CN205755100U - Solder paste printing fixture - Google Patents
Solder paste printing fixture Download PDFInfo
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- CN205755100U CN205755100U CN201620644994.5U CN201620644994U CN205755100U CN 205755100 U CN205755100 U CN 205755100U CN 201620644994 U CN201620644994 U CN 201620644994U CN 205755100 U CN205755100 U CN 205755100U
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- negative pressure
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Abstract
锡膏印刷治具。涉及半导体功率器件焊接加工领域，尤其涉及锡膏焊接的印刷治具。提供了一种结构简单，方便加工，便于控制锡膏量的锡膏印刷治具。所述吸盘定位板上设有用于放置负压吸盘的定位槽，所述负压吸盘的顶面均布设有若干用于放置基板的基板槽，所述丝网印刷板上设有若干与基板一一对应的基板模。所述吸盘定位板上设有负压通道一，所述负压吸盘上设有连通的负压槽和负压通道二，所述负压槽位于所述基板槽的下方，所述负压槽通过若干气路一一连通所述基板槽，所述负压通道一连通所述负压通道二。所述定位槽内设有定位柱，所述负压吸盘上设有与定位柱对应的定位孔。本实用新型提高了工作效率，可靠性高。
Solder paste printing fixture. The invention relates to the field of welding and processing of semiconductor power devices, in particular to printing fixtures for solder paste welding. Provided is a solder paste printing jig with simple structure, convenient processing and convenient control of the amount of solder paste. The suction cup positioning plate is provided with positioning grooves for placing negative pressure suction cups, and the top surface of the negative pressure suction cups is evenly provided with a number of substrate grooves for placing substrates. A corresponding substrate mold. The suction cup positioning plate is provided with a negative pressure channel 1, and the negative pressure suction cup is provided with a connected negative pressure groove and a negative pressure channel 2, the negative pressure groove is located below the substrate groove, and the negative pressure groove The substrate tanks are connected one by one through several gas paths, and the negative pressure channel one is connected with the negative pressure channel two. A positioning post is provided in the positioning groove, and a positioning hole corresponding to the positioning post is provided on the negative pressure suction cup. The utility model improves working efficiency and has high reliability.
Description
技术领域technical field
本实用新型涉及半导体功率器件焊接加工领域，尤其涉及锡膏焊接的印刷治具。The utility model relates to the field of welding processing of semiconductor power devices, in particular to a printing jig for solder paste welding.
背景技术Background technique
现有技术中，功率器件的焊接多采用焊片工艺，其不足是效率低，焊接孔洞大；而锡膏焊接可改善上述不足，但它也存在以下不足：锡量难以控制，量多会造成焊锡流淌、连锡短路、端子爬锡等问题，量少会导致焊接面减小，热阻增加，影响产品可靠性。In the prior art, the welding of power devices mostly adopts the soldering process, which has the disadvantages of low efficiency and large welding holes; while solder paste welding can improve the above deficiencies, but it also has the following deficiencies: the amount of tin is difficult to control, and excessive amount will cause Problems such as solder flow, tin short circuit, and terminal tin creeping, etc., if the amount is small, the soldering surface will be reduced, the thermal resistance will increase, and the reliability of the product will be affected.
实用新型内容Utility model content
本实用新型针对以上问题，提供了一种结构简单，方便加工，便于控制锡膏量的锡膏印刷治具。Aiming at the above problems, the utility model provides a solder paste printing jig which is simple in structure, convenient for processing and convenient for controlling the amount of solder paste.
本实用新型的技术方案是：依次包括吸盘定位板、负压吸盘和丝网印刷板，所述吸盘定位板上设有用于放置负压吸盘的定位槽，所述负压吸盘的顶面均布设有若干用于放置基板的基板槽，所述丝网印刷板上设有若干与基板一一对应的基板模。The technical scheme of the utility model is: sequentially comprising a suction cup positioning plate, a negative pressure suction cup and a screen printing plate, the suction cup positioning plate is provided with a positioning groove for placing a negative pressure suction cup, and the top surface of the negative pressure suction cup is all arranged There are several substrate grooves for placing substrates, and several substrate molds corresponding to the substrates are arranged on the screen printing plate.
所述吸盘定位板上设有负压通道一，所述负压吸盘上设有连通的负压槽和负压通道二，所述负压槽位于所述基板槽的下方，所述负压槽通过若干气路一一连通所述基板槽，所述负压通道一连通所述负压通道二。The suction cup positioning plate is provided with a negative pressure channel 1, and the negative pressure suction cup is provided with a connected negative pressure groove and a negative pressure channel 2, the negative pressure groove is located below the substrate groove, and the negative pressure groove The substrate tanks are connected one by one through several gas paths, and the negative pressure channel one is connected with the negative pressure channel two.
所述定位槽内设有定位柱，所述负压吸盘上设有与定位柱对应的定位孔。A positioning post is provided in the positioning groove, and a positioning hole corresponding to the positioning post is provided on the negative pressure suction cup.
本实用新型在工作中，首先将待印刷焊膏的基板放在负压吸盘的基板槽内；再将丝网印刷板覆于负压吸盘上，基板锡膏印刷位置与丝网印刷板上的基板模重合；最后，采用刮刀将丝网印刷板上焊膏刮到基板印刷位置，其焊锡的厚度与丝网印刷板厚度一致。其中，负压吸盘可通过定位孔套设在吸盘定位板的定位柱上，基板通过气路、负压槽、负压通道二和负压通道一连接负压源进行固定。本实用新型提高了工作效率，可靠性高。In the work of the utility model, firstly, the substrate to be printed with solder paste is placed in the substrate groove of the negative pressure suction cup; The substrate mold overlaps; finally, use a scraper to scrape the solder paste on the screen printing board to the printing position of the substrate, and the thickness of the solder is consistent with the thickness of the screen printing board. Wherein, the negative pressure suction cup can be sleeved on the positioning column of the suction cup positioning plate through the positioning hole, and the base plate is fixed by connecting the negative pressure source through the air circuit, the negative pressure groove, the negative pressure channel 2 and the negative pressure channel 1. The utility model improves working efficiency and has high reliability.
附图说明Description of drawings
图1是本实用新型中吸盘定位板的结构示意图，Fig. 1 is the structural representation of sucker positioning plate in the utility model,
图2是图1的左视图，Figure 2 is a left side view of Figure 1,
图3是本实用新型中负压吸盘的结构示意图，Fig. 3 is the structural representation of negative pressure sucker in the utility model,
图4是图3的左视图，Figure 4 is a left side view of Figure 3,
图5是本实用新型中丝网印刷板的结构示意图；Fig. 5 is the structural representation of screen printing plate in the utility model;
图中1是吸盘定位板，11是定位槽，12是负压通道一，13是定位柱，2是负压吸盘，21是基板槽，22是负压槽，23是负压通道二，24是气路，25是定位孔，3是丝网印刷板，30是基板模。In the figure, 1 is the suction cup positioning plate, 11 is the positioning groove, 12 is the negative pressure channel 1, 13 is the positioning column, 2 is the negative pressure suction cup, 21 is the substrate groove, 22 is the negative pressure groove, 23 is the negative pressure channel 2, 24 Is an air path, 25 is a positioning hole, 3 is a screen printing plate, and 30 is a substrate mold.
具体实施方式detailed description
本实用新型如图1-5所示，依次包括吸盘定位板1、负压吸盘2和丝网印刷板3，所述吸盘定位板1上设有用于放置负压吸盘的定位槽11，所述负压吸盘的顶面均布设有若干用于放置基板的基板槽21，所述丝网印刷板3上设有若干与基板一一对应的基板模30（根据基板焊接面形状设计不锈钢丝网印刷板，丝网印刷板图形与基板焊接面图形对齐）；最后，采用刮刀将丝网印刷板的图形上的焊膏均匀刮平，焊锡的厚度与丝网印刷板厚度一致。As shown in Figure 1-5, the utility model comprises a suction cup positioning plate 1, a negative pressure suction cup 2 and a screen printing plate 3 in sequence, and the suction cup positioning plate 1 is provided with a positioning groove 11 for placing a negative pressure suction cup. The top surface of the negative pressure suction cup is evenly provided with a number of substrate grooves 21 for placing the substrate, and the screen printing plate 3 is provided with a number of substrate molds 30 corresponding to the substrate one by one (the stainless steel screen printing plate is designed according to the shape of the welding surface of the substrate. board, the graphics on the screen printing board are aligned with the graphics on the soldering surface of the substrate); finally, use a scraper to evenly scrape the solder paste on the graphics on the screen printing board, and the thickness of the solder is consistent with the thickness of the screen printing board.
所述吸盘定位板上设有负压通道一12，所述负压吸盘上设有连通的负压槽22和负压通道二23，所述负压槽22位于所述基板槽21的下方，所述负压槽22通过若干气路24一一连通所述基板槽21，所述负压通道一12连通所述负压通道二23，负压通道一连接负压源。The suction cup positioning plate is provided with a negative pressure channel 12, and the negative pressure suction cup is provided with a connected negative pressure groove 22 and a negative pressure channel 2 23, and the negative pressure groove 22 is located below the substrate groove 21, The negative pressure tanks 22 are connected to the substrate tanks 21 one by one through several air passages 24 , the negative pressure channel one 12 is connected to the negative pressure channel two 23 , and the negative pressure channel one is connected to a negative pressure source.
工作中，基板放置在基板槽内，基板槽连通气路、气路连通负压槽、负压槽连通负压通道二、负压通道二连通负压通道一，最后负压通道一连接负压源，从而实现对基板的固定。During work, the substrate is placed in the substrate groove, the substrate groove is connected to the gas path, the gas path is connected to the negative pressure groove, the negative pressure groove is connected to the negative pressure channel 2, the negative pressure channel 2 is connected to the negative pressure channel 1, and finally the negative pressure channel 1 is connected to the negative pressure channel source, so as to realize the fixation of the substrate.
所述定位槽内设有定位柱13，所述负压吸盘上设有与定位柱对应的定位孔25，便于负压吸盘可靠地连接在吸盘定位板上，定位可靠。A positioning column 13 is arranged in the positioning groove, and a positioning hole 25 corresponding to the positioning column is provided on the negative pressure suction cup, so that the negative pressure suction cup can be reliably connected to the suction cup positioning plate, and the positioning is reliable.
本实用新型根据产品内部结构要求采用与之相配套的丝网印刷板直接将锡膏印刷到相应部位，通过不锈钢丝网印刷板的厚度控制锡层厚度以达到控制焊锡量的要求。According to the internal structure requirements of the product, the utility model adopts the matching screen printing plate to directly print the solder paste to the corresponding parts, and controls the thickness of the tin layer through the thickness of the stainless steel screen printing plate to meet the requirement of controlling the amount of solder.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620644994.5U CN205755100U (en) | 2016-06-24 | 2016-06-24 | Solder paste printing fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620644994.5U CN205755100U (en) | 2016-06-24 | 2016-06-24 | Solder paste printing fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205755100U true CN205755100U (en) | 2016-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620644994.5U Expired - Fee Related CN205755100U (en) | 2016-06-24 | 2016-06-24 | Solder paste printing fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205755100U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112078232A (en) * | 2020-09-30 | 2020-12-15 | 成都赛力康电气有限公司 | A kind of DBC board double-sided printing tool and DBC board double-sided printing process |
-
2016
- 2016-06-24 CN CN201620644994.5U patent/CN205755100U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112078232A (en) * | 2020-09-30 | 2020-12-15 | 成都赛力康电气有限公司 | A kind of DBC board double-sided printing tool and DBC board double-sided printing process |
| CN112078232B (en) * | 2020-09-30 | 2025-02-07 | 成都赛力康电气有限公司 | DBC board double-sided printing tool and DBC board double-sided printing process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 |