CN208680853U - A kind of positioning component - Google Patents
A kind of positioning component Download PDFInfo
- Publication number
- CN208680853U CN208680853U CN201821270872.XU CN201821270872U CN208680853U CN 208680853 U CN208680853 U CN 208680853U CN 201821270872 U CN201821270872 U CN 201821270872U CN 208680853 U CN208680853 U CN 208680853U
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- CN
- China
- Prior art keywords
- positioning
- mainboard
- briquetting
- chock
- electronic component
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Abstract
The utility model relates to a kind of welding toolings, to solve the problems, such as in the prior art it cannot be guaranteed that the distance between electronic component top surface and mainboard；The utility model provides a kind of positioning component, comprising: positioning chock is arranged between electronic component and mainboard, the bottom surface for positioning chock is abutted with the top surface of mainboard, and at least partly top surface for positioning chock is abutted at least partly bottom surface of electronic component；Briquetting is pressed on the top surface of electronic component.The positioning component of the utility model embodiment has positioning quick accurate, easy to disassemble；The distance between electronic component and mainboard can be controlled using the thickness of positioning chock, simultaneously, under the action of briquetting, electronic component and positioning chock can be stable be positioned on mainboard, so as to guarantee the positioning accuracy between appliance component, positioning chock and mainboard, it can guarantee welding quality when subsequent soldering processes in turn, while be also convenient for flowing water standardized work, greatly improve working efficiency.
Description
Technical field
The utility model relates to a kind of welding tooling more particularly to a kind of positioning components.
Background technique
Air-conditioning mainboard module is when carrying out welding procedure, it is desirable that the height of the top surface of the electronic component after welding keeps one
It causes；As rectifier bridge, insulated gate electrode transistor npn npn (IGBT), diode, intelligent power module (IPM) are welded on mainboard (such as PCB electricity
Road plate) on after, it is desirable that the distance of the top surface of above-mentioned component is identical as the distance between mainboard；
It generallys use in the prior art and welding is positioned manually by electronic component Primary Location on mainboard, to guarantee electronics
Then electronic component is welded on mainboard using selective wave soldering processes by the distance between component top surface and mainboard
On；However, accordingly, there exist certain peaces because of the consistency that not can guarantee electronic component apical side height when manual positioning welding
Full hidden danger.
Utility model content
The utility model provide a kind of structure it is simple, convenient for operation, top surface and the master of electronic component to be welded can be protected
The positioning component of distance between plate.
A kind of positioning component, for electronic component to be located in the welding position of mainboard, the positioning component includes:
Chock is positioned, is arranged between electronic component and the mainboard, the bottom surface of the positioning chock and the mainboard
Top surface abut, it is described positioning chock at least partly top surface abutted at least partly bottom surface of the electronic component；
Briquetting is pressed on the top surface of the electronic component.
As an example, the bottom surface of the briquetting has positioning insertion pin, the positioning insertion pin on the mainboard for determining
Position hole grafting.
As an example, having positioning end face on the positioning insertion pin；
Wherein, with after the mainboard grafting, the positioning end face abuts the positioning insertion pin with the top surface of the mainboard.
As an example, have through-hole on the positioning chock, the positioning insertion pin wear after the through-hole with the mainboard
On location hole grafting.
As an example, the positioning component further includes abutment；
The side of the briquetting is arranged in the abutment, and has extended downwardly section of stretching out, and the section of stretching out is used for and institute
The side for stating positioning chock abuts.
As an example, the abutment is connect with the briquetting using screw.
As an example, the top surface of the briquetting has handhold part.
As an example, the handle cage structure is screw-like, the top of the briquetting has threaded hole, the handle portion rotation
Enter the threaded hole to be spirally connected with the briquetting.
As an example, it is described positioning chock at least partly side have upwardly-extending baffle, the baffle be used for
The side of the briquetting abuts.
As an example, the briquetting is configured to the rectangular block of strip, the material of the briquetting is metal.
The beneficial effect of the utility model embodiment is:
The positioning component of the utility model embodiment has positioning quick accurate, easy to disassemble；Using positioning chock
Thickness controls the distance between electronic component and mainboard so that keep between electronic component top surface and mainboard specifically away from
From；Meanwhile under the action of briquetting, what electronic component and positioning chock can be stable is positioned on mainboard, so as to protect
Welding matter when demonstrate,proving the positioning accuracy between appliance component, positioning chock and mainboard, and then can guarantee subsequent soldering processes
Amount, while it being also convenient for flowing water standardized work, greatly improve working efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the positioning component of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the briquetting of the positioning component of the utility model embodiment；
Fig. 3 is the structural schematic diagram of the embodiment one of the positioning chock of the positioning component of the utility model；
Fig. 4 is the structural schematic diagram of the embodiment two of the positioning chock of the positioning component of the utility model.
Appended drawing reference:
1- positions chock；11- through-hole；12- baffle；2- briquetting；21- positioning insertion pin；3- abutment；The handhold part 4-.
Specific embodiment
In order to make those skilled in the art better understand the technical solution of the utility model, with reference to the accompanying drawings of the specification
The utility model embodiment is described in detail.
As shown in Figure 1, a kind of positioning component provided by the embodiment of the utility model, for electronic component to be located in master
On the welding position of plate (such as PCB circuit board)；Positioning component includes positioning chock 1 and briquetting 2.Chock 1 is positioned to be arranged (to be welded
Connect) between electronic component (not shown) and mainboard (not shown), between electronic component and mainboard
Distance is positioned；Wherein, the bottom surface for positioning chock 1 is abutted with the top surface of mainboard, positions at least partly top surface and the electricity of chock 1
At least partly bottom surface of sub- component abuts.Briquetting 2 is pressed on the top surface of electronic component, to prevent appliance component, determine
Positional shift occurs between position chock 1 and mainboard.
The positioning component of the utility model embodiment has the advantages that positioning is quick accurate, easy to disassemble；Using positioning
The thickness of chock 1 controls the distance between electronic component and mainboard, so as to keep between electronic component top surface and mainboard
Specific distance；Meanwhile under the action of briquetting 2, what electronic component and positioning chock 1 can be stable is positioned on mainboard,
So as to guarantee the positioning accuracy between appliance component, positioning chock 1 and mainboard, and then it can guarantee subsequent soldering processes
When welding quality, while being also convenient for flowing water standardized work, greatly improve working efficiency.
Specifically, as shown in Fig. 2, briquetting 2 is the strip of rectangle in embodiment provided by the utility model；Wherein,
In order to realize that preferable locating effect, briquetting 2 can be made of the higher metal material of quality；In addition, the shape of briquetting 2 is simultaneously
It is not limited only to as strip structure, those skilled in the art the shape to briquetting 2 and material can make corresponding adjust according to actual needs
It is whole.
Further, in order to realize better positioning, the bottom surface of briquetting 2 has positioning insertion pin 21, and positioning insertion pin 21 is used for
With the location hole grafting in mainboard (not shown).When briquetting 2 is pressed on electronic component top surface, the positioning of briquetting 2 is inserted
Location hole grafting on needle 21 and mainboard, so as to prevent briquetting 2 from generating positional shift with respect to mainboard, simultaneously, moreover it is possible to realize pressure
Accurate contraposition between block 2 and mainboard.Further, in order to enable keeping specific distance, this implementation between briquetting 2 and mainboard
There is positioning end face (not shown) in example, on positioning insertion pin 21；Wherein, after positioning insertion pin 21 and mainboard grafting, positioning end
Face is abutted with the top surface of mainboard.Specifically, in the present embodiment, positioning insertion pin 21 has multiple, and multiple positioning insertion pins 21
Structure is all the same.In actual use, the length of positioning insertion pin 21, installation position and quantity can be adjusted accordingly according to the actual situation
It is whole；In addition, positioning insertion pin 21 can be an integral molding structure with briquetting 2 (ontology), it is also possible to again will after the two is separately formed
Positioning insertion pin 21 is fixedly connected on briquetting 2 (ontology)；Wherein positioning insertion pin 21 and the type of attachment of briquetting 2 (ontology) can be
Welding or threaded connection etc., the utility model is not especially limited this.
Further, as shown in Figures 2 to 4, positional shift occurs for positioning chock 1 in order to prevent, mentions in the utility model
In the embodiment of confession, positioning has through-hole 11 on chock 1, and positioning insertion pin 21 is inserted after wearing through-hole 11 with the location hole on mainboard
It connects.Specifically, the diameter of the aperture of through-hole 11 and positioning insertion pin 21 is essentially identical, (diameter of through-hole 11 is slightly larger than positioning insertion pin 21
Diameter), to guarantee more accurate positioning accuracy.Further, position chock 1 on can only be arranged one for position it is slotting
The through-hole 11 that needle 21 is worn, also can be set multiple；The quantity of through-hole 11 and setting position on chock 1 are positioned in practical applications
It can be adjusted accordingly according to actual needs, the utility model is not construed as limiting this.
In order to further enhance positioning component to the positioning accuracy of electronic component, in the present embodiment, positioning component is also wrapped
Include abutment 3；The side of briquetting 2 is arranged in abutment 3, and has extended downwardly section of stretching out, and section of stretching out is used for and positioning chock 1
Side abuts.Wherein, abutment 3 can be abutted with the side of positioning chock 1 and electronic component, to realize to positioning chock
1 and electronic component positioning.Further, for the ease of production, abutment 3 is connect with briquetting 2 using screw.Wherein, it supports
The material of block piece 3 can be the materials such as polyethylene, polypropylene, polyvinyl chloride.
Further, for the ease of briquetting 2 of taking, the top surface of briquetting 2 has handhold part 4；Specifically, in the present embodiment
In, for the ease of production, handle portion is two, and is configured to screw-like, and there is threaded hole (not show in figure at the top of briquetting 2
Out), handle portion screws in threaded hole and is spirally connected with briquetting 2.Further, at least partly side for positioning chock 1, which has, to be upwardly extended
Baffle 12, baffle 12 with the side of briquetting 2 for abutting.Wherein, baffle 12 can not only play certain positioning action, also
Be conducive to take out positioning chock 1；That is, staff can also be dialled by the baffle 12 after completing welding to electronic component
Chock 1 is positioned out.
Further, in practical application in order to promote working efficiency, in the present embodiment, a briquetting 2 can press simultaneously
It is located at the top surface of multiple electronic components, therefore, in embodiment provided by the utility model, the quantity of positioning chock 1 can be
It is multiple, wherein a positioning chock 1 can position an electronic component, can also be simultaneously to multiple electronics member devices
Part is positioned.
As shown in Figures 3 and 4, two different types of positioning chocks 1 are provided in the present embodiment；Specifically, in Fig. 3
Shown positioning chock 1 is for positioning intelligent power module (IPM)；Shown in Fig. 4 positioning chock 1 for pair
Rectifier bridge, insulated gate electrode transistor npn npn (IGBT) and diode are positioned simultaneously.Wherein, the top surface shape for positioning chock 1 can
It is adjusted accordingly according to the shape of different types of electronic component, to realize optimal locating effect.
Specifically, first positioning chock 1 can be placed in mainboard (such as PCB circuit board) and welded accordingly in practical operation
It connects at position, and keeps the through-hole 11 positioned on chock 1 opposite with the location hole on mainboard, then by electronic component to be welded
It is placed on the top of the positioning chock 1, meanwhile, the contact pin of electronic component is inserted on circuit board in corresponding welding hole, is pressed
Pressure electronic component abuts its bottom surface with the top surface of chock, then briquetting 2 is pressed in the top surface of electronic component, meanwhile, it is fixed
Position contact pin 21 pass through positioning chock 1 through-hole 11 after with the location hole grafting on mainboard, under the effect of gravity, electronic component and
Positioning chock 1 is firmly pressed on mainboard, to ensure that the distance between electronic component top surface and circuit board.Later,
Electronic component can be welded on mainboard by welding (such as selective wave soldering) technique.
Obviously, it is practical without departing from this can to carry out various modification and variations to the utility model by those skilled in the art
Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technologies, then the utility model is also intended to include these modifications and variations.
Claims (10)
1. a kind of positioning component, for electronic component to be located in the welding position of mainboard, which is characterized in that the positioning
Component includes:
Chock is positioned, is arranged between electronic component and the mainboard, the bottom surface of the positioning chock and the top of the mainboard
Face abuts, and at least partly top surface of the positioning chock is abutted at least partly bottom surface of the electronic component；
Briquetting is pressed on the top surface of the electronic component.
2. positioning component according to claim 1, which is characterized in that the bottom surface of the briquetting has positioning insertion pin, described
Positioning insertion pin is used for and the location hole grafting on the mainboard.
3. positioning component according to claim 2, which is characterized in that have positioning end face on the positioning insertion pin；
Wherein, with after the mainboard grafting, the positioning end face abuts the positioning insertion pin with the top surface of the mainboard.
4. positioning component according to claim 2, which is characterized in that have through-hole, the positioning on the positioning chock
Contact pin wear after the through-hole with the location hole grafting on the mainboard.
5. positioning component according to claim 1, which is characterized in that the positioning component further includes abutment；
The side of the briquetting is arranged in the abutment, and has extended downwardly section of stretching out, the section of stretching out be used for it is described fixed
The side of position chock abuts.
6. positioning component according to claim 5, which is characterized in that the abutment and the briquetting are connected using screw
It connects.
7. positioning component according to claim 1, which is characterized in that the top surface of the briquetting has handhold part.
8. positioning component according to claim 7, which is characterized in that the handhold part is configured to screw-like, the briquetting
Top there is threaded hole, the handhold part screws in the threaded hole and is spirally connected with the briquetting.
9. positioning component according to claim 1, which is characterized in that it is described positioning chock at least partly side have to
The baffle of upper extension, the baffle with the side of the briquetting for abutting.
10. positioning component according to claim 1, which is characterized in that the briquetting is configured to the rectangular block of strip, institute
The material for stating briquetting is metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821270872.XU CN208680853U (en) | 2018-08-07 | 2018-08-07 | A kind of positioning component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821270872.XU CN208680853U (en) | 2018-08-07 | 2018-08-07 | A kind of positioning component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208680853U true CN208680853U (en) | 2019-04-02 |
Family
ID=65884237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821270872.XU Active CN208680853U (en) | 2018-08-07 | 2018-08-07 | A kind of positioning component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208680853U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112016262A (en) * | 2020-08-27 | 2020-12-01 | 东风汽车集团有限公司 | Positioning tool and method for multiple groups of parallel double-side cooling IGBT pins |
-
2018
- 2018-08-07 CN CN201821270872.XU patent/CN208680853U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112016262A (en) * | 2020-08-27 | 2020-12-01 | 东风汽车集团有限公司 | Positioning tool and method for multiple groups of parallel double-side cooling IGBT pins |
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