CN110446354A - A kind of pcb board high-precision size forming method applied to LED - Google Patents
A kind of pcb board high-precision size forming method applied to LED Download PDFInfo
- Publication number
- CN110446354A CN110446354A CN201910784018.8A CN201910784018A CN110446354A CN 110446354 A CN110446354 A CN 110446354A CN 201910784018 A CN201910784018 A CN 201910784018A CN 110446354 A CN110446354 A CN 110446354A
- Authority
- CN
- China
- Prior art keywords
- image
- gong
- cis
- led
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformation in the plane of the image
- G06T3/40—Scaling the whole image or part thereof
- G06T3/4038—Scaling the whole image or part thereof for image mosaicing, i.e. plane images composed of plane sub-images
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Abstract
The present invention provides a kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine is equipped with CCD detection device, it is characterized in that, so that the CCD detection device is read 4 mark points on each unit set of PCB figure and surveys number, then it is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.The present invention uses the gong machine that number function is surveyed with CCD, the 4 mark points read on each unit set of PCB figure survey number, then it is compensated automatically according to the data of reading, it eliminates that drilling hole location tolerance, pattern transfer tolerance, the tolerances such as plate harmomegathus are cumulative automatically in this way, is processed with high-precision of the tolerance within ± 0.05mm for reaching compact dimensions and PCB figure to edges of boards.
Description
Technical field
The invention belongs to LED circuit board processing technique fields, and in particular to a kind of pcb board high-precision ruler applied to LED
Very little forming method.
Background technique
The maximum competitiveness of the small space distance LED display screen of high density is that display screen is completely seamless and shows the nature of color
Really, it requires the precision of the pcb board compact dimensions of LED higher and higher in this way, it is higher and higher also to require that moulding process requires, from
Pcb board outer dimension size tolerance+0.15mm, ± 0.10mm, ± 0.05mm is got higher step by step, while requiring PCB pattern to plate
Dimensional tolerance ± the 0.15mm on side, ± 0.10mm, ± 0.05mm are got higher step by step；When the outer dimension and pcb board figure for requiring pcb board
When the dimensional tolerance of shape to edges of boards is all ± 0.05mm, this challenge to molding technique ultralimit.Forming technique originally is
Upper pin is planted on gong machine table top, and progress gong sheet metal forming, this kind of technique are folded to position pcb board and 2-5 block plate as one with pin
Can there are drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus etc. to be accumulated in together, Yao Shixian compact dimensions PCB figure arrives
Edges of boards tolerance+0.05mm substantially can not.
Existing forming technique is the new gong machine of schmollRMXY6-125-CCD, and edges of boards still use pin to position, In
4 mark points (the circle copper point that mark point is less than 0.5mm) of per unit set increase on figure, and band on each gong head of gong machine
There is CCD camera, the automatic compensation of 4 mark points photograph access that can automatically on unit set each to figure before gong plate makes to bore
Hole hole location tolerance, pattern transfer tolerance, plate harmomegathus compensate guarantee molding PCB figure to edges of boards tolerance+0.05mm with
It is interior.
Above-mentioned forming technique has that drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus etc. are accumulated in together,
Since cumulative limit has no idea to improve greatly the precision of compact dimensions, form within PCB figure to edges of boards tolerance+0.05mm, nothing
Method reaches the requirement of high-precision processing.
Summary of the invention
In view of this, the present invention provides a kind of pcb board high-precision size forming method applied to LED, surveyed using band CCD
The gong machine of number function, the 4 mark points read on each unit set of PCB figure are surveyed number, are then carried out certainly according to the data of reading
Dynamic compensation eliminates the tolerances such as drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus and adds up, automatically in this way to reach molding
High-precision processing of the tolerance within ± 0.05mm of size and PCB figure to edges of boards.
The technical solution of the present invention is as follows:
A kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine are equipped with CCD detection dress
It sets, which is characterized in that so that the CCD detection device is read 4 mark points on each unit set of PCB figure and survey number, then root
It is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.
Further, the CCD detection device is using 4 mark on the vision software crawl each unit set of PCB figure
Point value, data transmit UVW platform automatic aligning tolerance balancing value.
Further, the gong machine is equipped with vacuum absorption device, using vacuumizing so that pcb board and gong machine are pasted.
Further, the CCD detection device further analyzes drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
The ranges such as tolerance.
Further, the method that the CCD detection device takes symmetrical cover guarantees the precision of product gong sheet metal forming.
Further, the detection method of the CCD detection device includes:
S1. full image digital collection instrument is used, by the image acquisition mechanism of setting, Image Acquisition is carried out to PCB figure；
S2., one image procossing mechanism is set, the image of acquisition is successively handled as follows: CIS splicing；Image consistency
Correction process；Image high-precision resampling processing；Bitmap turns vector processing, and the vector data of acquisition is exported；
S3. according to the vector data of output, vector quantization reconstruction is carried out to pattern-information possessed by material to be measured.
Further, the CIS splicing the following steps are included:
S21., more CIS imaging sensors will be set in the image acquisition mechanism and whole in the arrangement of " it " font, it is described
Adjacent two CIS of more CIS imaging sensors there is overlapping region, vertical direction to have dislocation region in the horizontal direction, and set
It is fixed to determine overlapping region, dislocation zone, the width of every CIS scanning；
S22., 0-L pixel, L-2L pixel are set to adjacent first CIS channel image data, second in the horizontal direction
Root CIS channel image data；
S23. production can cover the splicing paper with abundant alignment mark of whole image pickup area, the paper figure of input splicing later
Picture, using splicing tool manually by the overlapping region of adjacent two junctions CIS be integrally moved to the left pixel w, both
Dislocation zone integrally moves up pixel h, until horizontally overlapping region and upper and lower dislocation zone are not present in image, utilizes simultaneously
Software backstage algorithm records splicing parameter w, h, and generates configuration file, need to only load configuration text when each scan image later
The automatic Mosaic of image can be realized in part.
Further, the image consistency correction process includes the following steps: to acquire a white figure of saturation bright field
With a black figure of dark field, correction data is obtained；Using peg method, image rectification is carried out as follows: where G correction
(x, y) is the image data after correction, and G original (x, y) is raw image data, and G bright field is that the saturation that aligning tool obtains is bright
Field data, G dark field are the dark field data that aligning tool obtains, and C is correction factor, usually takes 255.
Further, the image high-precision resampling is to be realized in rear end by cube interpolation algorithm.
Further, it is to turn vector operation by bitmap to realize that the bitmap, which turns vector processing, including following step
It is rapid: bitmap being decomposed into closed path set, constitutes the boundary between black and white region；The resulting closing of above-mentioned processing will be passed through
Set of paths is converted into the optimal polygon in the approximation path；Convert polygon to smooth vector outline；It is last defeated
The curve set of a sequence out, and each curve is to be made of a series of linear segments and Bezier segment, and use
The mode of redundancy encoding stores curve obtained collection.
Further, the gong board parameter are as follows: revolving speed: 20000-30000RPM, feed velocity: 0.2-0.7m/min is moved back
Knife speed: 11-18m/min.
The present invention uses the gong machine that number function is surveyed with CCD, and the 4 mark points read on each unit set of PCB figure are surveyed
Number, is then compensated according to the data of reading automatically, to eliminate drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
Tolerance etc. it is cumulative, in conjunction with the control of gong board parameter, can achieve compact dimensions and PCB figure to edges of boards tolerance ±
Within 0.05mm.
Key technology control point of the invention is:
1. gong machine must with CCD and have survey number compensate the function of gong plate program and the control of gong board parameter automatically；
2. 4 access mark points must be designed on PCB figure per unit set.
Forming method of the invention mentions the pcb board compact dimensions precision for being applied to LED in the prior art from ± 0.15mm
Height arrives ± 0.05mm, greatly improves the precision of processing.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with specific embodiment, to this
Invention is described in further detail.It should be understood that the specific embodiments described herein are only to explain this hair
It is bright, and the scope of protection of the present invention is not limited.
Embodiment 1
A kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine are equipped with CCD detection dress
It sets, which is characterized in that so that the CCD detection device is read 4 mark points on each unit set of PCB figure and survey number, then root
It is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.
Further, the CCD detection device is using 4 mark on the vision software crawl each unit set of PCB figure
Point value, data transmit UVW platform automatic aligning tolerance balancing value.
Further, the gong machine is equipped with vacuum absorption device, using vacuumizing so that pcb board and gong machine are pasted.
Further, the CCD detection device further analyzes drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
The ranges such as tolerance.
Further, the method that the CCD detection device takes symmetrical cover guarantees the precision of product gong sheet metal forming.
Further, the detection method of the CCD detection device includes:
S1. full image digital collection instrument is used, by the image acquisition mechanism of setting, Image Acquisition is carried out to PCB figure；
S2., one image procossing mechanism is set, the image of acquisition is successively handled as follows: CIS splicing；Image consistency
Correction process；Image high-precision resampling processing；Bitmap turns vector processing, and the vector data of acquisition is exported；
S3. according to the vector data of output, vector quantization reconstruction is carried out to pattern-information possessed by material to be measured.
Further, the CIS splicing the following steps are included:
S21., more CIS imaging sensors will be set in the image acquisition mechanism and whole in the arrangement of " it " font, it is described
Adjacent two CIS of more CIS imaging sensors there is overlapping region, vertical direction to have dislocation region in the horizontal direction, and set
It is fixed to determine overlapping region, dislocation zone, the width of every CIS scanning；
S22., 0-L pixel, L-2L pixel are set to adjacent first CIS channel image data, second in the horizontal direction
Root CIS channel image data；
S23. production can cover the splicing paper with abundant alignment mark of whole image pickup area, the paper figure of input splicing later
Picture, using splicing tool manually by the overlapping region of adjacent two junctions CIS be integrally moved to the left pixel w, both
Dislocation zone integrally moves up pixel h, until horizontally overlapping region and upper and lower dislocation zone are not present in image, utilizes simultaneously
Software backstage algorithm records splicing parameter w, h, and generates configuration file, need to only load configuration text when each scan image later
The automatic Mosaic of image can be realized in part.
Further, the image consistency correction process includes the following steps: to acquire a white figure of saturation bright field
With a black figure of dark field, correction data is obtained；Using peg method, image rectification is carried out as follows: where G correction
(x, y) is the image data after correction, and G original (x, y) is raw image data, and G bright field is that the saturation that aligning tool obtains is bright
Field data, G dark field are the dark field data that aligning tool obtains, and C is correction factor, usually takes 255.
Further, the image high-precision resampling is to be realized in rear end by cube interpolation algorithm.
Further, it is to turn vector operation by bitmap to realize that the bitmap, which turns vector processing, including following step
It is rapid: bitmap being decomposed into closed path set, constitutes the boundary between black and white region；The resulting closing of above-mentioned processing will be passed through
Set of paths is converted into the optimal polygon in the approximation path；Convert polygon to smooth vector outline；It is last defeated
The curve set of a sequence out, and each curve is to be made of a series of linear segments and Bezier segment, and use
The mode of redundancy encoding stores curve obtained collection.
Further, the gong board parameter are as follows: revolving speed: 24000RPM, feed velocity: 0.4m/min, withdrawing speed: 15m/
min。
The present invention uses the gong machine that number function is surveyed with CCD, and the 4 mark points read on each unit set of PCB figure are surveyed
Number, is then compensated according to the data of reading automatically, to eliminate drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
Tolerance etc. it is cumulative, in conjunction with the control of gong board parameter, can achieve compact dimensions and PCB figure to edges of boards tolerance ±
Within 0.05mm.
Embodiment 2
A kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine are equipped with CCD detection dress
It sets, which is characterized in that so that the CCD detection device is read 4 mark points on each unit set of PCB figure and survey number, then root
It is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.
Further, the CCD detection device is using 4 mark on the vision software crawl each unit set of PCB figure
Point value, data transmit UVW platform automatic aligning tolerance balancing value.
Further, the gong machine is equipped with vacuum absorption device, using vacuumizing so that pcb board and gong machine are pasted.
Further, the CCD detection device further analyzes drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
The ranges such as tolerance.
Further, the method that the CCD detection device takes symmetrical cover guarantees the precision of product gong sheet metal forming.
Further, the detection method of the CCD detection device includes:
S1. full image digital collection instrument is used, by the image acquisition mechanism of setting, Image Acquisition is carried out to PCB figure；
S2., one image procossing mechanism is set, the image of acquisition is successively handled as follows: CIS splicing；Image consistency
Correction process；Image high-precision resampling processing；Bitmap turns vector processing, and the vector data of acquisition is exported；
S3. according to the vector data of output, vector quantization reconstruction is carried out to pattern-information possessed by material to be measured.
Further, the CIS splicing the following steps are included:
S21., more CIS imaging sensors will be set in the image acquisition mechanism and whole in the arrangement of " it " font, it is described
Adjacent two CIS of more CIS imaging sensors there is overlapping region, vertical direction to have dislocation region in the horizontal direction, and set
It is fixed to determine overlapping region, dislocation zone, the width of every CIS scanning；
S22., 0-L pixel, L-2L pixel are set to adjacent first CIS channel image data, second in the horizontal direction
Root CIS channel image data；
S23. production can cover the splicing paper with abundant alignment mark of whole image pickup area, the paper figure of input splicing later
Picture, using splicing tool manually by the overlapping region of adjacent two junctions CIS be integrally moved to the left pixel w, both
Dislocation zone integrally moves up pixel h, until horizontally overlapping region and upper and lower dislocation zone are not present in image, utilizes simultaneously
Software backstage algorithm records splicing parameter w, h, and generates configuration file, need to only load configuration text when each scan image later
The automatic Mosaic of image can be realized in part.
Further, the image consistency correction process includes the following steps: to acquire a white figure of saturation bright field
With a black figure of dark field, correction data is obtained；Using peg method, image rectification is carried out as follows: where G correction
(x, y) is the image data after correction, and G original (x, y) is raw image data, and G bright field is that the saturation that aligning tool obtains is bright
Field data, G dark field are the dark field data that aligning tool obtains, and C is correction factor, usually takes 255.
Further, the image high-precision resampling is to be realized in rear end by cube interpolation algorithm.
Further, it is to turn vector operation by bitmap to realize that the bitmap, which turns vector processing, including following step
It is rapid: bitmap being decomposed into closed path set, constitutes the boundary between black and white region；The resulting closing of above-mentioned processing will be passed through
Set of paths is converted into the optimal polygon in the approximation path；Convert polygon to smooth vector outline；It is last defeated
The curve set of a sequence out, and each curve is to be made of a series of linear segments and Bezier segment, and use
The mode of redundancy encoding stores curve obtained collection.
Further, the gong board parameter are as follows: revolving speed: 20000RPM, feed velocity: 0.2m/min, withdrawing speed: 11m/
min。
The present invention uses the gong machine that number function is surveyed with CCD, and the 4 mark points read on each unit set of PCB figure are surveyed
Number, is then compensated according to the data of reading automatically, to eliminate drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
Tolerance etc. it is cumulative, in conjunction with the control of gong board parameter, can achieve compact dimensions and PCB figure to edges of boards tolerance ±
Within 0.05mm.
Embodiment 3
A kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine are equipped with CCD detection dress
It sets, which is characterized in that so that the CCD detection device is read 4 mark points on each unit set of PCB figure and survey number, then root
It is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.
Further, the CCD detection device is using 4 mark on the vision software crawl each unit set of PCB figure
Point value, data transmit UVW platform automatic aligning tolerance balancing value.
Further, the gong machine is equipped with vacuum absorption device, using vacuumizing so that pcb board and gong machine are pasted.
Further, the CCD detection device further analyzes drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
The ranges such as tolerance.
Further, the method that the CCD detection device takes symmetrical cover guarantees the precision of product gong sheet metal forming.
Further, the detection method of the CCD detection device includes:
S1. full image digital collection instrument is used, by the image acquisition mechanism of setting, Image Acquisition is carried out to PCB figure；
S2., one image procossing mechanism is set, the image of acquisition is successively handled as follows: CIS splicing；Image consistency
Correction process；Image high-precision resampling processing；Bitmap turns vector processing, and the vector data of acquisition is exported；
S3. according to the vector data of output, vector quantization reconstruction is carried out to pattern-information possessed by material to be measured.
Further, the CIS splicing the following steps are included:
S21., more CIS imaging sensors will be set in the image acquisition mechanism and whole in the arrangement of " it " font, it is described
Adjacent two CIS of more CIS imaging sensors there is overlapping region, vertical direction to have dislocation region in the horizontal direction, and set
It is fixed to determine overlapping region, dislocation zone, the width of every CIS scanning；
S22., 0-L pixel, L-2L pixel are set to adjacent first CIS channel image data, second in the horizontal direction
Root CIS channel image data；
S23. production can cover the splicing paper with abundant alignment mark of whole image pickup area, the paper figure of input splicing later
Picture, using splicing tool manually by the overlapping region of adjacent two junctions CIS be integrally moved to the left pixel w, both
Dislocation zone integrally moves up pixel h, until horizontally overlapping region and upper and lower dislocation zone are not present in image, utilizes simultaneously
Software backstage algorithm records splicing parameter w, h, and generates configuration file, need to only load configuration text when each scan image later
The automatic Mosaic of image can be realized in part.
Further, the image consistency correction process includes the following steps: to acquire a white figure of saturation bright field
With a black figure of dark field, correction data is obtained；Using peg method, image rectification is carried out as follows: where G correction
(x, y) is the image data after correction, and G original (x, y) is raw image data, and G bright field is that the saturation that aligning tool obtains is bright
Field data, G dark field are the dark field data that aligning tool obtains, and C is correction factor, usually takes 255.
Further, the image high-precision resampling is to be realized in rear end by cube interpolation algorithm.
Further, it is to turn vector operation by bitmap to realize that the bitmap, which turns vector processing, including following step
It is rapid: bitmap being decomposed into closed path set, constitutes the boundary between black and white region；The resulting closing of above-mentioned processing will be passed through
Set of paths is converted into the optimal polygon in the approximation path；Convert polygon to smooth vector outline；It is last defeated
The curve set of a sequence out, and each curve is to be made of a series of linear segments and Bezier segment, and use
The mode of redundancy encoding stores curve obtained collection.
Further, the gong board parameter are as follows: revolving speed: 30000RPM, feed velocity: 0.7m/min, withdrawing speed:
18m/min。
The present invention uses the gong machine that number function is surveyed with CCD, and the 4 mark points read on each unit set of PCB figure are surveyed
Number, is then compensated according to the data of reading automatically, to eliminate drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
Tolerance etc. it is cumulative, in conjunction with the control of gong board parameter, can achieve compact dimensions and PCB figure to edges of boards tolerance ±
Within 0.05mm.
Embodiment 4
A kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine are equipped with CCD detection dress
It sets, which is characterized in that so that the CCD detection device is read 4 mark points on each unit set of PCB figure and survey number, then root
It is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.
Further, the CCD detection device is using 4 mark on the vision software crawl each unit set of PCB figure
Point value, data transmit UVW platform automatic aligning tolerance balancing value.
Further, the gong machine is equipped with vacuum absorption device, using vacuumizing so that pcb board and gong machine are pasted.
Further, the CCD detection device further analyzes drilling hole location tolerance, pattern transfer tolerance, plate harmomegathus
The ranges such as tolerance.
Further, the method that the CCD detection device takes symmetrical cover guarantees the precision of product gong sheet metal forming.
Further, the detection method of the CCD detection device includes:
S1. full image digital collection instrument is used, by the image acquisition mechanism of setting, Image Acquisition is carried out to PCB figure；
S2., one image procossing mechanism is set, the image of acquisition is successively handled as follows: CIS splicing；Image consistency
Correction process；Image high-precision resampling processing；Bitmap turns vector processing, and the vector data of acquisition is exported；
S3. according to the vector data of output, vector quantization reconstruction is carried out to pattern-information possessed by material to be measured.
Further, the CIS splicing the following steps are included:
S21., more CIS imaging sensors will be set in the image acquisition mechanism and whole in the arrangement of " it " font, it is described
Adjacent two CIS of more CIS imaging sensors there is overlapping region, vertical direction to have dislocation region in the horizontal direction, and set
It is fixed to determine overlapping region, dislocation zone, the width of every CIS scanning；
S22., 0-L pixel, L-2L pixel are set to adjacent first CIS channel image data, second in the horizontal direction
Root CIS channel image data；
S23. production can cover the splicing paper with abundant alignment mark of whole image pickup area, the paper figure of input splicing later
Picture, using splicing tool manually by the overlapping region of adjacent two junctions CIS be integrally moved to the left pixel w, both
Dislocation zone integrally moves up pixel h, until horizontally overlapping region and upper and lower dislocation zone are not present in image, utilizes simultaneously
Software backstage algorithm records splicing parameter w, h, and generates configuration file, need to only load configuration text when each scan image later
The automatic Mosaic of image can be realized in part.
Further, the image consistency correction process includes the following steps: to acquire a white figure of saturation bright field
With a black figure of dark field, correction data is obtained；Using peg method, image rectification is carried out as follows: where G correction
(x, y) is the image data after correction, and G original (x, y) is raw image data, and G bright field is that the saturation that aligning tool obtains is bright
Field data, G dark field are the dark field data that aligning tool obtains, and C is correction factor, usually takes 255.
Further, the image high-precision resampling is to be realized in rear end by cube interpolation algorithm.
Further, it is to turn vector operation by bitmap to realize that the bitmap, which turns vector processing, including following step
It is rapid: bitmap being decomposed into closed path set, constitutes the boundary between black and white region；The resulting closing of above-mentioned processing will be passed through
Set of paths is converted into the optimal polygon in the approximation path；Convert polygon to smooth vector outline；It is last defeated
The curve set of a sequence out, and each curve is to be made of a series of linear segments and Bezier segment, and use
The mode of redundancy encoding stores curve obtained collection.
Further, the gong board parameter are as follows: revolving speed: 27000RPM, feed velocity: 0.5m/min, withdrawing speed: 16m/
min。
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, can pass through this
Field any prior art is realized.
Claims (10)
1. a kind of pcb board high-precision size forming method applied to LED, including gong machine, the gong machine is equipped with CCD detection dress
It sets, which is characterized in that so that the CCD detection device is read 4 mark points on each unit set of PCB figure and survey number, then root
It is compensated automatically according to the data of reading, determines gong board parameter, carry out the processing of gong plate.
2. the pcb board high-precision size forming method according to claim 1 applied to LED, which is characterized in that described
For CCD detection device using 4 mark point values on the vision software crawl each unit set of PCB figure, it is flat that data transmit UVW
Platform automatic aligning tolerance balancing value.
3. the pcb board high-precision size forming method according to claim 2 applied to LED, which is characterized in that the gong
Machine is equipped with vacuum absorption device, and using vacuumizing so that pcb board is bonded with gong machine, the CCD detection device further analyzes brill
The ranges such as hole hole location tolerance, pattern transfer tolerance, plate harmomegathus tolerance.
4. the pcb board high-precision size forming method according to claim 3 applied to LED, which is characterized in that described
The method that CCD detection device takes symmetrical cover guarantees the precision of product gong sheet metal forming.
5. the pcb board high-precision size forming method according to claim 1 applied to LED, which is characterized in that described
The detection method of CCD detection device includes:
S1. full image digital collection instrument is used, by the image acquisition mechanism of setting, Image Acquisition is carried out to PCB figure；
S2., one image procossing mechanism is set, the image of acquisition is successively handled as follows: CIS splicing；Image consistency
Correction process；Image high-precision resampling processing；Bitmap turns vector processing, and the vector data of acquisition is exported；
S3. according to the vector data of output, vector quantization reconstruction is carried out to pattern-information possessed by material to be measured.
6. the pcb board high-precision size forming method according to claim 5 applied to LED, which is characterized in that described
CIS splicing the following steps are included:
S21., more CIS imaging sensors will be set in the image acquisition mechanism and whole in the arrangement of " it " font, it is described
Adjacent two CIS of more CIS imaging sensors there is overlapping region, vertical direction to have dislocation region in the horizontal direction, and set
It is fixed to determine overlapping region, dislocation zone, the width of every CIS scanning；
S22., 0-L pixel, L-2L pixel are set to adjacent first CIS channel image data, second in the horizontal direction
Root CIS channel image data；
S23. production can cover the splicing paper with abundant alignment mark of whole image pickup area, the paper figure of input splicing later
Picture, using splicing tool manually by the overlapping region of adjacent two junctions CIS be integrally moved to the left pixel w, both
Dislocation zone integrally moves up pixel h, until horizontally overlapping region and upper and lower dislocation zone are not present in image, utilizes simultaneously
Software backstage algorithm records splicing parameter w, h, and generates configuration file, need to only load configuration text when each scan image later
The automatic Mosaic of image can be realized in part.
7. the pcb board high-precision size forming method according to claim 5 applied to LED, which is characterized in that described
Image consistency correction process includes the following steps: one white figure of saturation bright field of acquisition and a black figure of dark field, obtains correction number
According to；Using peg method, image rectification is carried out as follows: where G correction (x, y) is the image data after correction, G
Original (x, y) is raw image data, and G bright field is the saturation bright field data that aligning tool obtains, and G dark field obtains for aligning tool
Dark field data, C is correction factor, usually takes 255.
8. the pcb board high-precision size forming method according to claim 5 applied to LED, which is characterized in that described
Image high-precision resampling is to be realized in rear end by cube interpolation algorithm.
9. the pcb board high-precision size forming method according to claim 5 applied to LED, which is characterized in that described
It is to turn vector operation by bitmap to realize that bitmap, which turns vector processing, comprising the following steps: bitmap is decomposed into closed path collection
It closes, constitutes the boundary between black and white region；An approximation will be converted by the resulting closed path set of above-mentioned processing should
The optimal polygon in path；Convert polygon to smooth vector outline；Finally export the curve set of a sequence, and each song
Line is all to be made of a series of linear segments and Bezier segment, and curve obtained is stored by the way of redundancy encoding
Collection.
10. the pcb board high-precision size forming method according to claim 1 applied to LED, which is characterized in that described
Gong board parameter are as follows: revolving speed: 20000-30000RPM, feed velocity: 0.2-0.7m/min, withdrawing speed: 11-18m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910784018.8A CN110446354A (en) | 2019-08-23 | 2019-08-23 | A kind of pcb board high-precision size forming method applied to LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910784018.8A CN110446354A (en) | 2019-08-23 | 2019-08-23 | A kind of pcb board high-precision size forming method applied to LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110446354A true CN110446354A (en) | 2019-11-12 |
Family
ID=68437469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910784018.8A Pending CN110446354A (en) | 2019-08-23 | 2019-08-23 | A kind of pcb board high-precision size forming method applied to LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110446354A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295050A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | Novel LED lamp panel alignment processing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327922A (en) * | 2003-04-28 | 2004-11-18 | Sumitomo Heavy Ind Ltd | Working position correction method |
| CN106506899A (en) * | 2015-09-08 | 2017-03-15 | 东莞市智觉电子科技有限公司 | A kind of image acquisition based on machine vision and method for reconstructing and device |
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN109819596A (en) * | 2019-03-26 | 2019-05-28 | 深圳市景旺电子股份有限公司 | A kind of production method of LED product HDI plate |
-
2019
- 2019-08-23 CN CN201910784018.8A patent/CN110446354A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327922A (en) * | 2003-04-28 | 2004-11-18 | Sumitomo Heavy Ind Ltd | Working position correction method |
| CN106506899A (en) * | 2015-09-08 | 2017-03-15 | 东莞市智觉电子科技有限公司 | A kind of image acquisition based on machine vision and method for reconstructing and device |
| CN106900139A (en) * | 2017-04-20 | 2017-06-27 | 胜宏科技（惠州）股份有限公司 | It is a kind of high-accuracy without technique edges LED circuit board moulding process |
| CN109819596A (en) * | 2019-03-26 | 2019-05-28 | 深圳市景旺电子股份有限公司 | A kind of production method of LED product HDI plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295050A (en) * | 2020-02-27 | 2020-06-16 | 梅州市志浩电子科技有限公司 | Novel LED lamp panel alignment processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108604373A (en) | For using multiple cameras to implement the system and method for seamless zoom function | |
| US6678000B1 (en) | High resolution still-image capture apparatus that shifts pixels by plus or minus two-thirds pixel pitch | |
| KR100816301B1 (en) | Apparatus and method for compensating color, and image processor, digital processing apparatus, recording medium using it | |
| CN101305599A (en) | Device for correcting quantity of ambient light, method for correcting quantity of ambient light, electronic information apparatus, control program and readable recording medium | |
| CN101248454A (en) | Image processing method and image processor, digital camera equipment, and recording medium with image processing program stored thereon | |
| CN108141531A (en) | Photographic device, image processing apparatus and display device | |
| CN101764907B (en) | Document reader | |
| CN101887521A (en) | Method and terminal for rectifying deviation of file | |
| US10304201B2 (en) | Item image stitching from multiple line-scan images for barcode scanning systems | |
| CN102170527A (en) | Image processing apparatus | |
| CN104683634A (en) | Determining Apparatus, Mobile Terminal Apparatus, And Recording Medium | |
| CN104813648A (en) | Image processing device, image capture device, image processing method, and image processing program | |
| CN106780328A (en) | A kind of file scanning method that multiple photos automatic Mosaic is shot based on mobile phone camera | |
| US20140161357A1 (en) | Image processing apparatus with function of geometrically deforming image, image processing method therefor, and storage medium | |
| EP0759599A2 (en) | Specific color field recognition apparatus and method | |
| CN107657642B (en) | A kind of automation scaling method carrying out projected keyboard using external camera | |
| CN110446354A (en) | A kind of pcb board high-precision size forming method applied to LED | |
| JP2000168109A (en) | Image-correcting apparatus | |
| CN106599010B (en) | Graph code searching method | |
| WO2018167974A1 (en) | Image processing device, control method, and control program | |
| CN107071277A (en) | A kind of light paints filming apparatus, method and mobile terminal | |
| CN104754177B (en) | A kind of chromatic aberration correction of CIS large format scanners and background color filter method | |
| CN110035281A (en) | A kind of dead pixel detection method, device and electronic equipment | |
| US6522790B1 (en) | Method and apparatus for merging images | |
| CN108961213B (en) | Equipment for realizing batch inspection of drilling quality and detection method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191112 |