CN113567800A - Sorting device and sorting method for detecting quality of micro LED chip - Google Patents
Sorting device and sorting method for detecting quality of micro LED chip Download PDFInfo
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Abstract
The invention discloses a sorting device and a sorting method for detecting the quality of a micro LED chip (1), wherein the micro LED chip (1) comprises a chip substrate (15) and a plurality of LED wafers (11); the plurality of LED chips (11) are provided with a common first negative electrode (12) and independent first positive electrodes (13); the sorting device comprises an electrical property detection unit (2), wherein the electrical property detection unit (2) comprises a detection unit main body (21) and a second positive electrode (22) and a second negative electrode (23). The LED chips (11) are electrically connected to the electrical property detection unit (2) in a common cathode and common anode mode, when the electrical property detection unit (2) is connected with an external power supply, the LED chips (11) are connected to the power supply in a parallel connection mode, so that the light emitting conditions of the LED chips (11) are detected simultaneously, the area detection is completed, the efficiency is improved compared with the conventional single lighting, and the rapid quality detection of the micro LED is realized.
Description
Technical Field
The invention belongs to the technical field of miniature LED display screens, and particularly relates to a sorting device and a sorting method for detecting the quality of a miniature LED chip.
Background
Micro LED (Micro LED) display has the advantages of high resolution, high brightness, low power consumption, high color saturation, long service life and the like. Can adapt to various sizes of seamless splicing and the like. As far as present, there is a potential for next generation display technologies.
Before bonding of the Micro LED chips, the conditions of damage, deletion and the like are inevitable in the production process, if qualified products, unqualified products and unqualified products are not sorted in advance, the first-choice unqualified product downstream production line can cause the defects of a display and increase of defective products, and the downstream production line of the unqualified products can produce more reported waste products to cause waste, namely if the quality of the Micro LED chips is not detected, the control panel combined with the unqualified Micro LED chips is also wasted. Therefore, how to detect qualified products, defective products and reported waste products in the next step of the process on the Micro LED chip and repair the dead spots through the detection is an urgent problem to be solved.
At present, the LED detection generally adopts a probe type detection, the probe type detection accuracy is high, but the detection is not suitable for a Micro LED with higher resolution, because the Micro LED has higher resolution, a very small Micro LED display screen contains a large number of LED wafers, for example, a Micro LED display screen about 0.39 inches, the number of the contained LED wafers is about 240 thousands, if the probe type single detection is selected, the detection is too long, the detection is not suitable for production line volume production, and the economic requirement cannot be met.
The present invention has been made to solve the above problems.
Disclosure of Invention
The invention has the following objects: 1. the problem that Micro LED chips are difficult to sort is solved. 2. The Micro LED sorting is simple and easy to operate, and the detection efficiency is improved. 3. The problems of complex detection process and low accuracy of the Micro LED are solved. 4. The problem that Micro LEDs are not damaged in sorting is solved, and the sorting yield is guaranteed.
The invention provides a sorting device for micro LED chips, wherein a micro LED chip 1 comprises a chip substrate 15 and a plurality of LED wafers 11 fixed on the chip substrate 15; the plurality of LED chips 11 have a common first negative electrode 12, and the plurality of LED chips 11 have independent first positive electrodes 13, respectively;
the sorting device comprises an electrical property detection unit 2, wherein the electrical property detection unit 2 comprises a detection unit main body 21 and a second positive electrode 22 and a second negative electrode 23 which are positioned on the detection unit main body 21;
the miniature LED chip 1 is positioned above the sorting device; the first positive electrodes 13 of the plurality of LED chips 11 are electrically connected to the second positive electrodes 22, and the first negative electrodes 12 are electrically connected to the second negative electrodes 23;
the electrical property detection unit 2 is electrically connected with an external power supply.
An LED chip, also known as an LED bead, is essentially an LED light emitting diode.
Preferably, the second positive electrode 22 and the second negative electrode 23 are detection panels, so that the plurality of LED chips 11 are electrically connected to the electrical property detection unit 2 in a common cathode and common anode manner. The second positive electrode 22 and the second negative electrode 23 are made of metal materials such as copper or aluminum, and the electrical property detection unit 2 is fixed on the precise alignment platform 5. The common anode and common cathode detection panels have low requirement on detection alignment precision, the positive electrode and the negative electrode can detect the whole Micro LED element at one time, the test is accurate, and the time is saved.
Preferably, the sorting device further comprises an image collecting unit 3, which can collect the light emission of the plurality of LED chips 11 after the power supply is connected.
Preferably, the image acquisition unit 3 comprises a plurality of CCD cameras. The CCD camera adopts a high-resolution camera, so that the positioning is more accurate and the image acquisition is clearer.
Preferably, the sorting device further comprises a negative pressure adsorption unit 4 for adsorbing the micro LED chip 1 and placing it on the electrical property detection unit 2.
Preferably, the negative pressure adsorption unit 4 includes a negative pressure adsorption unit main body 41, an air extraction opening 42 and a negative pressure adsorption hole 43, the air extraction opening 42 is connected with an air extraction device, air in the negative pressure adsorption unit main body 41 is extracted, so that the negative pressure adsorption hole 43 is in a negative pressure environment, and then a suction force is generated to absorb the micro LED chip 1. The middle of the negative pressure adsorption unit body 41 is a cavity, and two sides of the cavity are respectively provided with an air extraction opening 42, so that negative pressure is formed in the cavity to adsorb the tested component. One surface of the negative pressure adsorption unit for adsorbing the components is provided with a negative pressure adsorption hole 43.
The negative pressure adsorption unit body 41 is provided with an infrared reflection resistant or laser reflection resistant film, so that infrared or laser is prevented from being reflected by the negative pressure adsorption unit body 41. Further, the image collecting unit 3 can accurately and clearly collect the light emitting conditions of the plurality of LED chips 11. This film is plated on quartz (negative pressure adsorption unit body 41), and the material may be selected from: silicon monoxide, magnesium fluoride, zinc sulfide, and the like.
Preferably, the negative pressure adsorption unit main body 41 is transparent and is selected from quartz, glass and other transparent materials; the negative pressure adsorption holes 43 are distributed around the periphery of the chip substrate 15 outside the display area and avoid the positions of alignment target points. The high-light-transmission quartz material can enable the CCD high-resolution camera to better collect the positioning target and the Micro LED performance image on the Micro LED original piece. The negative pressure adsorption holes 43 are distributed around the periphery outside the display area of the chip substrate 15, so that the influence of the opening (the negative pressure adsorption holes 43) on the CCD high-resolution camera on the sampling and image acquisition of the micro LED chip can be avoided.
Alignment target points are first alignment target 14 and second alignment target 24.
Preferably, the chip substrate 15 further has a first alignment target 14 thereon, and the detection unit main body 21 has a second alignment target 24 thereon; the first alignment target 14 and the second alignment target 24 are matched, so that the micro LED chip 1 and the electrical property detection unit 2 correspond, and the first positive electrode 13 is electrically connected to the second positive electrode 22, and the first negative electrode 12 is electrically connected to the second negative electrode 23.
Preferably, the sorting device further comprises a precise alignment platform 5, and the precise alignment platform 5 can control the electrical property detection unit 2 to move to align at X, Y, Z in the theta axis;
the image acquisition unit 3 and the accurate alignment platform 5 are both connected with an external computer host, the micro LED chip 1 and the electrical property detection unit 2 are caused to correspond in position by the first alignment target 14 and the second alignment target 24, the image acquisition unit 3 acquires images of the first alignment target 14 and the second alignment target 24 and feeds back the image information to the external computer host, and the computer host further adjusts the positions of the first alignment target 14 and the second alignment target 24 by regulating and controlling the accurate alignment platform 5 according to the image information and a set value.
In the second aspect of the present invention, a sorting method for the quality of a micro LED chip 1 is provided, wherein, using the sorting device of the first aspect of the present invention, a plurality of LED chips 11 on the micro LED chip 1 have a common first negative electrode 12, and the plurality of LED chips 11 have independent first positive electrodes 13 respectively;
the electrical property detection unit 2 includes a second positive electrode 22 and a second negative electrode 23;
the LED chips 11 are electrically connected to the electrical property detection unit 2 in a common cathode and common anode manner, and when the electrical property detection unit 2 is connected with an external power supply, the LED chips 11 are connected to the power supply in a parallel manner, so that the light emitting conditions of the LED chips 11 are detected at the same time, and the detection of the micro LED chips 1 in different regions is completed.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention electrically connects a plurality of LED chips 11 to the electrical property detection unit 2 in a way of common cathode and common anode, when the electrical property detection unit 2 is connected with an external power supply, the plurality of LED chips 11 are connected to the power supply in a parallel mode, thereby detecting the light emitting condition of the plurality of LED chips 11 at the same time. Compared with the prior art, the efficiency is improved by lighting a single LED, and the Micro LED can realize quick detection.
2. The sorting device of the invention further comprises an image acquisition unit 3, which may be a plurality of high resolution CCD cameras. And on the common cathode and common anode regional detection method, a high-resolution camera is matched for sorting. The Micro LED is enabled to be lighted together, the area detection is realized, and the detection result is more accurate.
3. The invention designs a negative pressure adsorption unit 4 independently, which is used for adsorbing the micro LED chip 1 and placing the micro LED chip on the electrical property detection unit 2. By adopting a negative pressure adsorption method, the Micro LED is more convenient to grab and is not easy to shift. Further, the negative pressure adsorption unit body 41 is made of transparent materials such as quartz and glass, and due to the high light transmittance of the negative pressure adsorption unit body 41, high-resolution shooting positioning can be accurate and Micro LED lighting information can be accurately collected.
4. The method can be used for sorting the single Micro LED display screen and the whole Micro LED epitaxial wafer.
5. Compared with a detection device with a single probe, the detection method and the detection device of the common cathode and common anode areas of the detection platform have the advantages of simple and easy operation in the detection process, higher efficiency and easier and more convenient replacement of equipment production and manufacture.
6. The sorting device further comprises an alignment target and a precise alignment platform 5, wherein the image acquisition unit 3 and the precise alignment platform 5 are both connected with an external computer host, the micro LED chip 1 and the electrical property detection unit 2 are corresponding in position through the first alignment target 14 and the second alignment target 24, the image acquisition unit 3 acquires images at the first alignment target 14 and the second alignment target 24 and feeds back the image information to the external computer host, and the computer host further adjusts the positions of the first alignment target 14 and the second alignment target 24 by regulating and controlling the precise alignment platform 5 according to the image information and a set value, so that the alignment of the micro LED chip 1 and the electrical property detection unit 2 is accurate.
7. The second positive electrode 22 and the second negative electrode 23 are detection panels in the present invention, so that the plurality of LED chips 11 are electrically connected to the electrical property detection unit 2 in a common cathode and common anode manner. Because of being a monoblock detection panel, so low to detecting the requirement for counterpoint precision, positive electrode and negative electrode can once detect whole Micro LED original paper, and the test is accurate, saves time.
Drawings
FIG. 1 is a schematic structural diagram of a sorting device for detecting the quality of a micro LED chip 1 according to the present invention;
FIG. 2 is a schematic structural diagram of the negative pressure adsorption unit 4 in the sorting apparatus according to the present invention;
FIG. 3 is a top view of the negative pressure adsorption unit 4 in the sorting apparatus according to the present invention;
FIG. 4 is a left side view of the negative pressure adsorption unit 4 in the sorting apparatus according to the present invention;
fig. 5 is a top view of the electrical property detection unit 2 of the sorting apparatus according to the present invention;
FIG. 6 is a flow chart of the method for detecting the quality of the micro LED chip 1 according to the present invention;
the names of the reference symbols are: the device comprises a 1-micro LED chip, a 11-LED wafer, a 12-first negative electrode, a 13-first positive electrode, a 14-first alignment target, a 15-chip substrate, a 2-electrical property detection unit, a 21-detection unit main body, a 22-second positive electrode, a 23-second negative electrode, a 24-second alignment target, a 3-image acquisition unit, a 4-negative pressure adsorption unit, a 41-negative pressure adsorption unit main body, a 42-air extraction opening, a 43-negative pressure adsorption hole and a 5-precise alignment platform.
Detailed Description
The present invention will be described in further detail with reference to examples.
It will be appreciated by those skilled in the art that the following examples are illustrative of the invention only and should not be taken as limiting the scope of the invention. The examples do not specify particular techniques or conditions, and are performed according to the techniques or conditions described in the literature in the art or according to the product specifications. The materials or equipment used are not indicated by manufacturers, and all are conventional products available by purchase.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, "connected" as used herein may include wirelessly connected.
In the description of the present invention, "a plurality" means two or more unless otherwise specified. The terms "inner," "upper," "lower," and the like, refer to an orientation or a state relationship based on that shown in the drawings, which is for convenience in describing and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "provided" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. To those of ordinary skill in the art, the specific meanings of the above terms in the present invention are understood according to specific situations.
It will be understood by those skilled in the art that, unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Example 1
The embodiment provides a sorting device for micro LED chips, wherein a micro LED chip 1 comprises a chip substrate 15 and a plurality of LED chips 11 fixed on the chip substrate 15; the plurality of LED chips 11 have a common first negative electrode 12, and the plurality of LED chips 11 have independent first positive electrodes 13, respectively;
the sorting device comprises an electrical property detection unit 2, wherein the electrical property detection unit 2 comprises a detection unit main body 21 and a second positive electrode 22 and a second negative electrode 23 which are positioned on the detection unit main body 21;
the miniature LED chip 1 is positioned above the sorting device; the first positive electrodes 13 of the plurality of LED chips 11 are electrically connected to the second positive electrodes 22, and the first negative electrodes 12 are electrically connected to the second negative electrodes 23;
the electrical property detection unit 2 is electrically connected with an external power supply.
An LED chip, also known as an LED bead, is essentially an LED light emitting diode.
The second positive electrode 22 and the second negative electrode 23 are detection panels, so that the LED chips 11 are electrically connected to the electrical property detection unit 2 in a common cathode and common anode manner. The second positive electrode 22 and the second negative electrode 23 are made of copper metal material, and the electrical property detection unit 2 is fixed on the precise alignment platform 5. The common anode and common cathode detection panels have low requirement on detection alignment precision, the positive electrode and the negative electrode can detect the whole Micro LED element at one time, the test is accurate, and the time is saved.
The sorting device further comprises an image acquisition unit 3 which can acquire the light emitting conditions of the plurality of LED wafers 11 after the power supply is connected.
The image acquisition unit 3 includes a plurality of CCD cameras. The CCD camera adopts a high-resolution camera, so that the positioning is more accurate and the image acquisition is clearer.
The sorting device further comprises a negative pressure adsorption unit 4, and the negative pressure adsorption unit is used for adsorbing the micro LED chip 1 and placing the micro LED chip on the electrical property detection unit 2. The negative pressure adsorption unit 4 comprises a negative pressure adsorption unit main body 41, an air suction port 42 and a negative pressure adsorption hole 43, wherein the air suction port 42 is connected with an air suction device, air in the negative pressure adsorption unit main body 41 is sucked out, so that the negative pressure adsorption hole 43 is in a negative pressure environment, suction force is generated, and the micro LED chip 1 is sucked. The middle of the negative pressure adsorption unit body 41 is a cavity, and two sides of the cavity are respectively provided with an air extraction opening 42 (air extraction is more uniform), so that negative pressure is formed in the cavity to adsorb the tested component. One surface of the negative pressure adsorption unit for adsorbing the components is provided with a negative pressure adsorption hole 43.
The negative pressure adsorption unit main body 41 is transparent and is made of quartz transparent materials; the negative pressure adsorption holes 43 are distributed around the periphery of the chip substrate 15 outside the display area and avoid the positions of alignment target points. The high-light-transmission quartz material can enable the CCD high-resolution camera to better collect the positioning target and the Micro LED performance image on the Micro LED original piece. The negative pressure adsorption holes 43 are distributed around the periphery outside the display area of the chip substrate 15, so that the influence of the opening (the negative pressure adsorption holes 43) on the CCD high-resolution camera on the sampling and image acquisition of the micro LED chip can be avoided.
Alignment target points are first alignment target 14 and second alignment target 24.
The chip substrate 15 is also provided with a first alignment target 14, and the detection unit main body 21 is provided with a second alignment target 24; the first alignment target 14 and the second alignment target 24 are matched, so that the micro LED chip 1 and the electrical property detection unit 2 correspond, and the first positive electrode 13 is electrically connected to the second positive electrode 22, and the first negative electrode 12 is electrically connected to the second negative electrode 23.
The sorting device further comprises a precise alignment platform 5, wherein the precise alignment platform 5 can control the electrical property detection unit 2 to move to align at X, Y, Z and theta axis;
the image acquisition unit 3 and the accurate alignment platform 5 are both connected with an external computer host, the micro LED chip 1 and the electrical property detection unit 2 are caused to correspond in position by the first alignment target 14 and the second alignment target 24, the image acquisition unit 3 acquires images of the first alignment target 14 and the second alignment target 24 and feeds back the image information to the external computer host, and the computer host further adjusts the positions of the first alignment target 14 and the second alignment target 24 by regulating and controlling the accurate alignment platform 5 according to the image information and a set value.
Using the sorting device of the present embodiment, in the method for sorting the quality of the micro LED chip 1, a plurality of LED chips 11 on the micro LED chip 1 have a common first negative electrode 12, and the plurality of LED chips 11 have independent first positive electrodes 13 respectively;
the electrical property detection unit 2 includes a second positive electrode 22 and a second negative electrode 23;
the LED chips 11 are electrically connected to the electrical property detection unit 2 in a common cathode and common anode manner, and when the electrical property detection unit 2 is connected with an external power supply, the LED chips 11 are connected to the power supply in a parallel manner, so that the light emitting conditions of the LED chips 11 are detected at the same time, and the detection of the micro LED chips 1 in different regions is completed.
Claims (10)
1. A sorting device for detecting the quality of a micro LED chip is characterized in that the micro LED chip (1) comprises a chip substrate (15) and a plurality of LED wafers (11) fixed on the chip substrate (15); the plurality of LED chips (11) are provided with a common first negative electrode (12), and the plurality of LED chips (11) are respectively provided with an independent first positive electrode (13);
the sorting device comprises an electrical property detection unit (2), wherein the electrical property detection unit (2) comprises a detection unit main body (21) and a second positive electrode (22) and a second negative electrode (23) which are positioned on the detection unit main body (21);
the miniature LED chip (1) is positioned above the sorting device; and the first positive electrodes (13) of the plurality of LED chips (11) are electrically connected with the second positive electrodes (22), and the first negative electrodes (12) are electrically connected with the second negative electrodes (23);
the electrical property detection unit (2) is electrically connected with an external power supply.
2. The sorting device according to claim 1, wherein the second positive electrode (22) and the second negative electrode (23) are detection panels such that the plurality of LED chips (11) are electrically connected to the electrical property detection unit (2) in a common cathode and common anode manner.
3. The sorting device according to claim 1, further comprising an image collecting unit (3) for collecting light emission of a plurality of the LED chips (11) after power connection.
4. Sorting device according to claim 3, characterized in that the image acquisition unit (3) comprises a plurality of CCD cameras.
5. The sorting device according to claim 1, further comprising a negative pressure suction unit (4) for sucking the micro LED chip (1) and placing it on the electrical property detection unit (2).
6. The sorting device according to claim 5, wherein the negative pressure adsorption unit (4) comprises a negative pressure adsorption unit body (41), an air extraction opening (42) and a negative pressure adsorption hole (43), an air extraction device is connected to the air extraction opening (42), air in the negative pressure adsorption unit body (41) is extracted, the negative pressure adsorption hole (43) is in a negative pressure environment, and suction force is generated to suck the micro LED chip (1).
7. The sorting device according to claim 6, wherein the negative pressure adsorption unit main body (41) is transparent and is selected from transparent materials such as quartz, glass, and the like; the negative pressure adsorption holes (43) of the chip substrate (15) are distributed on the periphery outside the display area of the chip substrate (15) and avoid the positions of target points.
8. The sorting device according to claim 1, wherein the chip substrate (15) further has a first alignment target (14) thereon, and the detecting unit body (21) has a second alignment target (24) thereon; the first alignment target (14) and the second alignment target (24) are matched, so that the micro LED chip (1) and the electrical property detection unit (2) correspond, the first positive electrode (13) is electrically connected with the second positive electrode (22), and the first negative electrode (12) is electrically connected with the second negative electrode (23).
9. The sorting device according to claim 8, further comprising a precise alignment platform (5), wherein the precise alignment platform (5) can control the electrical property detection unit (2) to move to align at X, Y, Z θ;
the image acquisition unit (3) and the accurate alignment platform (5) are connected with an external computer host, the micro LED chip (1) and the electrical property detection unit (2) are enabled to correspond in position through the first alignment target (14) and the second alignment target (24), the image acquisition unit (3) acquires images of the first alignment target (14) and the second alignment target (24) and feeds the image information back to the external computer host, and the computer host further adjusts the positions of the first alignment target (14) and the second alignment target (24) by regulating and controlling the accurate alignment platform (5) according to the image information and a set value.
10. A sorting method for the quality of micro LED chips, characterized in that, using the sorting device of any one of claims 1 to 9, a plurality of LED chips (11) on the micro LED chip (1) have a common first negative electrode (12), and the plurality of LED chips (11) have independent first positive electrodes (13), respectively;
the electrical property detection unit (2) comprises a second positive electrode (22) and a second negative electrode (23);
the LED chips (11) are electrically connected to the electrical property detection unit (2) in a common cathode and common anode mode, when the electrical property detection unit (2) is connected with an external power supply, the LED chips (11) are connected to the power supply in a parallel mode, so that the light emitting conditions of the LED chips (11) are detected simultaneously, and the sub-region detection of the micro LED chip (1) is completed.
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| CN2021105165053 | 2021-05-12 | ||
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114018546A (en) * | 2021-11-11 | 2022-02-08 | 星源电子科技(深圳)有限公司 | Flaw measurement auxiliary system for Micro-LED |
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- 2021-06-22 CN CN202110691034.XA patent/CN113567800A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114018546A (en) * | 2021-11-11 | 2022-02-08 | 星源电子科技(深圳)有限公司 | Flaw measurement auxiliary system for Micro-LED |
| CN114018546B (en) * | 2021-11-11 | 2024-04-12 | 星源电子科技(深圳)有限公司 | Flaw measurement auxiliary system for Micro-LED |
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