CN107591383A - The detachable curved surface encapsulated structure of BGA device - Google Patents
The detachable curved surface encapsulated structure of BGA device Download PDFInfo
- Publication number
- CN107591383A CN107591383A CN201710831180.1A CN201710831180A CN107591383A CN 107591383 A CN107591383 A CN 107591383A CN 201710831180 A CN201710831180 A CN 201710831180A CN 107591383 A CN107591383 A CN 107591383A
- Authority
- CN
- China
- Prior art keywords
- bga
- bga device
- substrate
- curved substrate
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of encapsulating structure, the detachable curved surface encapsulated structure of especially a kind of BGA device, belong to the technical field of integrated antenna package.According to technical scheme provided by the invention, the detachable curved surface encapsulated structure of the BGA device, including curved substrate and BGA device；BGA device is located at the outside of curved substrate extrados, and the BGA soldered balls that some diameters are different are set between BGA device and curved substrate, and BGA soldered balls weld with BGA device, curved substrate respectively.The present invention is compact-sized, solves the problem that can not be mounted due to the difference in height of different soldered ball positions, melts soldered ball by heating up, realizes that curved surface encapsulated structure is detachable, securely and reliably.
Description
Technical field
The present invention relates to a kind of encapsulating structure, the detachable curved surface encapsulated structure of especially a kind of BGA device, belong to integrated
The technical field of circuit package.
Background technology
With the development of the curved surface electronics such as automotive electronics, wearable device, the demand of curved surface encapsulation is increasing, so opening
Toroid encapsulation technology becomes inexorable trend.Using traditional planar package technology, it is difficult to by device and fairshaped curved surface
Structure is combined as a whole, and causes equipment volume big, and power consumption is high, easily by environmental disturbances the problems such as.An and system packaging structure
In, when some device goes wrong, the detachable and re-assemble of encapsulating structure is difficult to realize, this is just proposed to encapsulation technology
Higher requirement.
The exit of planar device is generally made into the form for being suitable for planar device attachment, planar device is pasted
Loaded on curved substrate, it is meant that structure design must be re-started to the pasting area of exit and substrate surface, to meet it
Attachment requires.When the interconnection of plane BGA device and curved substrate is realized with the form of face-down bonding, different soldered ball position correspondences
Substrate is different to the height of BGA device, it is necessary to solve the problems, such as because the difference in height of different soldered ball positions leads to not attachment.
The content of the invention
The purpose of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of detachable curved surface envelope of BGA device
Assembling structure, its is compact-sized, solves the problem that can not be mounted due to the difference in height of different soldered ball positions, passes through the fusion welding that heats up
Ball, realize that curved surface encapsulated structure is detachable, securely and reliably.
According to technical scheme provided by the invention, the detachable curved surface encapsulated structure of the BGA device, including curved substrate
And BGA device；BGA device is located at the outside of curved substrate extrados, and some diameters are set between BGA device and curved substrate
Different BGA soldered balls, BGA soldered balls weld with BGA device, curved substrate respectively.
The BGA soldered balls are used with BGA device, curved substrate and are detachably welded to connect, described to be detachably welded to connect bag
Include being welded to connect for print solder paste.
The curvature of the curved substrate is 0 ° ~ 60 °.
The material of the curved substrate includes LTCC.
The encapsulation of the BGA device includes ceramic package, Plastic Package or silicon pinboard.
BGA device pad is set in the BGA device, curved substrate is provided with substrate pads, BGA soldered balls respectively with BGA
Device bonding pad, substrate pads are welded and fixed.
BGA soldered balls between BGA device and curved substrate are symmetrical on the top center line of curved substrate.
Advantages of the present invention：
1st, can be solved using the BGA soldered balls of different-diameter because the difference in height of different soldered ball positions leads to not asking for attachment
Topic.
2nd, the substrate pads of different-diameter are designed in the diverse location of curved substrate, realizes that the reliable of different-diameter soldered ball connects
Connect.
3rd, when system breaks down, component or substrate are if desired changed, can be realized by being warming up to melt solder balls
Encapsulating structure is dismantled and convenient replacement.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
Description of reference numerals：1- curved substrates, 2- substrate pads, 3-BGA soldered balls, 4-BGA pads and 5-BGA devices.
Embodiment
With reference to specific drawings and examples, the invention will be further described.
As shown in Figure 1：In order to solve the problem that can not be mounted due to the difference in height of different soldered ball positions, the present invention includes
Curved substrate 1 and BGA device 5；BGA device 5 is located at the outside of the extrados of curved substrate 1, between BGA device 5 and curved substrate 1
The BGA soldered balls 3 that some diameters are different are set, and BGA soldered balls 3 weld with BGA device 5, curved substrate 1 respectively.
Specifically, the material of the curved substrate 1 includes LTCC, the curvature of the curved substrate 1 for 0 ° ~
60 °, the technological means that curved substrate 1 can use the art to commonly use is prepared, and specific curved substrate 1 can basis
Need to be prepared, here is omitted.BGA device 5 is located at the outside of the extrados of curved substrate 1, the envelope of the BGA device 5
Dress includes ceramic package, Plastic Package or silicon pinboard.
The BGA soldered balls 3 of some different-diameters are set between BGA device 5 and curved substrate 1, it is corresponding bent according to diverse location
The distance between face substrate 1 and BGA device 5, the BGA soldered balls 3 of selection matching diameter are that is, suitable using the BGA soldered balls 3 of different-diameter
With the distance between BGA device 5 and curved substrate 1, cause so as to effectively solve the difference in height of the different positions of BGA soldered balls 3
The problem of can not mounting.After BGA soldered balls 3 are between BGA device 5 and curved substrate 1, BGA soldered balls 3 simultaneously with BGA device 5 with
And curved substrate 1 welds, between BGA device 5 and curved substrate 1 by a large amount of BGA soldered balls 3 connect after, can realize BGA device 5 with
Interconnection between curved substrate 1.
When it is implemented, top center line pair of the BGA soldered balls 3 on curved substrate 1 between BGA device 5 and curved substrate 1
Claim.Usually, the diameter positioned at the BGA soldered balls 3 of the top midline position of curved substrate 1 is small, outside from the top center line of curved substrate 1
Direction on, the diameter of BGA soldered balls 3 becomes larger, to adapt to the distance between BGA device 5 and curved substrate 1.
Further, the BGA soldered balls 3 are used with BGA device 5, curved substrate 1 and are detachably welded to connect, described removable
Unload and be welded to connect being welded to connect including print solder paste.
In the embodiment of the present invention, BGA device pad 4 is set, and curved substrate 1 is provided with substrate pads in the BGA device 5
2, BGA soldered balls 3 are welded and fixed with BGA device pad 4, substrate pads 2 respectively.BGA soldered balls 3 weld with BGA device pad 4, substrate
Disk 2 is using being removably welded to connect, and BGA device pad 4 is located in BGA device 5, and substrate pads 2 are located at curved substrate 1
On.Usually, as the diameter of BGA soldered balls 3 becomes big, BGA device pad 4, also mutually strain is big for the size of substrate pads 2, with full
Effective connection between foot and BGA soldered balls 3.
The encapsulating structure of said structure, can be prepared by following processing steps, specifically, preparation process include with
Lower step：
1）, the curved substrate 1 according to corresponding to diverse location arrive the height of BGA device 5, select the BGA soldered balls 3 of suitable diameter；
2）, according to the diameter of diverse location BGA soldered balls 3, separately design correspondence position curved substrate 1,5 corresponding base of BGA device
Plate pad 2, BGA device pad 4.
3）, ball technique planted but by the way of being not limited to using printing, the BGA soldered balls 3 of different-diameter are positioned over BGA device 5
Different-diameter BGA pads 4 on, place reflow ovens in flow back, complete welding.
4）, using print solder paste but by the way of being not limited to, the installing zone that BGA device 5 is placed on to curved substrate 1 positions,
Place in reflow ovens and flow back, complete welding.The final interconnection for realizing bga device 5 and curved substrate 1.
5）If, the encapsulating structure of gained break down, be suitably warming up to BGA device 5 and curved substrate 1 after melt solder balls
Separation, then substrate pads 2 are surface-treated, re-assembly realization encapsulation restructural.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (7)
1. a kind of detachable curved surface encapsulated structure of BGA device, including curved substrate（1）And BGA device（5）；It is characterized in that：
BGA device（5）Positioned at curved substrate（1）The outside of extrados, BGA device（5）With curved substrate（1）Between some diameters are set not
Same BGA soldered balls（3）, BGA soldered balls（3）Respectively with BGA device（5）, curved substrate（1）Welding.
2. the detachable curved surface encapsulated structure of BGA device according to claim 1, it is characterized in that：The BGA soldered balls（3）
With BGA device（5）, curved substrate（1）It is described to be detachably welded to connect the weldering including print solder paste using being detachably welded to connect
Connect in succession.
3. the detachable curved surface encapsulated structure of BGA device according to claim 1 or 2, it is characterized in that：The curved substrate
（1）Curvature be 0 ° ~ 60 °.
4. the detachable curved surface encapsulated structure of BGA device according to claim 1 or 2, it is characterized in that：The curved substrate
（1）Material include LTCC.
5. the detachable curved surface encapsulated structure of BGA device according to claim 1 or 2, it is characterized in that：The BGA device
（5）Encapsulation include ceramic package, Plastic Package or silicon pinboard.
6. the detachable curved surface encapsulated structure of BGA device according to claim 1 or 2, it is characterized in that：The BGA device
（5）Upper setting BGA device pad（4）, curved substrate（1）It is provided with substrate pads（2）, BGA soldered balls（3）Respectively with BGA device
Pad（4）, substrate pads（2）It is welded and fixed.
7. the detachable curved surface encapsulated structure of BGA device according to claim 1 or 2, it is characterized in that：BGA device（5）With
Curved substrate（1）Between BGA soldered balls（3）On curved substrate（1）Top center line it is symmetrical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710831180.1A CN107591383A (en) | 2017-09-15 | 2017-09-15 | The detachable curved surface encapsulated structure of BGA device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710831180.1A CN107591383A (en) | 2017-09-15 | 2017-09-15 | The detachable curved surface encapsulated structure of BGA device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107591383A true CN107591383A (en) | 2018-01-16 |
Family
ID=61052077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710831180.1A Pending CN107591383A (en) | 2017-09-15 | 2017-09-15 | The detachable curved surface encapsulated structure of BGA device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107591383A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113079631A (en) * | 2021-03-23 | 2021-07-06 | 浙江集迈科微电子有限公司 | Surface chip mounting stress buffering structure and process |
| CN113161243A (en) * | 2021-04-15 | 2021-07-23 | 浙江集迈科微电子有限公司 | Surface chip mounting process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200210A1 (en) * | 2006-02-28 | 2007-08-30 | Broadcom Corporation | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages |
| CN102456660A (en) * | 2010-10-14 | 2012-05-16 | 三星电子株式会社 | Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package |
| CN104377181A (en) * | 2013-08-15 | 2015-02-25 | 日月光半导体制造股份有限公司 | Semiconductor packaging part and manufacturing method thereof |
-
2017
- 2017-09-15 CN CN201710831180.1A patent/CN107591383A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070200210A1 (en) * | 2006-02-28 | 2007-08-30 | Broadcom Corporation | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages |
| CN102456660A (en) * | 2010-10-14 | 2012-05-16 | 三星电子株式会社 | Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package |
| CN104377181A (en) * | 2013-08-15 | 2015-02-25 | 日月光半导体制造股份有限公司 | Semiconductor packaging part and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113079631A (en) * | 2021-03-23 | 2021-07-06 | 浙江集迈科微电子有限公司 | Surface chip mounting stress buffering structure and process |
| CN113161243A (en) * | 2021-04-15 | 2021-07-23 | 浙江集迈科微电子有限公司 | Surface chip mounting process |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180116 |
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| RJ01 | Rejection of invention patent application after publication |