CN103874342B - Circuit board assembling method and circuit board - Google Patents
Circuit board assembling method and circuit board Download PDFInfo
- Publication number
- CN103874342B CN103874342B CN201410117932.4A CN201410117932A CN103874342B CN 103874342 B CN103874342 B CN 103874342B CN 201410117932 A CN201410117932 A CN 201410117932A CN 103874342 B CN103874342 B CN 103874342B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- supporting part
- supporting
- pad
- supporting zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention provides a kind of circuit board assembling method and circuit board, and circuit board assembling method includes：On circuit board to be assembled, it is determined that needing the supporting zone being supported to inserting device to be installed, the supporting zone is the pad being previously formed on the circuit board；During circuit board assembling, the supporting part of preset height is formed in the supporting zone, inserting device is supported with using supporting part.Relative to prior art, during the present invention in circuit board by assembling, the supporting part of preset height is just formed with circuit boards, the height of the supporting part and position can determine according to the inserting device coordinated with the circuit board, so, when electronic product is assembled, avoid the need for extra setting supporter, or increase unnecessary operation, while support accuracy can be ensured, save production cost.
Description
Technical field
The present invention relates to circuit board technology, more particularly to a kind of circuit board assembling method and circuit board.
Background technology
In electronic product, inserting device is a kind of common device, and it generally needs to be inserted by grafting pin thereon
On printed circuit board (PCB) (Printed Circuit Board, PCB).Wherein, inserting device such as power module, inserting network interface
Connector, memory bank socket etc., typically general or standard device, it will usually manufactured according to the size of standard retain
The grafting pin of regular length, therefore, what these pin lengths for inserting devices were usually fixed.
At present, in the electronic product of part, it will usually because structure design the need for, the thickness of PCB, or pcb board and its
Design smaller etc. different in gap between its part so that after inserting device inserting to PCB, easy appearance inserting pin is long,
The problems such as causing to be produced with other structures or device and interfere, or even cause electronic product to produce short circuit.Therefore, in the prior art,
During for needing to ensure inserting device inserting to grafting pin length after PCB in electronic product, inserting device is typically employed in
Supporter is set between PCB, and such as pad carrys out padded inserting device mode, or inserting pin is cut short mode to ensure
Inserting device is installed to the length of inserting pin after PCB, it is not impacted to other structures or device.
But, when inserting device is assembled, increase the padded inserting device of supporter, or inserting pin is carried out cutting short behaviour
Make, be required to increase corresponding operation, improve the complexity that inserting device is installed, increased the production cost of electronic product；
And, corresponding process operations are also not easily controlled performance accuracy, and the bad problem of product also occurs.
The content of the invention
In view of this, the present invention provides a kind of circuit board assembling method and circuit board, can during circuit board assembling shape
The supporting part that inserting device is supported in pairs.
A kind of circuit board assembling method, including：
On circuit board to be assembled, it is determined that the supporting zone being supported to inserting device to be installed is needed, it is described
Supporting zone is the pad being previously formed on the circuit board；
During circuit board assembling, the supporting part of preset height is formed in the supporting zone, to utilize supporting part pair
Inserting device is supported.
Further, the supporting part that preset height is formed in the supporting zone, specially：
On as the pad of the supporting zone, the solder with preset height is formed, the solder is the branch
Support part.
Further, the supporting zone be shaped as it is square；
Relation between the volume V of tin cream, the area S of supporting zone and bearing height h that are placed on the pad expires
Sufficient formula：V=2S × h.
Further, the supporting zone is shaped as circle；
Relation between the volume V of tin cream, the diameter d of supporting zone and bearing height h that are placed on pad meets public
Formula：
Further, the supporting part is the cushion block for being arranged on the supporting zone.
Further, the supporting part is by being arranged on the supporting part that the solder of the supporting zone and cushion block are constituted；
Wherein, the tin cream of cushion block and predetermined amount is placed on the pad as supporting zone, after Reflow Soldering melts tin cream
It is contracted on pad and welds on circuit boards, to form the supporting part during being assembled in circuit board cushion block.
Based on same thought, the present invention also provides a kind of circuit board of use above method assembling, including circuit board sheet
Body, is provided with the supporting part being supported to the inserting device installed in the circuit board body.
Further, the supporting part is the solder being formed on the circuit board.
Further, the supporting part is the cushion block being arranged on the circuit board.
Further, the supporting part is the supporting part being made up of the cushion block being arranged on the circuit board and solder.
Relative to prior art, during the present invention in circuit board by assembling, preset height is just formed on circuit boards
Supporting part, the height of the supporting part and position can determine according to the inserting device coordinated with the circuit board, so, in electronics
During assembling product, extra setting supporter is avoided the need for, or increase unnecessary operation, while support accuracy can be ensured, saved
Production cost.
Brief description of the drawings
Fig. 1 is a kind of flow chart of circuit board manufacturing method of the invention；
Fig. 2-1 is the schematic diagram of the circuit board with supporting zone that the present invention is provided；
Fig. 2-2 is the schematic diagram of the circuit board with supporting part that the present invention is provided；
The schematic diagram of circuit board when Fig. 3-1 is a kind of supporting part of formation on circuit boards of present invention offer；
Fig. 3-2 is the top view of Fig. 3-1；
Fig. 3-3 is the schematic diagram after Fig. 3-1 supporting parts are formed；
Fig. 3-4 is the schematic diagram after the circuit board that the present invention is provided installs inserting device；
Fig. 4 is the schematic diagram of the supporting part with rectangular shape that the present invention is provided；
Fig. 5 is the schematic diagram of the supporting part with segment shape that the present invention is provided；
Fig. 6 is another circuit board schematic diagram for forming supporting part on circuit boards that the present invention is provided；
Schematic diagram when Fig. 7-1 is another supporting part of formation on circuit boards of present invention offer；
Fig. 7-2 is the schematic diagram after supporting part is formed in Fig. 7-1.
Specific embodiment
In order to solve the above problems, the invention provides a kind of circuit board assembling method and circuit board.
Refer to Fig. 1, a kind of flow chart of circuit board assembling method, including step：
101st, on circuit board to be assembled, it is determined that needing the supporting zone being supported to inserting device to be installed；
As shown in Fig. 2-1, on circuit board 10 to be assembled, according to installation site, the model of inserting device to be installed
The parameters such as the topology layout of size and surrounding, can pre-set supporting zone 11, supporting zone in circuit board 10 to be assembled
11 regions marked with black broken line for the upper surface of circuit board 10 (figure middle polyline is only mark, not representative structure).Wherein, may be used
During circuit board making, the relevant position for installing inserting device on circuit boards in advance is pre-set as supporting zone
Pad, and the quantity of pad when circuit board is assembled, that is, can need to weld other electronic devices on circuit board with multiple
When, can be it is determined that all pads as supporting zone, or part pad be propped up as to inserting device to be installed
The supporting zone of support.
It should be noted that supporting zone 11 in Fig. 2-1 it is exemplary illustrate 2, and the circuit board of reality is assembled
In, supporting zone 11 is determined according to the size of inserting device, and can realize that stablizing support is defined, quantity, location and shape are not
It is limited.
102nd, during circuit board assembling, the supporting part of preset height is formed with the supporting zone 11, to utilize
Supporting part is supported to inserting device；
As shown in Fig. 2-2, form the supporting part 12 of preset height on the supporting zone on circuit board 10, supporting part it is pre-
If being highly exactly the bearing height to inserting device.Supporting zone supported portion 12 is covered herein, therefore is not shown in Fig. 2-2
Show to come.
As can be seen here, during the present invention in circuit board by assembling, the branch of preset height is just formed with circuit boards
Support part, the height of the supporting part and position can determine according to the inserting device coordinated with the circuit board, so, in electronic product
During assembling, extra setting supporter is avoided the need for, or increase unnecessary operation, while support accuracy can be ensured, save production
Cost.
In a preferred embodiment, the method that the supporting part of preset height is formed in the supporting zone, specifically can be as follows：
Fig. 3-1 is referred to, is schematic diagram when forming supporting part on circuit boards.First, in the weldering as supporting zone
A certain amount of tin cream 122 is set on disk 121, and the area covering of tin cream 122 simultaneously exceedes the area of the pad 121.
3-2 is referred to, is the top view of Fig. 3-1.Wherein it is possible to see on circuit board 10, it is provided with as inserting device
The supporting zone of 13 each strong point, i.e. pad 121；Tin cream 122 is provided with pad 121, the tin cream 122 can cover
Cover and surmount the area of the pad 121.Pad 121 and tin cream in figure it is exemplary represent 4, respectively circular and square
Shape, and in the assembling of the circuit board of reality, the size according to inserting device is determined, can realize that stablizing support is defined, quantity and
Shape is not limited.
In the preferred embodiment of the invention, generally using surface soldered technology (Surface Mount Technology, letter
Claim SMT) make the supporting part.Its process is mainly prints a certain amount of tin cream of coating on the pad 121 of circuit board 10
122, according to specific reflux temperature curve heater circuit plate 10, allow tin cream 122 to melt, tin cream 122 except under welding temperature,
As the volatilization of solvent and portions additive can be by outside the function by weldering component together with pad solder, itself is at it
Solder after alloying component cooled and solidified forms the supporting part with preset height on the pad 121 of circuit board 10.
Fig. 3-3 are referred to, the circuit board of Fig. 3-1 may be deformed to the weldering for preset height by the tin cream 122 after reflow ovens
Material 123, that is, form supporting part.
The present invention exactly utilizes and a certain amount of tin cream 122 is set on the pad 121 of supporting zone, and it is melted-is coagulated
Gu the preset height solder 123 that after-contraction is formed on pad 121 is used as the supporting part 12 that device 13 is inserted on circuit board 10.Such as
Fig. 3-4, when inserting device 13 is installed on circuit board 10, it is possible to padded by the supporting part 12 of tin cream formation on circuit board 10
Height, meets the installation needs of electronic product, and the operations such as pin need not be again cut short in installation process.
It should be noted that the mode of printing on tin cream 122 on pad 121, generally by the way of steel mesh printing.Steel
Net (stencils) namely SMT templates (SMT Stencil), it is a kind of SMT particular manufacturing crafts, and its major function is to aid in tin
The deposition of cream, the tin cream of accurate quantity is transferred to the accurate location (prior art, here is omitted) on null circuit plate.And
And the volume of tin cream can be adjusted according to the opening of steel mesh and thickness, so as to realize the flexible control of bearing height.Additionally,
Tin cream 122 is arranged on the pad 121 of circuit board 10 by way of steel mesh prints, making precision can be improved, and print
Brush tin cream can with circuit board other play the tin cream of connection function together with process, so as to reduce extra manufacturing procedure, section
About production cost.
Relative to prior art, supporting part of the invention can be controlled flexibly in an assembling process due to bearing height, without
Use the pad of different height, so that it may so that the inserting device of the compatible difference pin length of circuit board.
It is worth noting that, the calculating of the bearing height of supporting part of the present invention is related to the shape of supporting zone.Due to this
When invention is supported using SMT, supporting part is the solder of the preset height of the formation on pad.Generally used in this technology
Multi-point support (typically support inserts the corner of bottom device, and supporting zone is small, rounded) and large area support (are normally supported
Symmetrical two base of device is inserted, supporting zone area is big, is square) both supporting way, therefore different supports
The shape of supporting zone also can be different under mode.
When the supporting zone is when being shaped as square, as shown in figure 4, the solder boss formed after tin cream fusing-solidification
Because surface tension can typically form mellow and full profile, the supporting part that solder is formed can generally be calculated as cuboid,
Relation between the volume V of tin cream, the area S of supporting zone and bearing height h that are now placed on the pad meets public
Formula：V=2S × h.
When the supporting zone is when being shaped as circle, as shown in figure 5, now supporting part forms a spheroid, it is assumed that
The diameter of supporting zone be d, segment height (bearing height) be h, steel mesh print solder paste volume for V, segment radius be r：
After due to steel mesh printing, solder intergranular gap therein is filled, and the combined factors such as scaling powder auxiliary element volatilization consider
Afterwards, piling up the solder actual volume on pad can reduce that (usual solder residual volume and tin cream volume ratio are 1:2)；
According to segment volume computing formula V=π h2(r-h/3), obtain segment radius and segment is high, segment truncation circular diameter
The relation of (supporting zone diameter) d：
d2=4h (2r-h)；
R=(d2/4+h2)/2h；
It is comprehensive then tin cream volume can be calculated：
V=2* π h2((d2/4+h2)/2h-h/3)。
Obtained after simplification of a formula, the volume V of tin cream, the diameter d of supporting zone and bearing height h placed on pad
Between relation meet formula：
So, the present invention can utilize above-mentioned formula to calculate and should print according to the bearing height of inserting requirement on devices
Tin cream volume so that circuit board can be with the inserting device of the different pin lengths of compatible each manufacturer.And the change of height
Changing only need to change tin cream volume, and operation is increased without extra, save processing cost.And the support that above-mentioned computational methods are obtained
Height makes the accuracy of manufacture more accurate relative to the mode for installing pad by hand in the prior art.
In addition to the foregoing, in a preferred embodiment, when raising height higher for needs, the supporting part is also
It can be the cushion block for being arranged on the supporting zone.Generally can be using cushion block be welded on as support by way of welding
On the pad in region.As shown in fig. 6, cushion block 14 is set on the corresponding supporting zone of upper inserting device of circuit board 10, so that
Support is played a part of to inserting device.
In addition, Fig. 7-1 is referred to, and in a preferred embodiment, when raising height higher for needs, the supporting part
The supporting part being made up of the solder for being arranged on the supporting zone and cushion block can also be adopted as.Wherein, in the upper of circuit board 10
Pad 121 is set on the corresponding supporting zone of inserting device, a certain amount of tin cream is set between pad 121 and pad 124
122, by after reflow ovens processing, the tin cream 122 can deform and raise, as shown in Fig. 7-2, form solder 123, the solder
123 weld on circuit boards cushion block 124, therefore the supporting part of solder 123 and the composition of cushion block 124 can integrally be raised, so that right
Inserting device plays a part of support.It should be noted that unlike the mode of cushion block is welded in Fig. 6, by printing one
Quantitative tin cream 122, by after reflow ovens processing, tin cream 122 can become the solder 123 of preset height and weld cushion block 124
On the circuit board 10, this support scheme can raise height higher than being mounted directly cushion block, and bearing height is more accurate.
Based on identical design, present invention also offers a kind of circuit board of use foregoing circuit plate assemble method assembling,
Including circuit board body, the supporting part being supported to the inserting device installed is provided with the circuit board body.
Preferably, the supporting part is the solder being formed on the circuit board.
Preferably, the supporting part is the cushion block being formed on the circuit board.
Preferably, the supporting part is the supporting part of the cushion block and solder composition being formed on the circuit board.
As can be seen here, the present invention forms the support of variable height on circuit boards by way of adjusting print solder paste volume
Portion, so as to the pin for optimizing circuit board in the prior art raises design, makes circuit board to draw with the difference of compatible different manufacturers
The inserting device of pin length, meets requirement of the inserting device for different bearing heights, and simplifies manufacturing procedure, reduces system
Make difficulty, it is ensured that the accuracy of manufacture has simultaneously saved production cost.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements done etc. should be included within the scope of protection of the invention.
Claims (10)
1. a kind of circuit board assembling method, it is characterised in that including：
On circuit board to be assembled, it is determined that needing the supporting zone being supported to inserting device to be installed, the support
Region is the pad being previously formed on the circuit board；When circuit board is assembled, it is determined that using all or part of pad as
The supporting zone being supported to inserting device to be installed；
During circuit board assembling, the supporting part of preset height is formed in the supporting zone, to utilize supporting part to inserting
Device is supported.
2. method according to claim 1, it is characterised in that the support that preset height is formed in the supporting zone
Portion, specially：
On as the pad of the supporting zone, the solder with preset height is formed, the solder is the supporting part.
3. method according to claim 2, it is characterised in that being shaped as the supporting zone is square；
Relation between the volume V of tin cream, the area S of supporting zone and bearing height h that are placed on the pad meets public
Formula：V=2S × h.
4. method according to claim 2, it is characterised in that the supporting zone is shaped as circle；
Relation between the volume V of tin cream, the diameter d of supporting zone and bearing height h that are placed on pad meets formula：
5. method according to claim 1, it is characterised in that the supporting part is the pad for being arranged on the supporting zone
Block.
6. method according to claim 1, it is characterised in that the supporting part is the weldering by being arranged on the supporting zone
The supporting part that material is constituted with cushion block；
Wherein, the tin cream of cushion block and predetermined amount is placed on the pad as supporting zone, Reflow Soldering makes tin cream melt after-contraction
On pad and by cushion block welding on circuit boards, to form the supporting part during being assembled in circuit board.
7. the circuit board that a kind of assemble method of use claim 1 is assembled, it is characterised in that described including circuit board body
The supporting part being supported to inserting device to be installed is provided with circuit board body.
8. circuit board according to claim 7, it is characterised in that the supporting part is the weldering being formed on the circuit board
Material.
9. circuit board according to claim 7, it is characterised in that the supporting part is the pad being arranged on the circuit board
Block.
10. circuit board according to claim 7, it is characterised in that the supporting part is by being arranged on the circuit board
Cushion block and solder composition supporting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117932.4A CN103874342B (en) | 2014-03-26 | 2014-03-26 | Circuit board assembling method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117932.4A CN103874342B (en) | 2014-03-26 | 2014-03-26 | Circuit board assembling method and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103874342A CN103874342A (en) | 2014-06-18 |
| CN103874342B true CN103874342B (en) | 2017-07-04 |
Family
ID=50912357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410117932.4A Active CN103874342B (en) | 2014-03-26 | 2014-03-26 | Circuit board assembling method and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103874342B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793566A (en) * | 2017-03-06 | 2017-05-31 | 维沃移动通信有限公司 | The preparation method and mobile terminal of a kind of printed circuit board plate |
| CN109195353A (en) * | 2018-09-17 | 2019-01-11 | 新华三技术有限公司 | Printed circuit board, electronic equipment and its production technology |
| CN109587948B (en) * | 2018-12-28 | 2021-02-02 | 维沃移动通信有限公司 | Circuit board device and processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1065372A (en) * | 1991-03-26 | 1992-10-14 | 古河电气工业株式会社 | The Printed circuit board and manufacturing methods of tape welding material coating |
| CN201509370U (en) * | 2009-07-24 | 2010-06-16 | 杭州华三通信技术有限公司 | Connecting assembly with plug-in unit |
| CN102522347A (en) * | 2011-12-23 | 2012-06-27 | 清华大学 | Method for manufacturing solder bump |
| CN103426780A (en) * | 2012-05-14 | 2013-12-04 | 万国半导体(开曼)股份有限公司 | Solder ball array used as height cushion block and solder fixture |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3504852B2 (en) * | 1998-02-13 | 2004-03-08 | 日本カーバイド工業株式会社 | Manufacturing method of printed wiring board |
-
2014
- 2014-03-26 CN CN201410117932.4A patent/CN103874342B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1065372A (en) * | 1991-03-26 | 1992-10-14 | 古河电气工业株式会社 | The Printed circuit board and manufacturing methods of tape welding material coating |
| CN201509370U (en) * | 2009-07-24 | 2010-06-16 | 杭州华三通信技术有限公司 | Connecting assembly with plug-in unit |
| CN102522347A (en) * | 2011-12-23 | 2012-06-27 | 清华大学 | Method for manufacturing solder bump |
| CN103426780A (en) * | 2012-05-14 | 2013-12-04 | 万国半导体(开曼)股份有限公司 | Solder ball array used as height cushion block and solder fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103874342A (en) | 2014-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103874342B (en) | Circuit board assembling method and circuit board | |
| CN203827615U (en) | Welding tray | |
| CN101374387B (en) | Method for welding electronic element on circuit board | |
| CN109310012A (en) | A kind of steel mesh and the manual reflow soldering method using the steel mesh | |
| CN104768334A (en) | Surface mounting method for dynamically adjusting surface mounting position and device thereof | |
| CN109121294B (en) | Circuit board structure and electronic equipment | |
| US11850684B2 (en) | Wave solder pallets for optimal solder flow and methods of manufacturing | |
| CN105338757A (en) | Printed circuit board manufacturing method and printed circuit board | |
| CN103028802A (en) | Temperature control method for reflow welding machine | |
| JP2000124588A (en) | Electronic circuit unit and manufacture of it | |
| CN103415162B (en) | The method of steel mesh perforate | |
| JP2020040085A (en) | Sleeve soldering device | |
| CN206100642U (en) | Clamp | |
| CN205987536U (en) | Fixed subassembly of metal shrapnel and mobile terminal | |
| JP2012019101A (en) | Surface-mounted electronic circuit module | |
| CN201328220Y (en) | Welding mold for circuit board | |
| CN207854292U (en) | Print tin jig | |
| CN101600303A (en) | Tin-soldering device and tin-soldering method thereof | |
| JP5326823B2 (en) | Wiring board and electronic component mounting structure using the same | |
| CN102291974B (en) | Cutting side positioning type welding structure and method for preventing pins from shifting | |
| CN110958786A (en) | Method for soldering tin on side surface of PCBA (printed Circuit Board Assembly) of on-chip paster | |
| TWI244360B (en) | Printed circuit board | |
| CN100520790C (en) | System and method for dynamic regulation of solder pad | |
| CN215268932U (en) | Resistance welding plug hole air guide base plate | |
| CN208638794U (en) | A kind of printed circuit board and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Applicant after: Xinhua three Technology Co., Ltd. Address before: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Applicant before: Huasan Communication Technology Co., Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |