CN103874342A - Circuit board assembling method and circuit board - Google Patents
Circuit board assembling method and circuit board Download PDFInfo
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- CN103874342A CN103874342A CN201410117932.4A CN201410117932A CN103874342A CN 103874342 A CN103874342 A CN 103874342A CN 201410117932 A CN201410117932 A CN 201410117932A CN 103874342 A CN103874342 A CN 103874342A
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- circuit board
- support portion
- supporting zone
- plug
- pad
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Abstract
The invention provides a circuit board assembling method and a circuit board. The circuit board assembling method includes the steps that a supporting area needing to support a plug-in mounting device to be mounted is determined on the circuit board to be assembled, and the supporting area is a bonding pad preformed on the circuit board; in the assembling process of the circuit board, a supporting part with a preset height is formed in the supporting area so that the plug-in mounting device can be supported through the supporting part. Compared with the prior art, the supporting part with the preset height is formed in the assembling process of the circuit board, the height and the position of the supporting part can be determined according to the plug-in mounting device matched with the circuit board, thus, when an electronic product is assembled, a support does not need to be additionally arranged, or excessive procedures do not need to be added, meanwhile, supporting accuracy can be guaranteed, and production cost is saved.
Description
Technical field
The present invention relates to circuit board technology, relate in particular to a kind of circuit board assembling method and circuit board.
Background technology
In electronic product, plug-in mounting device is a kind of common device, and it need to be inserted on printed circuit board (PCB) (Printed Circuit Board, PCB) by the grafting pin on it conventionally.Wherein, plug-in mounting device is power module, plug-in mounting network interface connector, memory bank socket etc. such as, device normally general or standard; conventionally can manufacture according to the size of standard; retain the grafting pin of regular length, therefore, the pin length of these plug-in mounting devices is normally fixed.
At present; in portions of electronics product; conventionally can be because the needs of structural design; the thickness of PCB; or it is different that gap design between pcb board and other parts is less etc., and plug-in mounting device is inserted to after PCB, easily occurs that plug-in mounting pin is long; cause producing and interfering with other structure or device, even cause electronic product to produce the problems such as short circuit.Therefore, in prior art, when needing in electronic product to guarantee that plug-in mounting device is inserted to the grafting pin length after PCB, conventionally adopt, between plug-in mounting device and PCB, supporter is set, for example pad carrys out padded plug-in mounting device mode, or plug-in mounting pin is cut short to mode, guarantee that plug-in mounting device is installed to the length of plug-in mounting pin after PCB, can not impact to other structure or device it.
But, when the assembling of plug-in mounting device, increase the padded plug-in mounting device of supporter, or plug-in mounting pin is cut short to operation, all need to increase corresponding operation, improve the complexity that plug-in mounting device is installed, increase the production cost of electronic product; And corresponding process operations is also not easy control operation precision, also there will be the bad problem of product.
Summary of the invention
In view of this, the invention provides a kind of circuit board assembling method and circuit board, can turn over the support portion that in journey, formation is supported plug-in mounting device in circuit board group.
A kind of circuit board assembling method, comprising:
On circuit board to be assembled, determine the supporting zone that need to support plug-in mounting device to be installed, described supporting zone is the pad being pre-formed on described circuit board;
In circuit board group process of assembling, form the support portion of preset height at described supporting zone, to utilize support portion to support plug-in mounting device.
Further, the described support portion that forms preset height at described supporting zone, is specially:
On the pad as described supporting zone, form the scolder with preset height, described scolder is described support portion.
Further, described supporting zone be shaped as square;
Relation between the volume V of the tin cream of placing on described pad, the area S of supporting zone and bearing height h meets formula: V=2S × h.
Further, described supporting zone be shaped as circle;
Relation between the volume V of the tin cream of placing on pad, the diameter d of supporting zone and bearing height h meets formula:
Further, described support portion is the cushion block that is arranged on described supporting zone.
Further, serve as reasons and be arranged on the scolder of described supporting zone and the support portion that cushion block forms in described support portion;
Wherein, place the tin cream of cushion block and predetermined amount on the pad as supporting zone, Reflow Soldering is welded on circuit board tin cream fusing after-contraction on pad and by cushion block, to form described support portion in circuit board group process of assembling.
Based on same thought, the present invention also provides a kind of circuit board that adopts said method assembling, comprises circuit board body, is provided with the support portion that the plug-in mounting device to installing supports on described circuit board body.
Further, described support portion is the scolder being formed on described circuit board.
Further, described support portion is the cushion block being arranged on described circuit board.
Further, serve as reasons and be arranged on the support portion of cushion block on described circuit board and scolder composition in described support portion.
With respect to prior art, the present invention is by circuit board group process of assembling, just on circuit board, form the support portion of preset height, the height of this support portion and position can determine according to the plug-in mounting device coordinating with this circuit board, like this, and in the time that electronic product is assembled, just do not need the extra supporter that arranges, or increase unnecessary operation, and can guarantee support accuracy simultaneously, save production cost.
Accompanying drawing explanation
Fig. 1 is the flow chart of a kind of circuit board manufacturing method of the present invention;
Fig. 2-1st, the schematic diagram of the circuit board with supporting zone provided by the invention;
Fig. 2-2nd, the schematic diagram of the circuit board with support portion provided by the invention;
Fig. 3-1st, a kind of schematic diagram of circuit board form support portion on circuit board time provided by the invention;
Fig. 3-2nd, the vertical view of Fig. 3-1;
Fig. 3-3rd, the schematic diagram after support portion, Fig. 3-1 forms;
Fig. 3-4th, circuit board provided by the invention is installed the schematic diagram after plug-in mounting device;
Fig. 4 is the schematic diagram of the support portion with rectangular shape provided by the invention;
Fig. 5 is the schematic diagram of the support portion with spheroid shape provided by the invention;
Fig. 6 is the circuit board schematic diagram that another kind provided by the invention forms support portion on circuit board;
Fig. 7-1st, schematic diagram when another kind provided by the invention forms support portion on circuit board;
Fig. 7-2nd, the schematic diagram of support portion after forming in Fig. 7-1.
Embodiment
In order to address the above problem, the invention provides a kind of circuit board assembling method and circuit board.
Refer to Fig. 1, a kind of flow chart of circuit board assembling method, comprising step:
101,, on circuit board to be assembled, determine the supporting zone that need to support plug-in mounting device to be installed;
As shown in Fig. 2-1, on circuit board to be assembled 10, according to parameters such as the installation site of plug-in mounting device to be installed, model size and topology layouts around, can set in advance supporting zone 11 at circuit board to be assembled 10, the upper surface that supporting zone 11 is circuit board 10 is with the region (figure middle polyline is only mark, not representative structure) of black broken line mark.Wherein, can be in circuit board making process, the relevant position that plug-in mounting device is installed in advance on circuit board sets in advance the pad as supporting zone, and the quantity of pad can be multiple, in the time that circuit board is assembled, while namely needing to weld other electronic device on circuit board, can determine all pads as supporting zone, or the supporting zone that supports as the plug-in mounting device to be installed of part pad.
It should be noted that, what supporting zone 11 in Fig. 2-1 was exemplary illustrates 2, and in the assembling of actual circuit board, supporting zone 11 is determined according to the size of plug-in mounting device, is as the criterion can realize stable support, and quantity, position and shape do not limit.
102,, in circuit board group process of assembling, be formed with the support portion of preset height at described supporting zone 11, to utilize support portion to support plug-in mounting device;
As shown in Fig. 2-2, on the supporting zone on circuit board 10, form the support portion 12 of preset height, the preset height of support portion is exactly the bearing height to plug-in mounting device.The supported portion 12 of supporting zone covers herein, therefore in Fig. 2-2, does not show.
As can be seen here, the present invention is by circuit board group process of assembling, just on circuit board, be formed with the support portion of preset height, the height of this support portion and position can determine according to the plug-in mounting device coordinating with this circuit board, like this, and in the time that electronic product is assembled, just do not need the extra supporter that arranges, or increase unnecessary operation, and can guarantee support accuracy simultaneously, save production cost.
In a preferred embodiment, the described method that forms the support portion of preset height at described supporting zone, specifically can be as follows:
Refer to Fig. 3-1, the schematic diagram for form support portion on circuit board time.First, a certain amount of tin cream 122 is set on the pad 121 as supporting zone, the area covering of tin cream 122 also exceedes the area of described pad 121.
Referring to 3-2, is the vertical view of Fig. 3-1.Wherein, can see on circuit board 10, be provided with the supporting zone as each strong point of plug-in mounting device 13, be i.e. pad 121; On pad 121, be provided with tin cream 122, described tin cream 122 can cover and surmount the area of described pad 121.What the pad 121 in figure and tin cream were exemplary expresses 4, is respectively circle and rectangle, and in the assembling of actual circuit board, determines according to the size of plug-in mounting device, is as the criterion can realize stable support, and quantity and shape do not limit.
In the preferred embodiment of the invention, conventionally adopt surface soldered technology (Surface Mount Technology is called for short SMT) to make described support portion.Its process is mainly a certain amount of tin cream 122 of printing coating on the pad 121 of circuit board 10, according to specific reflux temperature curve heater circuit plate 10, allow tin cream 122 melt, tin cream 122 is except under welding temperature, outside the function that welded components and parts and pad can be welded together along with the volatilization of solvent and portions additive, itself scolder after its alloying component cooled and solidified forms the support portion with preset height on the pad 121 of circuit board 10.
Refer to Fig. 3-3, the tin cream 122 of the circuit board of Fig. 3-1 after reflow ovens may be deformed to the scolder 123 into preset height, forms support portion.
The present invention utilizes just a certain amount of tin cream 122 is set on the pad 121 of supporting zone, and makes it melt-solidify preset height scolder 123 that after-contraction forms on pad 121 support portion 12 as plug-in mounting device 13 on circuit board 10.As Fig. 3-4, when plug-in mounting device 13 is installed on circuit board 10, the support portion 12 that just can form by tin cream on circuit board 10 is padded, meets the installation needs of electronic product, does not need to cut short the operations such as pin in installation process again.
It should be noted that, about the mode of printing of tin cream 122 on pad 121, conventionally adopt the mode of steel mesh printing.Steel mesh (stencils) is SMT template (SMT Stencil) namely, it is a kind of SMT particular manufacturing craft, its major function is the deposition that helps tin cream, and the tin cream of accurate quantity is transferred to the accurate location (prior art repeats no more) on null circuit plate herein.And the volume of tin cream can be adjusted according to the opening of steel mesh and thickness, thereby realize the flexible control of bearing height.In addition, the mode that tin cream 122 is printed by steel mesh is arranged on the pad 121 of circuit board 10, can improve making precision, and print solder paste can with on circuit board, other rise together with the tin cream of connection function and process, thereby reduce extra manufacturing procedure, saved production cost.
With respect to prior art, support portion of the present invention, because bearing height can be controlled flexibly in assembling process, without the pad that uses differing heights, just can make the plug-in mounting device of the compatible different pin length of circuit board.
The calculating of bearing height that it should be noted that support portion of the present invention is relevant with the shape of supporting zone.While adopting SMT to support due to the present invention, support portion is the scolder of the preset height of the formation on pad.In this technology, conventionally adopt (normally support plug-in mounting device bottom four jiaos of multi-point support, supporting zone is little, rounded) and large area support (conventionally support two symmetrical bases of plug-in mounting device, supporting zone area is large, be square) these two kinds of supporting way, therefore the shape in different supporting way lower support regions also can be different.
In the time that being shaped as of described supporting zone is square, as shown in Figure 4, tin cream melts-solidifies the scolder boss of rear formation because surface tension generally can form mellow and full profile, calculate as cuboid the support portion that conventionally scolder can be formed, and the relation between the volume V of the tin cream of now placing on described pad, the area S of supporting zone and bearing height h meets formula: V=2S × h.
When described supporting zone be shaped as circle time, as shown in Figure 5, now support portion forms a spheroid, the diameter of supposing supporting zone is that the radius that d, segment height (bearing height) are V, segment for the volume of h, steel mesh print solder paste is r:
After steel mesh printing, scolder grain gap-fill wherein, after the combined factors such as scaling powder auxiliary element volatilization are considered, the scolder actual volume piling up on pad can reduce (scolder residual volume and tin cream volume ratio are 1:2 conventionally);
According to segment volume computing formula V=π h2 (r-h/3), obtain that segment radius and segment are high, the relation of segment truncation circular diameter (supporting zone diameter) d:
d
2=4h（2r-h）；
r?=（d2/4+h2）/2h；
Comprehensively can calculate tin cream volume:
V=2*πh2(（d
2/4+h2）/2h-h/3)。
After simplification of a formula, obtain, the relation between the volume V of the tin cream of placing on pad, the diameter d of supporting zone and bearing height h meets formula:
So, the present invention can utilize above-mentioned formula to calculate the tin cream volume that should print according to the bearing height of plug-in mounting requirement on devices, thereby makes the plug-in mounting device of the different pin length that circuit board can compatible each manufacturer.And the conversion of height only need change tin cream volume, without the extra operation that increases, save processing cost.And the bearing height that above-mentioned computational methods obtain makes the accuracy of manufacture more accurate with respect to the manual mode that pad is installed in prior art.
Except above-mentioned situation, in a preferred embodiment, while raising higher height for needs, described support portion can also be for being arranged on the cushion block of described supporting zone.Conventionally can adopt cushion block is welded on the pad of supporting zone by the mode of welding.As shown in Figure 6, on supporting zone corresponding to the upper plug-in mounting device of circuit board 10, cushion block 14 is set, thereby plug-in mounting device is played to the effect of support.
In addition, refer to Fig. 7-1, in a preferred embodiment, while raising higher height for needs, described support portion can also be adopted as by being arranged on the scolder of described supporting zone and the support portion that cushion block forms.Wherein, on supporting zone corresponding to the upper plug-in mounting device of circuit board 10, pad 121 is set, a certain amount of tin cream 122 is set between pad 121 and pad 124, after reflow ovens processing, described tin cream 122 can be out of shape and raise, as shown in Fig. 7-2, form scolder 123, described scolder 123 is welded on cushion block 124 on circuit board, and the support portion entirety that therefore scolder 123 and cushion block 124 form can raise, thereby plug-in mounting device is played to the effect of support.It should be noted that, different from the mode of welding cushion block in Fig. 6 is, by printing a certain amount of tin cream 122, after reflow ovens processing, tin cream 122 can become the scolder 123 of preset height and cushion block 124 is welded on circuit board 10, this support scheme can be raised higher height than cushion block is directly installed, and bearing height is more accurate.
Based on identical design, the present invention also provides a kind of circuit board that adopts the assembling of foregoing circuit plate assemble method, comprises circuit board body, is provided with the support portion that the plug-in mounting device to installing supports on described circuit board body.
Preferably, described support portion is the scolder being formed on described circuit board.
Preferably, described support portion is the cushion block being formed on described circuit board.
Preferably, described support portion is the support portion that is formed on cushion block on described circuit board and scolder composition.
As can be seen here, the present invention forms the support portion of variable height on circuit board by adjusting the mode of print solder paste volume, thereby optimize the pin of circuit board in prior art and raised design, make the plug-in mounting device of the different pin length that circuit board can compatible different manufacturers, meet the requirement of plug-in mounting device for different bearing heights, and simplified manufacturing procedure, and reduce manufacture difficulty, guarantee the accuracy of manufacture and saved production cost.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of making, be equal to replacement, improvement etc., within all should being included in the scope of protection of the invention.
Claims (10)
1. a circuit board assembling method, is characterized in that, comprising:
On circuit board to be assembled, determine the supporting zone that need to support plug-in mounting device to be installed, described supporting zone is the pad being pre-formed on described circuit board;
In circuit board group process of assembling, form the support portion of preset height at described supporting zone, to utilize support portion to support plug-in mounting device.
2. method according to claim 1, is characterized in that, the described support portion that forms preset height at described supporting zone, is specially:
On the pad as described supporting zone, form the scolder with preset height, described scolder is described support portion.
3. method according to claim 2, is characterized in that, being shaped as of described supporting zone is square;
Relation between the volume V of the tin cream of placing on described pad, the area S of supporting zone and bearing height h meets formula: V=2S × h.
4. method according to claim 2, is characterized in that, described supporting zone be shaped as circle;
Relation between the volume V of the tin cream of placing on pad, the diameter d of supporting zone and bearing height h meets formula:
5. method according to claim 1, is characterized in that, described support portion is the cushion block that is arranged on described supporting zone.
6. method according to claim 1, is characterized in that, serves as reasons and be arranged on the scolder of described supporting zone and the support portion that cushion block forms in described support portion;
Wherein, place the tin cream of cushion block and predetermined amount on the pad as supporting zone, Reflow Soldering is welded on circuit board tin cream fusing after-contraction on pad and by cushion block, to form described support portion in circuit board group process of assembling.
7. a circuit board that adopts the assemble method assembling of claim 1, is characterized in that, comprises circuit board body, is provided with the support portion that plug-in mounting device to be installed is supported on described circuit board body.
8. circuit board according to claim 7, is characterized in that, described support portion is the scolder being formed on described circuit board.
9. circuit board according to claim 7, is characterized in that, described support portion is the cushion block being arranged on described circuit board.
10. circuit board according to claim 7, is characterized in that, serves as reasons and be arranged on the support portion of cushion block on described circuit board and scolder composition in described support portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117932.4A CN103874342B (en) | 2014-03-26 | 2014-03-26 | Circuit board assembling method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117932.4A CN103874342B (en) | 2014-03-26 | 2014-03-26 | Circuit board assembling method and circuit board |
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| CN103874342A true CN103874342A (en) | 2014-06-18 |
| CN103874342B CN103874342B (en) | 2017-07-04 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793566A (en) * | 2017-03-06 | 2017-05-31 | 维沃移动通信有限公司 | The preparation method and mobile terminal of a kind of printed circuit board plate |
| CN109195353A (en) * | 2018-09-17 | 2019-01-11 | 新华三技术有限公司 | Printed circuit board, electronic equipment and its production technology |
| CN109587948A (en) * | 2018-12-28 | 2019-04-05 | 维沃移动通信有限公司 | A kind of circuit board arrangement and its processing method |
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| CN1065372A (en) * | 1991-03-26 | 1992-10-14 | 古河电气工业株式会社 | The Printed circuit board and manufacturing methods of tape welding material coating |
| JPH11233929A (en) * | 1998-02-13 | 1999-08-27 | Nippon Carbide Ind Co Inc | Manufacture of printed wiring board |
| CN201509370U (en) * | 2009-07-24 | 2010-06-16 | 杭州华三通信技术有限公司 | Connecting assembly with plug-in unit |
| CN102522347A (en) * | 2011-12-23 | 2012-06-27 | 清华大学 | Method for manufacturing solder bump |
| CN103426780A (en) * | 2012-05-14 | 2013-12-04 | 万国半导体(开曼)股份有限公司 | Solder ball array used as height cushion block and solder fixture |
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2014
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1065372A (en) * | 1991-03-26 | 1992-10-14 | 古河电气工业株式会社 | The Printed circuit board and manufacturing methods of tape welding material coating |
| JPH11233929A (en) * | 1998-02-13 | 1999-08-27 | Nippon Carbide Ind Co Inc | Manufacture of printed wiring board |
| CN201509370U (en) * | 2009-07-24 | 2010-06-16 | 杭州华三通信技术有限公司 | Connecting assembly with plug-in unit |
| CN102522347A (en) * | 2011-12-23 | 2012-06-27 | 清华大学 | Method for manufacturing solder bump |
| CN103426780A (en) * | 2012-05-14 | 2013-12-04 | 万国半导体(开曼)股份有限公司 | Solder ball array used as height cushion block and solder fixture |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793566A (en) * | 2017-03-06 | 2017-05-31 | 维沃移动通信有限公司 | The preparation method and mobile terminal of a kind of printed circuit board plate |
| CN109195353A (en) * | 2018-09-17 | 2019-01-11 | 新华三技术有限公司 | Printed circuit board, electronic equipment and its production technology |
| CN109587948A (en) * | 2018-12-28 | 2019-04-05 | 维沃移动通信有限公司 | A kind of circuit board arrangement and its processing method |
| CN109587948B (en) * | 2018-12-28 | 2021-02-02 | 维沃移动通信有限公司 | Circuit board device and processing method thereof |
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| Publication number | Publication date |
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| CN103874342B (en) | 2017-07-04 |
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Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Applicant after: Xinhua three Technology Co., Ltd. Address before: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Applicant before: Huasan Communication Technology Co., Ltd. |
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