CN101600303A - Tin-soldering device and tin-soldering method thereof - Google Patents
Tin-soldering device and tin-soldering method thereof Download PDFInfo
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- CN101600303A CN101600303A CNA2008101095963A CN200810109596A CN101600303A CN 101600303 A CN101600303 A CN 101600303A CN A2008101095963 A CNA2008101095963 A CN A2008101095963A CN 200810109596 A CN200810109596 A CN 200810109596A CN 101600303 A CN101600303 A CN 101600303A
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Abstract
The present invention discloses a kind of tin-soldering device and tin-soldering method thereof, is used for soldered circuit board.Tin-soldering device comprises tin stove, carriage, a plurality of active supporting piece, reaches controller.The tin stove is used for the tin sticky circuit board, and it comprises a molten tin bath.Carriage is in order to place circuit board.A plurality of active supporting pieces are in order to Support bracket.Controller couples active supporting piece, and the control carriage moves to molten tin bath.After circuit board was finished tin sticky, controller was controlled to the motion of small part active supporting piece and makes carrier tilt, so that the circuit board detin.
Description
Technical field
The invention relates to a kind of scolding tin technology, particularly about a kind of tin-soldering device and tin-soldering method thereof of controlling the carrier tilt detin.
Background technology
Circuit board (Circuit Board) is the each side of people's life now deeply, is ubiquitous.In every case the electronic product that relates to as computer, mobile phone, PDA(Personal Digital Assistant), printer or facsimile machine etc., all can be applied to circuit board.
Be covered with circuit trace and electronic component on the circuit board, its manufacture craft also is quite complicated.The most important making flow process of circuit board is fixed in electronic component on the circuit board exactly.At first be covered with the configuring area of reserving electronic component on the circuit board of circuit trace, offer a plurality of holes in corresponding appropriate location again, pin for electronic component passes circuit board, with welding manner electronic component is fixed in configuring area on the circuit board then, and realizes electrically connecting by circuit trace and other electronic component.
After electronic component is inserted in circuit board, driving circuit board with connecting gear advances towards a predetermined direction, the while tinning stack, as reflow (reflow) equipment, wave soldering (wave soldering) stove, solder furnace etc. with the mode of the liquid tin after the fusion with the overflow of stratiform pulse wave, impact exposes outside the pin of the electronic component of circuit board bottom side, make liquid tin attached on the pin, condensed pin place will form solid-state metallic tin, so that electronic component is fixed on the circuit board.Above work flow promptly was the tin sticky operation of tin stove.
Though these tinning stacks can reasonable operation and reach certain effect, when utilizing above-mentioned tinning stack to carry out tin sticky to operate, the attachment state of liquid tin on the pin of electronic component can't effectively be controlled usually.Shown in Figure 1A, behind the tin, the pin 120 of electronic component, causes the spot size of pin 120 to differ, even may produce tin ball 130 after condensation because of being adhered to by excessive liquid tin excessively.Among Figure 1B, the pin 120 that electronic component is adjacent causes short circuit because the tin of condensation is in contact with one another for another example.
Traditional solution mostly carefully detects each product in artificial mode, if there is the situation of failure welding then to be decided to be defective products, repairs again and handle, but such way is not only consuming time but also increase production cost.And the result of detection judges according to operating personnel's experience, can't carry out effective keyholed back plate to the quality of product, and defective products is come into the market, and causes the product can't normal operation, even the situation that causes electronic component to burn because of short circuit.
Summary of the invention
In view of this, the invention provides a kind of tin-soldering device and tin-soldering method of easy detin.
The characteristic one of according to the present invention the invention provides a kind of tin-soldering device, is used for soldered circuit board.Tin-soldering device comprises tin stove, carriage, a plurality of active supporting piece and controller.The tin stove is used for the tin sticky circuit board, and it comprises a molten tin bath.Carriage is in order to place circuit board.A plurality of active supporting pieces are in order to Support bracket.Controller couples active supporting piece, and the control carriage moves to molten tin bath, and after circuit board was finished tin sticky, controller was controlled to the motion of small part active supporting piece and makes carrier tilt, so that the circuit board detin.
Another characteristic according to the present invention, the present invention also provides a kind of tin-soldering method, is implemented on circuit board.This method may further comprise the steps.Place circuit board in carriage, carriage is supported by a plurality of active supporting pieces.Movable support bracket, then, the tin sticky circuit board.At last, control these active supporting piece motions and make carrier tilt, so that the circuit board detin.
Beneficial effect of the present invention is to solve circuit board in the scolding tin process, and liquid molten tin adheres to and causes the electronic component pin to produce the excessive generation tin of solder joint ball, or adjacent pin overlaps the short circuit phenomenon that is produced mutually.
For above-mentioned feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A is depicted as liquid tin excessive in the known technology and adheres to and be condensate in schematic diagram on the electronic component pin.
Figure 1B is depicted as electronic component is adjacent in the known technology pin and is in contact with one another the schematic diagram that causes short circuit because of the tin of condensation.
Fig. 2 A is depicted as the schematic diagram of a kind of tin-soldering device of preferred embodiment according to the present invention.
The carriage that Fig. 2 B is depicted as the preferred embodiment according to the present invention moves to the schematic diagram on the molten tin bath of tin stove.
Fig. 2 C is depicted as one side that the active supporting piece support of the preferred embodiment according to the present invention plays carriage, makes the schematic diagram of carrier tilt.
After the detin that Fig. 2 D is depicted as the preferred embodiment according to the present invention is finished, make circuit board withdraw from the schematic diagram of molten tin bath.
Fig. 2 E is depicted as the functional block diagram of the control active supporting piece start of the preferred embodiment according to the present invention.
Figure 3 shows that the flow chart of a kind of tin-soldering method of preferred embodiment according to the present invention.
Embodiment
Fig. 2 A is depicted as the schematic diagram of a kind of tin-soldering device of preferred embodiment according to the present invention.The tin-soldering device 200 that present embodiment provided comprises tin stove 210, carriage (bracket) 220, a plurality of active supporting piece 241,242,243 and controller, and its middle controller indicates at Fig. 2 A, and relevant its detailed description is detailed later.
Above-mentioned tin stove 210 is arranged on an end of conveyer belt, and this conveyer belt comprises above-mentioned a plurality of active supporting piece 241,242,243.In the present embodiment, tin stove 210 is preferably the ripple solder furnace.Tin stove 210 includes a molten tin bath 211, with the liquid solder of ccontaining fusion, and utilizes the effect of pump, so that the molten tin bath liquid level forms the solder wave of given shape.By this, when the circuit board 100 that plugs electronic component (figure do not show) is sent to tin stove 210 through conveyer belts, utilize the active supporting piece 241,242 of conveyer belt, 243 effect, the feasible pin that is plugged in the electronic component of circuit board 100 passes solder wave and realizes solder joint tin sticky.
Above-mentioned carriage 220 is in order to carry one or more circuit boards 100.The carriage 220 that present embodiment provided has one or more molten tin bath holes (figure does not show) of crossing.Be placed on the pin of electronic component of the circuit board 100 on the carriage 220 and the part area of circuit board 100 and just can expose, to carry out tin stove tin sticky operation.
Above-mentioned a plurality of active supporting piece 241,242,243 is for forming the part of conveyer belt.In the present embodiment, active supporting piece 241,242,243rd utilizes cylinder to implement, in other embodiments, active supporting piece 241,242,243 also can utilize mechanical arm, conveyer belt or other equivalent device to replace.
In the present embodiment, active supporting piece 241,242 comes Support bracket 220 by its support portion, and active supporting piece 241, but 242 controlled devices are controlled and rising or decent support part, and then whether the circuit board on the control carriage 220 100 crosses the tin sticky of tin stove.In the present embodiment, active supporting piece 241,242 can be organized and be located on the guide rail (figure do not show), and active supporting piece 241,242 can move toward tin stove 210 directions by guide rail, or gets back to initial position.
That is to say, active supporting piece 241,242nd, same group, and be arranged on the other end (being arranged on an end of conveyer belt with respect to tin stove 210) of conveyer belt.When wanting tin when active supporting piece 241,242 load supports 220, then active supporting piece 241,242 meeting Be Controlled and then past molten tin bath 211 directions move.
In the present embodiment, active supporting piece 243 is to be fixedly installed on the other side of molten tin bath 211, and it is in order to propping up a side of carriage 220, and then makes carriage 220 tilt, so that circuit board 100 is by 211 plate detins of molten tin bath.Have in this area and know that usually the knowledgeable knows the purpose that also can reach carrier tilt by alternate manner after fully understanding the present invention, for example, by control active supporting piece 241 or 242 its support portions of rising, or by control active supporting piece 241,243 its support portions of rising, or raising its support portion in different height by controlling each active supporting piece, the present invention does not impose any restrictions this.
Figure 3 shows that the flow chart of the tin-soldering method of preferred embodiment according to the present invention, relevant its explanation is please in the lump with reference to Fig. 2 A～Fig. 2 E.
Please refer to Fig. 2 A, in step S310, plug-in type electronic component (DIP spare) (figure do not show) is placed in each welding hole (figure does not show) on the circuit board 100.In this embodiment, circuit board 100 for example is the motherboard of portable computer.Then, utilize mechanical arm that circuit board 100 is placed on the carriage 220 again, wherein the pin of each plug-in type electronic component of circuit board 100 is the molten tin bath holes excessively that are exposed at carriage 220 outward.
In step S311, for example be the scaling powder of colophony type to the pin spray of each plug-in type electronic component of circuit board 100.Like this can be so that in the soldering process, liquid molten tin can stick to the surface of pin of the plug-in type electronic component of circuit board 100 full and uniformly.
Please refer to Fig. 2 B and Fig. 2 E, in step S320, controller 250 control active supporting pieces 240 active supporting piece 241 wherein, 242 up prop up carriage 220, and control active supporting piece 241,242 moves toward molten tin bath 211 directions, controls active supporting piece 241 then, 242 support portion down so that carriage 220 is near molten tin baths 211.The pin of the electronic component of circuit board 100 passes solder wave and realizes that solder joint crosses the tin sticky of tin stove.
Please refer to Fig. 2 C, in step S330, after circuit board 100 is finished tin sticky, one side that one of them active supporting piece 243 in the controller 250 control active supporting pieces 241,242,243 promotes carriage 220 earlier, so that carriage 220 tilts, and then make circuit board 100 detins.
When one side of carriage 220 tilts, the molten tin of liquid state on the circuit board 100 can flow on one side to certain, make molten tin volume collect bigger and bigger, weight is also along with increase, himself gravity can offset the surface tension of molten tin fully, can make the liquid molten complete breaking circuit plate 100 of tin and can not remain between the pin of electronic component, and then make foregoing circuit plate 100 complete detin when crossing tin.
Please refer to Fig. 2 D, in step S340, after the pin of these plug-in type electronic components on the circuit board 100 left molten tin bath 211 (detin) fully by the time, controller 250 was controlled active supporting piece 241 again, 242 its support portions of rising are so that carriage 220 is the level of state and away from molten tin bath 211.Then, controller 250 control active supporting pieces 241,242 are got back to initial position.
Preferred embodiment of the present invention discloses as above, and has following advantage: solve in known technology, circuit board is carried out in the scolding tin operation, tin point is excessive and the tin ball and the short circuit phenomenon of generation have promoted the product yield, effectively reduces production costs.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (6)
1. a tin-soldering device is used for soldered circuit board, it is characterized in that, above-mentioned tin-soldering device comprises:
The tin stove is used for tin sticky foregoing circuit plate, and above-mentioned tin stove comprises molten tin bath;
Carriage is in order to place the foregoing circuit plate;
A plurality of active supporting pieces are in order to support above-mentioned carriage; And
Controller couples above-mentioned these active supporting pieces, controls above-mentioned carriage and moves to above-mentioned molten tin bath, and after the foregoing circuit plate was finished tin sticky, above-mentioned these active supporting piece motions that above-mentioned controller is controlled to small part made carrier tilt, so that the detin of foregoing circuit plate.
2. tin-soldering device according to claim 1 is characterized in that, above-mentioned these active supporting pieces are cylinder or mechanical arm.
3. tin-soldering device according to claim 1 is characterized in that, after the foregoing circuit plate was finished tin sticky, one side that one of them active supporting piece in above-mentioned these active supporting pieces of above-mentioned controller control promotes above-mentioned carriage earlier was so that above-mentioned carrier tilt.
4. a tin-soldering method is used for soldered circuit board, it is characterized in that, above-mentioned tin-soldering method may further comprise the steps:
Place circuit board in carriage, above-mentioned carriage is supported by a plurality of active supporting pieces;
Move above-mentioned carriage;
Tin sticky foregoing circuit plate; And
Control above-mentioned these active supporting piece motions and make above-mentioned carrier tilt, so that the detin of foregoing circuit plate.
5. tin-soldering method according to claim 4 is characterized in that, above-mentioned tin-soldering method also comprises:
The spray scaling powder is in the foregoing circuit plate.
6. tin-soldering method according to claim 4 is characterized in that, above-mentioned tin-soldering method also comprises:
After the detin of foregoing circuit plate, control above-mentioned these active supporting piece motions this carriage is the level of state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101095963A CN101600303A (en) | 2008-06-04 | 2008-06-04 | Tin-soldering device and tin-soldering method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101095963A CN101600303A (en) | 2008-06-04 | 2008-06-04 | Tin-soldering device and tin-soldering method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101600303A true CN101600303A (en) | 2009-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101095963A Pending CN101600303A (en) | 2008-06-04 | 2008-06-04 | Tin-soldering device and tin-soldering method thereof |
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| CN (1) | CN101600303A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151931A (en) * | 2011-03-22 | 2011-08-17 | 苏州工业园区新明亚电子科技有限公司 | Tin-soaking processing device |
| TWI510323B (en) * | 2013-03-08 | 2015-12-01 | Hon Hai Prec Ind Co Ltd | Shaping device and positioning mechanism thereof |
| CN107971595A (en) * | 2017-12-29 | 2018-05-01 | 昆山佰奥智能装备股份有限公司 | Horizontal tin sticky equipment |
-
2008
- 2008-06-04 CN CNA2008101095963A patent/CN101600303A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151931A (en) * | 2011-03-22 | 2011-08-17 | 苏州工业园区新明亚电子科技有限公司 | Tin-soaking processing device |
| TWI510323B (en) * | 2013-03-08 | 2015-12-01 | Hon Hai Prec Ind Co Ltd | Shaping device and positioning mechanism thereof |
| US9370812B2 (en) | 2013-03-08 | 2016-06-21 | Fu Ding Electronical Technology (Jiashan) Co., Ltd. | Reshaping device and positioning assembly thereof |
| CN107971595A (en) * | 2017-12-29 | 2018-05-01 | 昆山佰奥智能装备股份有限公司 | Horizontal tin sticky equipment |
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Open date: 20091209 |