CN212161854U - Reflow soldering jig device for flexible transparent display screen - Google Patents
Reflow soldering jig device for flexible transparent display screen Download PDFInfo
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- CN212161854U CN212161854U CN202021278690.4U CN202021278690U CN212161854U CN 212161854 U CN212161854 U CN 212161854U CN 202021278690 U CN202021278690 U CN 202021278690U CN 212161854 U CN212161854 U CN 212161854U
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- display screen
- transparent display
- flexible transparent
- jig
- reflow soldering
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Abstract
The utility model discloses a flexible transparent display screen reflow soldering tool device, concrete scheme includes: the supporting structure is used for fixing the flexible transparent display screen substrate, and a cover plate matched with the supporting structure is arranged on the upper surface of the supporting structure. The supporting structure is a tray jig, a plurality of grooves are formed in the surface of the tray jig, heat-conducting silica gel used for fixing the flexible transparent display screen substrate is filled in the grooves, and MARK reference points which correspond to the flexible transparent display screen substrate one to one and are used for aligning are arranged on the tray jig. The device adopts the reflow soldering technology to process flexible transparent display screen, can improve the efficiency of production greatly, can satisfy the printing and the welding of super small pad by current ripe reflow soldering technology.
Description
Technical Field
The utility model relates to a flexible transparent display screen technical field especially relates to a flexible transparent display screen reflow soldering tool device.
Background
At present, flexible transparent display screens are in a rapid development stage and are favored by the market, and the transparency and the lightness are outstanding characteristics. Due to the temperature characteristic of the substrate of the flexible transparent display screen, the production process generally adopts a dispensing mode to mount the LED chip on the conductive substrate. However, due to the reduction of the pin size of the LED chip, the common dispensing machine cannot meet the precision requirement, and the imported dispensing machine and the dispensing head are very expensive, so that a processing device with high efficiency and low cost and matched with a processing technology is urgently needed to mount the flexible transparent display screen substrate.
SUMMERY OF THE UTILITY MODEL
According to the problem that prior art exists, the utility model discloses a flexible transparent display screen reflow soldering tool device, concrete scheme includes:
the supporting structure is used for fixing the flexible transparent display screen substrate, and a cover plate matched with the supporting structure is arranged on the upper surface of the supporting structure.
The supporting structure is a tray jig, a plurality of grooves are formed in the surface of the tray jig, heat-conducting silica gel used for fixing the flexible transparent display screen substrate is filled in the grooves, and MARK reference points which correspond to the flexible transparent display screen substrate one to one and are used for aligning are arranged on the tray jig.
The supporting structure is a negative pressure adsorption jig, the upper surface of the negative pressure adsorption jig is provided with a plurality of adsorption holes, the adsorption holes are communicated with the inner cavity of the negative pressure adsorption jig, and the flexible transparent display screen substrate is fixed on the upper surface of the negative pressure adsorption jig in a negative pressure adsorption mode.
The supporting structure is a positioning tray jig, the bottom of the positioning tray jig is provided with a base which is matched with the positioning tray jig, the end part of the base is provided with a plurality of positioning pins, the end part of the positioning tray jig is provided with a plurality of positioning holes, and the positioning holes in the positioning tray jig are matched and connected with the positioning pins in the base to enable the flexible transparent display screen substrate to be fixed on the upper surface of the positioning tray jig.
Since the technical scheme is used, the utility model provides a pair of flexible transparent display screen reflow soldering tool device, the device adopt reflow soldering technology to process flexible transparent display screen, can improve the efficiency of production greatly, can satisfy the printing and the welding of super small pad by current ripe reflow soldering technology. Because the structure is simple, the production is convenient, the cost is very low, and the method is suitable for wide popularization.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of a pallet jig of the present invention;
fig. 2 is a schematic structural view of the middle negative pressure adsorption jig of the present invention;
fig. 3 is a schematic structural view of a positioning tray fixture of the present invention;
FIG. 4 is a schematic structural view of the middle cover plate of the present invention;
FIG. 5 is a schematic structural view of the base of the present invention;
fig. 6 is a schematic structural diagram of the middle flexible transparent display screen of the present invention.
In the figure: 108. the flexible transparent display screen comprises a cover plate 113-1, a tray jig, 102, a groove, 100, a MARK reference point, 113-2, a negative pressure adsorption jig, 116, adsorption holes, 113-3, a positioning tray jig, 114, positioning pins, 115, a base, 104, LED chips, 105, a flexible transparent display screen substrate, 106, an FPC connector, 110, an inner cavity, 111, positioning holes, 107 and cover plate LED corresponding hollowed holes, 109 and MARK point hollowed holes.
Detailed Description
For making the technical solution and the advantages of the present invention clearer, the following combines the drawings in the embodiments of the present invention, to the technical solution in the embodiments of the present invention is clear and complete description:
as shown in fig. 1 and 4, the reflow soldering jig device for the flexible transparent display screen comprises a supporting structure for fixing a substrate of the flexible transparent display screen, wherein a cover plate 108 working in cooperation with the supporting structure is arranged on the upper surface of the supporting structure.
Further, the supporting structure may be a tray fixture 113-1, the surface of the tray fixture 113-1 is provided with a plurality of grooves 102, the interior of each groove 102 is filled with heat-conducting silica gel for fixing the flexible transparent display screen substrate, and the tray fixture 113-1 is provided with MARK reference points 100 which are in one-to-one correspondence with the flexible transparent display screen substrate and are used for alignment.
Example 1:
fixing a flexible transparent display screen substrate on a flat tray jig 113-1, wherein the tray jig 113-1 is provided with a plurality of grooves 102, and the grooves 102 are filled with heat-conducting silica gel for fixing the flexible transparent display screen substrate; the tray fixture 113-1 has a one-to-one correspondence of MARK reference points 100 for alignment with the flexible transparent display substrate.
The flexible transparent display screen substrate and the steel mesh fixed on the tray jig 113-1 are placed into a printing machine, the flexible transparent display screen substrate and the steel mesh are aligned by aligning the MARK reference point 100, low-temperature solder paste printing is carried out, solder paste printing effect detection is carried out after the printing is finished, after the printing effect is detected to be good, the corresponding cover plate 108 is installed on the flexible transparent display screen substrate, wherein the cover plate 108 is provided with MARK point hollowed-out holes 109 corresponding to the MARK reference points on the flexible transparent display screen substrate and used for aligning the substrate and the cover plate, and the MARK reference points on the substrate are exposed and used for next-step LED mounting, and are placed into an SMT production line for LED mounting. And after the surface mounting is finished, carrying out optical automatic inspection, and carrying out reflow soldering operation through the inspected flexible transparent display screen substrate.
Carrying out optical automatic inspection on the flexible transparent display screen substrate after reflow soldering cooling, and inspecting whether a poor soldering phenomenon exists or not, and carrying out corresponding maintenance operation if the poor soldering exists; and if the welding phenomenon is good, the FPC connector is hot-pressed at the corresponding position of the flexible transparent display screen substrate. And finally, carrying out power-on test, and finishing the processing of the flexible transparent display screen.
Further, the supporting structure may be a negative pressure adsorption jig 113-2, the upper surface of the negative pressure adsorption jig 113-2 is provided with a plurality of adsorption holes 116, the adsorption holes 116 are communicated with the inner cavity 110 of the negative pressure adsorption jig 113-2, and the flexible transparent display screen substrate is fixed on the upper surface of the negative pressure adsorption jig 113-2 by adopting a negative pressure adsorption manner.
Example 2:
fixing the flexible transparent display screen substrate on a flat negative pressure adsorption jig, as shown in fig. 2, wherein a plurality of adsorption holes 116 are formed on the negative pressure adsorption jig 113-2, the adsorption holes 116 are communicated with the inner cavity 110 of the negative pressure adsorption jig 113-2, and the flexible transparent display screen substrate can be flatly fixed on the negative pressure adsorption jig 113-2 by opening a negative pressure adsorption jig switch; the negative pressure adsorption jig 113-2 is engraved with a frame consistent with the outer frame of the flexible transparent display screen substrate and used for aligning the flexible transparent display screen substrate.
The flexible transparent display screen substrate 105 fixed on the negative pressure adsorption jig 113-2 and the steel mesh are placed into a printing machine, the flexible transparent display screen substrate and the steel mesh are aligned through aligning a MARK reference point, low-temperature solder paste is printed, solder paste printing effect detection is carried out after printing is completed, and after the detection printing effect is good, the flexible transparent display screen substrate and the steel mesh are placed into an SMT production line to carry out LED surface mounting.
And after the surface mounting is finished, carrying out optical automatic inspection, and carrying out reflow soldering operation through the inspected flexible transparent display screen substrate.
Carrying out optical automatic inspection on the flexible transparent display screen substrate after reflow soldering cooling, and inspecting whether a poor soldering phenomenon exists or not, and carrying out corresponding maintenance operation if the poor soldering exists; and if the welding phenomenon is good, the FPC connector is hot-pressed at the corresponding position of the flexible transparent display screen substrate. And finally, carrying out power-on test, and finishing the processing of the flexible transparent display screen.
Further, as shown in fig. 3, the supporting structure is a positioning tray fixture 113-3, the end of the positioning tray fixture 113-3 is provided with a plurality of positioning holes 111, the bottom of the positioning tray fixture 113-3 is provided with a base 115 cooperating with the positioning tray fixture, the end of the base 115 is provided with a plurality of positioning pins 114, and the flexible transparent display screen substrate is connected with the positioning holes 111 on the positioning tray fixture and the positioning pins 114 on the base in a matching manner so that the flexible transparent display screen substrate is fixed on the upper surface of the positioning tray fixture 113-3.
Example 3:
as shown in fig. 3 and 5, four positioning pins 114 are disposed at four corners of the base of the positioning tray fixture 113-3, the positioning tray fixture 113-3 is aligned with the positioning pins 114 of the base through the positioning holes 111 thereof and is mounted on the base 115, and the flexible transparent display substrate is mounted on the positioning tray fixture 113-3 through the positioning holes 111, as shown in fig. 3. And after the flexible transparent display screen substrate is aligned and fixed with the positioning tray jig 113-3, the flexible transparent display screen substrate and the positioning tray jig are put into an STM assembly line together for operation.
And (3) placing the flexible transparent display screen substrate fixed on the positioning tray jig 113-3 and the steel mesh into a printer to print low-temperature solder paste, detecting the printing effect of the solder paste after printing is finished, and pasting the LED chip after the printing effect is good.
And after the surface mounting is finished, carrying out optical automatic inspection, and after the state is good, entering a reflow oven for reflow soldering.
Carrying out optical automatic inspection on the flexible transparent display screen substrate after reflow soldering cooling, and inspecting whether a poor soldering phenomenon exists or not, and carrying out corresponding maintenance operation if the poor soldering exists; and if the welding phenomenon is good, the FPC connector is hot-pressed at the corresponding position of the flexible transparent display screen substrate. And finally, carrying out power-on test till the flexible transparent display screen is processed, as shown in fig. 6.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (4)
1. The utility model provides a flexible transparent display screen reflow soldering tool device which characterized in that includes: the support structure is used for fixing the flexible transparent display screen substrate, and a cover plate (108) matched with the support structure is arranged on the upper surface of the support structure.
2. The reflow soldering jig device for the flexible transparent display screen according to claim 1, further characterized in that: the supporting structure is a tray jig (113-1), a plurality of grooves (102) are formed in the surface of the tray jig (113-1), heat-conducting silica gel used for fixing the flexible transparent display screen substrate is filled in the grooves (102), and MARK reference points (100) which correspond to the flexible transparent display screen substrate one by one and are used for aligning are arranged on the tray jig (113-1).
3. The reflow soldering jig device for the flexible transparent display screen according to claim 1, further characterized in that: the supporting structure is a negative pressure adsorption jig (113-2), a plurality of adsorption holes (116) are formed in the upper surface of the negative pressure adsorption jig (113-2), the adsorption holes (116) are communicated with an inner cavity (110) of the negative pressure adsorption jig (113-2), and the flexible transparent display screen substrate is fixed on the upper surface of the negative pressure adsorption jig (113-2) in a negative pressure adsorption mode.
4. The reflow soldering jig device for the flexible transparent display screen according to claim 1, further characterized in that: the supporting structure is a positioning tray jig (113-3), a base (115) which is matched with the positioning tray jig is arranged at the bottom of the positioning tray jig (113-3), a plurality of positioning pins (114) are arranged at the end part of the base (115), a plurality of positioning holes (111) are arranged at the end part of the positioning tray jig (113-3), and the positioning holes (111) in the positioning tray jig (113-3) are matched and connected with the positioning pins (114) to enable the flexible transparent display screen substrate to be fixed on the upper surface of the positioning tray jig (113-3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021278690.4U CN212161854U (en) | 2020-07-03 | 2020-07-03 | Reflow soldering jig device for flexible transparent display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021278690.4U CN212161854U (en) | 2020-07-03 | 2020-07-03 | Reflow soldering jig device for flexible transparent display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212161854U true CN212161854U (en) | 2020-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021278690.4U Active CN212161854U (en) | 2020-07-03 | 2020-07-03 | Reflow soldering jig device for flexible transparent display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212161854U (en) |
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2020
- 2020-07-03 CN CN202021278690.4U patent/CN212161854U/en active Active
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