CN109397370A - Splice screen board cutting method - Google Patents

Splice screen board cutting method Download PDF

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Publication number
CN109397370A
CN109397370A CN201710695897.8A CN201710695897A CN109397370A CN 109397370 A CN109397370 A CN 109397370A CN 201710695897 A CN201710695897 A CN 201710695897A CN 109397370 A CN109397370 A CN 109397370A
Authority
CN
China
Prior art keywords
cutting
cutting path
axis
screen board
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710695897.8A
Other languages
Chinese (zh)
Inventor
陈建帮
刘德林
余小丰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUIZHOU CEE ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
HUIZHOU CEE ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUIZHOU CEE ELECTRONIC TECHNOLOGY Co Ltd filed Critical HUIZHOU CEE ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201710695897.8A priority Critical patent/CN109397370A/en
Publication of CN109397370A publication Critical patent/CN109397370A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • B26D7/015Means for holding or positioning work for sheet material or piles of sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting

Abstract

The present invention relates to a kind of splicing screen board cutting methods, including the following steps: S1 determines the size of splicing screen board to be cut on pcb board, draws out the x-axis cutting path and y-axis cutting path of splicing screen board;S2 carries out first time machining to pcb board along y-axis cutting path;S3 plants pin in the gap made of machining;S4, machining is carried out to pcb board along x-axis cutting path, the y-axis path includes the first cutting path composition that several length are two pieces of splicing screen board length, the first cutting path array arrangement, the x-axis path include the second cutting path by the line at the midpoint of the first cutting path and the third cutting path by the interval between the first cutting path.The mosaic screen board size that the present invention was process is stablized, and mismachining tolerance is small, and appearance meets quality requirements.

Description

Splice screen board cutting method
Technical field
The present invention relates to the fields PCB, and in particular to a kind of automatic Mosaic screen board cutting method.
Background technique
With the development of mosaic screen technology, the requirement to the size control of splicing screen board is increasingly stringenter, and splices screen board Material is special, bigger to the abrasion of process tool using traditional one-pass molding mode compared with HDI plate thickness, causes size unstable And appearance requirement is not met.
Summary of the invention
Based on this, it is necessary in view of the above problems, providing a kind of splicing screen board cutting method, including the following steps:
S1 determines the size of splicing screen board to be cut on pcb board, draws out the x-axis cutting path and y-axis of splicing screen board Cutting path;
S2 carries out first time machining to pcb board along y-axis cutting path;
S3 plants pin in the gap made of machining;
S4 carries out machining to pcb board along x-axis cutting path.
The cutting of splice plate refers to that the mosaic screen finished product for needing client is cut down from pcb board semi-finished product, when cutting, first The machining path in y-axis direction is completed the process, plants pin in the path after then having reprocessed, is emptied with pin filling Path can make pin play a supporting role the splicing screen board of two sides, when so as to carry out the cutting of next step x-axis direction, spell Connecing screen board will not shake, and guarantee cut quality, the dimensionally stable of splicing screen board.Meanwhile the present invention is cut when splicing screen board, is used The one-time formed processing method of abandoning tradition, can be effectively protected process tool, extend the service life of process tool, thus Reduce processing cost.
Preferably, the y-axis path includes the first cutting path composition that several length are two pieces of splicing screen board length, institute The first cutting path array arrangement is stated, the x-axis path includes the second cutting by the line at the midpoint of the first cutting path Path and the third cutting path for passing through the interval between the first cutting path.
In this way, when carrying out the cutting of third cutting path, it is ensured that other three Bian Junyou of splicing screen board to be cut The support of supporter, i.e., with the support of pin.
Preferably, the edge of the pin and the splicing screen board offsets.
Pin offsets with splicing screen board, it is ensured that and splicing screen board will not move, and guarantee the stability of cutting processing, thus Guarantee the stability of splicing screen board appearance completed the process, to meet customer requirement.
Preferably, the diameter of the pin small 0.05mm compared with the width in the gap.
To guarantee that pin and splicing platen edge keep a very small gap, it can make pin both will not be to mosaic screen Squeeze and make its deformation, and support can be played the role of to mosaic screen, guarantees mosaic screen held stationary in process.
Preferably, the intersection of the y-axis cutting path and the x-axis cutting path is provided with pin.
The pin of y-axis path and the intersection in x-axis path can to the four pieces of splicing screen boards to offset therewith or therewith phase The two pieces of splicing screen boards supported are played a supporting role.
Further, the y-axis cutting path between the pcb board and the splicing screen board is cut with the x-axis The intersection for cutting path is provided with fillet towards the direction far from splicing screen board.
Fillet setting can be in order to the insertion of pin, while can increase the contact area of pin and pcb board, the pin for being It is more stable, secured for the support for splicing screen board.
Preferably, machining is carried out using gong knife.
Gong knife, which carries out machining, can make processing boundary smooth.
Further, when cutting to third cutting path, not a half a knife will a little be extended out to by cutting a little and returning sword Diameter.
When processing, gong knife can be in the operation longer time that cuts a little and return sword, and cutting a little and returning sword will a little extend outwardly At least half cutter diameter can concave point occur abnormal to avoid the mosaic screen at cutting a little and return sword is located at.
The principle of the present invention, effect are further illustrated below with reference to above-mentioned technical proposal:
1. cutting splicing screen board is repeatedly to be processed, the groove for avoiding process tool abrasion excessive, while occurring in processing Middle plantation pin keeps the stabilization of splicing screen board, it is ensured that the quality of the splicing screen board processed.
2. the y-axis path includes the first cutting paths composition that several length are two pieces of splicing screen board length, and described the One cutting path array arrangement, the x-axis path include the second cutting path by the line at the midpoint of the first cutting path And the third cutting path by the interval between the first cutting path.In this way, when carrying out the cutting of third cutting path, it can be with The support for guaranteeing the other three Bian Junyou supporter of splicing screen board to be cut, i.e., with the support of pin.
3. a pair third cutting path is cut, not a half a cutter diameter will a little be extended out to by cutting a little and returning sword.Processing When, gong knife can be in the operation longer time that cuts a little and return sword, and not a half a cutter diameter will a little be extended out to by cutting a little and returning sword It can concave point occur abnormal to avoid the mosaic screen at cutting a little and return sword is located at.
Detailed description of the invention
Fig. 1 is the schematic diagram 1 for splicing screen board cutting path described in the embodiment of the present invention;
Fig. 2 is the schematic diagram 2 for splicing screen board cutting path described in the embodiment of the present invention;
Description of symbols:
Pcb board 1 splices screen board 11, the first cutting path 21, the second cutting path 31, third cutting path 32, pin 4.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, being done further in detail below in conjunction with attached drawing and embodiment to the present invention Thin description:
A kind of 11 cutting method of splicing screen board, including the following steps:
S1 determines the size of splicing screen board 11 to be cut on pcb board 1, draws out the x-axis cutting path of splicing screen board 11 With y-axis cutting path;
S2 carries out first time machining to pcb board 1 along y-axis cutting path;
S3 plants pin 4 in the gap made of machining;
S4 carries out machining to pcb board 1 along x-axis cutting path.
The cutting of splice plate refers to that the mosaic screen finished product for needing client is cut down from 1 semi-finished product of pcb board, when cutting, First the machining path in y-axis direction is completed the process, pin 4 is planted in the path after then having reprocessed, is drawn with the filling of pin 4 Empty path, can make pin 4 play a supporting role the splicing screen board 11 of two sides, so as to carry out cutting for next step x-axis direction When cutting, splicing screen board 11 will not be shaken, and guarantee cut quality, the dimensionally stable of splicing screen board 11.Meanwhile the present invention cuts splicing When screen board 11, using the one-time formed processing method of abandoning tradition, it can be effectively protected process tool, extend process tool Service life, to reduce processing cost.
One of embodiment, such as Fig. 1, the y-axis path include that several length are two pieces of splicing 11 length of screen board First cutting path 21 composition, 21 array arrangement of the first cutting path, the x-axis path include passing through the first cutting path Second cutting path 31 of the line at 21 midpoint and the third cutting path 32 for passing through the interval between the first cutting path 21.
Wherein, array arrangement be the first cutting path 21 along the y-axis direction point-blank, along the x-axis direction, first path Endpoint flush with each other.In this way, when carrying out the cutting of third cutting path 32, it is ensured that be cut splices the another of screen board 11 The support of outer three Bian Junyou supporter, i.e., with the support of pin 4.
The edge of one of embodiment, the pin 4 and the splicing screen board 11 offsets.
Pin 4 offsets with splicing screen board 11, it is ensured that splicing screen board 11 will not move, and guarantee the stabilization of cutting processing Property, to guarantee the stability of splicing 11 appearance of screen board completed the process, to meet customer requirement.
One of embodiment, the diameter of the pin 4 small 0.05mm compared with the width in the gap.
To guarantee that pin 4 and splicing platen edge keep a very small gap, it can make pin 4 both will not be to splicing Screen, which squeeze, makes its deformation, and can play the role of support to mosaic screen, guarantees mosaic screen held stationary in process.
The intersection of one of embodiment, y-axis cutting path as described in Figure 2 and the x-axis cutting path is provided with Pin 4.
The pin 4 of the intersection in y-axis path and x-axis path can to the four pieces of splicing screen boards 11 to offset therewith or therewith The two pieces of splicing screen boards 11 to offset are played a supporting role.
One of embodiment, the y-axis cutting path between the pcb board 1 and the splicing screen board 11 The direction far from splicing screen board 11 is provided with fillet with the intersection of the x-axis cutting path.
Fillet setting can be in order to the insertion of pin 4, while can increase the contact area of pin 4 Yu pcb board 1, yes Pin 4 is more stable, secured for the support for splicing screen board 11.
One of embodiment carries out machining using gong knife.
Gong knife, which carries out machining, can make processing boundary smooth.
One of embodiment, when cutting to third cutting path 32, cutting a little and returning sword will a little extend outwardly At least half of cutter diameter.
When processing, gong knife can be in the operation longer time that cuts a little and return sword, and cutting a little and returning sword will a little extend outwardly At least half cutter diameter can concave point occur abnormal to avoid the mosaic screen at cutting a little and return sword is located at.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (8)

1. a kind of splicing screen board cutting method, characterized in that it comprises the following steps:
S1 determines the size of splicing screen board to be cut on pcb board, draws out the x-axis cutting path and y-axis of splicing screen board Cutting path;
S2 carries out first time machining to pcb board along y-axis cutting path;
S3 plants pin in the gap made of machining;
S4 carries out machining to pcb board along x-axis cutting path.
2. splicing screen board cutting method according to claim 1, which is characterized in that the y-axis path includes several length Splice the first cutting path composition of screen board length for two pieces, the first cutting path array arrangement, the x-axis path includes The second cutting path by the line at the midpoint of the first cutting path and the third by the interval between the first cutting path Cutting path.
3. splicing screen board cutting method according to claim 1, which is characterized in that the pin and the splicing screen board Edge offsets.
4. mosaic screen cutting method according to claim 1, which is characterized in that the diameter of the pin and the gap Width compares small 0.05mm.
5. splicing screen board cutting method according to claim 1, which is characterized in that the y-axis cutting path and the x-axis The intersection of cutting path is provided with pin.
6. splicing screen board cutting method according to claim 5, which is characterized in that be located at the pcb board and the splicing The intersection of the y-axis cutting path and the x-axis cutting path between screen board is provided with towards the direction far from splicing screen board Fillet.
7. splicing screen board cutting method according to claim 2, which is characterized in that carry out machining using gong knife.
8. mosaic screen cutting method according to claim 7, which is characterized in that when being cut to third cutting path, Not a half a cutter diameter will a little be extended out to by cutting a little and returning sword.
CN201710695897.8A 2017-08-15 2017-08-15 Splice screen board cutting method Pending CN109397370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710695897.8A CN109397370A (en) 2017-08-15 2017-08-15 Splice screen board cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710695897.8A CN109397370A (en) 2017-08-15 2017-08-15 Splice screen board cutting method

Publications (1)

Publication Number Publication Date
CN109397370A true CN109397370A (en) 2019-03-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710695897.8A Pending CN109397370A (en) 2017-08-15 2017-08-15 Splice screen board cutting method

Country Status (1)

Country Link
CN (1) CN109397370A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027596A2 (en) * 2003-09-12 2005-03-24 Siemens Aktiengesellschaft Printed circuit board for a radio module
CN101362224A (en) * 2008-09-03 2009-02-11 昆山鼎鑫电子有限公司 Cutting method of circuit board
CN203696254U (en) * 2013-12-24 2014-07-09 深圳市景旺电子股份有限公司 Device used for laser cutting of batch flexible plates
CN105093577A (en) * 2015-07-22 2015-11-25 武汉华星光电技术有限公司 Cutting device for liquid crystal display panel
CN205928769U (en) * 2016-04-08 2017-02-08 深圳市路维光电股份有限公司 Sheet material cutting device
CN106535478A (en) * 2016-11-12 2017-03-22 广东科翔电子科技有限公司 Method of improving milling groove burrs before electroless plating copper operation of PCB
CN106550543A (en) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 A kind of circuit panel forming method without location hole
CN106658975A (en) * 2017-03-20 2017-05-10 林春芳 Circuit board cutting machine fixture
CN106825763A (en) * 2017-01-11 2017-06-13 雪龙数控设备(深圳)有限公司 Without wiring board cutting processing technology, numerical control gong machine that pin on the table is followed closely

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005027596A2 (en) * 2003-09-12 2005-03-24 Siemens Aktiengesellschaft Printed circuit board for a radio module
CN101362224A (en) * 2008-09-03 2009-02-11 昆山鼎鑫电子有限公司 Cutting method of circuit board
CN203696254U (en) * 2013-12-24 2014-07-09 深圳市景旺电子股份有限公司 Device used for laser cutting of batch flexible plates
CN105093577A (en) * 2015-07-22 2015-11-25 武汉华星光电技术有限公司 Cutting device for liquid crystal display panel
CN205928769U (en) * 2016-04-08 2017-02-08 深圳市路维光电股份有限公司 Sheet material cutting device
CN106550543A (en) * 2016-10-26 2017-03-29 广东骏亚电子科技股份有限公司 A kind of circuit panel forming method without location hole
CN106535478A (en) * 2016-11-12 2017-03-22 广东科翔电子科技有限公司 Method of improving milling groove burrs before electroless plating copper operation of PCB
CN106825763A (en) * 2017-01-11 2017-06-13 雪龙数控设备(深圳)有限公司 Without wiring board cutting processing technology, numerical control gong machine that pin on the table is followed closely
CN106658975A (en) * 2017-03-20 2017-05-10 林春芳 Circuit board cutting machine fixture

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Application publication date: 20190301

RJ01 Rejection of invention patent application after publication