unknown
- 2019-05-24 CN CN201920759221.5U patent/CN209592372U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112768974A (en) * | 2019-10-21 | 2021-05-07 | 北京小米移动软件有限公司 | Laminated plate structure and electronic equipment |
| WO2022062196A1 (en) * | 2020-09-22 | 2022-03-31 | 深圳市大疆创新科技有限公司 | Interposer circuit board, stacked circuit board structure, and electronic device |
| WO2022064074A1 (en) * | 2020-09-28 | 2022-03-31 | Softiron Limited | Interposer for printed circuit boards |
| CN114828404A (en) * | 2021-01-21 | 2022-07-29 | 欣兴电子股份有限公司 | Circuit board structure and spliced circuit board |
| CN114828404B (en) * | 2021-01-21 | 2024-04-12 | 欣兴电子股份有限公司 | Circuit board structure and spliced circuit board |
| WO2023115539A1 (en) * | 2021-12-24 | 2023-06-29 | Intel Corporation | Pcb spacer |
| CN114390805A (en) * | 2022-01-26 | 2022-04-22 | 深圳市潜力创新科技有限公司 | Double-layer circuit board welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM581353U (en) | 2019-07-21 |
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