CN109819596A - A kind of production method of LED product HDI plate - Google Patents
A kind of production method of LED product HDI plate Download PDFInfo
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- CN109819596A CN109819596A CN201910234166.2A CN201910234166A CN109819596A CN 109819596 A CN109819596 A CN 109819596A CN 201910234166 A CN201910234166 A CN 201910234166A CN 109819596 A CN109819596 A CN 109819596A
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- technique edges
- hdi plate
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Abstract
The invention discloses a kind of LED product production methods of HDI plate, include the following steps: S1, technique edges are set on substrate opposite both sides, the technique edges are set to the upper and lower two sides of substrate effective district, and the technique edges are connect with the effective district by connection position；S2, location hole is opened up in the technique edges；S3, it slots in connection position；S4, circuit board making is carried out using through above-mentioned steps treated substrate；S5, test.This method is by being arranged technique edges in the two sides of substrate, increase location hole on technique edges, then it is tested using jig, measuring accuracy and LED product formed precision greatly improved, the setting of location hole simultaneously also improves the precision for installing other elements, solve the problems, such as traditional LED be difficult to test with HDI plate, false failure rate it is high；It slots in connection position, so that technique edges are easily separated, it can convenient removal technique edges after installation elements.
Description
Technical field
The invention belongs to printed circuit board production technical fields, are related to a kind of production method of HDI plate, specifically, relating to
And a kind of LED product production method of HDI plate.
Background technique
Light emitting diode (English: Light-Emitting Diode, abbreviation LED) is a kind of to convert electrical energy into luminous energy
Semiconductor electronic component, purposes by the indicator light at initial stage gradually expand to display, glory decorate and illumination etc..LED makees
For forth generation light source, have many advantages, such as energy-saving and environmental protection, safety, service life length, low-power consumption, low-heat, high brightness, water, shock.
With the deep propulsion of industry 4.0, the energy saving and environment friendly light source of LED has become high-end optoelectronic device, intelligent appliance etc.
The mainstream configuration of product.For the performance for promoting this kind of product, more and more LED products import the design of HDI plate.HDI refers to height
Density interconnects (High Density Interconnector) plate, is a kind of route distribution density using micro- blind buried via hole technology
Higher circuit board, HDI plate can reduce wiring board cost, conducive to advanced structure dress technology use, possess more preferably electrical property and
Signal correctness can also improve thermal property.
For LED product, need to guarantee that wick plate spectrum is uniformly unshadowed, therefore, without any fixed in this kind of HDI production board
Position hole can be used for test position fix.But printed circuit board must carry out electrical property detection to pads all on plate before shipment, with
The electric property for ensuring printed circuit board avoids leading to functional defect because opening short circuit after parts, reduces yield.Conventional measurement
Method for testing is setting at least four location hole in plate, then by flying probe, for high density interconnecting board, before the forming, first
Then whole plate flying probe carries out moulding process again, this method low efficiency, processing flow and time are long, equipment cost, manpower at
This height, it is difficult to the situation that meet demand amount is big, the friendship phase is urgent.In addition it for the HDI plate of no location hole, cannot be controlled using traditional
Has test method, positioning accuracy is poor during the test, false failure rate is high, needs to adjust machine repeatedly in production, testing efficiency is low.
Summary of the invention
For this purpose, the present invention exactly will solve above-mentioned technical problem, thus propose a kind of high production efficiency, can be achieved it is quickly high
The production method of the precision HDI plate of the LED product without assignment test effect.
In order to solve the above technical problems, the technical solution of the present invention is as follows:
The present invention provides a kind of production method of LED product HDI plate comprising following steps:
S1, technique edges being set on substrate opposite both sides, the technique edges are set to the upper and lower two sides of substrate effective district,
The technique edges are connect with the effective district by connection position；
S2, location hole is opened up in the technique edges；
S3, it slots in connection position；
S4, circuit board making is carried out using through above-mentioned steps treated substrate；
S5, test.
Preferably, the substrate include lamp bead face for installing lamp bead pad and it is opposite with the lamp bead face, be used for
The face control IC of installation control IC, the step S3 specifically: carry out controlling deep gong in the side that the connection position is located at lamp bead face
Slot makes V-groove in the side for being located at the control face IC.
Preferably, the depth for controlling deep gong slot is 0.6 times, width 2-3mm of technique edges thickness, the V-groove
Depth be 0.15 times of technique edges thickness, V-groove angle is 30 degree.
Preferably, the location hole is set to the extension of connection position, diameter 1-2mm, the location hole is close to work
One lateral extent on skill avris side side distance is 1.5-3mm.
Preferably, the width of the technique edges is 3-5mm, the length of the connection position is 4-5mm.
Preferably, the connection position is 4, it is symmetrically disposed on the two sides up and down of substrate effective district.
Preferably, lamp bead face close to effective area edge pad away from effective area edge 0.05-0.075mm, the control
The face IC has layers of copper, and layers of copper edge is 0.4-0.5mm away from effective district Edge Distance.
Preferably, test described in the step S5 are as follows: the circuit diagram production test fixture according to HDI plate is surveyed
Examination, the test fixture are positioned by location hole.
Preferably, circuit board making described in the step S4 include sawing sheet, internal layer circuit production, pressing, drilling,
The step of electric plating of whole board, outer-layer circuit production, graphic plating, etching, welding resistance character, surface treatment, molding.
Preferably, the molding is carried out by CCD molding machine.
The above technical solution of the present invention has the following advantages over the prior art:
(1) production method of LED product of the present invention HDI plate includes the following steps: S1, opposite in substrate
Technique edges are arranged in both sides, and the technique edges are set to the upper and lower two sides of substrate effective district, and the technique edges and the effective district are logical
Cross connection position connection；S2, location hole is opened up in the technique edges；S3, it slots in connection position；S4, using at through above-mentioned steps
Substrate after reason carries out circuit board making；S5, test.This method is by being arranged technique edges in the two sides of substrate, on technique edges
Increase location hole, is then tested using jig, measuring accuracy and LED product formed precision greatly improved, position simultaneously
The setting in hole also improves the precision for installing other elements, solves that traditional LED is difficult to test with HDI plate, false failure rate is high asks
Topic；It slots in connection position, so that technique edges are easily separated, it can convenient removal technique edges after installation elements.
(2) production method of LED product of the present invention HDI plate, it is described before test described in the step S5
Molding is the optical point by CCD molding machine into middle CCD system detection circuit board.Optical point can be located at the outside of location hole, root
According to the harmomegathus situation of optical point, CCD system compensates molding route automatically, substantially increases the formed precision of HDI plate, was placing
Position deviation CCD vision positioning system of Cheng Zhong, the HDI plate in 80mm can be carried out route correction, reduces plate and puts
Precision improves operation convenience and puts plate efficiency.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is HDI plate structural schematic diagram made from production method of the LED product described in the embodiment of the present invention with HDI plate；
Fig. 2 is the schematic diagram slotted in method described in the embodiment of the present invention.
Appended drawing reference indicates in figure are as follows: 1- technique edges；2- effective district；3- connection position；4- location hole；5- controls deep trouth；6-V type
Slot；7- optical point.
Specific embodiment
Embodiment
The present embodiment provides a kind of LED product production methods of HDI plate, are used to solve traditional LED and are tested with HDI plate
The problem that positioning accuracy is poor, false failure rate is high in the process is, it can be achieved that jig test, high-volume automate quickly test.
This method comprises the following steps:
S1, a substrate is provided, as shown in Figure 1, two sides design and manufacture craft side 1 above and below substrate, by technique edges 1 and base
Part gong is empty between the effective district 2 of plate, retains symmetrical two connection positions 3, the technique edges 1, which are symmetrically disposed on substrate, to be had
The two sides up and down in area 2 are imitated, are respectively connect by two connection positions 3 with effective district 2, the width of the technique edges 1 is 3-5mm, this reality
Applying is preferably 4mm in example, and the length of the connection position 3 is 4-5mm (length of scale C).
S2, location hole 4 is opened up on technique edges 1, in the present embodiment, the location hole 4 is set to the extension of connection position 3
Portion, it is preferable that the center of circle of location hole 4 is located at the middle line of connection position 3, is opened up on every technique edges 1 there are two location hole 4, described
The diameter of location hole is 1-2mm, is 1.5mm in this implementation, the location hole 4 is close to a lateral extent of 1 side of the technique edges side
The distance on side is 1.5-3mm, is 2mm in the present embodiment.
S3, slot treatment is carried out in connection position 3, specifically, the substrate includes opposite two sides, wherein being used on one side
Lamp bead pad to be installed, referred to as lamp bead face (alternatively referred to as reverse side), is used for subsequent welding lamp bead, another side controls IC for installing,
Referred to as control the face IC (alternatively referred to as positive), this one side does not arrange LED lamp bead, positioned at lamp bead face edge lamp bead pad away from
Effective area edge 0.05-0.75mm, the control face IC are provided with layers of copper, and layers of copper edge is 0.4-0.5mm away from effective district Edge Distance；
As shown in Fig. 2, controlling deep gong slot in pad face, the control deep trouth 5 that sectional view is rectangle is obtained, makees V-groove 6 in control IC wheat flour,
Connection position 3 and 2 consistency of thickness of technique edges 1 and effective district are set as T, and the depth of the control deep trouth 5 is 0.6T, width 2-
3mm, the depth of the V-groove 6 are 0.15T, and the V-arrangement angle of V-groove 6 is 30 °, and after production control deep trouth 5 and V-groove 6, residue is even
Connect position 3 with a thickness of 0.25T.
S4, using common process carry out circuit board making: sawing sheet, internal layer circuit production, pressing, drilling, electric plating of whole board, outside
Sandwich circuit production, graphic plating, etching, welding resistance character, surface treatment, molding obtain the HDI plate that can be tested by jig,
In, molding specifically: HDI plate obtained is punched into type machine by CCD automatic positioning and carries out high-precision modeling, and the CCD is automatic
Positioning punching molding machine has CCD vision system, corrects system for automated optical point location, and HDI plate is placed on molding machine,
The optical point 7 of CCD vision system automatic measurement route plate, the optical point 7 is located at the outside of location hole 4, according to optical point 7
Harmomegathus situation, automatic compensation molding route, substantially increases formed precision, as long as deviation vision system of the HDI plate within 80mm
System can be carried out automatic route correction, relax required precision when operator puts plate, while greatly improving working efficiency.
S5, test make test fixture according to circuit diagram, and the test fixture is positioned by location hole 4, according to conventional survey
Examination process conditions are tested, and by using test fixture, testing efficiency greatly improved.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of LED product production method of HDI plate, which comprises the steps of:
S1, technique edges are set on substrate opposite both sides, the technique edges are set to the upper and lower two sides of substrate effective district, described
Technique edges are connect with the effective district by connection position；
S2, location hole is opened up in the technique edges；
S3, it slots in connection position；
S4, circuit board making is carried out using through above-mentioned steps treated substrate；
S5, test.
2. the LED product according to claim 1 production method of HDI plate, which is characterized in that the substrate includes being used for
The lamp bead face and the face control IC opposite with the lamp bead face, for installing control IC of lamp bead pad, the step S3 tool are installed
Body are as follows: carry out controlling deep gong slot in the side that the connection position is located at lamp bead face, make V-groove in the side for being located at the control face IC.
3. the LED product according to claim 2 production method of HDI plate, which is characterized in that the depth for controlling deep gong slot
Degree is 0.6 times, width 2-3mm of technique edges thickness, and the depth of the V-groove is 0.15 times of technique edges thickness, V-groove angle
Degree is 30 degree.
4. the LED product according to claim 3 production method of HDI plate, which is characterized in that the location hole is set to
The extension of connection position, diameter 1-2mm, the location hole are 1.5- close to a lateral extent of technique edges side side distance
3mm。
5. the LED product according to claim 4 production method of HDI plate, which is characterized in that the width of the technique edges
For 3-5mm, the length of the connection position is 4-5mm.
6. the LED product according to claim 5 production method of HDI plate, which is characterized in that the connection position is 4,
It is symmetrically disposed on the two sides up and down of substrate effective district.
7. the LED product according to claim 6 production method of HDI plate, which is characterized in that lamp bead face is close to effective district
The pad at edge has layers of copper away from effective area edge 0.05-0.075mm, the face control IC, and layers of copper edge is away from effective area edge
Distance is 0.4-0.5mm.
8. the LED product according to claim 7 production method of HDI plate, which is characterized in that described in the step S5
Test are as follows: the circuit diagram production test fixture according to HDI plate is tested, and the test fixture is positioned by location hole.
9. the LED product according to claim 8 production method of HDI plate, which is characterized in that described in the step S4
Circuit board making include sawing sheet, internal layer circuit production, pressing, drilling, electric plating of whole board, outer-layer circuit production, graphic plating, erosion
The step of quarter, welding resistance character, surface treatment, molding.
10. the LED product according to claim 9 production method of HDI plate, which is characterized in that the molding passes through CCD
Molding machine carries out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234166.2A CN109819596A (en) | 2019-03-26 | 2019-03-26 | A kind of production method of LED product HDI plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910234166.2A CN109819596A (en) | 2019-03-26 | 2019-03-26 | A kind of production method of LED product HDI plate |
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| CN201910234166.2A Pending CN109819596A (en) | 2019-03-26 | 2019-03-26 | A kind of production method of LED product HDI plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446354A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of pcb board high-precision size forming method applied to LED |
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| JP2015168855A (en) * | 2014-03-07 | 2015-09-28 | イビデン株式会社 | Wiring board chemical treatment device and wiring board chemical treatment method |
| CN106034380A (en) * | 2015-12-22 | 2016-10-19 | 奥士康精密电路（惠州）有限公司 | Manufacturing method of printed circuit board |
| CN205786943U (en) * | 2016-05-30 | 2016-12-07 | 信丰福昌发电子有限公司 | A kind of high density LED blind buried via hole circuit board leads to out of circuit test tool |
-
2019
- 2019-03-26 CN CN201910234166.2A patent/CN109819596A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015168855A (en) * | 2014-03-07 | 2015-09-28 | イビデン株式会社 | Wiring board chemical treatment device and wiring board chemical treatment method |
| CN106034380A (en) * | 2015-12-22 | 2016-10-19 | 奥士康精密电路（惠州）有限公司 | Manufacturing method of printed circuit board |
| CN205786943U (en) * | 2016-05-30 | 2016-12-07 | 信丰福昌发电子有限公司 | A kind of high density LED blind buried via hole circuit board leads to out of circuit test tool |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446354A (en) * | 2019-08-23 | 2019-11-12 | 惠州中京电子科技有限公司 | A kind of pcb board high-precision size forming method applied to LED |
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Application publication date: 20190528 |