CN113161243A - Surface chip mounting process - Google Patents
Surface chip mounting process Download PDFInfo
- Publication number
- CN113161243A CN113161243A CN202110403765.XA CN202110403765A CN113161243A CN 113161243 A CN113161243 A CN 113161243A CN 202110403765 A CN202110403765 A CN 202110403765A CN 113161243 A CN113161243 A CN 113161243A
- Authority
- CN
- China
- Prior art keywords
- flexible film
- wafer
- chip
- solder balls
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 47
- 238000005476 soldering Methods 0.000 claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000002955 isolation Methods 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 230000004907 flux Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/111—Manufacture and pre-treatment of the bump connector preform
- H01L2224/1111—Shaping
Abstract
The invention provides a surface chip mounting process, which comprises the following steps: step S1, providing a wafer, preparing a first bonding pad on the surface of the wafer, implanting solder balls with the same height into the first bonding pad on the surface of the wafer, welding to obtain a wafer with the surface implanted with the solder balls, and then cutting the wafer to obtain a chip with the solder balls with the same height; step S2, providing a flexible film, manufacturing a second pad on the surface of the flexible film, and arranging an isolation layer between the second pad and the flexible film; step S3, a chip with solder balls is attached to the surface of the flexible film in a surface mounting mode, the solder balls on the chip are welded with a second bonding pad on the surface of the flexible film through reflow soldering, and the flexible film is combined with a mold in the reflow soldering process to obtain the solder ball distribution with the same surface appearance as the mold; and step S4, separating the solder ball with the second pad from the flexible film to obtain a chip with the height of the solder ball on the surface matched with the curved surface of the base. The invention reduces the problem of desoldering.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a surface chip mounting process.
Background
Planar die attach technology, which enables a die with BGA solder balls to be interconnected to a substrate (e.g., a PCB or a substrate) having pads on a surface thereof, requires that the BGA solder balls be planar within a single plane, has a small height difference, and also requires that the pads of the substrate be planar within a single plane.
However, with the application of special areas, especially the great popularization of artificial wearable products, more and more electronic modules are converted from a plane to a curved surface, which requires that the chip soldering technology is converted from a plane to a curved surface, especially when the base is a curved surface before soldering, only a part of the flat BGA solder balls on the surface of the planar chip can be soldered on the soldering pad, and other areas can be detached due to insufficient distance.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a surface chip mounting process, which can obtain a chip with the height of a surface solder ball matched with the curved surface of a base. In order to realize the technical purpose, the invention adopts the technical scheme that:
the embodiment of the invention provides a surface chip mounting process, which comprises the following steps:
step S1, providing a wafer, preparing a first bonding pad on the surface of the wafer, implanting solder balls with the same height into the first bonding pad on the surface of the wafer, welding to obtain a wafer with the surface implanted with the solder balls, and then cutting the wafer to obtain a chip with the solder balls with the same height;
step S2, providing a flexible film, manufacturing a second pad on the surface of the flexible film, and arranging an isolation layer between the second pad and the flexible film;
step S3, a chip with solder balls is attached to the surface of the flexible film in a surface mounting mode, the solder balls on the chip are welded with a second bonding pad on the surface of the flexible film through reflow soldering, and the flexible film is combined with a mold in the reflow soldering process to obtain the solder ball distribution with the same surface appearance as the mold;
and step S4, separating the solder ball with the second pad from the flexible film to obtain a chip with the height of the solder ball on the surface matched with the curved surface of the base.
Further, in step S1, before the solder balls are implanted into the first pads on the surface of the wafer, flux is sprayed.
Further, the soldering in step S1 employs reflow soldering.
Further, the flexible film is deformed by the jig during the reflow process of step S3.
Further, in step S4, the second pads are separated from the flexible film by UV light or heat.
The invention has the advantages that: the invention uses an intermediate film to apply stress to the BGA solder ball at a relatively low temperature, so that the solder ball is deformed after being melted to form a welding plane consistent with the curved surface of the base; therefore, when the chip is welded, the BGA solder balls can be in contact with the curved-surface bonding pads of the base of the electronic product, and the problem of desoldering is reduced.
Drawings
FIG. 1 is a schematic view illustrating a wafer and a flexible film welded together according to an embodiment of the present invention.
Fig. 2 is a schematic diagram illustrating deformation of a flexible film passing jig according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of solder ball distribution with the same surface topography as the mold in an embodiment of the present invention.
Fig. 4 is a schematic view illustrating a chip and a base curved surface welding in an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Moreover, repeated reference numerals or designations may be used in various embodiments. These iterations are merely for simplicity and clarity of describing the present invention, and are not intended to represent any correlation between the various embodiments and/or structures discussed.
Reference numerals in the various embodiments of the invention with respect to steps are merely for convenience of description and are not necessarily associated in a substantially sequential manner. Different steps in each embodiment can be combined in different sequences, so that the purpose of the invention is achieved.
The embodiment of the invention provides a surface chip mounting process, which comprises the following steps:
step S1, providing a wafer 1, preparing a first bonding pad 101 on the surface of the wafer 1, implanting solder balls 2 with the same height on the first bonding pad 101 on the surface of the wafer 1, welding to obtain a wafer with the surface implanted with the balls, and then cutting the wafer 1 to obtain a chip with the solder balls 2 with the same height; in particular, the amount of the solvent to be used,
as shown in fig. 1, a wafer 1 is provided, and a first pad 101 is prepared on a surface of the wafer 1; then, spraying soldering flux on the surface of the wafer 1, and planting solder balls 2 with the same height on the first bonding pads 101 on the surface of the wafer 1; the diameter range of the solder ball 2 is 100 mu m-1 mm;
then reflow soldering is carried out to enable the solder balls 2 to be connected with the first bonding pads 101 on the surface of the wafer 1; removing the soldering flux to obtain a wafer 1 with the surface thereof being provided with balls, and then cutting the wafer 1 to obtain a chip with the same height of the solder balls;
step S2, providing a flexible film 3, manufacturing a second pad 301 on the surface of the flexible film 3, and forming an isolation layer between the second pad 301 and the flexible film 3; so that the second pads 301 can be detached from the flexible film 3 by means of UV light or heat;
as shown in particular in fig. 1;
step S3, a chip with solder balls 2 is attached to the surface of the flexible film 3 in a surface mounting mode, the solder balls 2 on the chip are welded with the second bonding pads 301 on the surface of the flexible film 3 through reflow soldering, and meanwhile, the flexible film 3 is combined with a mold in the reflow soldering process to obtain the distribution of the solder balls 2 with the same appearance as the surface of the mold;
specifically, as shown in fig. 2, soldering flux is sprayed on the surface of a chip, the chip with solder balls 2 is attached to the surface of a flexible film 3 in a surface mounting manner, then reflow soldering is carried out, and the flexible film 3 is deformed by a jig 4 in the reflow soldering process to obtain the distribution of the solder balls 2 with the same appearance as the surface of a die;
the surface appearance of the mould is the same as that of the base 5;
step S4, separating the solder ball 2 with the second pad 301 from the flexible film 3 to obtain a chip with the height of the solder ball on the surface matched with the curved surface of the base 5;
specifically, as shown in fig. 3, the second pad 301 may be separated from the flexible film 3 by means of UV light or heat;
finally, when the chip is used, as shown in fig. 4, the second bonding pad 301 on the solder ball 2 of the chip can be bonded to the third bonding pad 501 on the curved surface of the base 5 of the electronic product.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (5)
1. A surface chip mounting process is characterized by comprising the following steps:
step S1, providing a wafer (1), preparing a first bonding pad (101) on the surface of the wafer (1), implanting solder balls (2) with the same height into the first bonding pad (101) on the surface of the wafer (1), welding to obtain the wafer with the surface implanted with the balls, and then cutting the wafer (1) to obtain a chip with the solder balls (2) with the same height;
step S2, providing a flexible film (3), manufacturing a second bonding pad (301) on the surface of the flexible film (3), and arranging an isolation layer between the second bonding pad (301) and the flexible film (3);
step S3, a chip with solder balls (2) is attached to the surface of the flexible film (3) in a surface mounting mode, the solder balls (2) on the chip are welded with the second bonding pads (301) on the surface of the flexible film (3) through reflow soldering, and the flexible film (3) is combined with a mold in the reflow soldering process to obtain the distribution of the solder balls (2) with the same surface appearance as the mold;
and step S4, separating the solder ball (2) with the second bonding pad (301) from the flexible film (3) to obtain a chip with the height of the solder ball on the surface matched with the curved surface of the base (5).
2. The surface chip mounting process according to claim 1,
in step S1, before the solder balls (2) are implanted into the first pads (101) on the surface of the wafer (1), flux is sprayed.
3. The surface die attach process according to claim 1 or 2,
the soldering in step S1 employs reflow soldering.
4. The surface die attach process according to claim 1, 2 or 3,
and deforming the flexible film (3) through the jig (4) in the reflow soldering process of the step S3.
5. The surface die attach process according to claim 1, 2 or 3,
step S4 is to separate the second pad (301) from the flexible film (3) by means of UV light or heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110403765.XA CN113161243A (en) | 2021-04-15 | 2021-04-15 | Surface chip mounting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110403765.XA CN113161243A (en) | 2021-04-15 | 2021-04-15 | Surface chip mounting process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113161243A true CN113161243A (en) | 2021-07-23 |
Family
ID=76890719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110403765.XA Pending CN113161243A (en) | 2021-04-15 | 2021-04-15 | Surface chip mounting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113161243A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020155637A1 (en) * | 2001-04-20 | 2002-10-24 | Shih-Chang Lee | Flip chip interconnected structure and a fabrication method thereof |
| JP2005340393A (en) * | 2004-05-25 | 2005-12-08 | Olympus Corp | Small-sized mount module and manufacturing method thereof |
| JP2012119387A (en) * | 2010-11-29 | 2012-06-21 | Fujikura Ltd | Semiconductor device, method of manufacturing the same, and electronic device |
| US20120309187A1 (en) * | 2011-05-30 | 2012-12-06 | International Business Machines Corporation | Conformal Coining of Solder Joints in Electronic Packages |
| CN107591383A (en) * | 2017-09-15 | 2018-01-16 | 中国电子科技集团公司第五十八研究所 | The detachable curved surface encapsulated structure of BGA device |
-
2021
- 2021-04-15 CN CN202110403765.XA patent/CN113161243A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020155637A1 (en) * | 2001-04-20 | 2002-10-24 | Shih-Chang Lee | Flip chip interconnected structure and a fabrication method thereof |
| JP2005340393A (en) * | 2004-05-25 | 2005-12-08 | Olympus Corp | Small-sized mount module and manufacturing method thereof |
| JP2012119387A (en) * | 2010-11-29 | 2012-06-21 | Fujikura Ltd | Semiconductor device, method of manufacturing the same, and electronic device |
| US20120309187A1 (en) * | 2011-05-30 | 2012-12-06 | International Business Machines Corporation | Conformal Coining of Solder Joints in Electronic Packages |
| CN107591383A (en) * | 2017-09-15 | 2018-01-16 | 中国电子科技集团公司第五十八研究所 | The detachable curved surface encapsulated structure of BGA device |
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