CN111446938A - High-temperature-resistant surface-mounted L C filter packaging method - Google Patents
High-temperature-resistant surface-mounted L C filter packaging method Download PDFInfo
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- CN111446938A CN111446938A CN202010318628.1A CN202010318628A CN111446938A CN 111446938 A CN111446938 A CN 111446938A CN 202010318628 A CN202010318628 A CN 202010318628A CN 111446938 A CN111446938 A CN 111446938A
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- filter
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
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Abstract
The invention discloses a high-temperature-resistant surface-mounted L C filter packaging method which comprises the following steps of S1, welding a printed circuit board on a tube seat, S2, welding a capacitor on the printed circuit board, S3, dispensing at four right angles of the printed circuit board to fix the printed circuit board and the tube seat, S4, welding an inductance coil on the printed circuit board, S5, adhering the inductance coil on the side wall of the tube seat, S6, parallelly seam-welding a tube cap on the tube seat to obtain an L C filter, and S7, welding a L C filter obtained in the S6 on a whole machine printed circuit board to finish packaging the L C filter.
Description
Technical Field
The invention relates to the field of L C filters, in particular to a high-temperature-resistant surface-mounted L C filter packaging method.
Background
L C filter is internally provided with an inductance coil wound by a magnetic ring, the inductance coil needs to be bonded and fixed by silicon rubber, the lead leg of the inductance coil is prevented from being broken under certain mechanical vibration conditions, then, if the L C filter is assembled by a reflow soldering mode, and the temperature exceeds the melting point of solder, the solder in the device is melted, at the moment, the silicon rubber expands by heat to extrude the solder joint, so that a tin bead is formed or the solder joint and the adjacent solder joint form bridging, and the device failure is caused.
On the premise of not violating the space requirement, research needs to be carried out on the aspects of layout of printed circuit board pads, a glue adhering and fixing mode and the like to solve the problem and make up for the defect.
Disclosure of Invention
The invention aims to solve the problems and provides a high-temperature-resistant surface-mounted L C filter packaging method for reflow soldering production of a surface-mounted L C filter.
To achieve these objects and other advantages in accordance with the present invention, there is provided a high temperature resistant sticker L C filter packaging method, comprising the steps of:
s1, welding the printed circuit board on the tube seat;
s2, welding a capacitor on the printed circuit board;
s3, dispensing at four right angles of the printed circuit board to fix the printed circuit board with the tube seat;
s4, welding an inductance coil on the printed circuit board;
s5, adhering the inductance coil on the side wall of the tube seat;
s6, parallel seam welding a pipe cap on the pipe seat to obtain the L C filter;
and S7, soldering the L C filter obtained in the step S6 on a whole printed circuit board, and completing the packaging of the L C filter.
Preferably, in the method for packaging the high-temperature resistant surface-mounted L C filter, in S7, a solder paste is used for secondary reflow to solder the L C filter to the complete printed circuit board.
Preferably, in the method for packaging the high-temperature resistant surface-mounted L C filter, the tube seat and the tube cap are made of kovar alloy.
Preferably, in the method for packaging the high-temperature resistant surface-mounted L C filter, in S1, the solder paste is applied to the header and the printed circuit board by printing, the thickness of the applied solder paste is 0.2 ± 0.05mm, and the distance between the solder paste and the edge of the bottom plate of the header is 3 ± 0.5 mm.
Preferably, in the packaging method of the high temperature resistant surface mount L C filter, a Sup-Bond5221 glue is used in S3, and after dispensing, the printed circuit board and the socket are baked for 5min at 125 ℃ to make the Sup-Bond5221 glue fully hardened.
Preferably, in the method for packaging the high-temperature resistant surface-mounted L C filter, the S1 and the S2 are both soldered by using SnAgCu305 solder paste, and the S4 is soldered by using SnAgCu305 solder wire.
Preferably, in the method for packaging a high temperature resistant surface-mounted L C filter, 180-degree enameled wires are used as the inductor coil used in S4.
Preferably, in the method for packaging the high-temperature-resistant surface-mounted L C filter, the lead soldering length of the inductor coil in S4 is 1/2-3/4 of the length of the pad of the printed circuit board, the bottom of the inductor coil is 0.5-1mm away from the printed circuit board, a margin of 2-2.5mm is left for the soldered lead of the inductor coil, and meanwhile, the end of the lead of the inductor coil needs to be exposed by a tin-coating length of 0.5-1 mm.
Preferably, in the method for packaging a high temperature resistant surface mount L C filter, the height of the adhesive after being fixed in S5 reaches 1/2-3/4 positions of the coil.
Preferably, in the method for packaging a high temperature resistant surface-mounted L C filter, in S5, the fixed inductor and the base are cured at room temperature for 24 hours, and then baked at 125 ℃ for 4 hours to outgas the colloid.
The invention has the beneficial effects that:
1. on one hand, the phenomenon that when the reflow soldering assembly of the L C filter is carried out, the solder in the device melts, the silicon rubber expands by heating to extrude a welding point to form tin beads or form bridging with adjacent welding points to cause the failure of the device is avoided.
2. By adopting the mode of fixing the four corners of the printed circuit board and the tube seat by Sup-Bond5221 glue, the phenomena of product far-out band inhibition and reduction and no waveform caused by poor contact due to re-melting of solder after reflow soldering between the printed circuit board and the tube seat are avoided.
3. By using the SnAgCu305 soldering paste and the soldering wires, the reflow soldering assembly mode of the L C filter is realized on the premise of not using higher solder, the risk of damage to a ceramic capacitor and a printed circuit board caused by soldering by high-temperature solder is avoided, the influence that the product cannot be repaired when the nano silver paste is used for soldering internal devices is avoided, the reliability of the product is improved, and the cost is saved.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
Fig. 1 is a flowchart of a method for packaging a high temperature resistant surface mount L C filter according to the present invention;
fig. 2 is a schematic view of the adhesion between the printed circuit board and the socket according to the present invention.
Detailed Description
The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
It is to be noted that the experimental methods described in the following embodiments are all conventional methods unless otherwise specified, and the reagents and materials, if not otherwise specified, are commercially available; in the description of the present invention, the terms "lateral", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
As shown in fig. 1-2, an embodiment of the present invention provides a method for packaging a high temperature resistant surface mount L C filter:
the implementation method 1: and the printed board welding pads of the inductance coil and the capacitor are not laid out. The printed board and the capacitor are welded by using SnAgCu305 soldering paste, and the inductance coil is welded by using SnAgCu305 soldering wire. The printed circuit board is adhered to the four corners of the tube seat without spot Sup-Bond5221 glue. The inductance coil point DC3140 glue is fixed on the printed board. The pipe cap is welded on the pipe seat in parallel by seam welding. The welding assembly was performed as follows.
(1) The printed circuit board is welded on the tube seat in a reflow mode;
(2) the capacitor is reflow welded on the printed circuit board;
(3) dispensing and fixing the four corners of the printed circuit board and the tube seat;
(4) the inductance coil is manually welded on the printed circuit board;
(5) the inductance coil is adhered to the printed board;
(6) the pipe cap is welded on the pipe seat in parallel through seam welding.
And (4) performing secondary reflow soldering on the components obtained in the steps (1) to (6) on the whole printed circuit board by using soldering paste. The electric performance of partial products is unqualified, and the phenomena of reduced far-out-of-band inhibition and no waveform appear. Unqualified welding spots of partial products occur, and the phenomenon of tin beads caused by extruding the welding spots by silicon rubber for adhering and fixing the magnetic rings is avoided.
The printed circuit board bonding pad is an independent bonding pad, the size of the inductance coil welding bonding pad is not designed according to the requirements in the table 1, and the bonding pad of the inductance coil is not distributed on the periphery of the capacitance welding bonding pad.
TABLE 1 inductor pad size design requirements
| Serial number | Wire diameter of enameled wire mm | Length, mm | Width, mm | Pitch, mm |
| 1 | 0.13 | 1.5-2.0 | 1.0-1.5 | 2.0-3.5 |
| 2 | 0.16 | 1.5-2.0 | 1.0-1.5 | 2.0-3.5 |
| 3 | 0.21 | 1.5-2.0 | 1.0-1.5 | 2.0-3.5 |
| 4 | 0.31 | 1.5-2.0 | 1.2-2.0 | 2.0-3.5 |
The implementation method 2 comprises the following steps: the size of the welding pad of the inductance coil is designed according to the requirements in the table 1, the welding pads of the inductance coil and the printed board welding pad of the capacitor are distributed, and the welding pads of the inductance coil are all distributed on the periphery of the welding pad of the capacitor. The printed board and the capacitor are welded by using SnAgCu305 soldering paste, and the inductance coil is welded by using SnAgCu305 soldering wire. The printed circuit board is adhered to the four corners of the tube seat by Sup-Bond5221 glue. The inductance coil point DC3140 is fixed by adhering to the side wall of the tube seat. The pipe cap is welded on the pipe seat in parallel by seam welding. The welding assembly was performed as follows.
The welding assembly was performed as follows.
(1) The printed circuit board is welded on the tube seat in a reflow mode;
(2) the capacitor is reflow welded on the printed circuit board;
(3) dispensing and fixing the four corners of the printed circuit board and the tube seat;
(4) the inductance coil is manually welded on the printed circuit board;
(5) the inductance coil is fixedly adhered to the side wall of the tube seat;
(6) the pipe cap is welded on the pipe seat in parallel through seam welding.
And (4) performing secondary reflow soldering on the components obtained in the steps (1) to (6) on the whole printed circuit board by using soldering paste. The same test methods and experimental methods were used as in the implementation of method 1. The electrical property and the welding spot quality of the product are qualified.
By comparing the two implementation methods, the following results can be obtained:
1. on one hand, the phenomenon that when the reflow soldering assembly of the L C filter is carried out, the solder in the device melts, the silicon rubber expands by heating to extrude a welding point to form tin beads or form bridging with adjacent welding points to cause the failure of the device is avoided.
2. By adopting the mode of fixing the four corners of the printed circuit board and the tube seat by Sup-Bond5221 glue, the phenomena of product far-out band inhibition and reduction and no waveform caused by poor contact due to re-melting of solder after reflow soldering between the printed circuit board and the tube seat are avoided.
3. By using the SnAgCu305 soldering paste and the soldering wires, the reflow soldering assembly mode of the L C filter is realized on the premise of not using higher solder, the risk of damage to a ceramic capacitor and a printed circuit board caused by soldering by high-temperature solder is avoided, the influence of unrepairable products caused by soldering internal devices by using the nano silver paste is avoided, the reliability of the products is improved, and the cost is saved.
While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable to various fields of endeavor for which the invention may be embodied with additional modifications as would be readily apparent to those skilled in the art, and the invention is therefore not limited to the details given herein and to the embodiments shown and described without departing from the generic concept as defined by the claims and their equivalents.
Claims (10)
1. A high-temperature resistant surface-mounted L C filter packaging method is characterized by comprising the following steps:
s1, welding the printed circuit board on the tube seat;
s2, welding a capacitor on the printed circuit board;
s3, dispensing at four right angles of the printed circuit board to fix the printed circuit board with the tube seat;
s4, welding an inductance coil on the printed circuit board;
s5, adhering the inductance coil on the side wall of the tube seat;
s6, parallel seam welding a pipe cap on the pipe seat to obtain the L C filter;
and S7, soldering the L C filter obtained in the step S6 on a whole printed circuit board, and completing the packaging of the L C filter.
2. The method for packaging a high temperature resistant surface mounted L C filter as claimed in claim 1, wherein in S7, secondary reflow of solder paste is used to solder the L C filter to the complete machine PCB.
3. The method of claim 1, wherein the header and the cap are made of kovar alloy.
4. The method for packaging a high temperature resistant surface-mounted L C filter as claimed in claim 1, wherein in S1, the solder paste is applied to the socket and the pcb by printing, the thickness of the applied solder paste is 0.2 ± 0.05mm, and the distance between the solder paste and the bottom plate edge of the socket is 3 ± 0.5 mm.
5. The method for encapsulating the high-temperature-resistant surface-mount L C filter of claim 1, wherein a Sup-Bond5221 adhesive is used in S3, and after dispensing, the printed circuit board and the socket are baked at 125 ℃ for 5min to make the Sup-Bond5221 adhesive sufficiently hardened.
6. The method for packaging a high temperature resistant surface-mounted L C filter as claimed in claim 1, wherein S1 and S2 are soldered with SnAgCu305 solder paste, and S4 is soldered with SnAgCu305 solder wire.
7. The method for packaging a high temperature resistant surface-mounted L C filter according to claim 1, wherein the inductor coil used in S4 is a 180-degree enameled wire.
8. The method for packaging a high temperature resistant surface-mounted L C filter, according to claim 1, wherein the lead bonding length of the inductor coil in S4 is 1/2-3/4 of the land length of the printed circuit board, the bottom of the inductor coil is 0.5-1mm away from the printed circuit board, the lead of the inductor coil after bonding has a margin of 2-2.5mm, and the end of the lead of the inductor coil needs to be exposed with a tin lining length of 0.5-1 mm.
9. The method for packaging a high temperature resistant sticker L C filter as claimed in claim 1, wherein the height of the adhesive after the bonding in S5 reaches 1/2-3/4 position of the coil.
10. The method for packaging a high temperature resistant surface-mounted L C filter as claimed in claim 1, wherein in S5, the adhered inductor and the base are cured at room temperature for 24 hours, and then baked at 125 ℃ for 4 hours to outgas the colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010318628.1A CN111446938A (en) | 2020-04-21 | 2020-04-21 | High-temperature-resistant surface-mounted L C filter packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010318628.1A CN111446938A (en) | 2020-04-21 | 2020-04-21 | High-temperature-resistant surface-mounted L C filter packaging method |
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| CN111446938A true CN111446938A (en) | 2020-07-24 |
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| CN202010318628.1A Pending CN111446938A (en) | 2020-04-21 | 2020-04-21 | High-temperature-resistant surface-mounted L C filter packaging method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367060A (en) * | 2020-11-23 | 2021-02-12 | 北京航天微电科技有限公司 | Adhering method for metal-packaged EMI filter |
| CN114245603A (en) * | 2021-12-20 | 2022-03-25 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
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| US6417745B1 (en) * | 1999-04-26 | 2002-07-09 | Murata Manufacturing Co., Ltd. | LC filter with a coupling capacitor formed by shared first and second capacitor patterns |
| CN101419645A (en) * | 2008-12-05 | 2009-04-29 | 中国电子科技集团公司第十四研究所 | SAW filter meter plaster encapsulation method |
| CN104883152A (en) * | 2015-05-19 | 2015-09-02 | 北京中科飞鸿科技有限公司 | Broadband and low-fluctuation band-pass LC filter |
| CN106788322A (en) * | 2016-12-21 | 2017-05-31 | 北京中科飞鸿科技有限公司 | A kind of high performance mini binary channels hybrid integrated filtration module |
| CN108173525A (en) * | 2017-03-24 | 2018-06-15 | 珠海晶讯聚震科技有限公司 | Rf-resonator and wave filter |
| CN110048687A (en) * | 2019-03-26 | 2019-07-23 | 成都宏明电子科大新材料有限公司 | A kind of organic compound filter of LTCC |
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2020
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6417745B1 (en) * | 1999-04-26 | 2002-07-09 | Murata Manufacturing Co., Ltd. | LC filter with a coupling capacitor formed by shared first and second capacitor patterns |
| CN101419645A (en) * | 2008-12-05 | 2009-04-29 | 中国电子科技集团公司第十四研究所 | SAW filter meter plaster encapsulation method |
| CN104883152A (en) * | 2015-05-19 | 2015-09-02 | 北京中科飞鸿科技有限公司 | Broadband and low-fluctuation band-pass LC filter |
| CN106788322A (en) * | 2016-12-21 | 2017-05-31 | 北京中科飞鸿科技有限公司 | A kind of high performance mini binary channels hybrid integrated filtration module |
| CN108173525A (en) * | 2017-03-24 | 2018-06-15 | 珠海晶讯聚震科技有限公司 | Rf-resonator and wave filter |
| CN110048687A (en) * | 2019-03-26 | 2019-07-23 | 成都宏明电子科大新材料有限公司 | A kind of organic compound filter of LTCC |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112367060A (en) * | 2020-11-23 | 2021-02-12 | 北京航天微电科技有限公司 | Adhering method for metal-packaged EMI filter |
| CN114245603A (en) * | 2021-12-20 | 2022-03-25 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
| CN114245603B (en) * | 2021-12-20 | 2024-01-30 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
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