CN113973433B - Built-in circuit board and manufacturing method thereof - Google Patents
Built-in circuit board and manufacturing method thereof Download PDFInfo
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- CN113973433B CN113973433B CN202010724673.7A CN202010724673A CN113973433B CN 113973433 B CN113973433 B CN 113973433B CN 202010724673 A CN202010724673 A CN 202010724673A CN 113973433 B CN113973433 B CN 113973433B
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- substrate
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- light
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
Abstract
The application provides an embedded circuit board, comprising: the first circuit layer comprises a first base material and a first conductive circuit, wherein the first base material comprises a first surface, and the first conductive circuit is arranged on the first surface; the second circuit layer comprises a second substrate, the absorptivity of the first substrate and the second substrate for light are different, an embedded groove penetrating through the second substrate is formed on the second substrate, and the first surface is exposed by the embedded groove; the embedded element is arranged in the embedded groove; the first conductive trace includes a heat dissipating unit, at least a portion of which extends to the buried groove and contacts the buried element. The application also provides a manufacturing method of the embedded circuit board.
Description
Technical Field
The application relates to the technical field of embedded circuit boards, in particular to an embedded circuit board and a manufacturing method thereof.
Background
In recent years, electronic products are widely used in daily work and life, and light, thin, and small electronic products are becoming popular. The circuit board is taken as a main component of the electronic product, occupies a larger space of the electronic product, so that the volume of the electronic product is greatly influenced by the volume of the circuit board, and the large-volume circuit board is difficult to conform to the trend of light, thin, short and small electronic products. The embedded circuit board is mainly used for embedding the electronic components into the circuit board, so that the circuit board module is miniaturized, the connection path between the components is shortened, the transmission loss is reduced, and the embedded circuit board is a technical approach capable of realizing the functions of smaller and lighter portable electronic equipment and higher performance.
In order to form an embedded groove for accommodating an embedded element, the substrate layer is generally isolated from the copper layer by using a peelable adhesive in the industry, then the substrate is removed by etching, and then the peelable adhesive is removed by uncapping; however, in the method, residual glue remains on the surface of the copper layer after the strippable glue is stripped, so that the electrical connection between the copper layer and the embedded element is invalid or the heat conduction efficiency is reduced, the circuit board surface is easily scratched in the process of uncovering, and the method has a complex flow. The embedded groove can be formed in the industry by a method for forming the fishing groove, the method is simple in flow, low in cost and low in accuracy controllability, the depth of the formed embedded groove is not easy to control, and a substrate or a conductive circuit is extremely easy to damage in the manufacturing process.
How to solve the above problems is considered by those skilled in the art.
Disclosure of Invention
In view of the above, the present application provides an embedded circuit board, comprising:
the first circuit layer comprises a first base material and a first conductive circuit, wherein the first base material comprises a first surface, and the first conductive circuit is arranged on the first surface;
the second circuit layer comprises a second substrate, the absorptivity of the first substrate and the second substrate for light are different, an embedded groove penetrating through the second substrate is formed on the second substrate, and the first surface is exposed by the embedded groove;
the embedded element is arranged in the embedded groove; and
the first conductive trace includes a heat dissipating unit, at least a portion of which extends to the buried groove and contacts the buried element.
In one embodiment, the material of the second substrate comprises glass fibers.
In an embodiment, the second substrate includes a second surface, the second surface is disposed on a side of the second substrate away from the first substrate, the buried groove penetrates through the second surface, the second circuit layer further includes a second conductive circuit, and the second conductive circuit is disposed on the second surface.
In an embodiment, the embedded circuit board further includes a third circuit layer, the third circuit layer includes a third substrate and a third conductive circuit, the third conductive circuit is disposed on a surface of the third substrate, and the first substrate covers at least a portion of the third conductive circuit.
The application also provides a manufacturing method of the embedded circuit board, which comprises the following steps:
providing a first double-sided board, wherein the first double-sided board comprises a third base material and a third conductive circuit formed on the surface of the third base material;
forming a first substrate and a first conductive material layer on one surface of the first double-sided board through pressing, wherein the first substrate comprises a first surface, the first surface is arranged on one side, far away from the third substrate, of the first substrate, and the first conductive material layer is arranged on the first surface;
etching the first conductive material layer to obtain a first conductive circuit, wherein the first conductive circuit comprises a heat dissipation unit;
forming a second substrate on one side of the first conductive circuit far away from the first substrate through pressing, wherein the first conductive circuit and the part of the first surface not covered by the first conductive circuit are different in absorptivity of light rays; and
forming an embedded groove on the second substrate by using a laser etching mode, wherein the embedded groove penetrates through the second substrate, and the embedded groove exposes at least part of the first surface and the heat dissipation unit.
In one embodiment, the light used for laser bulk etching is excited by a carbon dioxide laser emitter.
In one embodiment, the light excited by the carbon dioxide laser emitter does not etch the first substrate and the light excited by the carbon dioxide laser emitter etches the second substrate.
In one embodiment, the material of the second substrate comprises glass fibers.
In an embodiment, when a second substrate is formed on a side of the first conductive circuit away from the first substrate by pressing, a second conductive material layer is disposed on a side of the second substrate away from the first substrate, and the second conductive material layer is etched to obtain a second conductive circuit.
In one embodiment, the method further comprises the following steps:
providing an embedded element, and arranging the embedded element in the embedded groove to connect the embedded element with the first conductive circuit.
Compared with the prior art, the embedded circuit board and the manufacturing method thereof have the advantages that the first base material and the second base material with different light absorbances are arranged, and then the embedded groove is formed in a laser etching mode, so that accurate etching of the embedded groove can be realized, the first conductive circuit arranged on the surface of the first base material is not damaged, or residual glue is left on the surface of the first conductive circuit.
Drawings
Fig. 1 is a schematic partial cross-sectional view of an embedded circuit board according to an embodiment of the application.
Fig. 2 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 3 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 4 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 5 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 6 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 7 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 8 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Fig. 9 is a schematic diagram of a manufacturing process of an embedded circuit board according to an embodiment of the application.
Description of the main reference signs
Built-in circuit board 1
First circuit layer 11
First substrate 111
First conductive line 112
Radiating unit 115
First surface 119
Second circuit layer 12
Second substrate 121
Second conductive line 122
Second surface 129
Third circuit layer 13
Third substrate 131
Third conductive line 132
Fourth line layer 14
Fourth substrate 141
Fourth conductive line 142
Embedded element 15
Buried groove 16
First double-sided board 20
First conductive material layer 21
Second conductive material layer 22
Third conductive material layer 23
Fourth conductive material layer 24
The application will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description will make reference to the accompanying drawings to more fully describe the application. Exemplary embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. Like reference numerals designate identical or similar components.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, as used herein, "comprises" and/or "comprising" or "includes" and/or "including" or "having" and/or "has", integers, steps, operations, elements, and/or components, but does not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Furthermore, unless the context clearly defines otherwise, terms such as those defined in a general dictionary should be construed to have meanings consistent with their meanings in the relevant art and the present disclosure, and should not be construed as idealized or overly formal meanings.
The following description of exemplary embodiments will be provided with reference to the accompanying drawings. It is noted that the components depicted in the referenced figures are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar technical terms.
The following describes in further detail the embodiments of the present application with reference to the accompanying drawings.
As shown in fig. 1, the present application provides a buried circuit board 1, which includes a first circuit layer 11, a second circuit layer 12, a third circuit layer 13, and a buried element 15. The first circuit layer 11 is disposed on the side of the third circuit layer 13, the second circuit layer 12 is disposed on the side of the first circuit layer 11 away from the third circuit layer 13, the second circuit layer 12 is provided with an embedded groove 16, the embedded groove 120 penetrates through the second circuit layer 12 to expose at least a portion of the surface of the first circuit layer 11, and the embedded element 15 is disposed in the embedded groove 16.
The third circuit layer 13 includes a third substrate 131 and a third conductive circuit 132, and the third conductive circuit 132 is disposed on the surface of the third substrate 131. In an embodiment, the third circuit layer 13 may be a double-sided board, and the third conductive circuit 132 includes two layers of conductive circuits respectively disposed on two opposite surfaces of the third substrate 131.
In an embodiment, the embedded circuit board 1 may further include a fourth circuit layer 14, and the fourth circuit layer 14 is disposed on a side of the third circuit layer 13 away from the first circuit layer 11. In the present embodiment, the fourth circuit layer 14 is a single-layer circuit structure, that is, the fourth circuit layer 14 includes a fourth substrate 141 and a fourth conductive circuit 142 disposed on a surface of the fourth substrate 141 away from the first circuit layer 11. In other embodiments, the fourth circuit layer 14 may be a multi-layer circuit stack, i.e., the fourth circuit layer 14 includes a plurality of layers of stacked substrates and conductive traces.
The first circuit layer 11 includes a first substrate 111 and a first conductive circuit 112, the first substrate 111 includes a first surface 119, and the first conductive circuit 112 is disposed on the first surface 119. The first circuit layer 11 is disposed on one side of the third circuit layer 13 and covers at least one surface of the third circuit layer 13, and the first substrate 111 covers at least a portion of the third conductive circuit 132, specifically may be the third conductive circuit 132 disposed on one surface of the third substrate 131.
The second circuit layer 12 includes a second substrate 121 and a second conductive circuit 122, the second substrate 121 includes a second surface 129, the second surface 129 is disposed on a side of the second substrate 121 away from the first substrate 111, and the second conductive circuit 122 is disposed on the second surface 129.
In an embodiment, the embedded circuit board 1 further includes a plurality of conductive pillars 19, and the plurality of conductive pillars 19 are disposed in the first substrate 111, the second substrate 121, the third substrate 131 and the fourth substrate 141, respectively, and the first conductive trace 112, the second conductive trace 122, the third conductive trace 132 and the fourth conductive trace 142 can be electrically connected through the conductive pillars 19. In one embodiment, the conductive posts 19 may be plated conductive holes or through holes filled with conductive paste.
The second substrate 121 has an embedded groove 16 formed therein and extending through the second substrate 121, the embedded groove 16 extending through the second surface 129, and the embedded groove 16 exposing at least a portion of the first surface 119.
The absorptivity of the first substrate 111 and the second substrate 121 to light is different, specifically, the absorptivity of the first substrate 111 and the second substrate 121 to light excited by the carbon dioxide laser generator is different, the second substrate 121 can be etched by the light excited by the carbon dioxide laser generator, and the first substrate 111 cannot be etched by the light excited by the carbon dioxide laser generator. In one embodiment, the material of the second substrate 121 may include glass fibers.
In one embodiment, the first conductive line 112 includes a heat dissipating unit 115, at least a portion of the heat dissipating unit 115 extends to the embedded groove 16, a portion of the heat dissipating unit 115 is covered by the second substrate 121, and another portion is exposed by the embedded groove 16. In other embodiments, the heat dissipation unit 115 may be replaced with a terminal for transmitting an electrical signal.
The embedded element 15 is disposed in the embedded groove 16, the embedded element 15 is connected with the heat dissipation unit 115, and the embedded element 15 is connected with the first conductive line 112; in one embodiment, the embedded component 15 is in physical contact with the heat dissipation unit 115 to dissipate heat, and when the heat dissipation unit 115 is replaced with a terminal for transmitting an electrical signal, the embedded component 15 can be electrically connected with the structure. In one embodiment, the embedded device 15 may be an active device or a passive device such as a resistor, a capacitor, or an inductor.
In one embodiment, the embedded circuit board 1 may further include a solder mask or a passivation layer disposed at the outermost side for protecting the embedded circuit board 1.
As shown in fig. 2 to 9, the method for manufacturing the embedded circuit board 1 provided by the application comprises the following steps:
step S1: a first double-sided board 20 is provided, and the first double-sided board 20 includes a third substrate 131 and a third conductive circuit 132 formed on a surface of the third substrate 131.
Step S11: as shown in fig. 2, a first double-sided board 20, a third substrate 131 of the first double-sided board 20, and third conductive material layers 23 disposed on two opposite surfaces of the third substrate 131 are provided.
In one embodiment, the first dual-sided board 20 may be a dual-sided copper-clad substrate.
Step S12: as shown in fig. 3, the third conductive material layer 23 is etched to form a third conductive line 132, so as to obtain a third line layer 13.
In an embodiment, the third conductive material layer 23 may be etched by photolithography, and the third conductive material layer 23 disposed on both sides of the third substrate 131 may be etched in the same etching process or may be etched in different etching processes.
Step S2: as shown in fig. 4, a first substrate 111 and a first conductive material layer 21 are formed on a surface of the first double-sided board 20 by pressing, where the first substrate 111 includes a first surface 119, the first surface 119 is disposed on a side of the first substrate 111 away from the third substrate 131, and the first conductive material layer 21 is disposed on the first surface 119.
Step S3: as shown in fig. 5, the first conductive material layer 21 is etched to obtain a first conductive circuit 112, and the first conductive circuit 112 includes a heat dissipation unit 115.
In an embodiment, a plurality of conductive pillars 19 are formed, the first conductive traces 112 are electrically connected to the third conductive traces 132 through the conductive pillars 19, and the third conductive traces 132 distributed on different surfaces can also be electrically connected through the conductive pillars.
In one embodiment, the plurality of conductive pillars 19 may be formed by punching plating, or may be formed by punching a conductive paste.
Step S4: as shown in fig. 6, a second substrate 121 is formed on a side of the first conductive trace 112 away from the first substrate 111 by pressing, where the first conductive trace 112 and the first surface 119 are not covered by the first conductive trace 112, and the absorptivity of the first substrate 111 and the second substrate 121 for light is different.
In an embodiment, when the second substrate 121 is formed on the side of the first conductive trace 112 away from the first substrate 111 by pressing, a second conductive material layer 22 is disposed on the side of the second substrate 121 away from the first substrate 111, and the second conductive material layer 22 is etched to obtain a second conductive trace 122.
In an embodiment, a fourth substrate 141 and the fourth conductive material layer 24 may be further pressed on a side of the third substrate 131 away from the first substrate 111.
Step S5: as shown in fig. 7, a buried trench 16 is formed on the second substrate 121 by using a laser etching method, the buried trench 16 penetrates through the second substrate 121, and the buried trench 16 exposes at least a portion of the first surface 119 and the heat dissipation unit 115.
In one embodiment, the light used for laser bulk etching is excited by a carbon dioxide laser emitter.
In one embodiment, the light excited by the carbon dioxide laser emitters does not etch the first substrate 111, and the light excited by the carbon dioxide laser emitters etches the second substrate 121.
In one embodiment, the material of the second substrate 121 includes glass fibers.
By providing the first substrate 111 and the second substrate 121 with different light absorptivity, the first substrate 111 is not etched by the light emitted by the laser emitter or the absorptivity of the first substrate 111 to the etching light is kept at an extremely low level, so that the etching caused by the etching light to the first substrate 111 is kept at an extremely low level, and meanwhile, the absorptivity of the second substrate 121 to the etching light is higher, and the second substrate 121 is easier to be etched. That is, when etching is performed using a laser emitter (e.g., a carbon dioxide laser emitter), buried trench 16 can be formed on second substrate 121 with precise control, but the etching process does not damage first conductive trace 112 and first substrate 111.
Step S6: as shown in fig. 8, a plurality of conductive pillars 19 are formed, such that the first conductive trace 112 and the second conductive trace 122 are electrically connected through the conductive pillars 19, and the third conductive trace 132 and the fourth conductive trace 142 are electrically connected through the conductive pillars 19.
Step S7: as shown in fig. 9, an embedded component 15 is provided, and the embedded component 15 is disposed in the embedded groove 16, so that the embedded component 15 is connected with the first conductive line 112.
Hereinabove, the specific embodiments of the present application are described with reference to the accompanying drawings. However, those of ordinary skill in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the application without departing from the spirit and scope thereof. Such modifications and substitutions are intended to be included within the scope of the present application.
Claims (10)
1. An embedded circuit board, comprising:
the first circuit layer comprises a first base material and a first conductive circuit, wherein the first base material comprises a first surface, and the first conductive circuit is arranged on the first surface;
the second circuit layer comprises a second substrate, the absorptivity of the first substrate and the second substrate for light are different, so that the second substrate can be etched by light excited by the laser generator, and the first substrate cannot be etched by the light excited by the laser generator, or the absorptivity of the first substrate for etching light is kept at an extremely low level, so that the etching caused by the etching light for the first substrate is kept at an extremely low level, the absorptivity of the second substrate for etching light is higher, and an embedded groove penetrating through the second substrate is formed on the second substrate, and the embedded groove exposes the first surface;
the embedded element is arranged in the embedded groove; and
the first conductive trace includes a heat dissipating unit, at least a portion of which extends to the buried groove and contacts the buried element.
2. The embedded circuit board of claim 1, wherein the material of the second substrate comprises fiberglass.
3. The embedded circuit board of claim 1, wherein the second substrate comprises a second surface, the second surface is disposed on a side of the second substrate away from the first substrate, the embedded groove penetrates through the second surface, the second circuit layer further comprises a second conductive circuit, and the second conductive circuit is disposed on the second surface.
4. The embedded circuit board of claim 1, further comprising a third circuit layer, the third circuit layer comprising a third substrate and a third conductive trace, the third conductive trace disposed on a surface of the third substrate, the first substrate covering at least a portion of the third conductive trace.
5. The manufacturing method of the embedded circuit board is characterized by comprising the following steps:
providing a first double-sided board, wherein the first double-sided board comprises a third base material and a third conductive circuit formed on the surface of the third base material;
forming a first substrate and a first conductive material layer on one surface of the first double-sided board through pressing, wherein the first substrate comprises a first surface, the first surface is arranged on one side, far away from the third substrate, of the first substrate, and the first conductive material layer is arranged on the first surface;
etching the first conductive material layer to obtain a first conductive circuit, wherein the first conductive circuit comprises a heat dissipation unit;
forming a second substrate on one side of the first conductive circuit far away from the first substrate by pressing, wherein the first conductive circuit and the part of the first surface not covered by the first conductive circuit are different in light absorptivity, so that the second substrate can be etched by light excited by the laser generator and the first substrate cannot be etched by light excited by the laser generator, or the light absorptivity of the first substrate to the etching light is kept at an extremely low level, so that etching caused by the etching light to the first substrate is kept at an extremely low level, and the light absorptivity of the second substrate to the etching light is higher; and
forming an embedded groove on the second substrate by using a laser etching mode, wherein the embedded groove penetrates through the second substrate, and the embedded groove exposes at least part of the first surface and the heat dissipation unit.
6. The method of claim 5, wherein the light used for etching the laser body is excited by a carbon dioxide laser emitter.
7. The method of claim 6, wherein the light emitted by the carbon dioxide laser does not etch the first substrate and the light emitted by the carbon dioxide laser etches the second substrate.
8. The method of claim 7, wherein the material of the second substrate comprises fiberglass.
9. The method of claim 5, wherein when a second substrate is formed on a side of the first conductive trace away from the first substrate by pressing, a second conductive material layer is disposed on a side of the second substrate away from the first substrate, and the second conductive material layer is etched to obtain a second conductive trace.
10. The method of manufacturing a buried wiring board according to claim 5, further comprising the steps of:
providing an embedded element, and arranging the embedded element in the embedded groove to connect the embedded element with the first conductive circuit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010724673.7A CN113973433B (en) | 2020-07-24 | 2020-07-24 | Built-in circuit board and manufacturing method thereof |
| TW109125896A TWI749672B (en) | 2020-07-24 | 2020-07-30 | Embedded circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010724673.7A CN113973433B (en) | 2020-07-24 | 2020-07-24 | Built-in circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113973433A CN113973433A (en) | 2022-01-25 |
| CN113973433B true CN113973433B (en) | 2023-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010724673.7A Active CN113973433B (en) | 2020-07-24 | 2020-07-24 | Built-in circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113973433B (en) |
| TW (1) | TWI749672B (en) |
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| CN103889165A (en) * | 2012-12-22 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | Circuit board with embedded element and manufacturing method thereof |
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| CN109219255A (en) * | 2018-11-14 | 2019-01-15 | 生益电子股份有限公司 | A kind of production method and PCB of non-metallic stepped groove |
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| TWI400998B (en) * | 2010-08-20 | 2013-07-01 | Nan Ya Printed Circuit Board | Printed circuit board and method for fabricating the same |
| TW201424491A (en) * | 2012-12-03 | 2014-06-16 | Unimicron Technology Corp | Wiring board and laser drilling method of the wiring board |
| US9119313B2 (en) * | 2013-04-25 | 2015-08-25 | Intel Corporation | Package substrate with high density interconnect design to capture conductive features on embedded die |
| CN109413836B (en) * | 2017-08-15 | 2021-04-20 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and preparation method thereof |
| TWI686108B (en) * | 2019-02-26 | 2020-02-21 | 嘉聯益科技股份有限公司 | Circuit board module and heat-dissipating board structure thereof |
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2020
- 2020-07-24 CN CN202010724673.7A patent/CN113973433B/en active Active
- 2020-07-30 TW TW109125896A patent/TWI749672B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889165A (en) * | 2012-12-22 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | Circuit board with embedded element and manufacturing method thereof |
| CN104219867A (en) * | 2013-05-31 | 2014-12-17 | 宏启胜精密电子(秦皇岛)有限公司 | A circuit board and a manufacturing method thereof |
| CN109640524A (en) * | 2018-11-02 | 2019-04-16 | 武汉铱科赛科技有限公司 | A kind of laser blind hole ends-opening method |
| CN109219255A (en) * | 2018-11-14 | 2019-01-15 | 生益电子股份有限公司 | A kind of production method and PCB of non-metallic stepped groove |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113973433A (en) | 2022-01-25 |
| TW202205929A (en) | 2022-02-01 |
| TWI749672B (en) | 2021-12-11 |
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